CN111128817B - 一种晶舟盒的开盖装置及其开盖方法 - Google Patents
一种晶舟盒的开盖装置及其开盖方法 Download PDFInfo
- Publication number
- CN111128817B CN111128817B CN201911333818.4A CN201911333818A CN111128817B CN 111128817 B CN111128817 B CN 111128817B CN 201911333818 A CN201911333818 A CN 201911333818A CN 111128817 B CN111128817 B CN 111128817B
- Authority
- CN
- China
- Prior art keywords
- cover
- box
- wafer boat
- turntable
- fixing element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (5)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911333818.4A CN111128817B (zh) | 2019-12-23 | 2019-12-23 | 一种晶舟盒的开盖装置及其开盖方法 |
PCT/CN2020/120538 WO2021129052A1 (zh) | 2019-12-23 | 2020-10-13 | 一种晶舟盒的开盖装置及其开盖方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911333818.4A CN111128817B (zh) | 2019-12-23 | 2019-12-23 | 一种晶舟盒的开盖装置及其开盖方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111128817A CN111128817A (zh) | 2020-05-08 |
CN111128817B true CN111128817B (zh) | 2022-02-22 |
Family
ID=70501004
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911333818.4A Active CN111128817B (zh) | 2019-12-23 | 2019-12-23 | 一种晶舟盒的开盖装置及其开盖方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN111128817B (zh) |
WO (1) | WO2021129052A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111128817B (zh) * | 2019-12-23 | 2022-02-22 | 颀中科技(苏州)有限公司 | 一种晶舟盒的开盖装置及其开盖方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002076106A (ja) * | 2000-08-28 | 2002-03-15 | Dainippon Printing Co Ltd | ボックス開閉装置 |
JP2006339618A (ja) * | 2005-05-31 | 2006-12-14 | Dan-Takuma Technologies Inc | 手動式foupオプナー |
CN204155913U (zh) * | 2014-09-24 | 2015-02-11 | 武汉新芯集成电路制造有限公司 | 金属晶舟盒固定装置及晶舟盒推车 |
CN105321861A (zh) * | 2014-07-30 | 2016-02-10 | 三星电子株式会社 | 半导体晶片储料器设备和利用该设备传送晶片的方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003092345A (ja) * | 2001-07-13 | 2003-03-28 | Semiconductor Leading Edge Technologies Inc | 基板収納容器、基板搬送システム、保管装置及びガス置換方法 |
CN201845745U (zh) * | 2010-10-16 | 2011-05-25 | 武汉新芯集成电路制造有限公司 | 开关系统 |
CN111128817B (zh) * | 2019-12-23 | 2022-02-22 | 颀中科技(苏州)有限公司 | 一种晶舟盒的开盖装置及其开盖方法 |
-
2019
- 2019-12-23 CN CN201911333818.4A patent/CN111128817B/zh active Active
-
2020
- 2020-10-13 WO PCT/CN2020/120538 patent/WO2021129052A1/zh active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002076106A (ja) * | 2000-08-28 | 2002-03-15 | Dainippon Printing Co Ltd | ボックス開閉装置 |
JP2006339618A (ja) * | 2005-05-31 | 2006-12-14 | Dan-Takuma Technologies Inc | 手動式foupオプナー |
CN105321861A (zh) * | 2014-07-30 | 2016-02-10 | 三星电子株式会社 | 半导体晶片储料器设备和利用该设备传送晶片的方法 |
CN204155913U (zh) * | 2014-09-24 | 2015-02-11 | 武汉新芯集成电路制造有限公司 | 金属晶舟盒固定装置及晶舟盒推车 |
Also Published As
Publication number | Publication date |
---|---|
WO2021129052A1 (zh) | 2021-07-01 |
CN111128817A (zh) | 2020-05-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN111128817B (zh) | 一种晶舟盒的开盖装置及其开盖方法 | |
CN1255235A (zh) | 多个单片晶片气塞晶片处理装置及其装卸方法 | |
CA2364588A1 (en) | Blade maintenance tool, and its application to friction welding of blades | |
JP2012064827A (ja) | カセットアダプタ、及びアダプタ本体ロック装置 | |
CN212706688U (zh) | 一种电子工程用多用途工具箱 | |
CN211169710U (zh) | 一种移动式魔芋干片提升机 | |
CN214719800U (zh) | 一种便于快速定位的密封圈加工用打孔装置 | |
CN211388699U (zh) | 一种智能电力安全工器具柜 | |
US20040140442A1 (en) | Method and apparatus for accessing microelectronic workpiece containers | |
CN214162791U (zh) | 一种通信设备电源板壳体定位工具 | |
CN214432670U (zh) | 一种基于计算机实验技术的多功能操作平台 | |
CN210325748U (zh) | 一种半导体芯片加工用固定机构 | |
JP2006339618A (ja) | 手動式foupオプナー | |
CN215884784U (zh) | 一种工业机器人专用运输保护箱 | |
CN216503962U (zh) | 一种全自动去毛刺机用防护外壳 | |
CN213446836U (zh) | 显示屏切割装置 | |
CN213197004U (zh) | 一种可降低安全隐患的铝合金抛光设备 | |
CN218052956U (zh) | 一种电路板加工用防喷溅工作台 | |
CN220626965U (zh) | 一种数据库安全加固平台 | |
CN218788409U (zh) | 一种电芯去壳回收装置 | |
CN211389608U (zh) | 光伏设备 | |
CN217192913U (zh) | 一种具有定位功能的电池切片装置 | |
CN218665352U (zh) | 一种伸缩开瓶器 | |
CN213113501U (zh) | 真空镀膜设备 | |
CN219998313U (zh) | 一种电芯破壳装置以及锂电池回收设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: No. 166 Fengli Street, Suzhou Industrial Park, Jiangsu Province Applicant after: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Address before: No. 166 Fengli Street, Suzhou Industrial Park, Jiangsu Province Applicant before: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant before: Beijing yisiwei Material Technology Co.,Ltd. Address after: No. 166 Fengli Street, Suzhou Industrial Park, Jiangsu Province Applicant after: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant after: Beijing yisiwei Material Technology Co.,Ltd. Address before: No. 166 Fengli Street, Suzhou Industrial Park, Jiangsu Province Applicant before: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant before: Beijing yisiwei Technology Co.,Ltd. |
|
CB02 | Change of applicant information | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210616 Address after: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Applicant after: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant after: Hefei Qizhong Sealing Technology Co.,Ltd. Address before: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Applicant before: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant before: Xi'an yisiwei Material Technology Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
CB02 | Change of applicant information |
Address after: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Applicant after: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant after: Hefei Qizhong Technology Co.,Ltd. Address before: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Applicant before: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant before: Hefei Qizhong Sealing Technology Co.,Ltd. |
|
CB02 | Change of applicant information | ||
GR01 | Patent grant | ||
GR01 | Patent grant |