CN111093141A - Loudspeaker unit, electronic equipment and manufacturing method of loudspeaker unit - Google Patents
Loudspeaker unit, electronic equipment and manufacturing method of loudspeaker unit Download PDFInfo
- Publication number
- CN111093141A CN111093141A CN201911350871.5A CN201911350871A CN111093141A CN 111093141 A CN111093141 A CN 111093141A CN 201911350871 A CN201911350871 A CN 201911350871A CN 111093141 A CN111093141 A CN 111093141A
- Authority
- CN
- China
- Prior art keywords
- sound cavity
- circuit board
- limiting
- horn
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R29/00—Monitoring arrangements; Testing arrangements
- H04R29/001—Monitoring arrangements; Testing arrangements for loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/006—Interconnection of transducer parts
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
The invention relates to the technical field of electronics, and discloses a loudspeaker unit, electronic equipment and a manufacturing method of the loudspeaker unit. The electronic equipment comprises the loudspeaker unit. The manufacturing method of the loudspeaker unit comprises the following steps: integrally injection-molding the shell and the terminal plate; assembling a horn assembly into a sound cavity region of a housing; the circuit board is assembled into the sound cavity area of the housing and connected to the first portion of the terminal plate and the speaker assembly. The loudspeaker unit, the electronic equipment and the manufacturing method of the loudspeaker unit solve the problem that the production efficiency is low due to the fact that the circuit board penetrates out of the sound cavity manually.
Description
Technical Field
The present invention relates to the field of electronic technologies, and in particular, to a speaker unit, an electronic device, and a method for manufacturing the speaker unit.
Background
In the prior art, in electronic devices such as mobile phones and tablet computers, a speaker assembly and a circuit board are both disposed in a sound cavity on a housing, and the circuit board needs to pass through a hole on a side wall of the sound cavity to be connected with a circuit. And because the hole size that the power supply circuit board passed on the sound chamber lateral wall is less, so can only rely on the manual work to realize wearing out of circuit board, nevertheless, realize wearing out of circuit board through the manual work and have the lower problem of production efficiency, be unfavorable for loudspeaker unit production efficiency's improvement.
Disclosure of Invention
The invention provides a loudspeaker unit, electronic equipment and a manufacturing method of the loudspeaker unit, which are used for solving the problem that in the prior art, a circuit board penetrates out of a sound cavity manually, so that the production efficiency is low.
In order to achieve the purpose, the invention provides the following technical scheme:
a horn unit comprising:
the loudspeaker comprises a shell provided with a sound cavity area, a loudspeaker assembly fixedly arranged in the sound cavity area, a circuit board fixedly arranged in the sound cavity area and connected with the loudspeaker assembly, and a terminal board integrally formed on the shell, wherein the terminal board comprises a first part positioned in the sound cavity area and a second part positioned outside the sound cavity area, the first part is connected with the circuit board, and the second part is used for connecting an external circuit.
The loudspeaker unit provided by the invention is integrally formed with the terminal board on the shell, the first part of the terminal board is positioned in the sound cavity area, the second part of the terminal board is positioned outside the sound cavity area and is used for connecting an external circuit, the circuit board in the sound cavity area is connected with the first part of the terminal board, the connection with the external circuit can be realized through the terminal board, the circuit board does not need to penetrate out of the sound cavity area, and the production efficiency can be obviously improved.
In addition, the terminal board is integrally formed on the shell, and the connection between the terminal board and the shell is more reliable.
Optionally, the casing includes the backplate, is formed in order to be used for enclosing on the backplate the spacing muscle in sound cavity district, wherein, spacing muscle is including being used for doing the spacing first spacing portion of loudspeaker subassembly, first spacing portion is including being used for doing the spacing step face of loudspeaker subassembly.
Optionally, the limiting rib includes a second limiting portion, and the terminal plate penetrates through the second limiting portion.
Optionally, at least two first positioning holes are formed in one end of the circuit board connected with the first limiting portion, first positioning pins corresponding to the first positioning holes one to one are formed on the surface of the first limiting portion, and the first positioning pins are inserted into the corresponding first positioning holes.
Optionally, at least one second positioning hole is formed in a portion of the circuit board adjacent to the terminal board, a second positioning pin corresponding to the second positioning hole is formed in an area surrounded by the second limiting portion on the housing, and the second positioning pin is inserted into the corresponding second positioning hole.
Optionally, a support portion for supporting the circuit board is formed between the speaker assembly and the terminal plate in the cavity region.
Optionally, the second portion of the terminal plate is provided with a PAD area for connection with an external circuit.
The invention further provides electronic equipment which comprises any one of the loudspeaker units provided in the technical scheme, and the electronic equipment at least can achieve the beneficial effects which can be achieved by the loudspeaker units, so that the production efficiency of the loudspeaker units and even the electronic equipment is improved.
The invention also provides a manufacturing method of the loudspeaker unit, which comprises the following steps:
integrally injection-molding a shell and a terminal plate, wherein the shell is provided with a sound cavity area, the terminal plate comprises a first part positioned in the sound cavity area and a second part positioned outside the sound cavity area, and the second part is used for connecting an external circuit;
assembling a horn assembly into the sound cavity region;
the circuit board is assembled into the sound cavity area and connected to the first portion of the terminal plate and the speaker assembly.
The loudspeaker unit manufactured by the manufacturing method of the loudspeaker unit provided by the invention has the advantages that the terminal board is integrally formed on the shell, the first part of the terminal board is positioned in the sound cavity area, the second part of the terminal board is positioned outside the sound cavity area and is used for connecting an external circuit, the circuit board in the sound cavity area is connected with the first part of the terminal board, the connection with the external circuit can be realized through the terminal board, the circuit board does not need to penetrate out of the sound cavity area, and the production efficiency can be obviously improved.
In addition, the terminal board is integrally formed on the shell, and the connection between the terminal board and the shell is more reliable.
Optionally, the housing includes a back plate and a limiting rib formed on the back plate to surround the sound cavity region, the limiting rib includes a first limiting portion for limiting the speaker assembly, and the first limiting portion includes a step surface for limiting the speaker assembly;
the assembling of the horn assembly into the sound cavity region comprises:
mounting the horn assembly on the first limiting part;
and bonding the horn component with the first limiting part.
Optionally, after the circuit board is assembled in the sound cavity area and connected with the first part of the terminal board and the speaker assembly, the method includes:
carrying out short circuit test on the horn unit;
and after the test is passed, the circuit board is sealed on the shell in an adhesive manner.
Drawings
Fig. 1 is a schematic structural diagram of a speaker unit according to an embodiment of the present invention;
fig. 2 is a schematic view of a partial structure of the horn unit shown in fig. 1;
fig. 3 is a flowchart of a method for manufacturing a speaker unit according to an embodiment of the present invention.
Icon: 1-a shell; 11-a back plate; 12-a limiting rib; 121-a first limiting part; 122-a second limiting part; 1211 — a first dowel pin; 2-a horn assembly; 3-a circuit board; 4-a terminal plate; 41-a first part; 42-a second portion; 5-a second locating pin; 6-a support part; 7-PAD area; 100-sound cavity area.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 and 2, the present embodiment provides a horn unit including: the loudspeaker comprises a shell 1 provided with a sound cavity area 100, a loudspeaker component 2 fixedly arranged in the sound cavity area 100, a circuit board 3 (the circuit board 3 can be a flexible circuit board, which is abbreviated as FPC) fixedly arranged in the sound cavity area 100 and connected with the loudspeaker component 2, and a terminal board 4 integrally formed on the shell 1, wherein the terminal board 4 comprises a first part 41 positioned in the sound cavity area 100 and a second part 42 positioned outside the sound cavity area 100, the first part 41 is connected with the circuit board 3, and the second part 42 is used for connecting an external circuit.
The loudspeaker unit that this embodiment provided has terminal board 4 on casing 1 integrated into one piece, and the first part 41 of terminal board 4 is located sound cavity district 100, and the second part 42 is located outside sound cavity district 100 and is used for connecting the external circuit, and circuit board 3 in sound cavity district 100 is connected with first part 41 of terminal board 4, can realize through terminal board 4 with the connection of external circuit, need not again to wear out sound cavity district 100 with circuit board 3, can reduce the manufacturing difficulty, show improvement production efficiency, reduction in production cost.
In addition, among the prior art, wear out the sound chamber with the circuit board through the manual work, need beat the glue on the two sides of circuit board, have loudspeaker subassembly gas leakage, leak sound scheduling problem, production efficiency and product percent of pass are all lower moreover. The loudspeaker unit terminal board 4 integrated into one piece that this embodiment provided is on casing 1, and circuit board 3 passes through terminal board 4 and external circuit connection, and circuit board 3 is more reliable with terminal board 4's connection, has saved the process of beating the glue moreover, is favorable to improving the production efficiency of loudspeaker unit and the qualification rate of product.
The housing 1 and the middle plate or the front cover unit usually enclose a sound cavity, so in this embodiment, the sound cavity area 100 on the housing 1 is used for forming the sound cavity and is a part of the sound cavity.
When the terminal plate 4 is specifically provided, the first portion 41 and the second portion 42 may be of an integral structure; the second portion 42 may be provided with PAD-PAD areas 7 for connection with external circuitry.
Alternatively, the PAD area 7 may be gold-plated, and the thickness of the gold may be 0.15 um.
When specifically setting up above-mentioned casing 1, casing 1 can include backplate 11, form on backplate 11 in order to be used for enclosing the spacing muscle 12 of a sound cavity district 100, wherein, spacing muscle 12 can be including being used for the spacing first spacing portion 121 for loudspeaker subassembly 2, and first spacing portion 121 is including being used for the spacing step face for loudspeaker subassembly 2.
Further, the limiting rib 12 may further include a second limiting portion 122, and the terminal plate 4 penetrates through the second limiting portion 122 to form a first portion 41 located in the sound cavity area 100 and a second portion 42 located outside the sound cavity area 100; the circuit board 3 has one end connected to the speaker assembly 2 and the other end extending into the area surrounded by the second limiting portion 122 and connected to the first portion 41 of the terminal plate 4.
In order to facilitate the positioning of the circuit board 3, at least two first positioning holes may be formed at one end of the circuit board 3 connected to the first position-limiting portion 121, first positioning pins 1211 corresponding to the first positioning holes one by one are formed on the surface of the first position-limiting portion 121, and the first positioning pins 1211 are inserted into the corresponding first positioning holes. Specifically, two first positioning holes may be formed at one end of the circuit board 3 connected to the first position-limiting portion 121.
In order to further ensure the accuracy of the mounting position of the circuit board 3, at least one second positioning hole may be formed at a position of the circuit board 3 adjacent to the terminal board 4, and a second positioning pin 5 corresponding to the second positioning hole is formed in an area surrounded by the second limiting portion 122 on the housing 1, and the second positioning pin 5 is inserted into the corresponding second positioning hole. In order to simplify the positioning operation of the circuit board 3, in one implementation, a second positioning hole may be formed at a portion of the circuit board 3 adjacent to the terminal board 4, and a second positioning pin 5 corresponding to the second positioning hole is formed in an area surrounded by the second limiting portion 122 on the housing 1.
In order to improve the stability of the circuit board 3, a support portion 6 for supporting the circuit board 3 may be formed between the speaker assembly 2 and the terminal plate 4 in the sound chamber area 100. In particular, the support 6 may be a support column; meanwhile, in order to achieve a better supporting effect, the width of the supporting column may be the same as or similar to the width of the corresponding position of the circuit board 3.
In one implementation, the speaker assembly 2 may be bonded to the first limiting portion 121, and then riveted and positioned with the circuit board and then welded to a pad of the circuit board to achieve electrical connection.
In one specific implementation, the manufacturing of the horn assembly may include the following steps:
mounting the horn component on the first limiting part and gluing for fixing; assembling the circuit board to a corresponding position and pressing, and hot riveting the first positioning pin 1211 through a hot riveting machine to connect the circuit board 3 and the first positioning part 121; welding a welding disc at the connecting part of the loudspeaker assembly and the circuit board to realize the electric connection of the loudspeaker assembly and the circuit board; hot riveting the second positioning pin by a hot riveting machine to connect the circuit board and the shell; welding a welding plate at the joint of the terminal board and the circuit board to realize the electrical connection of the terminal board and the circuit board; detecting the quality of the welding spot by a CCD camera; performing short circuit test after the welding is qualified, and dispensing and sealing a welding spot through a glue dispenser to prevent short circuit after the test is OK; and finally, fixing the circuit board on the shell by dispensing glue through a glue dispenser.
The loudspeaker unit provided by the embodiment can be used for the lead-out structure design of a half-BOX FPC or a full-BOX FPC.
The electronic device provided by the embodiment comprises any one of the horn units provided in the technical scheme, and the electronic device can at least achieve the beneficial effects that the horn units can achieve, and improves the production efficiency of the horn units and even the electronic device.
The electronic device mentioned in this embodiment may be a mobile phone or a tablet computer, but is not limited to being a mobile phone or a tablet computer.
When the electronic equipment is a mobile phone, the PAD PAD area can be connected with an external circuit board through the elastic sheet.
As shown in fig. 3, the method for manufacturing a speaker unit according to this embodiment includes:
step S01, integrally injection-molding the shell 1 and the terminal board 4, wherein the shell 1 is provided with a sound cavity area 100, the terminal board 4 comprises a first part 41 positioned in the sound cavity area 100 and a second part 42 positioned outside the sound cavity area 100, and the second part 42 is used for connecting an external circuit;
step S02, assembling the horn assembly 2 into the sound cavity area 100;
step S03 is to assemble the circuit board 3 into the sound cavity area 100 and to connect the circuit board 3 to the first part 41 of the terminal board 4 and the speaker assembly 2.
The loudspeaker unit manufactured by the manufacturing method of the loudspeaker unit provided by the embodiment has the advantages that the terminal plate 4 is integrally formed on the shell 1, the first part 41 of the terminal plate 4 is located in the sound cavity area 100, the second part 42 is located outside the sound cavity area 100 and used for connecting an external circuit, the circuit board 3 in the sound cavity area 100 is connected with the first part 41 of the terminal plate 4, the connection with the external circuit can be realized through the terminal plate 4, the circuit board 3 does not need to penetrate out of the sound cavity area 100, and the production efficiency can be obviously improved.
In addition, the terminal plate 4 is integrally formed on the housing 1, and the connection between the terminal plate and the housing is more reliable.
In one implementation, the housing 1 includes a back plate 11, and a limiting rib 12 formed on the back plate 11 for enclosing a sound cavity region 100, the limiting rib 12 includes a first limiting portion 121 for limiting the speaker assembly 2, and the first limiting portion 121 includes a step surface for limiting the speaker assembly 2;
assembling the horn assembly 2 into the sound cavity region 100 includes:
mounting the horn assembly 2 on the first position-limiting portion 121;
the horn assembly 2 is bonded to the first stopper 121.
In one embodiment, the assembly of the circuit board 3 into the sound chamber area 100 and the connection of the circuit board 3 to the first portion 41 of the terminal plate 4 and the speaker assembly 2 includes:
carrying out short circuit test on the horn unit;
after the test is passed, the circuit board 3 is sealed on the housing 1.
In one implementation, at least two first positioning holes are formed at one end of the circuit board 3 connected to the first positioning portion 121, and first positioning pins 1211 corresponding to the first positioning holes one by one are formed on the surface of the first positioning portion 121;
assembling the circuit board 3 into the sound cavity area 100 includes:
the first positioning pins 1211 are inserted into the corresponding first positioning holes.
In one implementation, the limiting rib 12 includes a second limiting portion 122, and the terminal board 4 penetrates through the second limiting portion 122; at least one second positioning hole is formed at the position of the circuit board 3 close to the terminal board 4, and a second positioning pin 5 corresponding to the second positioning hole is formed in the area surrounded by the second limiting part 122 on the shell 1;
assembling the circuit board 3 into the sound cavity area 100, further includes:
the second positioning pins 5 are inserted into the corresponding second positioning holes.
In one implementation, connecting the circuit board 3 to the speaker assembly 2 includes:
and welding a welding pad at the joint of the circuit board 3 and the loudspeaker assembly 2.
In one implementation, connecting the circuit board 3 to the first portion 41 of the terminal board 4 comprises:
the solder circuit board 3 is soldered to a land at the junction with the first portion 41.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (11)
1. A horn unit, comprising: the loudspeaker comprises a shell provided with a sound cavity area, a loudspeaker assembly fixedly arranged in the sound cavity area, a circuit board fixedly arranged in the sound cavity area and connected with the loudspeaker assembly, and a terminal board integrally formed on the shell, wherein the terminal board comprises a first part positioned in the sound cavity area and a second part positioned outside the sound cavity area, the first part is connected with the circuit board, and the second part is used for connecting an external circuit.
2. The speaker unit of claim 1, wherein the housing comprises a back plate and a limiting rib formed on the back plate for surrounding the sound cavity region, wherein the limiting rib comprises a first limiting portion for limiting the speaker assembly, and the first limiting portion comprises a step surface for limiting the speaker assembly.
3. The horn unit according to claim 2, wherein the stopper rib includes a second stopper portion, and the terminal plate penetrates the second stopper portion.
4. The speaker unit as claimed in claim 3, wherein at least two first positioning holes are formed at one end of the circuit board connected to the first position-limiting portion, first positioning pins corresponding to the first positioning holes are formed on the surface of the first position-limiting portion, and the first positioning pins are inserted into the corresponding first positioning holes.
5. The horn unit according to claim 3, wherein at least one second positioning hole is formed in a portion of the circuit board adjacent to the terminal plate, and a second positioning pin corresponding to the second positioning hole is formed in an area of the housing surrounded by the second limiting portion, the second positioning pin being inserted into the corresponding second positioning hole.
6. The horn unit according to claim 1, wherein a support portion for supporting the circuit board is formed between the horn assembly and the terminal plate in the cavity region.
7. The horn unit according to any one of claims 1 to 6, wherein the second portion of the terminal plate is provided with a PAD area for connection with an external circuit.
8. An electronic device characterized by comprising the speaker unit according to any one of claims 1 to 7.
9. A method for manufacturing a horn unit is characterized by comprising the following steps:
integrally injection-molding a shell and a terminal plate, wherein the shell is provided with a sound cavity area, the terminal plate comprises a first part positioned in the sound cavity area and a second part positioned outside the sound cavity area, and the second part is used for connecting an external circuit;
assembling a horn assembly into the sound cavity region;
the circuit board is assembled into the sound cavity area and connected to the first portion of the terminal plate and the speaker assembly.
10. The manufacturing method of claim 9, wherein the housing includes a back plate, and a limiting rib formed on the back plate for surrounding the sound cavity region, the limiting rib includes a first limiting portion for limiting the speaker assembly, and the first limiting portion includes a step surface for limiting the speaker assembly;
the assembling of the horn assembly into the sound cavity region comprises:
mounting the horn assembly on the first limiting part;
and bonding the horn component with the first limiting part.
11. The method of claim 9, wherein the step of assembling the circuit board into the sound cavity region and connecting the circuit board to the first portion of the terminal plate and the speaker assembly comprises:
carrying out short circuit test on the horn unit;
and after the test is passed, the circuit board is sealed on the shell in an adhesive manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911350871.5A CN111093141A (en) | 2019-12-24 | 2019-12-24 | Loudspeaker unit, electronic equipment and manufacturing method of loudspeaker unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911350871.5A CN111093141A (en) | 2019-12-24 | 2019-12-24 | Loudspeaker unit, electronic equipment and manufacturing method of loudspeaker unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111093141A true CN111093141A (en) | 2020-05-01 |
Family
ID=70398271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911350871.5A Pending CN111093141A (en) | 2019-12-24 | 2019-12-24 | Loudspeaker unit, electronic equipment and manufacturing method of loudspeaker unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111093141A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111770255A (en) * | 2020-07-20 | 2020-10-13 | 福州鑫图光电有限公司 | Dustproof and moistureproof structure for scientific grade CMOS camera |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104581567A (en) * | 2015-01-20 | 2015-04-29 | 音品电子（深圳）有限公司 | Ultra-thin loudspeaker and assembling method thereof |
| CN204859471U (en) * | 2015-08-24 | 2015-12-09 | 嘉善豪声电子有限公司 | Cell -phone speaker cavity that uses FPC lead wire reaches speaker including this cavity |
| CN206413056U (en) * | 2016-12-09 | 2017-08-15 | 深圳市阿龙通讯技术有限公司 | A kind of Mobile phone horn side goes out sound cavity sealing structure |
| CN207166684U (en) * | 2017-07-31 | 2018-03-30 | 西安中兴新软件有限责任公司 | A kind of terminal |
| CN108811285A (en) * | 2018-07-16 | 2018-11-13 | Oppo广东移动通信有限公司 | Electronic equipment |
| US10187730B1 (en) * | 2018-08-10 | 2019-01-22 | AAC Technologies Pte. Ltd. | Sound generating device |
| CN109672948A (en) * | 2018-12-29 | 2019-04-23 | 歌尔股份有限公司 | Microphone device |
| CN208940227U (en) * | 2018-08-17 | 2019-06-04 | 中兴通讯股份有限公司 | A kind of anti-hygrechema chamber and electronic equipment |
-
2019
- 2019-12-24 CN CN201911350871.5A patent/CN111093141A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104581567A (en) * | 2015-01-20 | 2015-04-29 | 音品电子（深圳）有限公司 | Ultra-thin loudspeaker and assembling method thereof |
| CN204859471U (en) * | 2015-08-24 | 2015-12-09 | 嘉善豪声电子有限公司 | Cell -phone speaker cavity that uses FPC lead wire reaches speaker including this cavity |
| CN206413056U (en) * | 2016-12-09 | 2017-08-15 | 深圳市阿龙通讯技术有限公司 | A kind of Mobile phone horn side goes out sound cavity sealing structure |
| CN207166684U (en) * | 2017-07-31 | 2018-03-30 | 西安中兴新软件有限责任公司 | A kind of terminal |
| CN108811285A (en) * | 2018-07-16 | 2018-11-13 | Oppo广东移动通信有限公司 | Electronic equipment |
| US10187730B1 (en) * | 2018-08-10 | 2019-01-22 | AAC Technologies Pte. Ltd. | Sound generating device |
| CN208940227U (en) * | 2018-08-17 | 2019-06-04 | 中兴通讯股份有限公司 | A kind of anti-hygrechema chamber and electronic equipment |
| CN109672948A (en) * | 2018-12-29 | 2019-04-23 | 歌尔股份有限公司 | Microphone device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111770255A (en) * | 2020-07-20 | 2020-10-13 | 福州鑫图光电有限公司 | Dustproof and moistureproof structure for scientific grade CMOS camera |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3674769B2 (en) | Electrical connection device, battery having electrical connection device, and electronic apparatus having battery | |
| JP4127469B2 (en) | Electret condenser microphone | |
| CN112291394A (en) | Electronic device | |
| US10237659B2 (en) | Loudspeaker module | |
| KR100715349B1 (en) | Liquid crystal display apparatus | |
| CN111093141A (en) | Loudspeaker unit, electronic equipment and manufacturing method of loudspeaker unit | |
| WO2010097871A1 (en) | Circuit board module and electronic device provided with same | |
| KR101808862B1 (en) | Ground devic and portable terminal having the same | |
| CN210093521U (en) | Loudspeaker box | |
| CN112291657A (en) | Microphone module and assembling method thereof | |
| CN203387639U (en) | Loudspeaker module assembly | |
| CN214481255U (en) | Sound cavity module and mobile terminal | |
| US10999683B2 (en) | Microphone assembly and electronic device comprising a microphone assembly | |
| WO2020258215A1 (en) | Sound producing device | |
| JP3744334B2 (en) | Display device, manufacturing method thereof, and electronic device | |
| CN220672867U (en) | Grounding connection structure and electronic equipment | |
| CN215299609U (en) | Connector and electronic device | |
| CN218183624U (en) | Fingerprint key for intelligent equipment | |
| JP2002208389A (en) | Battery connector | |
| CN210721420U (en) | Step type flexible PET touch screen | |
| KR100740460B1 (en) | Condenser microphone for ??? and method of making the same | |
| KR200342924Y1 (en) | Microphone attachment structure of cellular phone | |
| CN112969112A (en) | Loudspeaker module and manufacturing method thereof | |
| KR20150086714A (en) | Display device and method thereof | |
| JP4238635B2 (en) | Electronic component characteristic measurement jig |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 201210 Building 1, 399 Keyuan Road, Zhangjiang High Tech Park, Pudong New Area, Shanghai Applicant after: Huaqin Technology Co.,Ltd. Address before: 201210 Building 1, 399 Keyuan Road, Zhangjiang High Tech Park, Pudong New Area, Shanghai Applicant before: HUAQIN TELECOM TECHNOLOGY Co.,Ltd. Address after: 201210 Building 1, 399 Keyuan Road, Zhangjiang High Tech Park, Pudong New Area, Shanghai Applicant after: Huaqin Technology Co.,Ltd. Address before: 201210 Building 1, 399 Keyuan Road, Zhangjiang High Tech Park, Pudong New Area, Shanghai Applicant before: Huaqin Technology Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200501 |
|
| RJ01 | Rejection of invention patent application after publication |