CN111123344A - A scintillator array with multi-layer reflective film and its preparation method and application - Google Patents

A scintillator array with multi-layer reflective film and its preparation method and application Download PDF

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CN111123344A
CN111123344A CN201911356229.8A CN201911356229A CN111123344A CN 111123344 A CN111123344 A CN 111123344A CN 201911356229 A CN201911356229 A CN 201911356229A CN 111123344 A CN111123344 A CN 111123344A
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film
scintillator
scintillator array
vapor deposition
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张建华
李意
毛龙妹
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Beijing Transpacific Technology Development Ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/20Measuring radiation intensity with scintillation detectors
    • G01T1/2002Optical details, e.g. reflecting or diffusing layers

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Abstract

本发明涉及辐射探测技术领域,具体涉及一种带有多层反射膜的闪烁体阵列及其制备方法和应用。本发明提供的带有多层反射膜的闪烁体阵列的制备方法,包括以下步骤:在原位制备的闪烁体阵列表面沉积高反膜,得到带有多层反射膜的闪烁体阵列;所述沉积的方法包括原子层沉积法、物理气相沉积法和化学气相沉积法中的一种或几种。本发明通过采用原子层沉积法、物理气相沉积法或化学气相沉积法在闪烁体阵列的表面沉积高反膜,能够同时对闪烁体阵列中的所有闪烁体条进行镀膜,无需对每个闪烁体条单独镀膜,能够节省制造成本,提高生产效率,且能够适应小尺寸的闪烁体阵列。

Figure 201911356229

The invention relates to the technical field of radiation detection, in particular to a scintillator array with a multi-layer reflective film and a preparation method and application thereof. The method for preparing a scintillator array with a multi-layer reflective film provided by the present invention includes the following steps: depositing a high-reflection film on the surface of the in-situ prepared scintillator array to obtain a scintillator array with a multi-layer reflective film; the The deposition method includes one or more of atomic layer deposition, physical vapor deposition and chemical vapor deposition. In the present invention, the high-reflection film is deposited on the surface of the scintillator array by using the atomic layer deposition method, the physical vapor deposition method or the chemical vapor deposition method, so that all the scintillator strips in the scintillator array can be coated at the same time, without the need for each scintillator. The strips are individually coated, which can save manufacturing costs, improve production efficiency, and can adapt to small-sized scintillator arrays.

Figure 201911356229

Description

Scintillator array with multilayer reflection film and preparation method and application thereof
Technical Field
The invention relates to the technical field of radiation detection, in particular to a scintillator array with a multilayer reflective film and a preparation method and application thereof.
Background
Scintillators are materials capable of emitting light after absorbing high-energy particles or rays, and play an important role in the field of radiation detection. The scintillator can be processed into various shapes and sizes so as to match with detectors of different types and sizes, the scintillator array is generally formed by orderly arranging a plurality of scintillator strips in one-dimensional or two-dimensional direction, and light-tight substances are filled in the adjacent scintillator strips so as to prevent the light of the scintillator strips from being interfered to the adjacent scintillator strips. However, the gaps in the small-sized scintillator array are narrow, and bubbles or other conditions are likely to occur when the gaps are filled with the light-impermeable substance, so that a rough contact surface is formed between the scintillator and the gaps after most of the light-impermeable substance is filled. Therefore, a part of the fluorescence is scattered or propagated to the adjacent scintillator strip through the rough contact interface, and in the detector requiring the scintillator array, if the leaked fluorescence is absorbed by the photodiode of the adjacent detection unit, signal crosstalk is caused, which leads to inaccurate signals and unreliable results.
Chinese patent CN207123619U discloses a scintillation crystal array, which uses mechanically polished strip-shaped scintillator crystals as scintillator strips, and then uses transparent colloid to bond the scintillator strips in corresponding grooves on a processed transparent substrate, wherein the end surface of each scintillator strip in the groove is plated with an antireflection film, and the side surface of each scintillator strip is plated with a highly reflective coating layer; and filling light-blocking mixtures into gaps among the scintillator strips to finally form the scintillator block. However, according to the scheme, each scintillator strip needs to be coated with a film respectively, then the scintillator strips are inserted into the grooves of the base body, and then the light-blocking mixture is filled among the scintillator strips, so that the preparation process is complex, the finally formed scintillator block is large in size and cannot adapt to a micro gap array due to the fact that the light-blocking mixture needs to be filled among the scintillator strips, the alignment precision between each scintillator strip and the grooves of the base plate cannot be guaranteed, and the situation that the coating film is scratched to generate gaps cannot be avoided in the installation process.
Disclosure of Invention
The invention aims to provide a preparation method of a scintillator array with a multilayer reflection film, in particular to a method for coating a film on the surface of a scintillator array prepared in situ.
In order to achieve the above object, the present invention provides the following technical solutions:
the invention provides a preparation method of a scintillator array with a multilayer reflection film, which comprises the following steps: depositing a high-reflection film on the surface of the scintillator array prepared in situ to obtain a scintillator array with a multilayer reflection film; the deposition method comprises one or more of an atomic layer deposition method, a physical vapor deposition method and a chemical vapor deposition method.
Preferably, when the high-reflection film is deposited by adopting the atomic layer deposition method, the pressure of the atomic layer deposition is 1.333X 10-4Pa, the temperature is 80-300 ℃;
when the high-reflection film is deposited by adopting a physical vapor deposition method, the pressure of the physical vapor deposition is 1.333 multiplied by 10- 4PPa at 50-700 ℃;
when the chemical vapor deposition method is adopted to deposit the high-reflection film, the pressure of the chemical vapor deposition is 1.333X 10- 4PPa, the temperature is 180-400 ℃.
Preferably, the thickness of the high-reflection film is 1nm to 100 μm.
Preferably, the high-reflection film comprises a metal composite film or a multilayer dielectric reflection film;
the metal composite film comprises a metal film and a protective film arranged on the outer surface of the metal film;
the multilayer dielectric reflection film comprises a high-refractive-index film and a low-refractive-index film which are alternately arranged in sequence, the high-refractive-index film is in contact with the surface of the scintillator array, and the low-refractive-index film is arranged on the outermost side.
Preferably, the metal film includes an aluminum film, a silver film, or a gold film; the protective film comprises a silicon dioxide film, an aluminum oxide film, a magnesium oxide film or a lithium fluoride film;
the low refractive index film comprises a silicon dioxide film, a sodium hexafluoroaluminate film or a magnesium fluoride film; the high refractive index film includes a zirconium dioxide film, a titanium dioxide film, a zinc sulfide film, or a zinc selenide film.
The invention also provides a scintillator array with the multilayer reflecting film, and the scintillator array is prepared by the preparation method of the technical scheme.
The invention also provides application of the scintillator array with the multilayer reflecting film in the technical scheme in the radiation detection field.
Preferably, the scintillator array with the multilayer reflective film is used in an XCT imaging device or a PET imaging device.
The invention provides a preparation method of a scintillator array with a multilayer reflection film, which comprises the following steps: depositing a high-reflection film on the surface of the scintillator array prepared in situ to obtain a scintillator array with a multilayer reflection film; the deposition method comprises one or more of an atomic layer deposition method, a physical vapor deposition method and a chemical vapor deposition method. According to the invention, the high-reflection film is deposited on the surface of the scintillator array by adopting the atomic layer deposition method, the physical vapor deposition method or the chemical vapor deposition method, so that all scintillator strips in the scintillator array can be coated at the same time, and each scintillator strip does not need to be coated with a film independently, so that the manufacturing cost can be saved, and the production efficiency can be improved; in addition, the preparation method provided by the invention can accurately control the thickness of the high-reflection film, and light-blocking substances are not required to be filled between the scintillator strips, so that the method is suitable for a small-size scintillator array.
Drawings
FIG. 1 is a schematic diagram of a scintillator array with a multilayer reflective film prepared according to an embodiment of the present invention.
Detailed Description
The invention provides a preparation method of a scintillator array with a multilayer reflection film, which comprises the following steps: depositing a high-reflection film on the surface of the scintillator array prepared in situ to obtain a scintillator array with a multilayer reflection film; the deposition method comprises one or more of an atomic layer deposition method, a physical vapor deposition method and a chemical vapor deposition method.
The invention deposits a high-reflection film on the surface of the scintillator array prepared in situ. In the present invention, the in-situ preparation is preferably inkjet printing. The preparation process of the scintillator array is not particularly limited in the present invention, and the preparation process known to those skilled in the art can be adopted according to actual production requirements.
In the invention, the deposition method comprises one or more of an atomic layer deposition method, a physical vapor deposition method and a chemical vapor deposition method, and the chemical vapor deposition method preferably comprises a plasma enhanced chemical vapor deposition method.
In the present invention, when the high-reflective film is deposited by the atomic layer deposition method, the pressure of the atomic layer deposition is preferably 1.333 × 10-4Pa, the temperature is preferably 80-300 ℃, and more preferably 120-150 ℃;
when the high-reflection film is deposited by physical vapor deposition, the pressure of the physical vapor deposition is preferably 1.333X 10-4Pa, the temperature is preferably 50-700 ℃, and more preferably 50-100 ℃;
when a chemical vapor deposition method is used for depositing the high-reflection film, the pressure of the chemical vapor deposition is preferably 1.333X 10-4Pa, the temperature is preferably 180-400 ℃, and more preferably 200-220 ℃;
when the plasma enhanced chemical vapor deposition method is adopted to deposit the high-reflection film, the pressure of the plasma enhanced chemical vapor deposition is preferably 1.333X 10-4Pa, the temperature is preferably 100-400 ℃.
In the present invention, the thickness of the high-reflection film is preferably 1nm to 100nm, and more preferably 55 nm; the thickness of the high-reflection film can be adjusted in a wide range.
In the present invention, the high-reflection film is preferably a metal composite film, and the metal composite film preferably includes a metal film and a protective film disposed on an outer surface of the metal film. In the present invention, the metal film preferably includes an aluminum film, a silver film or a gold film, and the thickness of the metal film is preferably 25 nm; the protective film preferably includes a silicon dioxide film, an aluminum oxide film, a magnesium oxide film, or a lithium fluoride film, and the thickness of the protective film is preferably 30 nm. In the present invention, the metal film mainly plays a role of emission, and the protective film plays a role of protecting the internal metal film from atmospheric corrosion.
In the present invention, the high-reflection film is preferably a multilayer dielectric reflection film, the multilayer dielectric reflection film preferably includes a high refractive index film and a low refractive index film alternately arranged in this order, the high refractive index film is in contact with the scintillator array surface, and the low refractive index film is at the outermost side. In the present invention, the low refractive index film preferably includes a silicon dioxide film, a sodium hexafluoroaluminate film or a magnesium fluoride film, and the thickness of the low refractive index film is preferably λ0/4,λ0Is the wavelength of the incident light; the high refractive index film preferably includes a zirconium dioxide film, a titanium dioxide film, a zinc sulfide film or a zinc selenide film, and the thickness of the high refractive index film is preferably λ0(ii)/4; the thickness of the high refractive index film is preferably the same as the thickness of the low refractive index film. The invention utilizes the different refractive indexes of different substances to play a role in increasing the reflectivity of the optical surface, improves the transmission of optical signals, finally increases the synthesized amplitude along with the increase of the film thickness, and can improve the detection sensitivity by designing the film thickness.
In a specific embodiment of the present invention, when the high-reflectivity film is a metal composite film, it is preferable to deposit a metal film by using a physical vapor deposition method and deposit a protection film by using an atomic layer deposition method;
when the high-reflection film is a multilayer dielectric reflection film, the high-reflection film is preferably deposited by a chemical vapor deposition method.
The invention also provides a scintillator array with a multilayer reflecting film, which is prepared by the preparation method in the technical scheme.
The scintillator array provided by the invention preferably comprises scintillator strips which are orderly arranged on the surface of a substrate, and the surfaces of the scintillator strips are coated with high-reflection films. In the present invention, the scintillator bar is preferably columnar. In the invention, the gap between two adjacent scintillator strips is preferably 0.1-100 μm, and more preferably 20 μm. In the invention, the material of the scintillator strip is preferably an inorganic nonmetal scintillator material or a scintillator material doped with quantum dots; the cross section area of the scintillator strip is preferably 50-400 mu m, and more preferably 80 mu m; the height of the scintillator strips is preferably 600-800 μm, more preferably 700 μm, and the heights of the scintillator strips are preferably all the same.
The invention also provides application of the scintillator array with the multilayer reflective film in the radiation detection field, and the scintillator array with the multilayer reflective film is preferably used in XCT imaging equipment or PET imaging equipment. The high-reflection film in the scintillator array with the multilayer reflection films, which is prepared by the invention, has higher reflectivity, can effectively reduce signal crosstalk among scintillators, thereby enhancing the transmission of optical signals, providing stronger optical signals for the optical sensor combined with the high-reflection film, further improving the spatial resolution, sensitivity and accuracy, and being particularly suitable for the small-size scintillator array.
The technical solution of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Printing an inorganic non-metal scintillator material on a substrate by using an ink-jet printing method to obtain a scintillator array on the surface of the substrate, wherein the scintillator array consists of columnar scintillator strips which are orderly arranged; the distance between adjacent scintillator strips is 0.1-5 μm; the scintillator strip has a diameter of 59 μm and a height of 700 μm; the specific method of the ink-jet printing comprises the following steps: fixing the scintillator colloid ink on a substrate by an ink-jet printing method, determining the diameter of columnar scintillator strips by changing the diameter of ink drops formed on the substrate, and then changing the spacing and arrangement among the columnar scintillator strips to obtain a first layer of scintillator array; then, stacking and accumulating are carried out on the basis of the first layer of scintillator array, so that the height of the columnar scintillator strip is increased, and the scintillator array can be obtained by adjusting the number of stacked layers;
placing the substrate and the scintillator array on the surface of the substrate in a physical vapor deposition equipment cavity, and adjusting the pressure to 1.333 × 10-4Pa, adjusting the temperature to 70 ℃, depositing an aluminum film (with the thickness of 25nm) on the surface of the scintillator array, transferring the scintillator array plated with the aluminum film into an atomic layer deposition equipment cavity under the protection of nitrogen, and adjusting the pressure to 1.333 x 10- 4Pa, adjusting the temperature to 100 ℃, and uniformly plating an aluminum oxide protective film (with the thickness of 30nm) on the surface of the scintillator array plated with the aluminum film to obtain the scintillator array with the multilayer reflecting film.
The reflectivity of the high-reflection film (aluminum film and aluminum oxide protective film) obtained by the embodiment is up to 99.9%, and the signal crosstalk among the scintillator strips is effectively reduced, so that the transmission of optical signals is enhanced, stronger optical signals are provided for the optical sensor combined with the optical sensor, and the spatial resolution and the sensitivity are improved; the process for preparing the high-reflection film is stable, the consistency and uniformity of the film thickness can be ensured, and the accuracy of signals and the reliability of detection results are improved.
Example 2
Preparing a scintillator array in situ on a substrate by the same method as in example 1;
placing the substrate and the scintillator array on the surface of the substrate in a cavity of a chemical vapor deposition device, and adjusting the pressure to be 1.333 x 10-4Pa, setting the temperature at 220 ℃, taking zirconium dioxide as a high-refractive-index material, and depositing a zirconium dioxide film (with the film thickness of lambda) on the surface of the scintillator array0/4,λ0As incident light wavelength), silicon dioxide is used as high refractive index material, and silicon dioxide film (with film thickness of lambda) is deposited on the surface of the scintillator array plated with zirconium dioxide film0/4,λ0At the wavelength of the incident light), e.g.This alternation was repeated 15 times, ending with the deposition of a silicon dioxide film, to obtain a highly reflective film with a thickness of 30nm, to obtain a scintillator array with a multilayer reflective film. The reflectivity of the high-reflection film prepared by the embodiment is as high as 99.98%, and the signal crosstalk among the scintillator strips can be effectively reduced, so that the detection sensitivity, accuracy and reliability are improved.
According to the results of the embodiments 1-2, the invention can deposit the high-reflection film on the surface of the scintillator array prepared by ink-jet printing, so as to obtain the scintillator array with the multilayer reflection film, and the single scintillator strips do not need to be deposited one by one, thereby providing the film coating efficiency on the basis of effectively avoiding signal crosstalk among the scintillator strips, and simplifying the preparation process.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (8)

1.一种带有多层反射膜的闪烁体阵列的制备方法,其特征在于,包括以下步骤:在原位制备的闪烁体阵列表面沉积高反膜,得到带有多层反射膜的闪烁体阵列;所述沉积的方法包括原子层沉积法、物理气相沉积法和化学气相沉积法中的一种或几种。1. a preparation method of the scintillator array with multilayer reflective film is characterized in that, comprises the following steps: deposit high reflective film on the surface of the scintillator array prepared in situ, obtain the scintillator with multilayer reflective film array; the deposition method includes one or more of atomic layer deposition, physical vapor deposition and chemical vapor deposition. 2.根据权利要求1所述的制备方法,其特征在于,当采用原子层沉积法沉积高反膜时,所述原子层沉积的压强为1.333×10-4Pa,温度为80~300℃;2 . The preparation method according to claim 1 , wherein when the high-reflection film is deposited by atomic layer deposition, the pressure of the atomic layer deposition is 1.333×10 -4 Pa and the temperature is 80-300° C. 3 . 当采用物理气相沉积法沉积高反膜时,所述物理气相沉积的压强为1.333×10-4PPa,温度为50~700℃;When the high-reflection film is deposited by the physical vapor deposition method, the pressure of the physical vapor deposition is 1.333×10 -4 PPa, and the temperature is 50-700° C.; 当采用化学气相沉积法沉积高反膜时,所述化学气相沉积的压强为1.333×10-4PPa,温度为180~400℃。When the chemical vapor deposition method is used to deposit the high-reflection film, the pressure of the chemical vapor deposition is 1.333×10 -4 PPa, and the temperature is 180-400°C. 3.根据权利要求1所述的制备方法,其特征在于,所述高反膜的厚度为1nm~100μm。3 . The preparation method according to claim 1 , wherein the thickness of the high-reflection film is 1 nm˜100 μm. 4 . 4.根据权利要求1或3所述的制备方法,其特征在于,所述高反膜包括金属复合膜或多层介质反射膜;4. The preparation method according to claim 1 or 3, wherein the highly reflective film comprises a metal composite film or a multilayer dielectric reflective film; 所述金属复合膜包括金属膜以及设置于所述金属膜外表面的保护膜;The metal composite film includes a metal film and a protective film disposed on the outer surface of the metal film; 所述多层介质反射膜包括依次交替设置的高折射率膜和低折射率膜,与所述闪烁体阵列表面接触的为高折射率膜,最外侧为低折射率膜。The multilayer dielectric reflection film includes a high-refractive index film and a low-refractive-index film alternately arranged in sequence, the high-refractive-index film is in contact with the surface of the scintillator array, and the outermost is a low-refractive-index film. 5.根据权利要求4所述的制备方法,其特征在于,所述金属膜包括铝膜、银膜或金膜;所述保护膜包括二氧化硅膜、氧化铝膜、氧化镁膜或氟化锂膜;5. The preparation method according to claim 4, wherein the metal film comprises an aluminum film, a silver film or a gold film; the protective film comprises a silicon dioxide film, an aluminum oxide film, a magnesium oxide film or a fluoride film Lithium film; 所述低折射率膜包括二氧化硅膜、六氟铝酸钠膜或氟化镁膜;所述高折射率膜包括二氧化锆膜、二氧化钛膜、硫化锌膜或硒化锌膜。The low refractive index film includes a silicon dioxide film, a sodium hexafluoroaluminate film or a magnesium fluoride film; the high refractive index film includes a zirconium dioxide film, a titanium dioxide film, a zinc sulfide film or a zinc selenide film. 6.一种带有多层反射膜的闪烁体阵列,其特征在于,采用权利要求1~5任一项所述制备方法制备得到。6 . A scintillator array with a multilayer reflective film, characterized in that, it is prepared by the preparation method according to any one of claims 1 to 5 . 7.权利要求6所述带有多层反射膜的闪烁体阵列在辐射探测领域中的应用。7. The application of the scintillator array with the multilayer reflective film of claim 6 in the field of radiation detection. 8.根据权利要求7所述的应用,其特征在于,将所述带有多层反射膜的闪烁体阵列用于XCT成像设备或PET成像设备中。8 . The application according to claim 7 , wherein the scintillator array with multilayer reflective films is used in XCT imaging equipment or PET imaging equipment. 9 .
CN201911356229.8A 2019-12-25 2019-12-25 A scintillator array with multi-layer reflective film and its preparation method and application Pending CN111123344A (en)

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CN111883550A (en) * 2020-08-10 2020-11-03 上海大学 a flat panel detector

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CN101893717A (en) * 2010-06-24 2010-11-24 江苏康众数字医疗设备有限公司 Scintillator panel and scintillator composite panel
CN102305937A (en) * 2011-05-25 2012-01-04 上海奕瑞光电子科技有限公司 Scintillator package structure
US20120267539A1 (en) * 2009-12-18 2012-10-25 Toshiba Electron Tubes & Devices Co., Ltd. Radiation Detector and Method for Manufacturing Same
CN107290771A (en) * 2017-07-28 2017-10-24 厦门中烁光电科技有限公司 A kind of method for packing of scintillation crystal array and scintillation crystal array

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040000644A1 (en) * 2000-09-11 2004-01-01 Takuya Homme Scintillator panel, radiation image sensor and methods of producing them
US20120267539A1 (en) * 2009-12-18 2012-10-25 Toshiba Electron Tubes & Devices Co., Ltd. Radiation Detector and Method for Manufacturing Same
CN101893717A (en) * 2010-06-24 2010-11-24 江苏康众数字医疗设备有限公司 Scintillator panel and scintillator composite panel
CN102305937A (en) * 2011-05-25 2012-01-04 上海奕瑞光电子科技有限公司 Scintillator package structure
CN107290771A (en) * 2017-07-28 2017-10-24 厦门中烁光电科技有限公司 A kind of method for packing of scintillation crystal array and scintillation crystal array

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111883550A (en) * 2020-08-10 2020-11-03 上海大学 a flat panel detector
CN111883550B (en) * 2020-08-10 2022-07-01 上海大学 a flat panel detector

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Application publication date: 20200508