CN111106075A - Fan-out type antenna packaging structure and packaging method - Google Patents
Fan-out type antenna packaging structure and packaging method Download PDFInfo
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- CN111106075A CN111106075A CN201811259793.3A CN201811259793A CN111106075A CN 111106075 A CN111106075 A CN 111106075A CN 201811259793 A CN201811259793 A CN 201811259793A CN 111106075 A CN111106075 A CN 111106075A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention provides a fan-out type antenna packaging structure and a packaging method, wherein in the fan-out type antenna packaging method, the front surface of a semiconductor chip is jointed to the upper surface of a separation layer; the side surface and the bottom surface of the semiconductor chip are coated by the packaging layer; separating the encapsulation layer based on the separation layer to expose the front surface of the semiconductor chip; the rewiring layer is electrically connected with the semiconductor chip; forming at least two layers of antenna structures stacked on the upper surface of the rewiring layer, wherein the antenna structures are electrically connected with the rewiring layer; forming a through hole through the packaging layer, wherein the through hole leaks the metal wiring layer in the rewiring layer; and forming a metal bump electrically connected with the metal wiring layer through the through hole. The production cost can be reduced, and a fan-out type antenna packaging structure with a multi-layer antenna structure and high integration is formed in a stacked mode; the performance of the fan-out antenna packaging structure is improved through the antenna structure and the semiconductor chip which are positioned on the two sides of the rewiring layer.
Description
Technical Field
The invention belongs to the technical field of semiconductor packaging, and relates to a fan-out type antenna packaging structure and a packaging method.
Background
Lower cost, more reliable, faster, and higher density circuits are sought after goals for integrated circuit packaging. In the future, integrated circuit packages will increase the integration density of various electronic components by ever decreasing feature sizes. Currently, common packaging methods include: wafer Level Chip Scale Packaging (WLCSP), Fan-Out Wafer Level Packaging (Fan-Out Wafer Level Package, FOWLP), Flip Chip (Flip Chip), stack on Packaging (POP), and the like. Among them, FOWLP is one of the more common packaging methods because of its more input/output ports (I/O) and better integration flexibility.
With the popularization of high-tech electronic products and the increase of the demands of people, especially for matching with the demands of movement, most of high-tech electronic products have increased wireless communication functions.
Generally, the conventional antenna structure is usually manufactured by directly manufacturing the antenna on the surface of the circuit board, which causes the antenna to occupy additional circuit board area, and has poor integration and high cost. For various high-tech electronic products, if the antenna is directly fabricated on the surface of the circuit board, a circuit board with a larger volume is required, so that the high-tech electronic products also occupy a larger volume, which is contrary to the requirements of people for miniaturization and convenience of the high-tech electronic products, and therefore, how to reduce the volume of the antenna packaging structure, improve the integration performance of the antenna packaging structure, and reduce the production cost is a problem to be overcome by these electronic devices.
In view of the above, a new fan-out antenna package structure and a new packaging method are needed to solve the above problems of the antenna package structure.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a fan-out antenna package structure and a package method thereof, which are used to solve the problems of the prior art that the antenna package structure has a large volume, low integration performance and high production cost.
To achieve the above and other related objects, the present invention provides a fan-out antenna packaging method, comprising:
providing a support substrate, and forming a separation layer on the support substrate;
providing a semiconductor chip, and bonding the front surface of the semiconductor chip to the upper surface of the separation layer;
the side face and the bottom face of the semiconductor chip are coated by a packaging layer, and the packaging layer comprises a first face and an opposite second face, wherein the first face is in contact with the separation layer;
separating the encapsulation layer based on the separation layer to expose the front surface of the semiconductor chip;
forming a rewiring layer on the first surface of the packaging layer, wherein the rewiring layer is electrically connected with the semiconductor chip;
forming at least two layers of antenna structures stacked on the upper surface of the redistribution layer, wherein the antenna structures are electrically connected with the redistribution layer;
forming a through hole through the packaging layer, wherein the through hole leaks the metal wiring layer in the rewiring layer;
and forming a metal bump electrically connected with the metal wiring layer through the through hole.
Optionally, the upper surface of the redistribution layer comprises N layers of the antenna structure, wherein N ≧ 3.
Optionally, the separating layer comprises an adhesive tape that decreases in viscosity under heat or light.
Optionally, the range of the warpage of the formed fan-out antenna package structure includes 0.1mm to 3.0 mm.
Optionally, the method for forming the through hole includes one or a combination of a laser drilling method and a dry etching method.
Optionally, the antenna structure includes an antenna metal connection post, an antenna encapsulation layer, and an antenna metal layer.
Optionally, the antenna metal connection column is covered by the antenna packaging layer and leaks, and the antenna metal layer is located on the upper surface of the antenna packaging layer and electrically connected with the antenna metal connection column.
Optionally, the encapsulation layer and the antenna encapsulation layer include an epoxy molding compound layer.
Optionally, the range of the thickness of the antenna structure includes 50 μm to 1000 μm.
Optionally, the metal bump protrudes from the through hole.
The invention also provides a fan-out antenna packaging structure, which comprises:
a rewiring layer including opposing first and second faces;
at least two layers of antenna structures arranged in a stacked manner, wherein the antenna structures are positioned on the second surface of the rewiring layer and are electrically connected with the metal wiring layer in the rewiring layer;
a semiconductor chip located on a first face of the rewiring layer, a front face of the semiconductor chip being electrically connected to the rewiring layer;
the packaging layer wraps the side face and the bottom face of the semiconductor chip and comprises a through hole which leaks the metal wiring layer;
and the metal bump is electrically connected with the metal wiring layer through the through hole.
Optionally, the second surface of the redistribution layer includes N stacked antenna structures, where N ≧ 3.
Optionally, the range of the warpage of the fan-out antenna package structure includes 0.1mm to 3.0 mm.
Optionally, the range of the thickness of the antenna structure includes 50 μm to 1000 μm.
Optionally, the antenna structure includes an antenna metal connection post, an antenna encapsulation layer, and an antenna metal layer.
Optionally, the antenna metal connection column is covered by the antenna packaging layer and leaks on the upper surface of the antenna metal connection column, and the antenna metal layer is located on the upper surface of the antenna packaging layer and is electrically connected with the antenna metal connection column.
Optionally, the encapsulation layer and the antenna encapsulation layer include an epoxy molding compound layer.
Optionally, the metal bump protrudes from the through hole.
As described above, the fan-out antenna packaging method of the present invention can reduce the production cost, and form a stacked fan-out antenna packaging structure with a multi-layer antenna structure and high integrity; the performance of the fan-out antenna packaging structure is improved through the antenna structure and the semiconductor chip which are positioned on the two sides of the rewiring layer.
Drawings
Fig. 1 is a flow chart illustrating a fan-out antenna packaging method according to the present invention.
Fig. 2 to 16 are schematic structural diagrams of steps of the fan-out antenna packaging method of the present invention, wherein fig. 16 is a schematic structural diagram of the fan-out antenna packaging structure of the present invention.
Description of the element reference numerals
101 supporting substrate
102 separating layers
103 semiconductor chip
104 encapsulation layer
105 rewiring layer
115 dielectric layer
125 metal wiring layer
106 first antenna structure
116 first antenna metal connection block
126 metal connection post for first antenna
136 first antenna encapsulation layer
146 first antenna metal layer
107 second antenna structure
117 second antenna metal connection block
127 second antenna metal connection post
137 second antenna packaging layer
147 second antenna metal layer
108 through hole
109 metal bump
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 1 to 16. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.
Example one
As shown in fig. 1, the present embodiment provides a fan-out antenna packaging method, which includes the following steps:
providing a support substrate, and forming a separation layer on the support substrate;
providing a semiconductor chip, and bonding the front surface of the semiconductor chip to the upper surface of the separation layer;
the side face and the bottom face of the semiconductor chip are coated by a packaging layer, and the packaging layer comprises a first face and an opposite second face, wherein the first face is in contact with the separation layer;
separating the encapsulation layer based on the separation layer to expose the front surface of the semiconductor chip;
forming a rewiring layer on the first surface of the packaging layer, wherein the rewiring layer is electrically connected with the semiconductor chip;
forming at least two layers of antenna structures stacked on the upper surface of the redistribution layer, wherein the antenna structures are electrically connected with the redistribution layer;
forming a through hole through the packaging layer, wherein the through hole leaks the metal wiring layer in the rewiring layer;
and forming a metal bump electrically connected with the metal wiring layer through the through hole.
The fan-out antenna packaging method can reduce the production cost, and form a stacked fan-out antenna packaging structure with a multi-layer antenna structure and high integration; the performance of the fan-out antenna packaging structure is improved through the antenna structure and the semiconductor chip which are positioned on the two sides of the rewiring layer.
Fig. 2 to 16 are schematic structural diagrams showing steps of the fan-out antenna packaging method in this embodiment.
As shown in fig. 2, a supporting substrate 101 is provided, and a separation layer 102 is formed on the supporting substrate 101.
As a further embodiment of this embodiment, the separation layer 102 includes an adhesive tape with reduced viscosity under heat or light, so as to facilitate the operation of the subsequent process and reduce the production cost.
Specifically, the separation layer 102 may include a foaming agent, and the foaming agent may include sodium carbonate, sodium bicarbonate, an azo compound, a sulfonyl hydrazide compound, or a nitroso compound, but is not limited to these enumerated examples. Under the heating condition, the separation layer 102 can generate bubbles so as to expand the separation layer 102, reduce the bonding strength of the separation layer 102, and facilitate the operation of the subsequent process. The separation layer 102 may be heated to a volume expansion range of 1% to 15%, such as 10%. The separation layer 102 may also include a tape with reduced viscosity under light, such as a UV film with reduced viscosity under UV light irradiation, which may be cured to a solid state under UV light irradiation, thereby dimensionally shrinking the separation layer 102, reducing the adhesive strength of the separation layer 102, and the volume shrinkable range of the UV film includes 5% to 10%, such as 8%. The supporting base 101 may include one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate, and a ceramic substrate, which is not limited herein.
As shown in fig. 3, a semiconductor chip 103 is provided, and the front surface of the semiconductor chip 103 is bonded to the upper surface of the separation layer 102.
Specifically, the separation layer 102 is preferably an adhesive tape with two adhesive surfaces, and the bonding strength between the separation layer 102 and the support substrate 101 is greater than the bonding strength between the separation layer and the semiconductor chip 103, so that the semiconductor chip 103 can be directly bonded to the upper surface of the separation layer 102, and the subsequent separation process is facilitated, thereby reducing the process complexity and saving the cost.
As shown in fig. 4, the side and bottom surfaces of the semiconductor chip 103 are covered with an encapsulation layer 104, and the encapsulation layer 104 includes a first surface in contact with the separation layer 102 and an opposite second surface.
Specifically, the material of the encapsulation layer 104 may include one of epoxy resin, polyimide, and silicone. The present embodiment preferably uses a common epoxy molding compound as the packaging layer 104. The thickness of the encapsulation layer 104 can be selected according to specific needs, such as 100 μm to 1000 μm, and is not limited herein.
As shown in fig. 5, the encapsulation layer 104 is separated based on the separation layer 102 to expose the front surface of the semiconductor chip 103. Then, as shown in fig. 6, a redistribution layer 105 is formed on the first surface of the packaging layer 104, and the redistribution layer 105 is electrically connected to the front surface of the semiconductor chip 103.
Specifically, the redistribution layer 105 includes a dielectric layer 115 and a metal wiring layer 125. The fabrication of the redistribution layer 105 includes the following steps: forming the dielectric layer 115 on the first surface of the encapsulation layer 104 by using a physical vapor deposition process or a chemical vapor deposition process, and etching the dielectric layer 115 to form the patterned dielectric layer 115; and then forming the metal wiring layer 125 on the surface of the patterned dielectric layer 115 by adopting a physical vapor deposition process, a chemical vapor deposition process, an evaporation process, a sputtering process, an electroplating process or a chemical plating process, and etching the metal wiring layer 125 to form the patterned metal wiring layer 125. The dielectric layer 115 is made of one or a combination of two or more of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass, and fluorine-containing glass, and is preferably made of a common epoxy resin material, so that the sealing layer 104 has good bonding performance, and the warping degree of the product is reduced. The material of the metal wiring layer 125 includes one or a combination of two or more of copper, aluminum, nickel, gold, silver, and titanium. The number of layers and the distribution morphology of the metal wiring layer 125 in the redistribution layer 105 may be selected according to specific needs, and are not limited herein.
As shown in fig. 7 to 14, at least two antenna structures stacked on the redistribution layer 105 are formed on the upper surface of the redistribution layer 105, and the antenna structures are electrically connected to the metal wiring layer 125 in the redistribution layer 105.
As a further embodiment of this embodiment, the upper surface of the redistribution layer 105 includes N layers of the antenna structure arranged in a stack, where N ≧ 3, so as to further improve the integration level and the integration performance of the fan-out antenna package structure.
Specifically, in the present embodiment, N is 2, that is, the antenna structure includes 2 stacked layers, including the first antenna structure 106 and the second antenna structure 107, and in another embodiment, N ≧ 3 stacked layers, such as 4 layers, 5 layers, and the like, which is not limited herein.
As a further embodiment of this embodiment, the antenna structure includes an antenna metal connection post, an antenna encapsulation layer, and an antenna metal layer.
Specifically, as shown in fig. 7 to 10, schematic structural diagrams of steps of forming the first antenna structure 106 are illustrated. The first antenna structure 106 includes a first antenna metal connection post 126, a first antenna encapsulation layer 136, and a first antenna metal layer 146, wherein the first antenna metal connection post 126 is electrically connected to the metal wiring layer 125 in the redistribution layer 105; the first antenna encapsulation layer 136 covers the first antenna metal connection post 126 and leaks the upper surface of the first antenna metal connection post 126; the first antenna metal layer 146 is located on the upper surface of the first antenna encapsulation layer 136 and is electrically connected with the first antenna metal connection post 126; thereby forming the first antenna structure 106.
As a further embodiment of this embodiment, the method for forming the first antenna metal connection pillar 126 includes a wire bonding process, such as one of a thermocompression bonding process, an ultrasonic bonding process, and a thermocompression ultrasonic bonding process. The material of the first antenna metal connection post 126 includes one or a combination of Au, Ag, Cu, Al.
As a further embodiment of this embodiment, the first antenna encapsulation layer 136 includes an epoxy molding layer, so as to form a good bonding performance with the redistribution layer 105, and further reduce the warpage of the product. The method for forming the first antenna package layer 136 includes one of compression molding, transfer molding, liquid encapsulation molding, vacuum lamination and spin coating, and the material of the first antenna package layer 136 may further include one of polyimide and silicone, which may be selected according to specific needs. After the first antenna packaging layer 136 is formed, a grinding or polishing method may be used to act on the upper surface of the first antenna packaging layer 136 to provide a flat first antenna packaging layer 136, thereby improving the product quality.
As a further embodiment of this embodiment, the method for forming the first antenna metal layer 146 includes one of a physical vapor deposition process, a chemical vapor deposition process, an evaporation process, a sputtering process, an electroplating process, or an electroless plating process. After the first antenna metal layer 146 is formed on the upper surface of the first antenna encapsulation layer 136, an etching process may be used to form the first antenna metal layer 146 with a desired pattern.
As shown in fig. 11 to 14, the structure diagrams of the steps of the second antenna structure 107 are illustrated. The second antenna structure 107 includes a second antenna metal connection post 127, a second antenna encapsulation layer 137 and a second antenna metal layer 147, wherein the second antenna metal connection post 127 is electrically connected to the first antenna metal layer 146 of the first antenna structure 106; the second antenna encapsulation layer 137 covers the second antenna metal connection post 127 and leaks the upper surface of the second antenna metal connection post 127; the second antenna metal layer 147 is located on the upper surface of the second antenna encapsulation layer 137 and is electrically connected to the second antenna metal connection post 127; thereby forming the second antenna structure 107. The specific method and material for forming the second antenna metal connection stud 127 and the second antenna metal layer 147 are the same as the first antenna structure 106, and are not described herein again.
As a further embodiment of this embodiment, the second antenna packaging layer 137 includes an epoxy molding layer, so as to form a good bonding performance with the first antenna packaging layer 136, and further reduce the warpage of the product. The method for forming the second antenna encapsulation layer 137 includes one of compression molding, transfer molding, liquid seal molding, vacuum lamination and spin coating, and the material of the second antenna encapsulation layer 137 may further include one of polyimide and silica gel, which may be selected according to specific needs. After the second antenna encapsulation layer 137 is formed, a grinding or polishing method may be used to act on the upper surface of the second antenna encapsulation layer 137, so as to provide a flat second antenna encapsulation layer 137 and improve the product quality.
As a further embodiment of this embodiment, the thickness of the antenna structure ranges from 50 μm to 1000 μm, such as 100 μm, 500 μm, and the like, and can be selected according to specific needs, and is not limited herein.
As a further embodiment of the embodiment, the range of the warpage of the fan-out antenna package structure formed includes 0.1mm to 3.0 mm.
Specifically, the package layer 104, the dielectric layer 115, the first antenna package layer 136, and the second antenna package layer 137 are made of epoxy resin materials with the same material, so that the warpage of the fan-out antenna package structure can be reduced, and the range of the warpage of the fan-out antenna package structure includes 0.1mm to 3.0mm, such as 0.5mm, 1.0mm, and 2.0 mm.
As a further embodiment of this embodiment, the antenna metal connection column may further include an antenna metal connection block having a cross-sectional area larger than that of the antenna metal connection column, such as the first antenna metal connection block 116 located between the first antenna metal connection column 126 and the metal wiring layer 125 and the second antenna metal connection block 117 located between the second antenna metal connection column 127 and the first antenna metal layer 146, so as to increase a contact area and improve electrical stability.
Next, as shown in fig. 15, a via 108 is formed through the encapsulation layer 104, the via 108 leaking the metal wiring layer 125 in the redistribution layer 105, and the specific shape and size of the via 108 are not limited herein.
As a further embodiment of this embodiment, the method for forming the through hole 108 may include one or a combination of a laser drilling method and a dry etching method. In this embodiment, a laser drilling method which is easy to operate and inexpensive is preferable, so that the production cost can be further reduced.
Finally, as shown in fig. 16, a metal bump 109 electrically connected to the metal wiring layer 125 is formed through the via 108. The metal bump 109 includes one of a copper metal bump, a nickel metal bump, a tin metal bump, and a silver metal bump, which is not limited herein. The metal bump 109 preferably protrudes from the through hole 108, so as to facilitate connection of subsequent circuits and reduce process complexity.
Example two
To further enable those skilled in the art to understand the advantages and effects of the present invention, fig. 16 is a schematic structural diagram illustrating a fan-out antenna package structure according to the present invention, the package structure includes:
a rewiring layer 105, the rewiring layer 105 including a first surface and a second surface opposite to each other;
at least two layers of antenna structures arranged in a stack, the antenna structures being located on a second side of the redistribution layer 105 and electrically connected to the metal wiring layer 125 in the redistribution layer 105;
a semiconductor chip 103 located on a first face of the rewiring layer 105, a front face of the semiconductor chip 103 being electrically connected to the rewiring layer 105;
the packaging layer 104, the packaging layer 104 wraps the side surface and the bottom surface of the semiconductor chip 103, and the packaging layer 104 includes a through hole 108 which leaks the metal wiring layer 125;
a metal bump 109, wherein the metal bump 109 is electrically connected to the metal wiring layer 125 through the via 108.
The embodiment can form a fan-out type antenna packaging structure with a multi-layer antenna structure and high integration in a stacking arrangement; the performance of the fan-out antenna packaging structure is improved through the antenna structure and the semiconductor chip which are positioned on the two sides of the rewiring layer.
Specifically, the material of the encapsulation layer 104 may include one of epoxy resin, polyimide, and silicone. The present embodiment preferably uses a common epoxy molding compound as the packaging layer 104. The thickness of the encapsulation layer 104 can be selected according to specific needs, such as 100 μm to 1000 μm, and is not limited herein. The redistribution layer 105 includes a dielectric layer 115 and a metal routing layer 125. The material of the dielectric layer 115 includes one or a combination of two or more of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass, and fluorine-containing glass, and is preferably a common epoxy resin material, so that the dielectric layer has good bonding performance with the encapsulation layer 104, and the warping degree of the product is reduced. The material of the metal wiring layer 125 includes one or a combination of two or more of copper, aluminum, nickel, gold, silver, and titanium. The number of layers and the distribution morphology of the metal wiring layer 125 in the redistribution layer 105 may be selected according to specific needs, and are not limited herein.
As a further embodiment of this embodiment, the upper surface of the redistribution layer 105 includes N layers of the antenna structure arranged in a stack, where N ≧ 3, so as to further improve the integration level and the integration performance of the fan-out antenna package structure.
Specifically, in the present embodiment, N is 2, that is, the antenna structure includes 2 stacked layers, including the first antenna structure 106 and the second antenna structure 107, and in another embodiment, N ≧ 3 stacked layers, such as 4 layers, 5 layers, and the like, which is not limited herein.
As a further embodiment of this embodiment, the antenna structure includes an antenna metal connection post, an antenna encapsulation layer, and an antenna metal layer.
Specifically, as shown in fig. 7 to 10, schematic structural diagrams of steps of forming the first antenna structure 106 are illustrated. The first antenna structure 106 includes a first antenna metal connection post 126, a first antenna encapsulation layer 136, and a first antenna metal layer 146, wherein the first antenna metal connection post 126 is electrically connected to the metal wiring layer 125 in the redistribution layer 105; the first antenna encapsulation layer 136 covers the first antenna metal connection post 126 and leaks the upper surface of the first antenna metal connection post 126; the first antenna metal layer 146 is located on the upper surface of the first antenna encapsulation layer 136 and is electrically connected with the first antenna metal connection post 126; thereby forming the first antenna structure 106.
As a further embodiment of this embodiment, the first antenna encapsulation layer 136 includes an epoxy molding layer, so as to form a good bonding performance with the redistribution layer 105, and further reduce the warpage of the product. The material of the first antenna encapsulation layer 136 may further include one of polyimide and silicone, which may be selected according to specific needs.
As shown in fig. 11 to 14, the structure diagrams of the steps of the second antenna structure 107 are illustrated. The second antenna structure 107 includes a second antenna metal connection post 127, a second antenna encapsulation layer 137 and a second antenna metal layer 147, wherein the second antenna metal connection post 127 is electrically connected to the first antenna metal layer 146 of the first antenna structure 106; the second antenna encapsulation layer 137 covers the second antenna metal connection post 127 and leaks the upper surface of the second antenna metal connection post 127; the second antenna metal layer 147 is located on the upper surface of the second antenna encapsulation layer 137 and is electrically connected to the second antenna metal connection post 127; thereby forming the second antenna structure 107.
As a further embodiment of this embodiment, the second antenna packaging layer 137 includes an epoxy molding layer, so as to form a good bonding performance with the first antenna packaging layer 136, and further reduce the warpage of the product. The material of the second antenna encapsulation layer 137 may further include one of polyimide and silicone, which may be selected according to specific needs.
As a further embodiment of this embodiment, the thickness of the antenna structure ranges from 50 μm to 1000 μm, such as 100 μm, 500 μm, and the like, and can be selected according to specific needs, and is not limited herein.
As a further embodiment of the embodiment, the range of the warpage of the fan-out antenna package structure formed includes 0.1mm to 3.0 mm.
Specifically, the package layer 104, the dielectric layer 115, the first antenna package layer 136, and the second antenna package layer 137 are made of epoxy resin materials with the same material, so that the warpage of the fan-out antenna package structure can be reduced, and the range of the warpage of the fan-out antenna package structure includes 0.1mm to 3.0mm, such as 0.5mm, 1.0mm, and 2.0 mm.
As a further embodiment of this embodiment, the antenna metal connection column may further include an antenna metal connection block having a cross-sectional area larger than that of the antenna metal connection column, such as the first antenna metal connection block 116 located between the first antenna metal connection column 126 and the metal wiring layer 125 and the second antenna metal connection block 117 located between the second antenna metal connection column 127 and the first antenna metal layer 146, so as to increase a contact area and improve electrical stability.
As a further embodiment of the embodiment, the metal bump 109 includes one of a copper metal bump, a nickel metal bump, a tin metal bump, and a silver metal bump, which is not limited herein. The metal bump 109 preferably protrudes from the through hole 108, so as to facilitate connection of subsequent circuits and reduce process complexity.
In summary, the fan-out antenna packaging method of the present invention can reduce the production cost, and form a stacked fan-out antenna packaging structure with a multi-layer antenna structure and high integrity; the performance of the fan-out antenna packaging structure is improved through the antenna structure and the semiconductor chip which are positioned on the two sides of the rewiring layer. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (18)
1. A fan-out antenna packaging method is characterized by comprising the following steps:
providing a support substrate, and forming a separation layer on the support substrate;
providing a semiconductor chip, and bonding the front surface of the semiconductor chip to the upper surface of the separation layer;
the side face and the bottom face of the semiconductor chip are coated by a packaging layer, and the packaging layer comprises a first face and an opposite second face, wherein the first face is in contact with the separation layer;
separating the encapsulation layer based on the separation layer to expose the front surface of the semiconductor chip;
forming a rewiring layer on the first surface of the packaging layer, wherein the rewiring layer is electrically connected with the semiconductor chip;
forming at least two layers of antenna structures stacked on the upper surface of the redistribution layer, wherein the antenna structures are electrically connected with the redistribution layer;
forming a through hole through the packaging layer, wherein the through hole leaks the metal wiring layer in the rewiring layer;
and forming a metal bump electrically connected with the metal wiring layer through the through hole.
2. The fan-out antenna packaging method of claim 1, wherein: the upper surface of the rewiring layer comprises N layers of the antenna structures which are arranged in a stacking mode, wherein N is larger than or equal to 3.
3. The fan-out antenna packaging method of claim 1, wherein: the separating layer comprises an adhesive tape that decreases in viscosity under heat or light.
4. The fan-out antenna packaging method of claim 1, wherein: the range of the warping degree of the formed fan-out type antenna packaging structure comprises 0.1 mm-3.0 mm.
5. The fan-out antenna packaging method of claim 1, wherein: the method for forming the through hole comprises one or a combination of a laser drilling method and a dry etching method.
6. The fan-out antenna packaging method of claim 1, wherein: the antenna structure comprises an antenna metal connecting column, an antenna packaging layer and an antenna metal layer.
7. The fan-out antenna packaging method of claim 6, wherein: the antenna metal connecting column is arranged on the upper surface of the antenna metal connecting column, the antenna metal layer is arranged on the upper surface of the antenna packaging layer and is electrically connected with the antenna metal connecting column.
8. The fan-out antenna packaging method of claim 6, wherein: the packaging layer and the antenna packaging layer comprise epoxy plastic packaging layers.
9. The fan-out antenna packaging method of claim 1, wherein: the range of the thickness of the antenna structure includes 50 μm to 1000 μm.
10. The fan-out antenna packaging method of claim 1, wherein: the metal bump protrudes out of the through hole.
11. A fan-out antenna package, the package comprising:
a rewiring layer including opposing first and second faces;
at least two layers of antenna structures arranged in a stacked manner, wherein the antenna structures are positioned on the second surface of the rewiring layer and are electrically connected with the metal wiring layer in the rewiring layer;
a semiconductor chip located on a first face of the rewiring layer, a front face of the semiconductor chip being electrically connected to the rewiring layer;
the packaging layer wraps the side face and the bottom face of the semiconductor chip and comprises a through hole which leaks the metal wiring layer;
and the metal bump is electrically connected with the metal wiring layer through the through hole.
12. The fan-out antenna package structure of claim 11, wherein: the second surface of the rewiring layer comprises N layers of stacked antenna structures, wherein N is larger than or equal to 3.
13. The fan-out antenna package structure of claim 11, wherein: the range of the warping degree of the fan-out type antenna packaging structure comprises 0.1 mm-3.0 mm.
14. The fan-out antenna package structure of claim 11, wherein: the range of the thickness of the antenna structure includes 50 μm to 1000 μm.
15. The fan-out antenna package structure of claim 11, wherein: the antenna structure comprises an antenna metal connecting column, an antenna packaging layer and an antenna metal layer.
16. The fan-out antenna package structure of claim 15, wherein: the antenna packaging layer covers the antenna metal connecting column and leaks the upper surface of the antenna metal connecting column, and the antenna metal layer is located on the upper surface of the antenna packaging layer and is electrically connected with the metal connecting column.
17. The fan-out antenna package structure of claim 15, wherein: the packaging layer and the antenna packaging layer comprise epoxy plastic packaging layers.
18. The fan-out antenna package structure of claim 15, wherein: the metal bump protrudes out of the through hole.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811259793.3A CN111106075A (en) | 2018-10-26 | 2018-10-26 | Fan-out type antenna packaging structure and packaging method |
| US16/412,949 US11211343B2 (en) | 2018-10-26 | 2019-05-15 | Fan-out antenna packaging structure and packaging method |
| US17/531,059 US11605604B2 (en) | 2018-10-26 | 2021-11-19 | Fan-out antenna packaging structure and packaging method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811259793.3A CN111106075A (en) | 2018-10-26 | 2018-10-26 | Fan-out type antenna packaging structure and packaging method |
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| CN111106075A true CN111106075A (en) | 2020-05-05 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114006160A (en) * | 2021-10-29 | 2022-02-01 | 京东方科技集团股份有限公司 | Liquid crystal antenna and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114006160A (en) * | 2021-10-29 | 2022-02-01 | 京东方科技集团股份有限公司 | Liquid crystal antenna and preparation method thereof |
| CN114006160B (en) * | 2021-10-29 | 2024-04-16 | 京东方科技集团股份有限公司 | Liquid crystal antenna and preparation method thereof |
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