CN104445043A - An MEMS microvalve and the process of manufacturing the same - Google Patents
An MEMS microvalve and the process of manufacturing the same Download PDFInfo
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Abstract
The present invention discloses an MEMS microvalve and the process of manufacturing the same, relates to the technical field of MEMS, and solves the technical problem of high requirements and weak loading capacities in the current microvalve manufacturing process. The MEMS microvalve in the present invention includes a first silicon layer, which is made of a monocrystalline silicon material with (111) crystal orientation, and has a fluid inlet and a fluid outlet; a second silicon layer, which is made of a monocrystalline silicon material with (111) crystal orientation, and has an external flow channel formed on a surface of the second silicon layer and a rigid element having an internal flow channel, wherein the rigid element is received in the external flow channel and is capable of moving between a valve open position and a valve closed position, second silicon layer includes a bonding portion and a sealing portion, the second silicon layer is bonded with the first silicon layer through the bonding portion, the fluid inlet and the fluid outlet are located at a non-bonding region of the first silicon layer, the external flow channel is located between the non-bonding region of the first silicon layer and the sealing portion, a buffer solution gap is formed between an upper surface of the rigid element and a lower surface of the non-bonding region of the first silicon layer, and a suspension solution gap is formed between a lower surface of the rigid element and an internal wall surface of the sealing portion.
Description
[technical field]
The present invention relates to MEMS(microelectromechanical systems) micro-valve and manufacture craft thereof, particularly based on micro-valve of MEMS technology, belong to MEMS technology field.
[background technology]
MEMS(Micro-Electro-Mechanic System, microelectromechanical systems) referring to can batch making, collection micro mechanism, microsensor, micro actuator and signal transacting and control circuit, until interface, communication and power supply etc. are in microdevice integrally or system.Microsensor, microactrator, micro parts, Micromechanical Optics device, microfluidic device etc. that MEMS technology makes have very wide application prospect in the fields such as Aero-Space, consumer electronics, military affairs, are also widely used in the field such as micro-fluidic chip and synthetic biology.
As the Primary Component that fluid controls, the micro-valve of silicon has outstanding application prospect in the industrial refrigeration of high pressure high flow capacity, relative to traditional mechanically controlled valve, the micro-valve of MEMS silicon has fast response time, controls accurately, good reliability, cost are low, can the outstanding advantage such as mass production, good stability.
The micro-valve of the majority be disclosed at present relies on the laminate structure of film or other form to control to the fluid realized between valve import and valve outlet port, and the industrial fluids that cannot be applied to high pressure high flow capacity controls, and such as cryogenic fluid controls.This is because from Hooke's law, if the rigidity of micro-structural on pressure-bearing direction is inadequate, then very large deformation can occur and even exceed deformation range, cause structural failure, therefore, such micro-valve arrangement cannot be used for the control of high pressure industrial fluid.US Patent No. 4895500 discloses a kind of typical micro-valve of double-decker, rely on flexible cantilever beam to control the break-make of valve port (comprising entrance and outlet), there is following limitation in this micro-valve: one, flexible cantilever beam is flexible member, the pressure range of its bearing load is limited, high-pressure fluid very easily makes micro-valve turn off fluid, or there is internal structure damage, such as cantilevered beam members root fractures; Two, this micro-valve exports moving displacement by flexible action mode, but displacement is limited, and the range of flow causing this micro-valve to control is very limited; Three, this micro-valve in the fabrication process, obtains cantilever beam structure, easily cause very large residual stress by the heavily doped corrosion in local, and the bonding had influence between wafer connects, and even has a strong impact on yield rate.
Micro-valve for flexible member control flow is difficult to the problem being applied to the control of high pressure high flow capacity industrial fluids, prior art has the following scheme of proposition: adopt thick silicon to carry out multilayer sealing-in, because, thick silicon has larger rigidity, higher fluid pressure can be carried, thick silicon is utilized to realize sliding valve structure as rigid member, rigid member produces the movement of rigidity mode, reach the object of opening or covering valve port, and be no longer utilize the flexible mode such as bending of film or laminate structure to realize fluid on-off or Flow-rate adjustment, the ability of device pressure-bearing can be improved greatly.
Such as: US Patent No. 7011378, US6523560 disclose a kind of micro-valve of three-decker, and disclose following structure: " a kind of micro-valve is made up of ground floor, the second layer and third layer, the second layer definition basin and between ground floor and third layer ".Based on the description of this patent to micro-valve, utilize three layer crystal circles respectively as the upper parietal layer of fluid chamber structure, intermediate layer (comprising movable mechanism), lower parietal layer, and make three layers closely to combine, realize airtight cavity body structure, the actuator in intermediate layer promotes silicon rigid member and moves, and reaches the object of opening or covering valve port.
Combination between wafer can be divided into without intermediate medium Direct Bonding with have non-immediate bonding two type of intermediate medium, but Direct Bonding is more suitable for forming micro-valve than non-immediate bonding.Realize the Direct Bonding of wafer, to wafer material, there is strict flatness requirement, to have the Si-Si direct bonding of high bond strength, requirement for silicon chip surface flatness is very high, in general, the Si-Si bonding that realize ideal, silicon chip used is at 2 × 2 μm
2interval in can not be greater than 1nm by the microroughness that AFM records.Direct Bonding between three layer crystal circles has harsher material flatness requirement and higher technique to realize difficulty than the Direct Bonding between two-layer wafer, is easy to the bottleneck becoming manufacturing process.Have high bearing capacity equally, compare the micro-valve of silicon that employing three layers of wafer bonding make, the silicon adopting two-layer wafer bonding to make micro-valve material cost is more economized, technology difficulty is lower, technique implementation procedure more simplifies.
[summary of the invention]
The present invention is that the deficiency overcoming present technology proposes the micro-valve of a kind of MEMS and manufacture craft thereof, simplifies micro-valve technique, reduces technique and realizes difficulty and material cost, and can meet the application demand of the aspects such as the industrial fluids control of high pressure high flow capacity.
For solving the problems of the technologies described above, the present invention adopts following technical scheme:
1, the micro-valve of MEMS, comprising:
First silicon layer, is made up of the single crystal silicon material in (111) crystal orientation, and has fluid intake and fluid issuing;
Second silicon layer, is made up of the single crystal silicon material in (111) crystal orientation, and has the outer flow passage that is formed in the second silicon surface and the rigid element with inner flow passage, and described rigid element to be placed in outer flow passage and can to move between valve opening position and valve closing position;
Second silicon layer comprises bonding part and sealing, second silicon layer is by bonding part and the first silicon layer bonding, fluid intake and fluid issuing are positioned at the nonbonding region of the first silicon layer, outer flow passage is between the first silicon layer nonbonding region and sealing, form buffer solution gap between the upper surface of rigid element and the lower surface in the first silicon layer nonbonding region, between the lower surface of rigid element and sealing internal face, form suspension gap.
Further, the upper surface of described rigid element is concordant with the bonding face of the second silicon layer, and the lower surface in described first silicon layer nonbonding region is provided with inner groovy;
Or the upper surface of described rigid element is lower than the bonding face of the second silicon layer, the lower surface in described first silicon layer nonbonding region is concordant with the bonding face of the second silicon layer;
Or the upper surface of described rigid element is lower than the bonding face of the second silicon layer, the lower surface in described first silicon layer nonbonding region is provided with inner groovy.
Further, described sealing internal face is distributed with some projections, produces active force holding rigid element upwards when flowing to make fluid.
Further, described first silicon layer is also provided with fluid pressure and detects mouth, described fluid pressure detects mouth between fluid intake and fluid issuing.
Further, also be provided with in the outer flow passage of described second silicon layer and activate rib, transmission ridge and displacement equations beam, described actuating rib is connected between transmission ridge and outer flow passage sidewall, described displacement equations beam is connected between transmission ridge and rigid element, described second silicon layer is provided with pair of electrodes, described actuating rib is by thermal drivers transmission ridge, and transmission ridge moves rigid element by displacement equations sill bolt and moves.
The invention allows for the manufacture craft of the micro-valve of a kind of MEMS, comprise the steps:
1), the first silicon layer and the second silicon layer are set;
2), inner flow passage is etched at the second silicon layer upper surface;
3), at the second silicon layer upper surface portion deposit mask;
4), at the non-deposit Mask portion of the second silicon layer upper surface tentatively outer flow passage is etched, to form the fine motion mechanical part comprising rigid element;
5), Deposition of protective layer on the second silicon layer upper surface and outer flow passage internal face;
6), etch the protective layer that the second silicon layer upper surface and outer flow passage diapire deposit, retain the protective layer on outer flow passage two side;
7), outer flow passage diapire is etched;
8), bottom outer flow passage form suspension gap by solution corrosion, move in outer flow passage to enable the fine motion mechanical part comprising rigid element;
9), remove the mask of deposit on the second silicon layer and remaining protective layer, and deposit forms electrode;
10) the first silicon layer, is etched;
11), by the first silicon layer be placed on the second silicon layer, and make closely to engage between the first silicon layer with the second silicon layer by bonding.
Beneficial effect of the present invention:
The micro-valve of MEMS of the present invention adopts the movement of rigid element to realize fluid intake and fluid issuing conducting or disconnection, and then realize valve opening or valve closing, compared to existing technology, rigid element of the present invention, owing to self possessing higher structural strength, thus can carry higher fluid pressure and not damage; In addition, by displacement equations beam, original output displacement is carried out conversion to amplify, the Large travel range rigid motion of rigid element in horizontal plane can be realized, expand the flow-control scope of micro-valve, the industrial fluids making the present invention can be applicable to high pressure high flow capacity controls, and such as cryogenic fluid controls.
The micro-valve of MEMS of the present invention is double-layer structure, micro-valve that three layers of relatively current Silicon Wafer sealing-in are formed, the micro-valve of the present invention significantly can reduce the requirement to material flatness and environment cleanliness, reduce technology difficulty and complexity, overcome technique bottleneck, improve yield rate, owing to decreasing one deck wafer material, reduce material cost.
These features of the present invention and advantage will detailed description of the invention below, exposure detailed in accompanying drawing.
[accompanying drawing explanation]
Below in conjunction with accompanying drawing, the present invention is described further:
Fig. 1 is the perspective view of the micro-valve embodiment one of the present invention;
Fig. 2 is the structural representation of the micro-valve embodiment one of the present invention under valve opening state;
Fig. 3 is the structural representation of the micro-valve embodiment one of the present invention under valve closing state;
Fig. 4 is that the micro-valve embodiment one of the present invention is at control principle schematic diagram;
Fig. 5 is the structural representation of the micro-valve embodiment two of the present invention under valve opening state;
Fig. 6 is the structural representation of the micro-valve embodiment two of the present invention under valve closing state;
Fig. 7 (a)-Fig. 7 (j) is the Making programme figure of the micro-valve of the present invention.
[detailed description of the invention]
The present invention proposes the micro-valve of a kind of MEMS, comprise the first silicon layer and the second silicon layer, first silicon layer has fluid intake and fluid issuing, second silicon layer have the outer flow passage being formed in the second silicon surface and the rigid element with inner flow passage, rigid element is placed in outer flow passage, and can move between valve opening position and valve closing position, second silicon layer comprises bonding part and sealing, second silicon layer is by bonding part and the first silicon layer bonding, fluid intake and fluid issuing are positioned at the nonbonding region of the first silicon layer, outer flow passage is between the first silicon layer nonbonding region and sealing, buffer solution gap is formed between the upper surface of rigid element and the lower surface in the first silicon layer nonbonding region, suspension gap is formed between the lower surface of rigid element and sealing internal face.Can control to form the more small microgap more accurately of interlayer by such scheme, when making micro-valve in off position, there is less leakage.Compared to existing technology, micro-valve of the present invention, structure simplifies, and technology difficulty reduces, and saves material cost, and can carry higher fluid pressure, is suitable for cryogenic fluid and controls.
The technical scheme of accompanying drawing to the embodiment of the present invention below in conjunction with the embodiment of the present invention is explained and illustrated, but following embodiment is only the preferred embodiments of the present invention, and not all.Based on the embodiment in embodiment, those skilled in the art under the prerequisite not making creative work obtain other embodiments, all belong to protection scope of the present invention.
Embodiment one:
With reference to Fig. 1-3, the micro-valve of MEMS, comprise the first silicon layer 1 and the second silicon layer 2, wherein the first silicon layer 1 outputs fluid intake 10 and fluid issuing 11, second silicon layer 2 has and is formed in the outer flow passage 20 on the second silicon layer 2 surface and the rigid element 3 with inner flow passage 31, rigid element 3 is placed in outer flow passage 20, and can move between valve opening position and valve closing position.
When designing rigid element 3, the present embodiment is by special drives structure, realize the larger displacement of rigid element 3 to export, concrete: be also provided with in the outer flow passage 20 of the second silicon layer 2 and activate rib 23, transmission ridge 22 and displacement equations beam 21, activating rib 23 is connected between transmission ridge 22 and outer flow passage 20 sidewall, displacement equations beam 21 is connected between transmission ridge 22 and rigid element 3, second silicon layer 2 is provided with pair of electrodes 26, in addition, displacement equations beam 21 needs a fulcrum 210 to be supported in outer flow passage 20, to form lever construction, and fulcrum 210 more levels off to transmission ridge 22, the displacement of transmission ridge 22 can be amplified on rigid element 3 to make displacement equations beam 21, realize the Large travel range rigid motion of rigid element 3 in horizontal plane, expand the flow-control scope of micro-valve, as a rule, when making the second silicon layer 2, these fine motion mechanical parts of above-mentioned actuating rib 23, transmission ridge 22, displacement equations beam 21 and rigid element 3 by one-body molded in outer flow passage 20, as by series of process such as etchings.
With reference to Fig. 2, under micro-valve valve opening state, the inner flow passage 31 on the fluid intake 10 on the first silicon layer 1 and the equal corresponding rigid element 3 of fluid issuing 11, fluid enters inner flow passage 31 by fluid intake 10, flow out inner flow passage 31 by fluid issuing 11, now rigid element 3 is in valve opening position; With reference to Fig. 3, under micro-valve valve closing state, the inner flow passage 31 on the corresponding rigid element 3 of the fluid intake 10 on the first silicon layer 1, and fluid issuing 11 side is stopped by rigid element 3, fluid can only enter inner flow passage 31 by fluid intake 10, and now rigid element 3 is in valve closing position.The movement of rigid element 3 between valve closing position and valve opening position at least can realize micro-valve valve opening and valve closing two kinds of mode of operations.
With reference to Fig. 1,4, in thermal drivers mode, two electrodes 26 are connected with the positive and negative electrode of power supply respectively, and circuit pathways is controlled by switch.When the switch is closed, power supply gives micro-valve signal of telecommunication, activates rib 23 expanded by heating, and along with actuating rib 23 expands, actuating rib 23 is extended and makes transmission ridge 22 action, causes displacement equations beam 21 around fulcrum, thus drives rigid element 3 action; When the switches are opened, micro-valve loses the signal of telecommunication that power supply gives, by the impact activating the rigidity of rib 23 own, rigid element 3 can be returned to initial position, concrete electricity connected mode is: first, by wire bonding, the electrode 26 of micro-valve and external pads is realized being electrically connected, again by the packing forms such as wire or substrate wiring, external pads is realized being electrically connected with the positive and negative electrode 26 of power supply.
The displacement of rigid element 3 and voltage are ratio corresponding relation, the fluid intake 10 of micro-valve can realize all or part of opening, fluid issuing 11 can realize all or part of covering, thus, by controlling the aperture of fluid intake 10 or fluid issuing 11 with applying the voltage levels correspondence ratio of the signal of telecommunication, the corresponding ratio realizing fluid flow controls.
In addition, micro-valve also can be controlled by the continuous print PWM signal of telecommunication, and the dutycycle of pwm signal realizes the corresponding ratio control of fluid flow.Certainly, except thermal drivers, the type of drive such as current piezoelectric actuated, magnetic actuation, electrostatically actuated also can be used in the present embodiment.
In order to make the motion of rigid element 3 more reliable and more stable, buffer solution gap 25 is formed between the upper surface 32 and the lower surface in the first silicon layer nonbonding region 12 of rigid element 3, buffer solution gap 25 only allows the fluid of small part to enter outer flow passage 20, this layer of buffer solution gap 25 can prevent the upper surface 32 of rigid element 3 from contacting with the lower surface in the first silicon layer nonbonding region 12, reduce the resistance of motion of rigid element 3, during concrete enforcement: the upper surface 32 that can be rigid element 3 is concordant with the bonding face of the second silicon layer 2, the lower surface in the first silicon layer nonbonding region 12 is provided with inner groovy, the groove depth of inner groovy is the width of buffer solution gap 25, also can be the bonding face of upper surface 32 lower than the second silicon layer 2 of rigid element 3, the lower surface in the first silicon layer nonbonding region 12 is concordant with the bonding face of the second silicon layer 2, and the vertical range between the upper surface of rigid element 3 and the bonding face of the second silicon layer 2 is the width of buffer solution gap 25, can also be the bonding face of upper surface 32 lower than the second silicon layer 2 of rigid element 3, the lower surface in the first silicon layer nonbonding region 12 be provided with inner groovy, and so upper surface to the groove bottom distance of inner groovy of rigid element 3 is the width of buffer solution gap 25.No longer this describes in detail more embodiment one by one, as long as ensure in principle to form certain interval between the upper surface 32 of rigid element 3 and the lower surface in the first silicon layer nonbonding region 12.
Under the prerequisite of above-mentioned buffer solution gap 25, form suspension gap 24 between the lower surface 33 of rigid element 3 and sealing internal face 281, like this, can ensure that rigid element 3 keeps suspended state always, resistance is little, makes micro-valve work more reliable and stable.Meanwhile, be distributed with some minute protrusions at sealing internal face 281, produce active force holding rigid element 3 upwards when flowing to make fluid, reach better suspension effect, in general, sealing internal face 281 has certain roughness.
It should be noted that: inner flow passage 31 is the groove structures formed at rigid element 3 upper surface, outer flow passage 20 is the groove structures formed described in the second silicon layer 2 upper surface, like this, buffer solution gap 25 and suspension gap 24 is had to deposit in case, rigid element 3 is be in suspended state in outer flow passage 20, and rigid element 3 and suspension gap 24 are all formed in outer flow passage 20.Once form outer flow passage 20, second silicon layer 2 can be divided into draws together bonding part 27 and sealing 28, second silicon layer is by bonding part 27 and the first silicon layer 1 bonding, fluid intake 10 and fluid issuing 11 are positioned at the nonbonding region 12 of the first silicon layer, outer flow passage 20 is between the first silicon layer nonbonding region 12 and sealing 28, form buffer solution gap 25 between the upper surface 32 of rigid element 3 and the lower surface in the first silicon layer nonbonding region 12, between the lower surface 33 of rigid element 3 and sealing internal face 281, form suspension gap 24.
In addition, the present embodiment is also different from prior art to the selection on wafer material, and in the present embodiment, at least the second silicon layer 2 is made up of the single crystal silicon material in (111) crystal orientation.Such as, the first silicon layer 1 and the second silicon layer 2 are the single crystal silicon material in (111) crystal orientation; Again or as, the second silicon layer 2 is the single crystal silicon material in (111) crystal orientation, the material that the first silicon layer 1 closely can engage with the monocrystalline silicon in (111) crystal orientation for other, such as, Pyrex, or the single crystal silicon material etc. in other crystal orientation.The present embodiment, based on the double-deck bonding of the single crystal silicon material in (111) crystal orientation, is conducive to technological operation, thus reaches better splicing results.
Embodiment two:
With reference to Fig. 5,6, micro-valve of the present embodiment is also provided with fluid pressure and detects mouth 13 on its first silicon layer 1, and fluid pressure detects mouth 13 between fluid intake 10 and fluid issuing 11, thus, and pressure when micro-valve energy test fluid flows into or flows out.
Concrete: as shown in Figure 5, under valve opening state, fluid intake 10 and fluid pressure detect mouth 13 and are communicated with, fluid is flowed into by fluid intake 10, detect mouth 13 by fluid pressure to flow out, within the response time, fluid pressure detects mouth 13 and obtains a standard fluid pressure signal, and micro-valve is operated in supercharging mode of operation.
As shown in Figure 6, under valve closing state, fluid issuing 11 and fluid pressure detect mouth 13 and are communicated with, and fluid is flowed out by fluid issuing 11, and standard fluid pressure signal is released, and micro-valve is operated in earial drainage mode of operation.
Other structures of the micro-valve of the present embodiment can refer to embodiment one, repeat no more.
Embodiment three:
Present embodiments provide the manufacture craft of the micro-valve of a kind of MEMS, comprise the steps:
1, arrange the first silicon layer and the second silicon layer, wherein the material of the first silicon layer includes but not limited to (111), (100), the single crystal silicon material in (110) crystal orientation and other semi-conducting materials, and the material of the second silicon layer is the single crystal silicon material in (111) crystal orientation;
2, as Fig. 7 (a), inner flow passage 31 is etched at the second silicon layer 2 upper surface;
3, as Fig. 7 (b), at the second silicon layer 2 upper surface portion deposit mask 4, not the second silicon layer 2 upper surface is all covered with mask in this step, but reserves the etched surface of subsequent technique;
4, as Fig. 7 (c), outer flow passage 20 is tentatively etched at the non-deposit Mask portion of the second silicon layer 2 upper surface, to form the fine motion mechanical part comprising rigid element 3, fine motion mechanical part also comprises integrated actuating rib, transmission ridge and displacement equations beam with rigid element 3; The present embodiment adopts RIE etching, RIE(ReactiveIon Etching, reactive ion etching) be a kind of microelectronics dry etch process, its principle is the sheath that can produce hundreds of micron thickness when applying the high frequency voltage of 10 ~ 100MHZ between plate electrode, put into sample wherein, ion high-speed impact sample and complete chemical reaction etching;
5, as Fig. 7 (d), Deposition of protective layer on the second silicon layer 2 upper surface and outer flow passage 20 internal face, here deposition is often referred to PECVD(Plasma Enhanced Chemical Vapor Deposition, plasma enhanced chemical vapor deposition method), the gas ionization containing film composed atom is made by microwave or radio frequency etc., be partially formed plasma, and plasma chemistry activity is very strong, be easy to react, desired thinfilm protective coating 5 can be deposited on the second silicon layer 2 upper surface and outer flow passage 20 internal face, the protective layer 5 of deposition can be SiO2 or Si3N4,
6, as Fig. 7 (e), etch the protective layer of deposition on the second silicon layer 2 upper surface and outer flow passage diapire 201, retain the protective layer on outer flow passage two side 200, this step mainly removes the thinfilm protective coating of the second silicon layer 2 upper surface and the thinfilm protective coating of outer flow passage diapire 201 formation, and the thinfilm protective coating on outer flow passage two side 200 retains, as the mask in subsequent etching processes;
7, as Fig. 7 (f), etching outer flow passage 20 diapire, etches through this step outer flow passage sidewall 200 ＇ formed and does not possess protective layer, so that solution corrosion;
8, as Fig. 7 (g), suspension gap 24 is formed by solution corrosion bottom outer flow passage 20, move in outer flow passage 20 to enable the fine motion mechanical part comprising rigid element 3, in this technique, KOH or TMAH solution is adopted to corrode silicon layer, TMAH(Tetramethy1ammonium hydroxide, tetramethyl aqua ammonia), water white transparency, has very strong water imbibition, soluble in water, and heat release when dissolving, the aqueous solution is strong basicity, has soapy feeling, have good corrosion rate and Selection radio, corrosion surface is effective;
9, as Fig. 7 (h), remove the mask of deposit on the second silicon layer 2 and remaining protective layer, and deposit forms electrode 26;
10, as Fig. 7 (i), etch the first silicon layer 1, form fluid intake 10 and fluid issuing 11, general, also can make two lead hole 14 on the first silicon layer 1, facilitate the second silicon layer 2 top electrode lead-in wire to pass through;
11, as Fig. 7 (j), the first silicon layer 1 is placed on the second silicon layer 2, and makes closely to engage between the first silicon layer 1 with the second silicon layer 2 by bonding.
The physical meaning of bonding is often referred to the homogeneity of two panels surface cleaning, atomically flating or heterogeneous semiconductor material through surface clean and activation process, directly combine under certain condition, by Van der Waals force, the molecular force even atomic force technology that makes bonding chip become to be integrated.Because Direct Bonding has strict flatness requirement for wafer material, so, the micro-valve of current three-decker compared by the double-deck micro-valve of the present invention, decrease a Direct Bonding technique, significantly reduce the requirement to material flatness and environment cleanliness, reduce technology difficulty and complexity; In addition, the micro-valve of current three-decker compared by the double-deck micro-valve of the present invention, decreases one deck wafer material, and material cost reduces.
On the basis of two layers of crystal circle structure, the movement that micro-valve of the present invention additionally uses rigid element realizes fluid intake and fluid issuing conducting or disconnection, and then realize valve opening or valve closing, compared to existing technology, rigid element, owing to self possessing higher structural strength, thus can carry higher fluid pressure and not damage; In addition, by displacement equations beam, original output displacement is carried out conversion to amplify, the Large travel range rigid motion of rigid element in horizontal plane can be realized, expand the flow-control scope of micro-valve, the industrial fluids making the present invention can be applicable to high pressure high flow capacity controls, and such as cryogenic fluid controls.
By above-described embodiment, object of the present invention is reached by fully effective.The personage being familiar with this skill should be understood that and the present invention includes but the content being not limited to accompanying drawing and describing in detailed description of the invention above.Any amendment not departing from function and structure principle of the present invention all will comprise within the scope of the appended claims.
Claims (6)
1. the micro-valve of MEMS, is characterized in that comprising:
First silicon layer, is made up of the single crystal silicon material in (111) crystal orientation, and has fluid intake and fluid issuing;
Second silicon layer, is made up of the single crystal silicon material in (111) crystal orientation, and has the outer flow passage that is formed in the second silicon surface and the rigid element with inner flow passage, and described rigid element to be placed in outer flow passage and can to move between valve opening position and valve closing position;
Second silicon layer comprises bonding part and sealing, second silicon layer is by bonding part and the first silicon layer bonding, fluid intake and fluid issuing are positioned at the nonbonding region of the first silicon layer, outer flow passage is between the first silicon layer nonbonding region and the second silicon layer sealing, form buffer solution gap between the upper surface of rigid element and the lower surface in the first silicon layer nonbonding region, between the lower surface of rigid element and sealing internal face, form suspension gap.
2. the micro-valve of a kind of MEMS as claimed in claim 1, is characterized in that: the upper surface of described rigid element is concordant with the bonding face of the second silicon layer, and the lower surface in described first silicon layer nonbonding region is provided with inner groovy;
Or the upper surface of described rigid element is lower than the bonding face of the second silicon layer, the lower surface in described first silicon layer nonbonding region is concordant with the bonding face of the second silicon layer;
Or the upper surface of described rigid element is lower than the bonding face of the second silicon layer, the lower surface in described first silicon layer nonbonding region is provided with inner groovy.
3. the micro-valve of a kind of MEMS as claimed in claim 1, is characterized in that: described sealing internal face is distributed with some projections, produces active force holding rigid element upwards when flowing to make fluid.
4. the micro-valve of a kind of MEMS as described in claim 1 or 2 or 3, is characterized in that: described first silicon layer is also provided with fluid pressure and detects mouth, and described fluid pressure detects mouth between fluid intake and fluid issuing.
5. the micro-valve of a kind of MEMS as described in claim 1 or 2 or 3, it is characterized in that: be also provided with in the outer flow passage of described second silicon layer and activate rib, transmission ridge and displacement equations beam, described actuating rib is connected between transmission ridge and outer flow passage sidewall, described displacement equations beam is connected between transmission ridge and rigid element, described second silicon layer is provided with pair of electrodes, described actuating rib is by thermal drivers transmission ridge, and transmission ridge moves rigid element by displacement equations sill bolt and moves.
6. a manufacture craft for the micro-valve of MEMS, is characterized in that comprising the steps:
1), the first silicon layer and the second silicon layer are set;
2), inner flow passage is etched at the second silicon layer upper surface;
3), at the second silicon layer upper surface portion deposit mask;
4), at the non-deposit Mask portion of the second silicon layer upper surface tentatively outer flow passage is etched, to form the fine motion mechanical part comprising rigid element;
5), Deposition of protective layer on the second silicon layer upper surface and outer flow passage internal face;
6), etch the protective layer that the second silicon layer upper surface and outer flow passage diapire deposit, retain the protective layer on outer flow passage two side;
7), outer flow passage diapire is etched;
8), bottom outer flow passage form suspension gap by solution corrosion, move in outer flow passage to enable the fine motion mechanical part comprising rigid element;
9), remove the mask of deposit on the second silicon layer and remaining protective layer, and deposit forms electrode;
10) the first silicon layer, is etched;
11), by the first silicon layer be placed on the second silicon layer, and make closely to engage between the first silicon layer with the second silicon layer by bonding.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108883413A (en) * | 2016-03-23 | 2018-11-23 | 洛桑联邦理工学院(Epfl) | Microfluidic networks device |
| CN111102398A (en) * | 2018-10-29 | 2020-05-05 | 盾安环境技术有限公司 | Microvalve and method of making same |
| CN113007436A (en) * | 2021-03-02 | 2021-06-22 | 深圳市和来生物技术有限公司 | Power conveying mechanism with multiple power channels and micro-fluidic chip |
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| CN111102398A (en) * | 2018-10-29 | 2020-05-05 | 盾安环境技术有限公司 | Microvalve and method of making same |
| CN111102398B (en) * | 2018-10-29 | 2021-11-05 | 盾安环境技术有限公司 | Microvalve and method of making same |
| CN113007436A (en) * | 2021-03-02 | 2021-06-22 | 深圳市和来生物技术有限公司 | Power conveying mechanism with multiple power channels and micro-fluidic chip |
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| CN104445043B (en) | 2017-07-07 |
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