CN111106509A - Laser heat dissipation device, preparation method thereof and solid laser - Google Patents

Laser heat dissipation device, preparation method thereof and solid laser Download PDF

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Publication number
CN111106509A
CN111106509A CN201911348093.6A CN201911348093A CN111106509A CN 111106509 A CN111106509 A CN 111106509A CN 201911348093 A CN201911348093 A CN 201911348093A CN 111106509 A CN111106509 A CN 111106509A
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China
Prior art keywords
heat transfer
laser
layer
heat
optical high
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CN201911348093.6A
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Chinese (zh)
Inventor
刘杰
谷昊周
程知群
刘艳
董志华
严丽平
周涛
刘国华
李世琦
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Hangzhou Dianzi University
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Hangzhou Dianzi University
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Priority to CN201911348093.6A priority Critical patent/CN111106509A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/042—Arrangements for thermal management for solid state lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/0405—Conductive cooling, e.g. by heat sinks or thermo-electric elements

Abstract

The embodiment of the specification discloses a laser heat dissipation device, a preparation method thereof and a solid laser, wherein the device comprises: a substrate; the optical high-reflection layer is positioned on one surface of the substrate and is provided with a total reflection structure; the heat transfer layer is positioned on the optical high reflection layer and comprises a plurality of heat transfer units which are arranged in an array manner, a heat transfer channel is formed between every two adjacent heat transfer units, and a supporting unit is arranged on each heat transfer unit; the heat transfer layer conducts heat generated by the solid laser out through the plurality of heat transfer units, and meanwhile, the heat generated by the solid laser is diffused out through the heat transfer channels formed in an array type arrangement. Therefore, the heat dissipation effect is effectively improved, the laser reflectivity is improved, and the performance of the laser device is integrally improved.

Description

Laser heat dissipation device, preparation method thereof and solid laser
Technical Field
The specification relates to the field of laser devices, in particular to a laser heat dissipation device, a preparation method of the laser heat dissipation device and a solid laser.
Background
Currently, in the use process of a solid laser, only a small part of input total energy is converted into laser output, and most of the energy is converted into heat of a device and dissipated. Especially the laser crystal heating has the greatest effect on the laser output. These designs with respect to these requirements become the key design for the development of high power lasers, since the larger the input power of the laser, the more severe the thermal effects and the integration of certain mechanical properties and optical structures required for special purpose lasers.
In the prior art, a scheme for solving the problems is provided through a heat dissipation device, but the provided heat dissipation device has a relatively single function, can reduce the reflectivity of laser while dissipating heat, affects the performance of a laser device, and is not excellent enough in heat dissipation effect.
Disclosure of Invention
An object of the embodiments of the present specification is to provide a laser heat dissipation device, a method for manufacturing the same, and a solid laser, so as to effectively improve a heat dissipation effect, improve a laser reflectivity, and improve the performance of a laser device as a whole.
In order to solve the above technical problem, the embodiments of the present specification are implemented as follows:
a laser heat sink comprising:
a substrate; the optical high-reflection layer is positioned on one surface of the substrate and is provided with a total reflection structure; the heat transfer layer is positioned on the optical high reflection layer and comprises a plurality of heat transfer units which are arranged in an array manner, a heat transfer channel is formed between every two adjacent heat transfer units, and a supporting unit is arranged on each heat transfer unit; the heat transfer layer conducts heat generated by the solid laser out through the plurality of heat transfer units, and meanwhile, the heat generated by the solid laser is diffused out through the heat transfer channels formed in an array type arrangement.
Optionally, an aluminum film layer or a heat conducting glue for auxiliary bonding is further disposed between the optical high-reflection layer and the heat transfer layer.
Optionally, the optical high reflection layer adopts a distributed bragg reflector design.
Optionally, the optical high-reflection layer is obtained by compounding a multilayer film prepared by adopting an atomic layer deposition process.
Optionally, the thickness of the film layer of the optical high reflection layer is controllable to obtain different total reflectivity.
Optionally, the heat transfer layer comprises a diamond film and a diamond composite film, wherein the diamond composite film is obtained by compositing copper and diamond according to a certain proportion, and the preset proportion range is 5: 5 to 7: 3, or less.
Optionally, the height of the supporting unit ranges from 5mm to 7 mm.
Optionally, the supporting unit is disposed on the heat transfer unit through a welding process or a mask photolithography process.
A preparation method of a laser heat dissipation device comprises the following steps:
providing a substrate;
forming an optical high-reflection layer with a total reflection structure on one surface of the substrate;
forming a heat transfer layer comprising a plurality of heat transfer units arranged in an array manner on the optical high reflection layer, and forming heat transfer channels between adjacent heat transfer units;
a supporting unit is disposed above each heat transfer unit of the heat transfer layer.
The solid laser comprises the laser heat dissipation device.
As can be seen from the technical solutions provided in the embodiments of the present specification, the embodiments of the present specification can achieve the following technical effects:
the thin film array design is adopted, the difficulty in preparing the large-size diamond thin film plate can be avoided, and the array design can simultaneously dissipate heat through the array heat transfer units and the heat transfer channels under the condition of forced water cooling, so that the heat dissipation effect is obviously superior to that of the integral covering type. And an optical high-reflection structure, namely an optical high-reflection layer, is also integrally designed, so that the total reflection rate of the solid laser is improved by a total reflection structure. In addition, the heat transfer unit is supported in a bearing manner through the supporting unit, so that on one hand, the effect of mechanical support is achieved, on the other hand, the heat dissipation area of the heat transfer unit can be further increased, and the heat dissipation efficiency is effectively improved.
Drawings
In order to more clearly illustrate the embodiments of the present specification or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only some embodiments described in the present specification, and for those skilled in the art, other drawings can be obtained according to the drawings without any creative effort.
Fig. 1 is a schematic structural diagram of a laser heat dissipation device according to an embodiment of the present disclosure.
Fig. 2a and 2b are schematic three-dimensional structures of a laser heat dissipation device according to an embodiment of the present disclosure.
Fig. 3 is a schematic view of a film structure of an optical high-reflection layer provided in an embodiment of the present disclosure.
Fig. 4 is a flowchart illustrating a process for manufacturing a laser heat sink according to an embodiment of the present disclosure.
Detailed Description
In order to make those skilled in the art better understand the technical solutions in the present specification, the technical solutions in the embodiments of the present specification will be clearly and completely described below with reference to the drawings in the embodiments of the present specification, and it is obvious that the described embodiments are only a part of the embodiments of the present specification, and not all of the embodiments. All other embodiments obtained by a person skilled in the art based on the embodiments in the present specification without any inventive step should fall within the scope of protection of the present specification.
Example one
Referring to fig. 1, a schematic structural diagram of a laser heat dissipation device provided in an embodiment of the present disclosure is shown, and in combination with the perspective views shown in fig. 2a and fig. 2b, the laser heat dissipation device may include:
the optical high-reflection film comprises a substrate 101 and an optical high-reflection layer 102 positioned on one surface of the substrate 101, wherein the optical high-reflection layer 102 has a total reflection structure; the heat transfer layer 103 is positioned on the optical antireflection layer 102, the heat transfer layer 103 comprises a plurality of heat transfer units 1031 arranged in an array, a heat transfer channel 1032 is formed between adjacent heat transfer units 1031, and a support unit 104 is arranged on each heat transfer unit 1031; the heat transfer layer 103 conducts heat generated by the solid laser through the plurality of heat transfer units 1031, and simultaneously, diffuses heat generated by the solid laser through the heat transfer channels 1032 formed in an array arrangement.
Considering that modern high-power solid laser has some technical requirements for stress distribution, the scheme of the application adopts a film array design for avoiding the phenomenon of concentrated stress. The array structure can avoid the difficulty in the preparation of the large-size diamond film plate, and the array design can simultaneously dissipate heat through the array heat transfer units and the heat transfer channels under the condition of forced water cooling, so that the heat dissipation effect is obviously superior to that of the integral covering type. Moreover, the improvement of heat sink design has not only been considered in this application scheme, has still integrated the design simultaneously and has had optics high reflection structure, optics high reflection layer promptly to total reflection structure promotes solid laser's total reflectance. In addition, the heat transfer unit is supported in a bearing manner through the supporting unit, so that on one hand, the effect of mechanical support is achieved, on the other hand, the heat dissipation area of the heat transfer unit can be further increased, and the heat dissipation efficiency is effectively improved.
It should be understood that, in the laser heat sink structure shown in fig. 1, the improved design mainly involves three aspects, namely, the mechanical structure design, the thermal structure design and the optical structure design. Among them, in designing the optical structure, the design in a relatively wide band is mainly considered, and a total reflection structure is designed. In the design of thermal and mechanical structures, not only the requirements of thermal conductivity in practical applications, but also the processability of particular materials are taken into consideration.
Optionally, in an embodiment of the present specification, an aluminum film layer or a heat conducting glue for auxiliary bonding is further disposed between the optical high-reflection layer and the heat transfer layer. Specifically, the metallization may be formed on the surfaces of the heat transfer layer and the optical high-reflection layer by an aluminum film, which facilitates the bonding of the optical high-reflection layer and the heat transfer layer, and at the same time, may further enhance the reflectivity. Alternatively, the bonding may be performed by a thermally conductive adhesive to promote effective bonding between the optically high reflective layer and the heat transfer layer.
It should be understood that in the embodiments of the present specification, the optical high reflection layer adopts a distributed bragg reflector design. In particular, in consideration of the fact that the heat emitted from the solid-state laser is desirably totally reflected by the heat-dissipating medium, it is possible to realize an optical high-reflection layer having a high reflection efficiency in order to increase the total reflection.
The optical high reflection layer can be obtained by compounding a multilayer film prepared by adopting an atomic layer deposition process. Wherein, the optical high reflection layer comprises from bottom to top in sequence: metallic aluminum and three periods of distributed Bragg reflector, wherein one period of distributed Bragg reflector is formed by a layer of Al2O3And a layer of TiO2And (4) forming. Wherein the metallic aluminum is in contact with the substrate and the DBR is in contact with the heat transfer layer.
Referring to fig. 3, the optical high reflection layer sequentially includes, from bottom to top, a metal aluminum 301, a first distributed bragg reflector 302, a second distributed bragg reflector 303, and a third distributed bragg reflector 304; the first distributed bragg reflector 302, the second distributed bragg reflector 303 and the third distributed bragg reflector 304 may be the same film structure, and are all made of Al2O3And TiO2And (5) film layer composition.
In the embodiment of the specification, the thickness of the film layer of the optical high-reflection layer can be controlled to obtain different total reflectivities. For example, the thickness of the optical high-reflection layer can be controlled by an Atomic Layer Deposition (ALD) process, so that the reflectivity of the optical high-reflection layer is better, and further, the total reflectivity of the solid laser can be ensured to achieve the best effect. The emissivity of the optical high reflection layer is close to 100% according to experimental determination.
Optionally, the heat transfer layer comprises a diamond film and/or a diamond composite film, wherein the diamond composite film is obtained by mixing copper and diamond in a preset ratio, and the preset ratio range is 5: 5 to 7: 3, wherein the copper is spherical, the purity of the copper powder is 99.5%, and the granularity is 300 meshes; the diamond is artificial diamond particles, the shape of the artificial diamond particles is irregular, the artificial diamond particles are polygons with clear water chestnuts, and the granularity is 275/325 meshes. It is to be understood that the diamond content in the composite material in the present specification is calculated in terms of volume percent. The heat transfer layer is made of a composite material of diamond and copper because the material has higher heat conduction efficiency than elemental copper and is easier to prepare than large-sized diamond. The composite material also well solves the problem of coupling with the laser substrate material, so that the interface thermal resistance is reduced, and the interface thermal conductivity is improved.
Optionally, the height of the support unit ranges from 6mm ± 1 mm. The height of the heat dissipation plate is preferably 6mm, so that the heat dissipation plate can play a role in powerful support on one hand, and a heat transfer channel with a large heat dissipation area can be formed on the other hand, and further the heat dissipation efficiency is improved. Wherein, the shape of the supporting unit can be a cylinder or a columnar structure with other shapes.
The heat transfer channel formed by the supporting unit is combined with the heat transfer channel formed by the heat transfer unit to form a better heat dissipation structure, and simulation results show that the heat sink structure increases the heat exchange efficiency, and the maximum temperature of the heat-reduced material can be reduced by 200 ℃.
Optionally, the supporting unit is disposed on the heat transfer unit through a welding process or a mask lithography process, so as to stably achieve strong coupling between the supporting unit and the heat transfer unit.
Example two
The following describes a preparation scheme of the device in combination with the structure of the laser heat dissipation device. Referring to fig. 4, the preparation method of the laser heat dissipation device mainly includes the following steps:
step 201: a substrate is provided.
In the embodiments of the present disclosure, the substrate may be a laser crystal, such as diamond or glass.
Step 202: and forming an optical high-reflection layer with a total reflection structure on one surface of the substrate.
Specifically, a distributed bragg reflector can be formed on one surface of the substrate by using an atomic layer deposition process ALD, the structure of the optical high-reflection layer can achieve a reflectivity close to 100%, and the thickness of the film layer can be controlled by using the ALD process to realize total reflection effects in different degrees. In particular implementations, multiple thin films may be sequentially prepared using ALD to form an optically highly reflective layer.
Step 203: and forming a heat transfer layer comprising a plurality of heat transfer units arranged in an array manner on the optical high reflection layer, and forming heat transfer channels between the adjacent heat transfer units.
In fact, before step 203 is performed, an aluminum film may be formed on the optical high-reflection layer by sputtering to enhance the surface bonding with the subsequent heat transfer layer. Wherein, the aluminum film can also be replaced by heat-conducting glue.
Step 204: a supporting unit is disposed above each heat transfer unit of the heat transfer layer.
It is to be understood that after the aluminum film is formed, the heat transfer layer and the supporting unit may be formed in two ways;
the first method is as follows:
and arranging a material layer with high heat conduction property on the aluminum film, and then forming a patterned heat transfer layer on the material layer by adopting a mask photoetching process. The patterned heat transfer layer is provided with a plurality of heat transfer units which are arranged in an array mode, and gaps exist between adjacent heat transfer units to form heat transfer channels which can facilitate heat dissipation.
Then, a plurality of supporting units are required to be manufactured, and the material of the supporting units can be the same as that of the heat transfer unit.
Finally, the supporting units are directly welded on the surfaces of the heat transfer units, and each heat transfer unit is welded with one supporting unit, so that a bearing structure is arranged for each heat transfer unit to stably support the heat transfer layer; meanwhile, the heat transfer unit is not required to be directly supported in a water-cooling environment, and the heat dissipation area can be increased through the supporting unit while the heat transfer unit is protected.
The second method comprises the following steps:
and arranging a material layer with high heat conduction property on the aluminum film, wherein the thickness of the material layer in the second mode is thicker than that in the first mode. Then, a plurality of supporting units are formed by adopting a first mask photoetching process, and then a plurality of heat transfer units arranged in an array mode are formed by adopting a second mask photoetching process to form a heat transfer layer.
Through the analysis, the preparation of the heat transfer layer and the support unit by the second mode is easier to realize, and the support unit and the heat transfer unit can be made of the same material and have high thermal conductivity; further, the heat dissipation effect is improved.
As can be seen from one or more embodiments of the present specification, the solid-state laser heat dissipation device is improved mainly by three aspects of design, which respectively include:
thermal design: the diamond and heat sink structure is directly arranged, and water cooling is arranged on one side. The heat sink design is carried out on the diamond, so that a plurality of tiny channels can be formed for heat exchange;
mechanical structure design: adopts a diamond film array design structure. The diamond in direct contact with the quartz glass is not a continuous diamond film. Each small cylinder and the diamond sheet independently form an array unit. The design of the structure has obvious advantages. Firstly, in the technical route, the difficulty of preparing a diamond film plate with large size can be avoided. Secondly, the heat dissipation of the design is obviously superior to that of the prior integral covering mode under the condition of forced water cooling;
designing an optical structure: a transition layer is added to increase the total reflection of the laser, a distributed Bragg reflector can be adopted as the transition layer, the reflectivity of the structure is close to 100%, and the thickness of the reflecting layer can be controlled through an ALD process, so that the total reflectivity of the laser can achieve the best effect.
EXAMPLE III
Meanwhile, the embodiment of the specification further provides a solid-state laser, and the solid-state laser may include the laser heat dissipation device according to any of the above aspects.
It should be understood that the substrate of the laser heat dissipation device can be in contact connection with the laser crystal of the solid laser, and then the laser heat dissipation device is placed in a water-cooling environment with the supporting unit of the laser heat dissipation device as the bottom, the laser crystal is partially on the top, the heat dissipation device is under the bottom, and the heat dissipation device placed in the water-cooling environment works in a working state, so that on one hand, effective heat dissipation is achieved, and on the other hand, a better total reflection effect is ensured.
It should be noted that the thicknesses of the film layers shown in the drawings in the embodiments of the present disclosure are only examples, and are not limiting.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the system embodiment, since it is substantially similar to the method embodiment, the description is simple, and for the relevant points, reference may be made to the partial description of the method embodiment.

Claims (10)

1. A laser heat sink, comprising:
a substrate; the optical high-reflection layer is positioned on one surface of the substrate and is provided with a total reflection structure; the heat transfer layer is positioned on the optical high reflection layer and comprises a plurality of heat transfer units which are arranged in an array manner, a heat transfer channel is formed between every two adjacent heat transfer units, and a supporting unit is arranged on each heat transfer unit; the heat transfer layer conducts heat generated by the solid laser out through the plurality of heat transfer units, and meanwhile, the heat generated by the solid laser is diffused out through the heat transfer channels formed in an array type arrangement.
2. The laser heat sink according to claim 1, wherein an aluminum film layer or a thermal conductive adhesive is further disposed between the optical high-reflection layer and the thermal conductive layer for auxiliary bonding.
3. The laser heat sink of claim 1, wherein the optical high reflection layer is designed with a distributed bragg reflector.
4. The laser heat sink according to any one of claims 1 to 3, wherein the optical high reflective layer is a multilayer thin film composite prepared by an atomic layer deposition process.
5. The laser heat sink of claim 4, wherein the thickness of the optically high reflective layer is controllable to obtain different total reflectivities.
6. The laser heat sink according to claim 1, wherein the heat transfer layer comprises a diamond film and a diamond composite film, wherein the diamond composite film is formed by mixing copper and diamond at a predetermined ratio, and wherein the predetermined ratio is in a range of 5: 5 to 7: 3, or less.
7. The laser heat sink as claimed in claim 1, wherein the height of the supporting unit is in a range of 5mm to 7 mm.
8. The laser heat sink according to claim 1 or 7, wherein the supporting unit is disposed on the heat transfer unit through a welding process or a mask lithography process.
9. A preparation method of a laser heat dissipation device is characterized by comprising the following steps:
providing a substrate;
forming an optical high-reflection layer with a total reflection structure on one surface of the substrate;
forming a heat transfer layer comprising a plurality of heat transfer units arranged in an array manner on the optical high reflection layer, and forming heat transfer channels between adjacent heat transfer units;
a supporting unit is disposed above each heat transfer unit of the heat transfer layer.
10. A solid state laser comprising the laser heat sink of any one of claims 1-8.
CN201911348093.6A 2019-12-24 2019-12-24 Laser heat dissipation device, preparation method thereof and solid laser Pending CN111106509A (en)

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CN108983489A (en) * 2018-07-03 2018-12-11 浙江锦浩光电材料有限公司 A kind of reflectance coating and backlight module of high reflection effect

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