CN111116237A - 一种手机后盖用3d氧化锆陶瓷的生产工艺 - Google Patents

一种手机后盖用3d氧化锆陶瓷的生产工艺 Download PDF

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CN111116237A
CN111116237A CN202010041587.6A CN202010041587A CN111116237A CN 111116237 A CN111116237 A CN 111116237A CN 202010041587 A CN202010041587 A CN 202010041587A CN 111116237 A CN111116237 A CN 111116237A
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吴建晓
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Guangdong ATC Technology Co Ltd
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Abstract

本发明公开了一种手机后盖用3D氧化锆陶瓷的生产工艺，其具体包括以下步骤：得到氧化锆陶瓷基材；对氧化锆陶瓷基材的表面打磨抛光；进行精雕处理，得到氧化锆陶瓷基材半成品；进行表面处理，形成图案层；进行电镀处理加工，形成若干电镀层；进行印刷盖底，形成盖底油墨层；初次烘干干燥处理，形成光学镀膜层；进行强化处理，固化形成硬化膜；二次烘干干燥处理，得到成品。本发明通过在氧化锆陶瓷表面制备光学镀膜层，改变氧化锆陶瓷表面的反射和透射特性，减弱或消除灰黄相，美化外观效果，还可以提高透过率，提升外观质感，并且通过对氧化锆陶瓷基材半成品进行表面处理，使得到手机后盖成品制备出需要的各种颜色及图案，使其外观更符合个性化的要求。

Description

一种手机后盖用3D氧化锆陶瓷的生产工艺
技术领域
本发明涉及手机后盖的技术领域，具体涉及一种手机后盖用3D氧化锆陶瓷的生产工艺。
背景技术
在氧化锆陶瓷是一种新型陶瓷材料，具备耐磨、耐腐蚀、高强度、高韧性、热稳定性好等诸多优良特性。与金属和塑料相比，氧化锆陶瓷具有莫氏硬度高、介电常数高、无信号屏蔽且生物相容性好的特点，在智能手机、可穿戴设备上具有广阔的应用前景，这使得氧化锆陶瓷以指纹识别盖板、手机后盖为起点，还将逐步切入移动终端产业链，成为继塑料和金属之后的第三大手机背板材料。
目前的氧化锆陶瓷加工技术存在效率低、加工精度低和成品率低等现象，本发明提供一种高效、高精度、高质量的氧化锆陶瓷加工工艺。且现有的氧化锆粉自身为白色粉末，其所制备的陶瓷自然为白色，目前用于电子设备壳体的氧化锆陶瓷透过率低，视觉上通透感不足，且基本为纯色，其颜色一般比较单一，难以满足用户的个性化需求。
发明内容
本项发明是针对现在的技术不足，提供一种手机后盖用3D氧化锆陶瓷的生产工艺。
本发明为实现上述目的所采用的技术方案是：
一种手机后盖用3D氧化锆陶瓷的生产工艺，具体包括以下步骤：
步骤1、将所述氧化锆陶瓷板材进行切割加工成氧化锆陶瓷基材；
步骤2、将所述氧化锆陶瓷基材的表面打磨整平后抛光，呈现镜面光亮效果；
步骤3、进行精雕内R弧面、凹平面及外R弧面，形成3D雏形并对内R弧面、凹平面及外R弧面进行铜抛处理得到氧化锆陶瓷基材半成品；
步骤4、进行表面处理，通过在氧化锆陶瓷基材半成品涂抹油墨进行UV转印，将纹理图案转印到氧化锆陶瓷基材半成品上，形成图案层；
步骤5、进行电镀处理加工，在图案层上电镀若干电镀层；
步骤6、进行印刷盖底，在电镀层上印刷盖底油墨，形成盖底油墨层；
步骤7、初次烘干干燥处理，在所述氧化锆陶瓷基片半成品的第一表面制备形成光学镀膜层，以提高所述氧化锆陶瓷基片在可见光范围内的透过率，得到氧化锆陶瓷；
步骤8、进行强化处理，在氧化锆陶瓷上喷淋硬化液，固化形成硬化膜；
步骤9、二次烘干干燥处理，得到氧化锆陶瓷手机后盖成品。
作进一步改进，步骤（2）所述的双面研磨过程中研磨分为粗磨和细磨两步进行，粗磨以碳化硼为磨料，细磨用研磨垫，将陶瓷表面加工至Ra3~5µm。
作进一步改进，步骤（3）所述的精雕机加工过程中，加工次序由内及外：用成型磨头对凹槽的内R弧面、凹平面和凸面外R弧面进行磨削，凹平面厚度留有约0.05~0.1mm的加工余量。
作进一步改进，步骤（3）所述的铜抛凸平面过程，加工至凸平面粗糙度Ra80~100nm。
作进一步改进，所述光学镀膜层的材料为氧化硅、氧化钛、氮化硅、锆酸镧以及氧化铌中的任意一种，所述光学镀膜层的厚度为0.5μm～5μm，所述光学镀膜层的透过率和反射率的比例为1/9～9/1。
作进一步改进，所述电镀层的依次电镀顺序为铟层、二氧化硅层和二氧化钛层。
作进一步改进，所述硬化膜的附着力百格测试≥6B，硬度≥4H。
作进一步改进，所述步骤（5）采用的采用真空镀膜法沉积制备，所述真空镀膜法包括电子束蒸发镀、反应磁控溅射镀、热丝蒸发镀以及离子镀中的任意一种。
本发明的有益效果：本发明氧化锆陶瓷基材表面处理前的工艺优化，将研磨分粗磨与细磨两步进行，可以有效的缩短研磨时间，提高加工效率，且保证抛光效果，提高后续加工的效率，并且通过二次烘干干燥，保证光学镀膜层及硬化层稳定贴附在氧化锆陶瓷表面，保证制备出的氧化锆陶瓷手机后盖的外观效果及性能；通过本发明通过在氧化锆陶瓷表面制备光学镀膜层，利用光学镀膜层的光学特性改变氧化锆陶瓷表面的反射和透射特性，可以减弱或消除氧化锆陶瓷本身的灰黄相，美化氧化锆陶瓷的外观效果，还可以提高氧化锆陶瓷在可见光范围内的透过率，提升氧化锆陶瓷的外观质感，并且通过对氧化锆陶瓷基材半成品进行表面处理，使最终得到氧化锆陶瓷手机后盖成品制备出需要的各种颜色及图案，使得到氧化锆陶瓷手机后盖的外观更符合个性化的要求。
下面结合附图与具体实施方式，对本发明进一步说明。
附图说明
图1为本实施例的手机后盖用3D氧化锆陶瓷的生产工艺流程示意图。
具体实施方式
以下所述仅为本发明的较佳实施例，并不因此而限定本发明的保护范围。
实施例，参见附图1，一种手机后盖用3D氧化锆陶瓷的生产工艺，具体包括以下步骤：
步骤1、将所述氧化锆陶瓷板材进行切割加工成氧化锆陶瓷基材；
步骤2、将所述氧化锆陶瓷基材的表面打磨整平后抛光，呈现镜面光亮效果；
步骤3、进行精雕内R弧面、凹平面及外R弧面，形成3D雏形并对内R弧面、凹平面及外R弧面进行铜抛处理得到氧化锆陶瓷基材半成品；
步骤4、进行表面处理，通过在氧化锆陶瓷基材半成品涂抹油墨进行UV转印，将纹理图案转印到氧化锆陶瓷基材半成品上，形成图案层；
步骤5、进行电镀处理加工，在图案层上电镀若干电镀层；
步骤6、进行印刷盖底，在电镀层上印刷盖底油墨，形成盖底油墨层；
步骤7、初次烘干干燥处理，在所述氧化锆陶瓷基片半成品的第一表面制备形成光学镀膜层，以提高所述氧化锆陶瓷基片在可见光范围内的透过率，得到氧化锆陶瓷；
步骤8、进行强化处理，在氧化锆陶瓷上喷淋硬化液，固化形成硬化膜；
步骤9、二次烘干干燥处理，得到氧化锆陶瓷手机后盖成品。
步骤（2）所述的双面研磨过程中研磨分为粗磨和细磨两步进行，粗磨以碳化硼为磨料，细磨用研磨垫，将陶瓷表面加工至Ra3~5µm。
步骤（3）所述的精雕机加工过程中，加工次序由内及外：用成型磨头对凹槽的内R弧面、凹平面和凸面外R弧面进行磨削，凹平面厚度留有约0.05~0.1mm的加工余量。
步骤（3）所述的铜抛凸平面过程，加工至凸平面粗糙度Ra80~100nm。
所述光学镀膜层的材料为氧化硅、氧化钛、氮化硅、锆酸镧以及氧化铌中的任意一种，所述光学镀膜层的厚度为0.5μm～5μm，所述光学镀膜层的透过率和反射率的比例为1/9～9/1。
所述电镀层的依次电镀顺序为铟层、二氧化硅层和二氧化钛层。
所述硬化膜的附着力百格测试≥6B，硬度≥4H。
所述步骤（5）采用的采用真空镀膜法沉积制备，所述真空镀膜法包括电子束蒸发镀、反应磁控溅射镀、热丝蒸发镀以及离子镀中的任意一种。
本发明并不限于上述实施方式，采用与本发明上述实施例相同或近似工艺或方法，而得到的其他用于手机后盖用3D氧化锆陶瓷的生产工艺，均在本发明的保护范围之内。

Claims (8)

1.一种手机后盖用3D氧化锆陶瓷的生产工艺，其特征在于，具体包括以下步骤：
步骤1、将所述氧化锆陶瓷板材进行切割加工成氧化锆陶瓷基材；
步骤2、将所述氧化锆陶瓷基材的表面打磨整平后抛光，呈现镜面光亮效果；
步骤3、进行精雕内R弧面、凹平面及外R弧面，形成3D雏形并对内R弧面、凹平面及外R弧面进行铜抛处理得到氧化锆陶瓷基材半成品；
步骤4、进行表面处理，通过在氧化锆陶瓷基材半成品涂抹油墨进行UV转印，将纹理图案转印到氧化锆陶瓷基材半成品上，形成图案层；
步骤5、进行电镀处理加工，在图案层上电镀若干电镀层；
步骤6、进行印刷盖底，在电镀层上印刷盖底油墨，形成盖底油墨层；
步骤7、初次烘干干燥处理，在所述氧化锆陶瓷基片半成品的第一表面制备形成光学镀膜层，以提高所述氧化锆陶瓷基片在可见光范围内的透过率，得到氧化锆陶瓷；
步骤8、进行强化处理，在氧化锆陶瓷上喷淋硬化液，固化形成硬化膜；
步骤9、二次烘干干燥处理，得到氧化锆陶瓷手机后盖成品。
2.根据权利要求1所述的一种手机后盖用3D氧化锆陶瓷的加工方法，其特征在于：步骤（2）所述的双面研磨过程中研磨分为粗磨和细磨两步进行，粗磨以碳化硼为磨料，细磨用研磨垫，将陶瓷表面加工至Ra3~5µm。
3.根据权利要求2所述的一种手机后盖用3D氧化锆陶瓷的加工方法，其特征在于：步骤（3）所述的精雕机加工过程中，加工次序由内及外：用成型磨头对凹槽的内R弧面、凹平面和凸面外R弧面进行磨削，凹平面厚度留有约0.05~0.1mm的加工余量。
4.根据权利要求3所述的一种手机后盖用3D氧化锆陶瓷的加工方法，其特征在于：步骤（3）所述的铜抛凸平面过程，加工至凸平面粗糙度Ra80~100nm。
5.根据权利要求4所述的一种手机后盖用3D氧化锆陶瓷的加工方法，其特征在于：所述光学镀膜层的材料为氧化硅、氧化钛、氮化硅、锆酸镧以及氧化铌中的任意一种，所述光学镀膜层的厚度为0.5μm～5μm，所述光学镀膜层的透过率和反射率的比例为1/9～9/1。
6.根据权利要求5所述的手机后盖用3D氧化锆陶瓷的生产工艺，其特征在于：所述电镀层的依次电镀顺序为铟层、二氧化硅层和二氧化钛层。
7.根据权利要求6所述的手机后盖用3D氧化锆陶瓷的生产工艺，其特征在于：所述硬化膜的附着力百格测试≥6B，硬度≥4H。
8.根据权利要求7所述的手机后盖用3D氧化锆陶瓷的生产工艺，其特征在于：所述步骤（5）采用的采用真空镀膜法沉积制备，所述真空镀膜法包括电子束蒸发镀、反应磁控溅射镀、热丝蒸发镀以及离子镀中的任意一种。
CN202010041587.6A 2020-01-15 2020-01-15 一种手机后盖用3d氧化锆陶瓷的生产工艺 Pending CN111116237A (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111587000A (zh) * 2020-05-15 2020-08-25 Oppo广东移动通信有限公司 仿陶瓷电子设备壳体及其制备方法和电子设备
CN113824826A (zh) * 2021-09-18 2021-12-21 广东阿特斯科技有限公司 一种3d打印手机背板生产工艺

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111587000A (zh) * 2020-05-15 2020-08-25 Oppo广东移动通信有限公司 仿陶瓷电子设备壳体及其制备方法和电子设备
CN113824826A (zh) * 2021-09-18 2021-12-21 广东阿特斯科技有限公司 一种3d打印手机背板生产工艺
CN113824826B (zh) * 2021-09-18 2023-05-30 广东阿特斯科技有限公司 一种3d打印手机背板生产工艺

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