CN112969112A

CN112969112A - Loudspeaker module and manufacturing method thereof

Info

Publication number: CN112969112A
Application number: CN202110378329.1A
Authority: CN
Inventors: 李小波
Original assignee: Huaqin Technology Co Ltd
Current assignee: Huaqin Technology Co Ltd
Priority date: 2021-04-08
Filing date: 2021-04-08
Publication date: 2021-06-15

Abstract

The embodiment of the invention relates to the field of loudspeakers and discloses a loudspeaker module and a manufacturing method thereof. The manufacturing method of the loudspeaker module comprises the following steps: inserting an adapter into the module shell through integral injection molding, wherein one end of the adapter is positioned in a joint area of the module shell, which is used for communicating elastic pins, and the elastic pins are used for outputting two paths of electric signals of electronic equipment where the module shell is positioned; after the loudspeaker single body is assembled on the module shell, one end of a Flexible Printed Circuit (FPC) is communicated to the other end of the adapter piece, which is located outside the laminating area, and the other end of the FPC is communicated to the positive electrode and the negative electrode of the loudspeaker, so that the loudspeaker module is formed. Use in the manufacturing process of speaker module, reach FPC and need not pass the laminating regional purpose that switches on that also can realize speaker module inside of wearing the laminating of jack to the module casing.

Description

Loudspeaker module and manufacturing method thereof

Technical Field

The embodiment of the invention relates to the field of loudspeakers, in particular to a loudspeaker module and a manufacturing method thereof.

Background

The electronic equipment such as mobile phones and flat panels are provided with loudspeaker modules for converting electric signals output by the electronic equipment into acoustic signals. The speaker module is usually by the module casing, speaker monomer and Flexible Circuit board (FPC) etc. constitute, wherein, a part of FPC need pass the through-hole that the module casing set up and get into the module casing and play the laminating region that the foot and reserve for the signal of telecommunication output of intercommunication electronic equipment, thereby make FPC be located the one end in the laminating region and can be used for the bullet foot switch-on of output signal of telecommunication with electronic equipment after electronic equipment assembles the completion, FPC's the other end then with speaker monomer switch-on, make two way signal of telecommunication of electronic equipment can be switched over respectively to the free positive negative pole of speaker through FPC after playing the foot output, control speaker monomer at last and send sound. In addition, the problem that the horizontal height of the surfaces of the FPC and the interpenetration area is inconsistent can cause the FPC and the interpenetration area not to be attached, and the like, and the FPC is usually fixed by introducing ribs to be attached to the interpenetration area.

On the one hand, however, when the FPC passes through the through-hole and is attached to the attachment area reserved in the module housing, the size of the attachment area must be increased by 1mm on the basis of the portion of the FPC located in the attachment area, otherwise, the FPC cannot pass through the through-hole and is attached to the attachment area of the module housing, for example, as shown in fig. 1, the width of the attachment area is 4.72mm, the width of the PAD of the FPC is 4.57mm, at this time, the above conditions are not satisfied, and the FPC cannot pass through the through-hole and be attached to the attachment area, so the size of the attachment area can only be increased or reduced, but the manufacture of the FPC has certain size limitation, and increasing the size of the module housing by increasing the attachment area increases the size of the electronic device, which affects user experience; on the other hand, use the rib can occupy the rear chamber space in certain module casing, and then weaken the rear chamber to the reinforcing of sound, influence the audio.

Disclosure of Invention

The invention aims to provide a loudspeaker module and a manufacturing method thereof, so that an FPC (flexible printed circuit) can be conducted in the loudspeaker module without penetrating through a through hole and being attached to an attachment area of a module shell.

In order to solve the above technical problem, an embodiment of the present invention provides a method for manufacturing a speaker module, including: inserting an adapter into the module shell through integral injection molding, wherein one end of the adapter is positioned in a joint area of the module shell, which is used for communicating elastic pins, and the elastic pins are used for outputting two paths of electric signals of electronic equipment where the module shell is positioned; after the loudspeaker single body is assembled on the module shell, one end of a Flexible Printed Circuit (FPC) is communicated to the other end of the adapter piece, which is located outside the laminating area, and the other end of the FPC is communicated to the positive electrode and the negative electrode of the loudspeaker, so that the loudspeaker module is formed.

An embodiment of the present invention further provides a speaker module, including: the loudspeaker module comprises a module shell, an adapter, a Flexible Printed Circuit (FPC) and a loudspeaker monomer; the adapter alternates through integrative injection moulding the inside of module casing, the one end of adapter is located the module casing is for the intercommunication bullet foot and the laminating region that sets up, it is used for exporting to play the foot two way signal of telecommunication of module casing place electronic equipment, the other end and the one end intercommunication of flexible circuit board FPC of adapter, FPC's the other end with the positive negative pole intercommunication of speaker.

Compared with the prior art, in the embodiment of the invention, when the integrated injection molding is carried out, the adapter is introduced, so that the adapter is inserted into the formed module shell, one end of the adapter is positioned in the attaching area and can be communicated with the elastic pins of two paths of electric signals of the output electronic equipment, the other end of the adapter is positioned outside the attaching area, and after the loudspeaker monomer is assembled on the module shell, the FPC does not need to penetrate through the inserting holes arranged in the module shell to be attached to the attaching area of the module shell, but only needs one end of the FPC to be connected to one section of the adapter positioned outside the attaching area, and the other end of the FPC is connected with the positive electrode and the negative electrode of the loudspeaker, so that the loudspeaker module can be obtained after the adapter, the FPC and the positive electrode and the negative electrode of the loudspeaker are sequentially communicated, and the two paths of electric signals output by the elastic pins can be respectively conducted to the positive electrode and the negative electrode of the loudspeaker The purpose that the portion switched on, and the adaptor alternates in speaker casing is inside, what occupy is the space that original module casing is filled by plastics, avoid using the rib to the occuping of back chamber, promoted the audio, solved because laminating area and FPC size no longer satisfy the problem that can not pass the interlude hole and laminate in the laminating area of module casing and use the rib to occupy the problem that the back chamber influences the audio in order to guarantee that laminating area and FPC closely laminate. In addition, because the FPC is not required to penetrate through the through hole and be attached to the attachment area of the module shell, the inner and outer notches of the FPC through hole are not required to be sealed, the process flow is simplified, materials are saved, and the problems that the sound cavity is leaked due to improper sealing, noise or no sound is caused are solved.

In addition, in the manufacturing method of the speaker module according to the embodiment of the present invention, the adaptor has two branches, and the communicating of one end of the Flexible Printed Circuit (FPC) to the other end of the adaptor specifically includes: and communicating the FPC to one end of the two branches outside the attaching area. The adaptor transmits the electrical signals through the two branches respectively, so that mutual influence between the two electrical signals is avoided, and the accuracy of signal transmission of the loudspeaker module is improved.

In addition, in the manufacturing method of the speaker module according to the embodiment of the present invention, the adaptor is an n-type circuit steel sheet, the n-type circuit steel sheet includes the two branches parallel to each other and a middle section connecting the two branches, the two branches penetrate through the module housing, and the middle section is exposed outside the module housing, and the method further includes: removing the intermediate section. In the injection molding process, the position of the circuit steel sheet in the shell can be adjusted and fixed through the middle section of the n-shaped circuit steel sheet, so that the circuit steel sheet can be accurately positioned in the shell conveniently.

In addition, according to the manufacturing method of the speaker module provided by the embodiment of the invention, the part of the adapter inserted into the module shell is provided with the bending structure, and the bending structure is adapted to the height change of the inserted area of the module shell. Like this when integrative injection moulding, the adaptor after the design of buckling alternates and only can occupy the module casing originally by the region that plastics were filled in the module casing, and can not occupy other regions, has kept the original shape of module casing and outward appearance, suits with subsequent electronic equipment, avoids the change to other subassemblies of electronic equipment.

In addition, the method for manufacturing a speaker module according to an embodiment of the present invention further includes, after inserting the adaptor into the module housing by integral injection molding: electroplating is carried out at one end of the adapter piece, which is positioned in the bonding area, so as to form a conductive coating. The surface conductivity of the adaptor and the elastic pin can be enhanced by the conductive plating layer, and the conduction performance of an electric signal from the elastic pin to the adaptor is further improved.

In addition, the method for manufacturing a speaker module according to an embodiment of the present invention further includes, after inserting the adaptor into the module housing by integral injection molding: and tinning an area, communicated with the FPC, on the adapter to form a soldering tin layer. A layer of tin is welded in advance in a communication area of the FPC and the adapter, so that the hot-press welding effect is better when the FPC and the adapter are subsequently processed, the connection between the FPC and the circuit adapter is tighter, and the conduction effect is better.

In addition, in the speaker module provided by the embodiment of the present invention, the adaptor includes two branches for respectively conducting the two paths of signals to the FPC, and one ends of the two branches located outside the attachment area are communicated with the FPC.

In addition, in the speaker module provided by the embodiment of the present invention, the portion of the adaptor inserted into the module housing has a bending structure, and the bending structure is adapted to the height change of the inserted area of the module housing.

In addition, according to the speaker module provided by the embodiment of the invention, the surface of one end of the adapter piece, which is positioned in the attaching area, further comprises a conductive plating layer; the surface of the area, communicated with the FPC, on the adapter piece also comprises a soldering tin layer.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.

Fig. 1 is a schematic structural diagram of a speaker module in the prior art;

fig. 2 is a flowchart of a method for manufacturing a speaker module according to a first embodiment of the present invention;

fig. 3 to 7 are schematic structural diagrams related to steps in a method for manufacturing a speaker module according to the first embodiment of the present invention shown in fig. 2.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present application in various embodiments of the present invention. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments. The following embodiments are divided for convenience of description, and should not constitute any limitation to the specific implementation manner of the present invention, and the embodiments may be mutually incorporated and referred to without contradiction.

A first embodiment of the present invention relates to a method for manufacturing a speaker module, the flow of which is shown in fig. 2, and the method includes:

step 201, the adaptor is inserted into the module housing through integral injection molding, and one end of the adaptor is located in a fitting area of the module housing, which is set for communicating the elastic pins.

In this embodiment, as shown in fig. 1, the speaker module converts the electrical signal into an acoustic signal, it is first necessary for the electronic device where the speaker module is located to provide the electrical signal, and the electronic device motherboard is provided with a spring pin, so as to provide two paths of electrical signals respectively input to the anode and the cathode for the speaker unit in the speaker module, correspondingly, in order to obtain the electrical signal of the electronic device, the speaker module is provided with a bonding region 101 in the module housing, so that after the electronic device is assembled, a component accommodated in the bonding region 101 is conducted with the spring pin, that is, the bonding region 101 in this embodiment, which is defined in this embodiment. Specifically, the embodiment provides a plastic piece and an adaptor, and then performs injection molding, and during injection molding, the position of the adaptor relative to a mold is also controlled, so that the adaptor can be integrally molded, and the molded product 300 as shown in fig. 3 is obtained, the molded product 300 is composed of a module housing 301 and the adaptor 302, the adaptor 302 is inserted inside the module housing 301, one end 3021 of the adaptor 302 is located in the attaching area 101 of the module housing 301, and the other end 3022 of the adaptor 302 is located outside the attaching area 101, more specifically, the transition area 102 as shown in fig. 1, so that the end 3021 of the adaptor 302 located in the attaching area 101 after the electronic device is assembled can be directly connected with the pogo pin. At this moment, the module shell 301 and the adapter 302 are better sealed through the integrated injection molding process, and sealing is not needed through gluing and other modes, so that a sealing flow is omitted, the manufacturing process is simplified, resources are saved, and the cost is reduced. It should be noted that, in the prior art, two ends of the FPC are respectively attached to the positive and negative electrodes of the speaker unit and the attachment region 101, and the middle portions of the FPC other than the two ends are the transition regions 102, and the specific position of the adaptor 302 in the transition region 102 is not limited in this embodiment.

Further, referring to fig. 4, the adaptor provided by the present embodiment has two

branches

401 and 402, so that after the electronic device is successfully assembled, two paths of electrical signals provided by the electronic device can be transmitted to the positive electrode and the negative electrode of the speaker through the two

branches

401 and 402, respectively, without interfering with each other.

Further, referring to fig. 4, in order to avoid occupying other spaces in the module housing, such as a rear cavity space for enhancing sound, the connecting member is bent to a certain degree, specifically, each branch is bent to obtain

bending structures

4031 and 4032 on the branches, the

bending structures

4031 and 4032 together form a bending structure 403, and the bending modes of the

bending structures

4031 and 4032 can adapt to the height change of the corresponding portion of the module housing, only the space originally filled with plastic is occupied, for example, the connecting member is bent to make the cross section of the integrally formed product as shown in fig. 5, at this time, the bending structure of the connecting member adapts to the height change of the attaching region 101 of the module housing relative to other portions, only the space originally filled with plastic of the module housing is occupied, and the obtained module housing still maintains the original shape, the assembly of the electronic equipment in the subsequent flow is not influenced, and the shape, the size and the like for assembling the electronic equipment are not required to be changed.

Further, referring to fig. 4, the adaptor may be an adaptor, the adaptor has two

parallel branches

401 and 402 and an intermediate section 404 between the two

branches

401 and 402 for connecting the two branches, when the module housing and the adaptor are integrally formed, the intermediate section 404 can be used to position and adjust the position of the adaptor relative to the module housing, so that the adaptor can be accurately positioned, and it is ensured that a section of the adaptor not containing the intermediate section is located in the attaching area 101, and no dislocation occurs, which affects the conduction effect or fails to conduct, at this time, referring to fig. 5, after the integral forming is completed, the two

branches

401 and 402 penetrate through one side of the module housing and the intermediate section 404 connecting the two branches is exposed outside the module housing, so as to avoid the intermediate section 404 and the two

branches

401 and 402 forming a conduction loop of an electrical signal, the intermediate section 404 connecting the two branches needs to be removed, for example, cutting away the middle section so that the cross-section of the branches is flush with the outer surface of the module housing, etc., resulting in a side sectional view of the module housing and the adapter as shown in fig. 6.

Step 202, after the speaker monomer is assembled on the module shell, one end of the Flexible Printed Circuit (FPC) is communicated to the other end of the adapter outside the attaching area, and the other end of the FPC is communicated to the positive electrode and the negative electrode of the speaker, so that the speaker module is formed.

In this embodiment, the speaker unit is assembled on the module housing and fixed by the bottom fixing glue applied between the speaker unit and the module housing, and then step 102 is performed. Specifically, a Flexible Printed Circuit (FPC) is provided in step 102, and since one section of the adaptor is located in the attachment region and the other end of the adaptor is located outside the attachment region, that is, the adaptor communicates the inside and the outside of the attachment region of the module housing, compared to a process in which the FPC passes through a through hole formed in the module housing and is attached to the attachment region 101 in the prior art, the adaptor in this embodiment can conduct a spoken electrical signal to the outside of the attachment region 101 when the adaptor is integrally injection molded, so that the FPC only needs to communicate the adaptor and the speaker unit, that is, referring to fig. 7, one end of the FPC is attached to one section of the adaptor located outside the attachment region 101, and the other end of the FPC is attached to the positive and negative electrodes of the speaker unit, and finally, the attachment positions of the FPC, the adaptor and the speaker unit are processed, for example, the attachment positions of the FPC and the adaptor are firstly fixed by hot melting and then hot-press-welding, The FPC and the single positive and negative electrodes of the loudspeaker are attached to be subjected to hot-press welding and the like, so that the loudspeaker module shown in figure 4 is obtained, when the loudspeaker module is assembled into the electronic equipment, the adaptor is communicated with the elastic pins, two paths of electric signals output by the elastic pins can be conducted to the FPC, and then the two paths of electric signals are respectively conducted to the positive electrode and the negative electrode of the single loudspeaker through the FPC, so that the loudspeaker is controlled to make a sound.

Further, after step 101 and before step 102 are performed, one end of the adaptor in the attaching region 101 may be plated to form a conductive plating layer, so that after the electronic device is assembled, the part of the adaptor in the attaching region 101 can be enhanced in conduction with the elastic legs through the conductive plating layer. In this embodiment, the material of the conductive plating layer is not limited, and may be any material having good conductivity, such as gold, silver, copper, and the like.

Further, after the step 101 and before the step 102 are performed, tin can be plated on an area of the adapter, which is communicated with the FPC, to form a solder layer, so that the soldering can be better completed when the communication part between the FPC and the adapter is soldered.

It should be noted that, since the FPC also has transition regions 102 other than the adaptor and the positive and negative electrodes of the speaker unit, if these transition regions 102 are not fixed on the surface of the module case, there may be a problem that the FPC bulges, and so on, and therefore, these transition regions 102 may also be subjected to operations such as heat-fusion fixing to fix the FPC.

It should be noted that, in the prior art, plastic rice is used for injection molding, and the obtained molded product specifically includes, as shown in fig. 3, a speaker unit mounting area, a bonding area 101 provided for communicating with an elastic pin, and the elastic pin is a structure for outputting an electrical signal to the speaker module by an electronic device. After having installed speaker monomer on the module casing, in order to communicate speaker monomer installation region and laminating region 101 to realize the inside conduction of speaker module, need pass the through-hole with Flexible Circuit board (Flexible Printed Circuit, FPC), and pass the one end laminating of through-hole with FPC at laminating region 101, the other end laminating is at the free positive negative pole of speaker. For the speaker module, the sound effect is affected by the sealing performance of the module, and therefore, for better sealing the speaker module, the FPC needs to be sealed by passing through the insertion hole attached to the attachment region 101, specifically including stacking, gluing and sealing the inner notch of the side face of the insertion hole far away from the attachment region 101, and dispensing and sealing the outer notch of the module housing in the back face (the face of the module housing where the speaker is assembled is the front face, and the other face is the back face) of the module housing in the region right opposite to the insertion hole. Further, in order to ensure the sealing property of the product, it is necessary to check the sealing state of the penetration hole by an instrument or the like. In the present application, since the FPC does not need to be inserted through the insertion hole, it is not necessary to perform the above-described sealing operation and the sealing property inspection at all. In addition, when the FPC passes through the insertion hole and is attached to the attachment region 101 of the module housing, the problem that the FPC and the attachment region 101 are not on the same plane needs to be solved, and generally, a rib is introduced to fix the FPC, so that the FPC is tightly fixed to the attachment region 101. But the rib can occupy the back chamber space that the module casing set up, and the back chamber space is used for strengthening the sound that the speaker sent, can weaken above-mentioned enhancement function after being occupied, and this application is because do not need FPC to laminate in laminating region 101, consequently, need not use the rib, has avoided above-mentioned problem.

Referring to fig. 7, the speaker module 700 includes a module housing 301, an adaptor 302, a Flexible Printed Circuit (FPC) 303, and a speaker unit 304.

The adaptor 302 alternates in the inside of module casing 301 through integrative injection moulding, and the one end of adaptor 302 is located module casing 301 and plays the foot and the laminating region that sets up for the intercommunication, and wherein, plays the foot and is used for two way electric signals of the electronic equipment of output module casing 301 place, and the other end of adaptor 302 and the one end of FPC303 communicate, and the other end and the speaker monomer 304 of FPC303 communicate.

Specifically, with reference to fig. 3: the module housing 301 and the adaptor 302 are the molded product 300 obtained by integral molding, in the molded product 300, the adaptor 302 is inserted inside the module housing 301, one end 3021 of the adaptor 302 is located in the attaching area 101 of the module housing 301, when the speaker module 700 is assembled on the electronic device in the attaching area 101, one end 3021 of the adaptor 302 located in the attaching area 101 can obtain an electrical signal by contacting with a pogo pin of the electronic device outputting the electrical signal. While the other end 3022 of the interposer 302 is located outside the attachment region 101, more specifically, inside the transition region 102 as shown in fig. 1, such that the interposer 302 communicates between the inside and outside of the attachment region 101, such that the FPC303 need not be attached to the attachment region 101 through the through-hole provided in the module housing 301, but need only be connected to the side 3022 of the interposer 302 located outside the attachment region 101. Because FPC303 need not laminate in laminating area 101 through the interlude hole that module casing 301 set up, consequently, need not introduce the rib in the back chamber and fix FPC303 and make its and laminate area 101 closely, just also avoided the occupation to the space of back chamber, can have bigger back chamber space for prior art promptly, and then promote the reinforcing effect to sound through the back chamber space increase, reach the purpose that promotes the audio at last. In addition, the FPC303 does not need to be attached to the attachment region 101 through the insertion hole formed in the module shell 301, and the inner and outer notches of the insertion hole do not need to be sealed, so that a sealing flow is omitted, the manufacturing process is simplified, resources are saved, and the cost is reduced.

Further, with reference to fig. 6: the interposer 302 has two

branches

401 and 402, each of the

branches

401 and 402 has one end located in the attachment region 101, and one ends of the

branches

401 and 402 located outside the attachment region 101 communicate with the FPC 4303. Therefore, after the electronic equipment is successfully combined, the two paths of electric signals can be respectively conducted through the two branches, and mutual influence between the signals is avoided.

Further, the adaptor 302 may be a circuit steel sheet, wherein the circuit steel sheet has two branches, and more specifically, the two branches are two mutually parallel branches remained after the n-shaped circuit steel sheet is cut to connect the middle sections of the two parallel branches.

Further, with reference to fig. 4: the adapter 302 also has a bending structure 403, in particular each limb, i.e. the bending structure 403 is actually formed by the bending

structures

4031 and 4032 of both limbs together. It should be noted that, as shown in fig. 6, the bending manner of the bending structure 403 is adapted to the height change of the corresponding portion of the adaptor 301. Thus, the adaptor 302 only occupies the space of the module casing 301 originally filled with plastic during the integral injection molding, so that the obtained module casing 301 still maintains the original shape, the assembly of the electronic device in the subsequent flow cannot be influenced, and the shape, the size and the like for assembling the electronic device do not need to be changed.

Further, a conductive plating layer may be added to an area of the adaptor 302 for communicating with the pogo pin to transmit an electrical signal, that is, a conductive plating layer may be added to an end of the adaptor 302 located in the attaching area 101, so that after the electronic device is assembled, a conduction effect between the adaptor and the pogo pin can be enhanced by the conductive plating layer in the attaching area 101. Meanwhile, a soldering tin layer can be added to the area, communicated with the FPC303, on the adapter 302, so that when the loudspeaker module 700 is processed and manufactured, welding is better completed when the communication position of the FPC303 and the adapter 302 is welded, and the connection tightness of the FPC303 and the adapter 302 is enhanced.

It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A method for manufacturing a loudspeaker module is characterized by comprising the following steps:

inserting an adapter into the module shell through integral injection molding, wherein one end of the adapter is positioned in a joint area of the module shell, which is used for communicating elastic pins, and the elastic pins are used for outputting two paths of electric signals of electronic equipment where the module shell is positioned;

after the loudspeaker single body is assembled on the module shell, one end of a Flexible Printed Circuit (FPC) is communicated to the other end of the adapter piece, which is located outside the laminating area, and the other end of the FPC is communicated to the positive electrode and the negative electrode of the loudspeaker, so that the loudspeaker module is formed.

2. The method according to claim 1, wherein the adaptor has two branches, and the communicating of one end of the flexible circuit board FPC to the other end of the adaptor specifically comprises: and communicating the FPC to one end of the two branches outside the attaching area.

3. The method of claim 2, wherein the interposer is a Π -type sheet of circuit steel, the Π -type sheet of circuit steel including the two branches being parallel to each other and an intermediate section connecting the two branches, the two branches penetrating the module housing, the intermediate section being exposed outside the module housing, the method further comprising: removing the intermediate section.

4. The method of claim 1, wherein the portion of the interposer inserted within the module housing has a bend configuration that is compatible with the height variation of the inserted area of the module housing.

5. The method of claim 1, wherein inserting the interposer into the interior of the module housing by injection molding further comprises:

electroplating is carried out at one end of the adapter piece, which is positioned in the bonding area, so as to form a conductive coating.

6. The method of claim 1, wherein inserting the interposer into the interior of the module housing by injection molding further comprises:

and tinning an area, communicated with the FPC, on the adapter to form a soldering tin layer.

7. A speaker module, comprising: the loudspeaker module comprises a module shell, an adapter, a Flexible Printed Circuit (FPC) and a loudspeaker monomer;

the adapter alternates through integrative injection moulding the inside of module casing, the one end of adapter is located the module casing is for the intercommunication bullet foot and the laminating region that sets up, it is used for exporting to play the foot two way signal of telecommunication of module casing place electronic equipment, the other end of adapter and flexible circuit board FPC's one end intercommunication, FPC's the other end with the free positive negative pole intercommunication of speaker.

8. The module according to claim 7, wherein the interposer comprises two branches for respectively conducting the two signals to the FPC, and one ends of the two branches located outside the bonding region are communicated with the FPC.

9. A module according to claim 7, characterized in that the part of the adapter inserted inside the module housing has a bent structure adapted to the height variation of the inserted area of the module housing.

10. The module of claim 7, wherein the adapter further comprises a conductive coating on an end surface of the attachment region; the surface of the area, communicated with the FPC, on the adapter piece also comprises a soldering tin layer.