CN111098062A - High-temperature lead-containing tin wire and production method thereof - Google Patents
High-temperature lead-containing tin wire and production method thereof Download PDFInfo
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- CN111098062A CN111098062A CN202010019859.2A CN202010019859A CN111098062A CN 111098062 A CN111098062 A CN 111098062A CN 202010019859 A CN202010019859 A CN 202010019859A CN 111098062 A CN111098062 A CN 111098062A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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Abstract
The invention belongs to the technical field of soldering tin lead-tin wire preparation, and discloses a high-temperature lead-tin wire and a production method thereof.A electrolytic tin is used for electrolyzing lead, sulfur is added into a smelting furnace to remove impurities to prepare tin-containing low-grade tin, the temperature is raised, and an antioxidant is added; adding Ag particles, stirring until Ag is completely dissolved to form SnAgPb alloy, and pouring the SnAgPb alloy into a tin cylinder mold at the temperature of 430 ℃ to prepare a semi-finished product of the tin cylinder containing Ag; extruding the tin cylinder to form a tin wire; drawing the extruded tin wires into thin wires by an oversize machine, a medium machine and a small machine according to the wire diameter specification; and coiling the tin wire with the specification by using a wire coiling machine, forming and packaging. The production method has low cost and simple process, and the obtained lead-tin wire has good linear performance.
Description
Technical Field
The invention belongs to the technical field of preparation of soldering tin lead-tin wires, and particularly relates to a high-temperature lead-tin wire and a production method thereof.
Background
Currently, the closest prior art: the lead-tin wire has a low melting point, a soft metal structure, low production efficiency and poor product quality, and is not beneficial to stretching of machining, and when the product is welded for the second time in application, the tin melting phenomenon occurs due to the low melting point.
With the increasing awareness of the scientific and technological community and the public society about the harmful effects of lead in tin-lead (Sn-Pb) solders used in the electronic industry, countries in the world have regulated or even prohibited the application of harmful materials such as lead-containing solders in the industries such as microelectronics by legislation. At present, the lead-free of electronic products is in great mind. Sn-Pb solder, Sn-Ag-Cu solder and Sn-Bi solder have gradually replaced Sn-Pb solder and are widely used in electronic packaging industry. Among them, Sn-Ag-Cu based lead-free solders are widely considered by the industry as the first choice to replace conventional lead-containing solders due to their excellent wettability, mechanical properties, etc. Among Sn-Ag-Cu solder, ternary near-eutectic Sn-3.0Ag-0.5Cu lead-free solder has the most extensive application, but has higher cost due to the higher content of Ag. On the other hand, currently, consumer electronics are becoming the fastest growing part of the electronics industry, especially the increasing popularity of handheld electronic devices and portable electronic devices represented by cell phones, digital cameras, video cameras, notebook computers, MP3 players, and the like. These handheld and portable electronic products are more rapid to upgrade and have a shorter life cycle in service than most conventional electronic devices, and thus failure due to temperature cycling has not been a major reliability concern; however, they are more susceptible to accidental bumps, jarring, bumping and dropping, which in turn introduces another new mechanical shock induced failure mechanism in the electronic package interconnect pads, i.e., drop/shock induced reliability issues. The reduction of the content of Ag in the solder can reduce the modulus of the solder alloy and improve the drop/impact resistance of the solder alloy; the addition of Ni can improve the structure and appearance of an interface intermetallic compound IMC of the brazing filler metal and a substrate (such as Cu or Ni) and can also effectively improve the drop/impact resistance of the brazing filler metal alloy. Therefore, the Sn-Ag-Cu solder is gradually developed to the direction of low silver at present. Chinese patent application No. 200810053841.3 discloses that the low-silver solder is poor in oxidation resistance and wettability due to the addition of easily-oxidizable elements Zn and Bi. The content of Ag (2.0-2.9 wt%) of the low-silver lead-free solder disclosed in the Chinese patent application No. 200310115384.3 is still high, and the cost of the solder alloy is not obviously reduced.
In summary, the problems of the prior art are as follows:
(1) the melting point is low, and the requirement of secondary welding (the welding spot is not melted) cannot be met.
(2) In the prior art, the production method is complicated, the cost is high, the waste of resources such as energy sources is large, and the quality of products obtained by the prior art is poor.
The significance of solving the technical problems is as follows: is beneficial to increasing the melting point and leading the product quality to be more stable.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a high-temperature lead-tin wire and a production method thereof.
The invention is realized in such a way that the production method of the high-temperature lead-tin wire comprises the following steps:
firstly, electrolytic lead is added by electrolytic tin, sulfur is added into a smelting furnace to remove impurities to prepare low-grade tin containing tin, the temperature is raised, and antioxidants such as phosphorus are added. The dosage ratio is 0.3 kg/ton.
And secondly, adding Ag particles, stirring until the Ag is completely dissolved to form SnAgPb alloy, and pouring the SnAgPb alloy into a tin cylinder mold at the temperature of 430 +/-10 ℃ to prepare the Ag-containing tin cylinder semi-finished product.
And thirdly, extruding the tin cylinder into a tin wire.
Fourthly, respectively drawing the extruded tin wires into thin wires phi 9.0 mm-phi 0.4mm by using an oversize machine, a medium machine and a small machine according to the wire diameter specification.
Fifthly, coiling the tin wire with the specification by using a wire coiling machine, forming and packaging.
Furthermore, in the first step, 60% electrolytic tin is used to electrolyze lead, a small amount of sulfur is added into a 330 ℃ smelting furnace to remove impurities to prepare low-grade tin containing 4.5% of tin, and the temperature is raised to 430 ℃ and 0.3 KG/ton antioxidant is added.
Further, in the second step, Ag particles are added according to the proportion of 2.0% at the temperature of 500 ℃ and stirred until Ag is completely dissolved to form SnAgPb alloy, and the SnAgPb alloy is poured into a tin cylinder mold at the temperature of 430 ℃ to prepare a 4.5% Ag-containing tin cylinder semi-finished product.
Further, the semi-finished product of the tin cylinder containing Ag is Sn4.5Ag2Pb93.4.
And further, in the third step, the tin cylinder is placed in a 350-ton press to be slowly extruded, the speed is 1 cylinder, the time is 15 minutes, the rosin content is adjusted to 1.7 percent, and the tin wire with the diameter of 9.0mm is extruded according to the method. So as to form a set of production process parameters.
The invention also aims to provide the high-temperature lead-tin wire produced by the production method of the high-temperature lead-tin wire.
In summary, the advantages and positive effects of the invention are:
in the production method of the high-temperature lead-tin wire, electrolytic tin and electrolytic lead are used, sulfur is added into a smelting furnace to remove impurities to prepare low-grade tin containing tin, the temperature is raised, and an antioxidant is added. Adding Ag grains and stirring until Ag is completely dissolved to form SnAgPb alloy, and pouring the SnAgPb alloy into a tin cylinder mold at the temperature of 430 ℃ to prepare the Ag-containing tin cylinder semi-finished product. And extruding the tin cylinder to obtain the tin wire. And drawing the extruded tin wires into thin wires by using an oversize machine, a medium machine and a small machine according to the wire diameter specification. And coiling the tin wire with the specification by using a wire coiling machine, forming and packaging. Lead-tin wires with good performance can be obtained. The melting point of the original product is 230-245 ℃, the melting point of the product is 307 ℃, and the melting point is theoretically required to be more than 260 ℃.
The results are shown in the following table:
| test sample | Melting Point (. degree.C.) |
| A2190086642101001 | 307.6 |
Drawings
Fig. 1 is a flow chart of a method for producing a high-temperature lead-tin wire according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
To solve the above problems, the following describes the technical solution of the present invention in detail with reference to the accompanying drawings.
As shown in fig. 1, the method for producing a high-temperature lead-tin wire according to an embodiment of the present invention includes:
s101, electrolyzing lead by using 60% electrolytic tin, adding a small amount of sulfur in a melting furnace at 330 ℃ to remove impurities to prepare low-degree tin containing 4.5% of tin, heating to about 430 ℃, and adding 0.3 KG/ton of antioxidant.
S102, adding Ag particles according to the proportion of 2.0% at the temperature of about 500 ℃, stirring until Ag is completely dissolved to form SnAgPb alloy, pouring the SnAgPb alloy into a tin cylinder mold at the temperature of 430 ℃, and preparing a semi-finished product of a 4.5% Ag-containing tin cylinder (Sn4.5Ag2Pb93.4).
S103, placing the tin cylinder in a 350-ton press to perform slow extrusion at the speed of 1 cylinder for 15 minutes, adjusting the rosin content to 1.7 percent, and extruding the tin cylinder into a tin wire with the diameter of 9.0 mm.
And S104, respectively drawing the extruded tin wires into thin wires by using an oversize machine, a medium machine and a small machine according to the wire diameter specification.
And S105, winding and forming the standard tin wire by using a wire winding machine, and packaging.
The invention is further described with reference to specific examples. The product is welded by a Sn4.5Ag2Pb93.4 lead-tin wire, and the test operation has the following advantages: 1. the product has moderate material quality, is suitable for wire drawing of a wire drawing machine, and improves the production efficiency of the process. 2. The material of the product in the machine is moderate, so the feeding is very smooth. 3. The melting point is increased by 307 ℃, and the standard requirement of the product over-reflow soldering temperature of 260-270 ℃ is met.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. The production method of the high-temperature lead-tin wire is characterized by comprising the following steps:
firstly, electrolyzing lead by electrolytic tin, adding sulfur in a smelting furnace to remove impurities to prepare low-grade tin containing tin, heating, and adding an antioxidant;
secondly, adding Ag particles and stirring until Ag is completely dissolved to form SnAgPb alloy, and pouring the SnAgPb alloy into a tin cylinder mold at the temperature of 430 ℃ to prepare a semi-finished product of the tin cylinder containing Ag;
thirdly, extruding the tin cylinder into a tin wire;
fourthly, respectively drawing the extruded tin wires into thin wires by an oversize machine, a medium machine and a small machine according to the wire diameter specification;
fifthly, coiling the tin wire with the specification by using a wire coiling machine, forming and packaging.
2. The method of claim 1, wherein in the first step, 60% electrolytic tin is used to electrolyze lead, a small amount of sulfur is added to a 330 ℃ melting furnace to remove impurities and prepare low-grade tin containing 4.5% tin, and 0.3 KG/ton antioxidant is added after the temperature is raised to 430 ℃.
3. The method of claim 1, wherein in the second step, Ag particles are added at a ratio of 2.0% at 500 ℃ and stirred until Ag is completely dissolved to form SnAgPb alloy, and the SnAgPb alloy is poured into a tin barrel mold at 430 ℃ to form a 4.5% Ag-containing tin barrel semi-finished product.
4. The method for producing high temperature leaded tin wire as set forth in claim 3, characterized in that the semi-finished product of the tin can containing Ag is Sn4.5Ag2Pb93.4.
5. The method for producing a high-temperature leaded tin wire as set forth in claim 1, wherein in the third step, the tin cylinder is placed in a 350-ton press and slowly pressed at a speed of 1 cylinder for 15 minutes, and the rosin content is adjusted to 1.7%, whereby a tin wire having a diameter of 9.0mm is formed.
6. A high temperature pb-sn wire produced by the method for producing a high temperature pb-sn wire according to claim 1.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010019859.2A CN111098062A (en) | 2020-01-09 | 2020-01-09 | High-temperature lead-containing tin wire and production method thereof |
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| CN202010019859.2A CN111098062A (en) | 2020-01-09 | 2020-01-09 | High-temperature lead-containing tin wire and production method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113770590A (en) * | 2021-10-13 | 2021-12-10 | 浙江强力控股有限公司 | Antimony-containing soldering tin wire free of soldering flux and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0857681A (en) * | 1994-08-22 | 1996-03-05 | Tanaka Kikinzoku Kogyo Kk | Low melting brazing filler metal and its production |
| CN104070303A (en) * | 2013-03-28 | 2014-10-01 | 北京康普锡威科技有限公司 | Anti-oxidation high-temperature soft-solder solid wire and manufacturing method thereof |
| CN107877029A (en) * | 2013-03-29 | 2018-04-06 | 三菱综合材料株式会社 | The installation method of the manufacture method of solder powder, solder slurry and electronic unit |
| CN108788535A (en) * | 2018-05-16 | 2018-11-13 | 深圳市绿色千田锡业科技有限公司 | A kind of manufacturing process of unleaded tin silk |
| CN110560966A (en) * | 2019-09-30 | 2019-12-13 | 无锡广捷富金属制品有限公司 | manufacturing process for tin wire production |
-
2020
- 2020-01-09 CN CN202010019859.2A patent/CN111098062A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0857681A (en) * | 1994-08-22 | 1996-03-05 | Tanaka Kikinzoku Kogyo Kk | Low melting brazing filler metal and its production |
| CN104070303A (en) * | 2013-03-28 | 2014-10-01 | 北京康普锡威科技有限公司 | Anti-oxidation high-temperature soft-solder solid wire and manufacturing method thereof |
| CN107877029A (en) * | 2013-03-29 | 2018-04-06 | 三菱综合材料株式会社 | The installation method of the manufacture method of solder powder, solder slurry and electronic unit |
| CN108788535A (en) * | 2018-05-16 | 2018-11-13 | 深圳市绿色千田锡业科技有限公司 | A kind of manufacturing process of unleaded tin silk |
| CN110560966A (en) * | 2019-09-30 | 2019-12-13 | 无锡广捷富金属制品有限公司 | manufacturing process for tin wire production |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113770590A (en) * | 2021-10-13 | 2021-12-10 | 浙江强力控股有限公司 | Antimony-containing soldering tin wire free of soldering flux and preparation method thereof |
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