CN111102398B - Microvalve and method of making same - Google Patents
Microvalve and method of making same Download PDFInfo
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- CN111102398B CN111102398B CN201811270104.9A CN201811270104A CN111102398B CN 111102398 B CN111102398 B CN 111102398B CN 201811270104 A CN201811270104 A CN 201811270104A CN 111102398 B CN111102398 B CN 111102398B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K99/0001—Microvalves
- F16K99/0003—Constructional types of microvalves; Details of the cutting-off member
Abstract
The invention provides a micro valve and a manufacturing method thereof, wherein the micro valve comprises a micro valve main body, the inner side of the micro valve main body is provided with a braking cavity, a plurality of inner rib structures are arranged in the braking cavity, and the braking cavity is connected with a valve port structure; the plurality of inner rib structures are connected through exhaust grooves, and the exhaust grooves are communicated with the valve port structures to discharge air in the micro valve. The technical scheme of the invention effectively solves the problems that bubbles in the micro valve in the prior art need to be discharged and need to pass through the cavity of the swing arm, and the bubbles generate fluctuation to the inner rib structure due to pressure change, thereby affecting the performance of the micro valve.
Description
Technical Field
The invention relates to the technical field of fluid control valves, in particular to a micro valve and a manufacturing method thereof.
Background
The micro valve is generally a thermal expansion type micro valve, and the main principle is that a metal heater in a cavity is used for heating to expand a closed cavity, so that an elastic diaphragm in the cavity deforms and bends to further block or partially block a channel, and the on-off or intermediate state control of a fluid channel is completed.
In such conventional microvalve structures, it has been found that in some cases, a small amount of air may be present in the microvalve. If this air is not purged from the microvalve, it may cause undesirable disturbances in the effective operation of the microvalve. To address this situation, it is known to operate the microvalve rapidly between open and closed positions when the microvalve is initially opened to purge all air trapped therein from the microvalve. However, such initial operation of the microvalve is also inefficient.
As shown in fig. 1 to 6, the conventional microvalve includes a base plate, an intermediate plate and a cover plate, wherein the base plate, the intermediate plate and the cover plate cooperate to form a stopper cavity. The brake cavity has including stopper swing arm cavity, specifically, be provided with a plurality of swing arms that can warp on the intermediate lamella, these swing arms have elasticity also can be called elastic diaphragm, also can be called interior rib structure because of it is similar with the structure of rib, the swing arm cavity is in the position of a plurality of swing arms just, bubble in the microvalve wants to discharge needs to pass through the swing arm cavity, but elastic deformation appears in the swing arm easily, when the bubble passes through, because of the pressure variation that the bubble produced can lead to the fact the fluctuation of different degrees to a plurality of swing arms, and then influence the stability of microvalve, harm the swing arm even. Because the swing arms are arranged at intervals and are not communicated with each other, the swing arms are further damaged due to uneven pressure among the swing arms generated by bubbles passing through the cavity of the swing arms, and the service life of the micro valve is shortened.
Disclosure of Invention
The invention mainly aims to provide a micro valve and a manufacturing method thereof, and aims to solve the problems that bubbles in the micro valve in the prior art need to be discharged and need to pass through a cavity of a swing arm, and the bubbles generate fluctuation on an inner rib structure due to pressure change, so that the performance of the micro valve is influenced.
In order to achieve the above object, according to one aspect of the present invention, there is provided a microvalve including a microvalve body, a braking cavity provided inside the microvalve body, a plurality of inner rib structures provided inside the braking cavity, the braking cavity being connected to a valve port structure; the inner rib structures are connected through the exhaust grooves, and the exhaust grooves are communicated with the valve port structures to discharge air in the micro valve.
Further, a plurality of inner rib structures are arranged to form a fish-rib structure, the exhaust grooves communicate gaps among the inner rib structures, and the exhaust grooves penetrate through the fish-rib structure.
Further, the microvalve body includes: the first surface of the substrate is provided with a first cavity groove structure; the first surface of the middle plate is provided with a second cavity groove structure, and the second surface of the middle plate is provided with a third cavity groove structure; the second surface of the cover plate is provided with a fourth cavity groove structure; the second cavity groove structure is communicated with the third cavity groove structure, and after the base plate, the middle plate and the cover plate are combined, the first cavity groove structure, the second cavity groove structure, the third cavity groove structure and the fourth cavity groove structure are matched to form a braking cavity.
Further, an exhaust groove is provided on the second surface of the intermediate plate.
Further, the brake cavity includes a first cavity portion having a terminal end region, a second cavity portion having a vent feature that vents air from the microvalve, and a vent structure extending from the first cavity portion to the second cavity portion.
Further, the exhaust groove is provided at a portion extending from the first cavity portion to the second cavity portion, and communicates with the exhaust structure.
According to another aspect of the present invention, there is provided a method of manufacturing a microvalve, the microvalve being as defined in any one of claims to, the manufacturing steps including: providing a first silicon layer, a second silicon layer and a third silicon layer; etching a first cavity groove structure on the first surface of the first silicon layer in cooperation with the mask, etching a second cavity groove structure on the first surface of the second silicon layer in cooperation with the mask, and etching a fourth cavity groove structure on the first surface of the third silicon layer in cooperation with the mask; attaching the first surface of the second silicon layer to the first surface of the third silicon layer; etching a third cavity groove structure on the second surface of the second silicon layer by matching with the mask; etching an exhaust groove on the second surface of the second silicon layer in cooperation with the mask; the second surface of the second silicon layer is attached to the first surface of the first silicon layer to form the micro valve.
Further, when the first surface of the first silicon layer is matched with the mask to etch the valve port structure, the manufacturing steps include: depositing a mask over the first surface portion of the first silicon layer; etching downwards from the first surface of the first silicon layer, etching through the part of the mask which is not deposited, and etching out a valve port structure; the mask on the first surface of the first silicon layer is removed.
Further, when the first surface of the first silicon layer is etched by matching with the mask, the manufacturing steps include: depositing a mask over the first surface portion of the first silicon layer; etching downwards from the first surface of the first silicon layer, etching the part of the undeposited mask by a preset depth, and etching a first cavity groove structure; the mask on the first surface of the first silicon layer is removed.
Further, when the first surface of the second silicon layer is matched with the mask to process the electrode structure, the manufacturing steps include: depositing a mask over the first surface portion of the second silicon layer; depositing a metal layer on the first surface of the second silicon layer; and removing the mask on the first surface of the second silicon layer, and stripping the electrode structure.
Further, when the first surface of the second silicon layer is etched by matching with the mask, the second cavity groove structure and the third cavity groove structure are etched, and the manufacturing steps comprise: depositing a mask on the second surface portion of the second silicon layer; etching downwards from the second surface of the second silicon layer, etching through the part of the mask which is not deposited, and etching a second cavity groove structure and a third cavity groove structure; the mask over the second surface of the second silicon layer is removed.
Further, when the second silicon layer etches the exhaust groove, the manufacturing steps include: depositing a mask on the second surface portion of the second silicon layer; etching downwards from the second surface of the second silicon layer, etching the part of the undeposited mask by a preset depth, and etching an exhaust groove structure; the mask over the second surface of the second silicon layer is removed.
Further, when the first surface of the third silicon layer is matched with the mask to etch the electrode opening structure, the manufacturing steps include: depositing a mask on the first surface portion of the third silicon layer; etching downwards from the first surface of the third silicon layer, etching through the part of the mask which is not deposited, and etching an electrode port structure; the mask over the first surface of the third silicon layer is removed.
Further, when the fourth cavity groove structure is etched on the first surface of the third silicon layer in cooperation with the mask, the manufacturing steps include: depositing a mask on the first surface portion of the third silicon layer; etching downwards from the first surface of the third silicon layer, etching the part of the undeposited mask by a preset depth, and etching a fourth cavity groove structure; the mask over the first surface of the third silicon layer is removed.
Furthermore, the first silicon layer, the second silicon layer and the third silicon layer are bonded.
Furthermore, the first silicon layer is a substrate, the second silicon layer is an intermediate plate, and the third silicon layer is a cover plate.
By applying the technical scheme of the invention, the arrangement of the exhaust grooves can communicate the gaps among the inner rib structures, and the exhaust grooves are directly communicated with the valve port structures, so that bubbles passing through the gaps among the adjacent inner rib structures can be directly and quickly discharged, and the bubbles can be quickly discharged without passing through a complete swing arm cavity. Moreover, after the gaps among the inner rib structures are communicated, bubbles entering the gaps among the adjacent inner rib structures can be more uniform, so that the pressure of the inner rib structures is close, and the running stability of the micro valve is ensured. The technical scheme of the invention effectively solves the problems that bubbles in the micro valve in the prior art need to be discharged and need to pass through the cavity of the swing arm, and the bubbles generate fluctuation to the inner rib structure due to pressure change, thereby affecting the performance of the micro valve.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 illustrates a schematic structural view of a conventional microvalve;
FIG. 2 illustrates a schematic structural view of another perspective of a conventional microvalve;
FIG. 3 illustrates an exploded view of a conventional microvalve;
FIG. 4 illustrates a schematic structural view of a cover plate of a conventional microvalve;
FIG. 5 illustrates a schematic structural view of an intermediate plate of a conventional microvalve;
FIG. 6 illustrates a schematic structural view of a substrate of a conventional microvalve;
FIG. 7 shows an exploded view of a microvalve of the present invention;
FIG. 8 shows a schematic structural view of an intermediate plate of a microvalve of the present invention;
FIG. 9 shows a schematic of the structure of a first surface of an intermediate plate of a microvalve of the present invention;
FIG. 10 is a schematic diagram showing the structure of the second surface of the intermediate plate of the microvalve of the present invention;
FIGS. 11-14 show structural changes during processing of the first silicon layer to etch the valve port structure;
fig. 15 to 17 are structural change diagrams during a process of etching the first cavity groove structure in the first silicon layer;
fig. 18 to 20 are views showing structural changes in the course of processing when the second silicon layer is provided with an electrode structure;
FIGS. 21 to 24 are views showing structural changes in the process of etching the electrode hole structure in the third silicon layer;
FIGS. 25 to 27 are structural change diagrams in a process of etching a fourth cavity groove structure in a third silicon layer;
fig. 28 shows a schematic structural view after the first surface of the second silicon layer is attached to the first surface of the third silicon layer;
fig. 29 to 31 are structural change diagrams during a process of etching the second cavity groove structure and the third cavity structure in the second silicon layer;
fig. 32 to 34 are views showing structural changes in the course of processing when the second silicon layer etches the exhaust trench; and
fig. 35 is a schematic structural view showing the second surface of the second silicon layer attached to the first surface of the first silicon layer.
Wherein the figures include the following reference numerals:
10. a microvalve body; 11. a substrate; 111. a first cavity groove structure; 112. a valve port structure; 12. a middle plate; 121. a second cavity groove structure; 122. a third cavity groove structure; 123. an inner rib structure; 124. an exhaust groove; 125. an electrode structure; 13. a cover plate; 131. a fourth cavity groove structure; 132. an electrode port structure.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
As shown in fig. 7 to 10, the microvalve of the present embodiment includes a microvalve body 10, a braking cavity is disposed inside the microvalve body 10, a plurality of inner rib structures 123 are disposed in the braking cavity, and the braking cavity is connected to the valve port structure 112. Wherein the plurality of inner rib structures 123 are connected by an exhaust channel 124, the exhaust channel 124 communicating with the valve port structure 112 to exhaust air from the microvalve.
By applying the technical scheme of the embodiment, the arrangement of the exhaust grooves 124 can communicate the gaps between the inner rib structures 123, and the exhaust grooves 124 are directly communicated with the valve port structure 112, so that bubbles passing through the gaps between the adjacent inner rib structures 123 can be directly and quickly exhausted, and the bubbles can be quickly exhausted without passing through a complete swing arm cavity. Moreover, after the gaps among the inner rib structures 123 are communicated, bubbles entering the gaps among the adjacent inner rib structures 123 can be more uniform, so that the pressure on the inner rib structures 123 is close, and the running stability of the micro valve is ensured. The technical scheme of this embodiment has solved effectively that the bubble in the microvalve among the prior art wants to discharge and needs to pass through the swing arm cavity and the bubble produces undulant and then influence the problem of microvalve performance to inner rib structure 123 because of pressure variation.
It should be noted that the heating wires are installed at the positions of the inner rib structures 123 to control the heat energy generated at the positions of the inner rib structures 123, so that the inner rib structures 123 are thermally expanded to block the gaps therebetween, thereby blocking the microvalve; when the heat is removed and the temperature is restored, the plurality of inner rib structures 123 shrink and restore the original deformation, so that the gaps therebetween are opened to allow the fluid in the microvalve to normally circulate. The on-off control of the micro valve can be realized through the process, and the on-off of the micro valve can be effectively controlled by connecting the electric heating wire with the control terminal. The arrangement of the exhaust grooves 124 can also accelerate the cooling speed of the inner rib structures 123, so that the response speed of the micro valve can be accelerated, and the sensitivity of the micro valve can be improved.
As shown in fig. 7 to 10, in the solution of the present embodiment, a plurality of inner rib structures 123 are arranged to form a fish-rib structure, a plurality of air discharge grooves 124 communicate gaps between the inner rib structures 123, and the air discharge grooves 124 penetrate through the fish-rib structure. The air discharge grooves 124 in the above structure can communicate the gaps between the plurality of inner rib structures 123, so that the air bubbles passing through the portion can be discharged quickly, and the stability of the microvalve is improved. After the gaps among the inner rib structures 123 are communicated, bubbles entering the gaps among the adjacent inner rib structures 123 can be more uniform, so that the pressure of the inner rib structures 123 is close, and the running stability of the micro valve is ensured.
As shown in fig. 7 to 10, in the present embodiment, the microvalve body 10 includes a base plate 11, an intermediate plate 12, and a cover plate 13. The first surface of the substrate 11 is formed with a first cavity groove structure 111. The first surface of the middle plate 12 is formed with a second cavity groove structure 121, and the second surface of the middle plate 12 is formed with a third cavity groove structure 122. The second surface of the cover plate 13 is opened with a fourth cavity groove structure 131. The second cavity groove structure 121 is communicated with the third cavity groove structure 122, and after the base plate 11, the middle plate 12 and the cover plate 13 are combined, the first cavity groove structure 111, the second cavity groove structure 121, the third cavity groove structure 122 and the fourth cavity groove structure 131 are matched to form a brake cavity. The above structure may form a brake cavity.
As shown in fig. 7 to 10, in the solution of the present embodiment, the exhaust grooves 124 are provided on the second surface of the intermediate plate 12. The structure is the preferable scheme of the embodiment, and the exhaust grooves 124 are only arranged on the middle plate 12, so that the micro valve can be conveniently processed, the process flow is simplified, and the production efficiency is improved. The exhaust grooves 124 may be provided in the base plate 11 or the cover plate 13 as long as they communicate with the plurality of inner rib structures 123 with a gap therebetween and exhaust efficiency can be improved. The exhaust grooves 124 may also be provided on two or three of the base plate 11, the intermediate plate 12, and the cover plate 13.
As shown in fig. 7 to 10, in the solution of the present embodiment, the braking cavity comprises a first cavity portion having a terminal end region, a second cavity portion having a means for removing air from the microvalve, and a venting structure extending from the first cavity portion to the second cavity portion. The arrangement of the first cavity part of the structure can facilitate the connection of a control terminal, the arrangement of the second cavity part can lead out air in the micro valve, and the partial arrangement of the third cavity part can discharge the air led out from the micro valve. Specifically, the first cavity portion is mainly disposed between the cover plate 13 and the middle plate 12, and the cover plate 13 is provided with an electrode port structure 132 connected to the terminal; a second cavity portion, which is mainly provided on the intermediate plate 12 and communicates with gaps between the plurality of inner rib structures 123, includes the air discharge grooves 124 in the present embodiment; the third cavity portion is mainly disposed between the base plate 11 and the middle plate 12, and the base plate 11 is provided with a valve port structure 112 communicating with the outside. Wherein the valve port structure 112 includes a fluid inlet, a fluid outlet, and an exhaust.
As shown in fig. 7 to 10, in the solution of the present embodiment, the exhaust groove 124 is provided at a portion extending from the first cavity portion to the second cavity portion, and communicates with the exhaust structure. The above structure can discharge the gas introduced into the exhaust groove 124 to the outside of the microvalve through the exhaust structure.
As shown in fig. 11 to 35, in the present embodiment, a method for manufacturing a micro valve is provided, where the micro valve is the micro valve according to any one of claims to, and the manufacturing step includes:
providing a first silicon layer, a second silicon layer and a third silicon layer;
etching the first cavity groove structure 111 on the first surface of the first silicon layer in cooperation with the mask, etching the second cavity groove structure 121 on the first surface of the second silicon layer in cooperation with the mask, and etching the fourth cavity groove structure 131 on the first surface of the third silicon layer in cooperation with the mask;
attaching the first surface of the second silicon layer to the first surface of the third silicon layer;
etching a third cavity trench structure 122 on the second surface of the second silicon layer in cooperation with the mask;
etching an exhaust trench 124 on the second surface of the second silicon layer in cooperation with the mask;
the second surface of the second silicon layer is attached to the first surface of the first silicon layer to form the micro valve.
The first silicon layer, the second silicon layer and the third silicon layer provided in the above manufacturing method refer to three silicon plate structures to be processed, which are similar or identical in size, specifically, in this embodiment, the first silicon layer is a plate to be processed of the substrate 11, the second silicon layer is a plate to be processed of the intermediate plate 12, and the third silicon layer is a plate to be processed of the cover plate 13.
It should be noted that the bonding manner among the first silicon layer, the second silicon layer and the third silicon layer is bonding. Other means of attachment, such as gluing, snapping, etc. may also be used, with keying being preferred. Bonding in this embodiment refers to a technique in which two homogeneous or heterogeneous semiconductor materials having clean surfaces and flat atomic levels are subjected to surface cleaning and activation treatment, and are directly bonded under a certain condition, and wafers are bonded into a whole by van der waals force, molecular force, or even atomic force.
As shown in fig. 11 to 14, in the present embodiment, when the first surface of the first silicon layer is etched with the valve port structure 112 in cooperation with the mask, the manufacturing steps include:
depositing a mask over the first surface portion of the first silicon layer;
etching down from the first surface of the first silicon layer, etching through the undeposited mask portion, and etching the valve port structure 112;
the mask on the first surface of the first silicon layer is removed.
The above-mentioned manufacturing steps are processing methods when the first silicon layer etches the valve port structure 112, and the processing of the valve port structure 112 is realized by the cooperation of the mask and the etching object.
As shown in fig. 15 to 17, in the technical solution of the present embodiment, when the first surface of the first silicon layer is etched by matching with the mask, the manufacturing steps include:
depositing a mask over the first surface portion of the first silicon layer;
etching downwards from the first surface of the first silicon layer, etching the part of the undeposited mask to a preset depth, and etching a first cavity groove structure 111;
the mask on the first surface of the first silicon layer is removed.
The manufacturing steps are processing methods when the first silicon layer is used for etching the first cavity groove structure 111, and processing of the first cavity groove structure 111 is achieved through cooperation of the mask and the etching object.
As shown in fig. 18 to fig. 20, in the technical solution of the present embodiment, when the electrode structure 125 is processed on the first surface of the second silicon layer in cooperation with the mask, the manufacturing steps include:
depositing a mask over the first surface portion of the second silicon layer;
depositing a metal layer on the first surface of the second silicon layer;
the mask on the first surface of the second silicon layer is removed and the electrode structure 125 is stripped.
The above-mentioned manufacturing steps are processing methods when the second silicon layer etches the electrode structure 125, and the processing of the electrode structure 125 is realized by the cooperation of the mask and the deposited metal. The plurality of inner rib structures 123 after the completion of the micro valve can be heated by the arrangement of the electrode structure 125 so as to realize the expansion with heat and contraction with cold of the micro valve and further control the on-off of the micro valve.
As shown in fig. 21 to fig. 24, in the technical solution of the present embodiment, when the electrode opening structure 132 is etched on the first surface of the third silicon layer in cooperation with the mask, the manufacturing steps include:
depositing a mask on the first surface portion of the third silicon layer;
etching down from the first surface of the third silicon layer, etching through the undeposited mask portion, and etching out the electrode port structure 132;
the mask over the first surface of the third silicon layer is removed.
The above-mentioned manufacturing steps are processing methods when the third silicon layer etches the electrode port structure 132, and the processing of the electrode port structure 132 is realized by the cooperation of the mask and the etching object.
As shown in fig. 25 to 27, in the technical solution of the present embodiment, when the fourth cavity groove structure 131 is etched on the first surface of the third silicon layer in cooperation with the mask, the manufacturing steps include:
depositing a mask on the first surface portion of the third silicon layer;
etching downwards from the first surface of the third silicon layer, etching the part of the undeposited mask by a preset depth, and etching a fourth cavity groove structure 131;
the mask over the first surface of the third silicon layer is removed.
The manufacturing steps are processing methods when the third silicon layer etches the fourth cavity groove structure 131, and the fourth cavity groove structure 131 is processed under the matching of a mask and an etching object.
As shown in fig. 28, in the technical solution of this embodiment, the first surface of the second silicon layer is attached to the first surface of the third silicon layer, and then a combination of the second silicon layer and the third silicon layer is formed.
As shown in fig. 29 to fig. 31, in the technical solution of this embodiment, when the second silicon layer etches the second cavity groove structure 121 and the third cavity groove structure 122, the manufacturing steps include:
depositing a mask on the second surface portion of the second silicon layer;
etching downwards from the second surface of the second silicon layer, etching through the part of the undeposited mask, and etching a second cavity groove structure 121 and a third cavity groove structure 122;
the mask over the second surface of the second silicon layer is removed.
The manufacturing steps are a processing method for etching the second cavity groove structure 121 and the third cavity groove structure 122 on the second silicon layer, and the second cavity groove structure 121 and the third cavity groove structure 122 are processed under the cooperation of a mask and an etching object. The second cavity groove structure 121 and the third cavity groove structure 122 are an integral structure, a portion of the second silicon layer close to the first silicon layer is the second cavity groove structure 121, and a portion of the second silicon layer close to the third silicon layer is the third cavity groove structure 122.
As shown in fig. 32 to 34, in the technical solution of the present embodiment, when the second silicon layer etches the exhaust trench 124, the manufacturing steps include:
depositing a mask on the second surface portion of the second silicon layer;
etching downwards from the second surface of the second silicon layer, and etching the part of the undeposited mask by a preset depth to etch an exhaust groove 124;
the mask over the second surface of the second silicon layer is removed.
The manufacturing steps are processing methods when the second silicon layer etches the exhaust groove 124, and the exhaust groove 124 is processed under the matching of the mask and the etching object.
As shown in fig. 35, in the technical solution of this embodiment, the second surface of the second silicon layer is attached to the first surface of the first silicon layer to form an integral structure of the micro valve, so that the micro valve is manufactured.
It is noted that the microvalve of the present invention is preferably fabricated using silicon layers, and may be fabricated using other semiconductor materials as desired.
From the above description, it can be seen that the above-described embodiments of the present invention achieve the following technical effects: the arrangement of the exhaust grooves 124 can communicate gaps between the inner rib structures 123, and the exhaust grooves 124 are directly communicated with the valve port structure 112, so that air bubbles passing through the gaps between the adjacent inner rib structures 123 can be directly and rapidly exhausted, and the air bubbles can be rapidly exhausted without passing through a complete swing arm cavity. Moreover, after the gaps among the inner rib structures 123 are communicated, bubbles entering the gaps among the adjacent inner rib structures 123 can be more uniform, so that the pressure on the inner rib structures 123 is close, and the running stability of the micro valve is ensured. The technical scheme of the invention effectively solves the problems that bubbles in the micro-valve in the prior art need to be discharged and need to pass through the cavity of the swing arm, and the bubbles generate fluctuation to the inner rib structure 123 due to pressure change, thereby affecting the performance of the micro-valve.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (15)
1. The micro valve is characterized by comprising a micro valve main body (10), wherein a braking cavity is arranged on the inner side of the micro valve main body (10), a plurality of inner rib structures (123) are arranged in the braking cavity, and the braking cavity is connected with a valve port structure (112);
wherein a plurality of the internal rib structures (123) are connected by an exhaust groove (124), the exhaust groove (124) communicating with the valve port structure (112) to exhaust air within the microvalve;
the plurality of inner rib structures (123) are arranged to form a fish rib structure, the exhaust groove (124) is positioned at one end of the plurality of inner rib structures (123), the exhaust groove (124) is communicated with gaps among the plurality of inner rib structures (123), and the exhaust groove (124) penetrates through the fish rib structure.
2. A microvalve according to claim 1, wherein said microvalve body (10) comprises:
the structure comprises a substrate (11), wherein a first cavity groove structure (111) is formed in a first surface of the substrate (11);
the first surface of the middle plate (12) is provided with a second cavity groove structure (121), and the second surface of the middle plate (12) is provided with a third cavity groove structure (122);
the second surface of the cover plate (13) is provided with a fourth cavity groove structure (131);
the second cavity groove structure (121) is communicated with the third cavity groove structure (122), and after the base plate (11), the middle plate (12) and the cover plate (13) are combined, the first cavity groove structure (111), the second cavity groove structure (121), the third cavity groove structure (122) and the fourth cavity groove structure (131) are matched to form the brake cavity.
3. A microvalve according to claim 2, wherein the vent groove (124) is provided on the second surface of the intermediate plate (12).
4. The microvalve of claim 1, wherein said actuator cavity includes a first cavity portion having a terminal end region, a second cavity portion having air displaced from said microvalve, and a vent structure extending from said first cavity portion to said second cavity portion.
5. The microvalve of claim 4, wherein the vent channel (124) is disposed at a portion extending from the first cavity portion to the second cavity portion and in communication with the vent structure.
6. A method of making a microvalve, said microvalve being in accordance with any one of claims 1 to 5, comprising the steps of:
providing a first silicon layer, a second silicon layer and a third silicon layer;
etching a first cavity groove structure (111) on the first surface of the first silicon layer in cooperation with a mask, etching a second cavity groove structure (121) on the first surface of the second silicon layer in cooperation with a mask, and etching a fourth cavity groove structure (131) on the first surface of the third silicon layer in cooperation with a mask;
attaching the first surface of the second silicon layer to the first surface of the third silicon layer;
etching a third cavity trench structure (122) on the second surface of the second silicon layer in cooperation with the mask;
etching an exhaust trench (124) on the second surface of the second silicon layer in cooperation with the mask;
and the second surface of the second silicon layer is attached to the first surface of the first silicon layer to form the micro valve.
7. The method of claim 6, wherein etching the valve port structure (112) on the first surface of the first silicon layer in cooperation with the mask comprises:
depositing a mask over a first surface portion of the first silicon layer;
etching down from the first surface of the first silicon layer, etching through the undeposited mask portion, etching the valve port structure (112);
and removing the mask on the first surface of the first silicon layer.
8. The method of claim 7, wherein the step of etching the first cavity groove structure (111) on the first surface of the first silicon layer in cooperation with the mask comprises:
depositing a mask over a first surface portion of the first silicon layer;
etching downwards from the first surface of the first silicon layer, etching the part of the mask which is not deposited to a preset depth, and etching to obtain a first cavity groove structure (111);
and removing the mask on the first surface of the first silicon layer.
9. The method of claim 6, wherein the step of processing the electrode structure (125) in cooperation with the mask on the first surface of the second silicon layer comprises:
depositing a mask on the first surface portion of the second silicon layer;
depositing a metal layer on the first surface of the second silicon layer;
removing the mask on the first surface of the second silicon layer and stripping the electrode structure (125).
10. The method of claim 6, wherein the etching the second cavity groove structure (121) and the third cavity groove structure (122) on the first surface of the second silicon layer with a mask comprises:
depositing a mask on a second surface portion of the second silicon layer;
etching down from the second surface of the second silicon layer, etching through the undeposited mask part, and etching the second cavity groove structure (121) and the third cavity groove structure (122);
the mask over the second surface of the second silicon layer is removed.
11. The method of claim 10, wherein the step of etching the vent trench (124) with the second silicon layer comprises:
depositing a mask on a second surface portion of the second silicon layer;
etching downwards from the second surface of the second silicon layer, etching the part without the deposited mask by a preset depth, and etching the structure of the exhaust groove (124);
the mask over the second surface of the second silicon layer is removed.
12. The method of claim 6, wherein etching the electrode opening structure (132) on the first surface of the third silicon layer in cooperation with the mask comprises:
depositing a mask on the first surface portion of the third silicon layer;
etching down from the first surface of the third silicon layer, etching through the undeposited mask portion, and etching the electrode port structure (132);
and removing the mask on the first surface of the third silicon layer.
13. The method of claim 12, wherein etching the fourth cavity trench structure (131) on the first surface of the third silicon layer in cooperation with the mask comprises:
depositing a mask on the first surface portion of the third silicon layer;
etching downwards from the first surface of the third silicon layer, etching the part without the deposited mask by a preset depth, and etching to obtain a fourth cavity groove structure (131);
and removing the mask on the first surface of the third silicon layer.
14. The method of claim 6, wherein the first, second, and third silicon layers are bonded together.
15. Method for manufacturing a microvalve according to claim 6, wherein the first silicon layer is a substrate (11), the second silicon layer is an intermediate plate (12), and the third silicon layer is a cover plate (13).
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