CN111100591B - Conductive element and electronic device - Google Patents
Conductive element and electronic device Download PDFInfo
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- CN111100591B CN111100591B CN201911046814.8A CN201911046814A CN111100591B CN 111100591 B CN111100591 B CN 111100591B CN 201911046814 A CN201911046814 A CN 201911046814A CN 111100591 B CN111100591 B CN 111100591B
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- silver
- powder particles
- conductive element
- silver powder
- resin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
Abstract
The invention provides a conductive element, which has a three-layer structure of a base material, a silver adhesive layer and a protective layer, wherein the silver adhesive layer comprises silver adhesive, the silver adhesive adopts resin as a connecting phase, and the resin accounts for 20-30% of the total weight of the silver adhesive; the silver colloid adopts silver powder particles as a conductive phase, and the silver powder particles comprise linear silver powder particles and flaky silver powder particles. The silver glue layer formed by uniformly mixing the resin and the silver powder particles has good flexibility and extensibility, and can prevent the conductive element from being broken when the conductive element is subjected to folding or tensile stress. The invention also provides an electronic device comprising the conductive element.
Description
Technical Field
The invention relates to a conductive element and an electronic device.
Background
With the continuous progress of science and technology development, mobile terminal devices such as mobile phones and tablet computers, some wearable devices and flexible electronics become essential communication and entertainment tools for people's life gradually, and touch screens are essential components of mobile terminal devices.
At present, the flexibility requirements of mobile terminals, wearable devices, flexible electronics and the like on conductive elements are higher and higher, and the traditional touch screen can not meet the flexibility requirements of people on electronic devices gradually.
The traditional method is to use a flexible substrate to enhance the flexibility of the electronic device, but the conductive silver adhesive circuit is easy to break after being stretched or bent after being cured, so that the service life of the touch screen is not long, and the use requirements of people cannot be met.
Disclosure of Invention
The invention provides a conductive element with good bending or stretching performance and an electronic device.
A conductive element comprises a substrate having a carrying surface; the silver glue layer is arranged on the bearing surface of the substrate; the protective layer, set up in the substrate the loading end covers the elargol conducting layer, the elargol layer includes elargol, the elargol adopts the resin as the connected phase, the resin accounts for 20% -30% of elargol total weight, the elargol adopts the silver powder granule as the electrically conductive phase, the silver powder granule includes threadiness silver powder granule and flaky silver powder granule. The silver glue layer has good extensibility, and can prevent the conductive element from being broken when the conductive element is subjected to folding or tensile stress.
Further, the resin comprises at least one of polyurethane and EVA resin. Polyurethane and EVA resin all have fine flexibility, can guarantee the flexibility of silver colloid, prevent the fracture.
Further, the diameter of the linear silver powder particles is 20nm to 100 nm. The nano silver powder particles have good conductivity after being dispersed in the silver colloid.
Further, the diameter of the linear silver powder particles is 40nm to 80 nm. The silver powder particles can be more uniformly dispersed in the silver paste.
Further, the thickness of the flaky silver powder particles is 20 nm-50 nm, and the width of the flaky silver powder particles is 1 um-3 um. When the silver flake particles are subjected to tensile or folding stress, the silver flake particles can be well connected with the circuit to keep the circuit conducted.
Further, the base material is made of at least one of thermoplastic polyurethane elastomer rubber, carbon-based rubber, silicone resin and macromolecular hydrogel.
Further, the material of the protective layer comprises at least one of thermoplastic polyurethane elastomer rubber, carbon-based rubber, silicone resin and macromolecular hydrogel. The flexibility and the ductility of the conductive element can be improved by adopting the materials.
Further, the melting point of the protective layer is 110-130 ℃, and the melting point of the base material is more than 180 ℃. The substrate needs to be made of a material with a relatively high melting point so as to avoid deformation of the substrate in the silver colloid curing process, and the material with a relatively low melting point is selected for the protective layer, so that the protective layer can be better attached to the silver colloid and the substrate during hot pressing.
Further, the elastic modulus of the base material, the elastic modulus of the silver glue layer and the elastic modulus of the protective layer are the same order of magnitude. The use of materials having elastic moduli of the same order of magnitude for the three layers avoids separation of the three layers when the conductive element is subjected to tensile or folding stresses.
The invention also provides an electronic device comprising the conductive element as described in any of the above.
Drawings
In order to more clearly illustrate the technical solution in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below.
FIG. 1 is a schematic view of a conductive element according to a preferred embodiment of the present invention;
FIG. 2 is a graph of the rate of change of resistance versus the number of bends of the conductive element of FIG. 1 during a bend test;
FIG. 3 is a line graph of the rate of change of resistance versus the number of stretches of the conductive element of FIG. 1 during a stretch test;
fig. 4 is a line graph of sheet resistance versus thickness of the silver paste print of the conductive element of fig. 1.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. As used herein, the terms "left", "right", "upper", "lower", and the like are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1, an electronic device includes a conductive element 100. The electronic device may be a mobile phone, a tablet computer, a wearable device, etc., and the present invention is not limited to the type of the electronic device, and the conductive element 100 claimed in the present invention should be considered as falling within the scope of the present invention.
The conductive element 100 includes a substrate 20, a silver paste layer 40, and a protective layer 60. The substrate 20 has a carrying surface 22, the silver paste layer 40 is disposed on the carrying surface 22, and the protection layer 60 is disposed on the carrying surface 22 and covers the silver paste layer 40 to protect the silver paste layer 40.
The silver adhesive layer 40 comprises silver adhesive 42, the silver adhesive 42 comprises resin 422 and silver powder particles 424, the resin 422 is used as a connecting phase, and the silver powder particles 424 are used as a conductive phase and are formed by mixing linear silver powder particles with the diameter of 20 nm-100 nm and flake silver powder particles. The flexibility and ductility of the silver paste 42 are enhanced by mixing the resin 422 with the silver powder particles 424, so that the conductive circuit of the silver paste layer 40 is prevented from being broken when the conductive element 100 is subjected to tensile or folding stress, and the product performance is prevented from being influenced.
Referring to fig. 2, fig. 3 and fig. 4, in the first embodiment of the present invention, the resin 422 accounts for 25% of the total weight of the silver paste 42, and tests show that the silver paste 42 has good bending and stretching resistance after being cured. The conductive element 100 has a resistance increase rate of not more than 80% when subjected to 2000 times of stretching under a condition of a stretching rate of 30%, and a resistance increase rate of not more than 15% when subjected to a folding test of 4.5 ten thousand times under a condition of a bending radius r of 0.6 mm. The sheet resistance of the conductive element 100 can be as low as 30u omega/saq when the printing thickness of the silver paste 42 is 8um, and the sheet resistance is basically stabilized between 30u omega/saq-35 u omega/saq when the printing thickness is 1 um-30 um.
The above test data can prove that the conductive element 100 disclosed by the invention has good bending resistance and extensibility.
In the second embodiment of the present invention, the resin 422 accounts for 20% of the total weight of the silver paste 42, and tests show that the conductive element 100 has a lower resistance increase rate than the first embodiment under the same test conditions, but the conductive element 100 has a line breaking phenomenon after being stretched or folded during the test process, and the yield is lower than 95%.
In the third embodiment of the present invention, the resin 422 accounts for 30% of the total weight of the silver paste 42, and it is found through experiments that the conductive element does not have the line breakage phenomenon of the silver paste layer 40 under the same test conditions in the first embodiment, but the resistance increase rate thereof exceeds 50% when subjected to the same number of folding tests under the same conditions, exceeds 150% when subjected to the same number of stretching tests under the same conditions, and even has the phenomenon that the circuit is not broken but is not conducted through the conduction test result.
By combining the three embodiments, it can be seen that, considering that the silver paste 42 needs to have both good bending and stretching resistance and good electrical conductivity, the resin 422 accounts for no less than 20% of the total weight of the silver paste 42, and if the content of the resin 422 is too low, the strength of the silver paste 42 after curing cannot be ensured, and the silver paste layer 40 may be broken and may not be good after being stretched or folded for a certain number of times. Meanwhile, the content of the resin 42 in the silver paste 422 should not exceed 30% of the total weight, which may otherwise cause the silver powder particles 424 in the silver paste 42 not to well lap and conduct a circuit and the resistance of the silver paste 42 increases too much when the silver paste is stretched or folded after being cured, thereby affecting the conductivity thereof. Therefore, the weight ratio of the resin 422 to the silver colloid 42 in the silver colloid 42 is preferably between 20% and 30%.
In order to ensure the flexibility and ductility of the silver paste layer 40, the resin 422 should be a resin having good flexibility and ductility after being cured, in one embodiment of the present invention, the resin 422 may be polyurethane, and the silver paste 42 is coated on the substrate 20 and cured to perform a tensile and bending test and a conductivity test, which fully satisfy the requirements of the conductive element 100.
The silver colloid 422 may also be EVA resin, or the resin 422 may also be formed by mixing polyurethane and EVA resin in a certain proportion. It is understood that any resin suitable for forming conductive elements and having good flexibility and ductility after curing can be used as the resin 422 of the present invention, and is not limited to the types of resins described above.
In order to keep the silver paste 42 in good conductive performance after being mixed with the resin 422 and avoid the problem of circuit non-conduction, in the embodiment of the present invention, the silver powder particles 424 adopt linear silver powder particles mixed with flake silver powder particles as the conductive phase of the silver paste 42, and the linear silver powder particles are nano silver wires. The conductivity of the silver colloid 42 is derived from a conductive network realized by mutual overlapping of the silver powder particles 422, and the selected silver powder particle design scheme can still realize effective overlapping conduction and can well conduct a circuit when the material is subjected to tensile or folding stress.
The linear silver powder particles can be well connected with the conductive network, and the flaky silver powder particles have large surface area and can play a role in supplementing and lapping gaps among the linear silver powder particles. When the conductive element 100 is under tensile or folding stress, the silver flake particles can be well stretched, so that the circuit conduction of the silver paste 42 is further ensured. The resin 422 and the silver powder particles 424 can be uniformly and stably mixed and can meet the impedance requirement of a printed circuit after being cured.
In the embodiment of the present invention, the diameter of the linear silver powder particles is 20nm to 100nm, preferably 40nm to 80 nm. Too small a diameter may result in insufficient strength of the silver powder particles, easy breakage under stress, and too large a diameter may result in uneven dispersion of the silver powder particles 424 in the silver paste 42, resulting in failure of conduction of the silver paste 42 circuit or excessive resistance affecting conductivity.
The thickness of the flaky silver powder particles is 20 nm-50 nm, and the width of the flaky silver powder particles is 1 um-3 um. Too small a thickness or too large a width may result in insufficient strength of the silver powder particles, and too large a thickness or too small a width may be disadvantageous to stretch-stretch. The width of the flaky silver powder particles is far greater than the thickness of the flaky silver powder particles, so that the flaky silver powder particles have a large surface area, and can be well extended when being subjected to tensile or folding stress to wrap the linear silver powder particles for lap joint, thereby ensuring that the circuit of the silver colloid 42 is conducted.
The silver powder particles 424 can be well mixed with the resin 422 under the above specification and can ensure the conduction of the lines of the silver paste 42, and the nano-scale silver powder particles can make the silver paste layer 40 have a smaller thickness, so that the conductive element 100 is thinner and lighter.
In this embodiment, the silver powder particles 424 and the resin 422 are taken, then an appropriate amount of solvent is added to mix and stir the mixture to form the silver colloid 42, the weight ratio range of the resin 422 to the silver colloid 42 is 20% -30%, and the silver colloid 42 is printed on the bearing surface 22 of the substrate 20 by silk-screen printing, transfer printing, impression printing, inkjet printing, 3D printing, sputtering and the like, so as to form the silver colloid layer 40. Preferably, when the silver powder particles 424 and the resin 422 are mixed, a mixed system of the silver powder particles 424 and the resin 422 may be heated, and the mixed system may be dispersed using a ball mill or a planetary mixer, so that the mixed system may be mixed more uniformly, and the silver paste 42 having a good property may be obtained.
In addition, in order to provide the substrate 20 with good flexibility, in one embodiment of the present invention, TPU (Thermoplastic polyurethane) elastomer rubber is used as a material for preparing the substrate. It is understood that in other embodiments, the substrate 20 may also be made of other flexible materials such that the substrate 20 is bendable and stretchable, such as at least one of carbon-based rubber (e.g., latex, butadiene rubber, ethylene propylene rubber, nitrile rubber, etc.), silicone rubber, silicone resin (e.g., Polydimethylsiloxane (PDMS)), SEBS (hydrogenated styrene-butadiene copolymer), EcoFlex (butylene adipate-butylene terephthalate copolymer), and macromolecular hydrogel.
Meanwhile, the base material 20 should be made of a material with a melting point higher than 180 ℃ so that the base material 20 can bear the high temperature of the silver colloid 42 in the curing process, and the silver colloid 42 is not warped and deformed in the curing process, thereby avoiding the bad product.
Also, the protective layer 60 is required to have excellent flexibility, and it is understood that the protective layer 60 may be made of the material used for the substrate as described above. The difference is that the protective layer 60 should be made of a material with a lower melting point relative to the base material 20, and the melting point is preferably not higher than 130 ℃, so that the protective layer 60 can be tightly pressed with the base material 20 and cover the silver glue layer 40 simply by means of hot pressing. However, the melting point should not be too low, preferably not lower than 110 ℃, otherwise, when the composition is applied to electronic equipment, the heat generated by the operation of the electronic equipment can cause the electronic equipment to deform. In summary, the material for preparing the protective layer 60 preferably has a melting point of 110-130 ℃. The hot pressing may realize an efficient RTR (Roll to Roll) operation by heating the roller, so that the conductive member 100 may be more slimmed.
In addition, considering that the three layers of the conductive element 100 are separated from each other due to too large difference in deformation when the three layers are subjected to tensile or folding stress, the elastic modulus of each layer should be the same when each layer is selected, so that each layer has almost the same deformation when being subjected to stress, and the close contact between each layer can be maintained without separation, thereby ensuring the product yield.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
1. A conductive element, comprising:
the substrate is provided with a bearing surface;
the silver glue layer is arranged on the bearing surface of the substrate;
a protective layer arranged on the bearing surface of the substrate and covering the silver glue layer,
the silver paste is characterized in that the silver paste layer comprises silver paste, the silver paste adopts resin as a connecting phase, and the resin accounts for 20-30% of the total weight of the silver paste; the silver colloid adopts silver powder particles as a conductive phase, and the silver powder particles comprise linear silver powder particles and flaky silver powder particles; the elastic modulus orders of magnitude of the base material, the silver glue layer and the protective layer are the same.
2. The conductive element of claim 1, wherein: the resin comprises at least one of polyurethane and EVA resin.
3. The conductive element of claim 1, wherein: the diameter of the linear silver powder particles is 20 nm-100 nm.
4. The conductive element of claim 3, wherein: the diameter of the linear silver powder particles is 40 nm-80 nm.
5. The conductive element of claim 1, wherein: the thickness of the flaky silver powder particles is 20 nm-50 nm, and the width of the flaky silver powder particles is 1 um-3 um.
6. The conductive element of claim 1, wherein: the material of the base material comprises at least one of TPU elastomer rubber, carbon-based rubber, silicon rubber, organic silicon resin and macromolecular hydrogel.
7. The conductive element of claim 1, wherein: the protective layer is made of at least one of TPU elastomer rubber, carbon-based rubber, silicon rubber, organic silicon resin and macromolecular hydrogel.
8. The conductive element of claim 1, wherein: the melting point of the protective layer is 110-130 ℃, and the melting point of the base material is more than 180 ℃.
9. An electronic device, characterized in that: comprising a conductive element according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911046814.8A CN111100591B (en) | 2019-10-30 | 2019-10-30 | Conductive element and electronic device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911046814.8A CN111100591B (en) | 2019-10-30 | 2019-10-30 | Conductive element and electronic device |
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| Publication Number | Publication Date |
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| CN111100591A CN111100591A (en) | 2020-05-05 |
| CN111100591B true CN111100591B (en) | 2022-02-01 |
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| CN201911046814.8A Active CN111100591B (en) | 2019-10-30 | 2019-10-30 | Conductive element and electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114244055B (en) * | 2022-01-11 | 2023-05-26 | 苏州昀冢电子科技股份有限公司 | Coil assembly and voice coil motor using same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104263303A (en) * | 2014-10-13 | 2015-01-07 | 中国科学院理化技术研究所 | Flexible conductive adhesive capable of being used in direct coating manner and preparation method of flexible conductive adhesive |
| CN105111988A (en) * | 2015-10-09 | 2015-12-02 | 重庆文理学院 | Flexible conductive silver adhesive |
| CN106753016A (en) * | 2017-01-22 | 2017-05-31 | 江苏旭泽技术有限公司 | A kind of radian screen hot bending film and its preparation method and application |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3857070B2 (en) * | 2001-04-25 | 2006-12-13 | アルプス電気株式会社 | Conductive resin composition and contact board using the same |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104263303A (en) * | 2014-10-13 | 2015-01-07 | 中国科学院理化技术研究所 | Flexible conductive adhesive capable of being used in direct coating manner and preparation method of flexible conductive adhesive |
| CN105111988A (en) * | 2015-10-09 | 2015-12-02 | 重庆文理学院 | Flexible conductive silver adhesive |
| CN106753016A (en) * | 2017-01-22 | 2017-05-31 | 江苏旭泽技术有限公司 | A kind of radian screen hot bending film and its preparation method and application |
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