Disclosure of Invention
The invention aims to provide a method for installing a fusion type cold-contraction intermediate joint, which has the advantages that the interface of a product and a cable accessory is perfectly compounded, the original interface characteristic is changed, the lightning impact resistance strength of the interface is greatly improved, and simultaneously, an air gap and a tip are not easy to generate, partial discharge is avoided, and water and gas are prevented from permeating into a compression interface from two ends and a wire core.
The technical purpose of the invention is realized by the following technical scheme:
a method for installing a fusion cold-shrink intermediate joint at least comprises the following steps:
s1, taking two cables, and sequentially stripping the outer sheath, the steel armor, the inner sheath, the copper shielding layer, the semi-conducting layer, the main insulating layer and the wire core from outside to inside in a layered manner;
s2, preparing a cable intermediate joint and a copper mesh, and sleeving a fused cold-shrinkage intermediate joint and the copper mesh on one cable;
s3, connecting conductor connecting pipes on the two exposed wire cores, flattening edges and burrs on the connecting pipes, and cleaning metal particles;
s4, taking the component A and the component B for preparing the adhesive, and mixing the component A and the component B at normal temperature;
s5, determining an installation positioning point on the outer side of the cable, and coating the mixed adhesive on the surface of the main insulating layer;
s6, axially sleeving the fusion cold-shrink intermediate joint at the butt joint of the two cables in a different place, and shrinking, wherein when shrinking, the port of the intermediate joint is overlapped with the installation positioning point, and curing at normal temperature;
and S7, sequentially recovering the stripped copper shielding layer, the inner sheath, the steel armor and the outer sheath.
By adopting the technical scheme, the self-made adhesive layer is adopted, the original coating silicone grease connection is changed, the original compression type abutting is changed into the mutual connection of the main insulating layer and the cold-contraction joint through the adhesive layer, the crosslinked polyethylene material and the silicone rubber material are fused into an integral structure by the adhesive layer in a chemical mode, the existence and the generation possibility of air gaps are fundamentally eliminated, the voltage resistance is improved, and the air gap discharge is avoided; because the existence on sticky layer has certain repair ability, can eliminate the construction defect that produces in the work progress, sticky layer has certain thickness after the solidification to utilize this thickness, repair sword trace, the pit that produces main insulation when the construction, avoid the production of small air gap and pointed end, can prevent again that steam from sinle silk and outside along compressing tightly interface infiltration, the breakdown accident that leads to.
Further setting: in step S1, the method further includes a step of performing a surface treatment on the main insulating layer, where the step of performing the surface treatment includes: and chamfering the tail end of the semi-conductive layer by using a cutter, and uniformly and annularly grinding the surface of the main insulating layer by using abrasive paper to remove residual semi-conductive particles and tool mark marks on the surface.
By adopting the technical scheme, potential air gaps are always left on the surface of the main insulating layer due to the fact that the outer semi-conducting layer is too deep when being stripped, the air gaps are not easy to be detected by naked eyes, and the position of a knife mark can cause field intensity concentration under the operating voltage to cause partial discharge. After the semiconductive layer is peeled off from the surface of the main insulating layer, semiconductive particles remain on the surface of the main insulating layer, and the semiconductive particles cause uneven electric field distribution on the surface of the main insulating layer to cause partial discharge. The residual semiconductive particles and tool mark marks on the surface are removed by using sand paper, so that the electric field distribution on the surface of the insulating layer is improved, and the voltage resistance of the main insulating layer is improved.
Further setting: in step S1, the method further includes a step of performing a surface treatment on the main insulating layer, where the step of performing the surface treatment includes: and uniformly coating a primer on the surface of the main insulating layer, wherein the material of the primer is the same as that of the self-made adhesive.
Alternatively, the surface treatment step comprises: and uniformly heating the surface of the main insulating layer at high temperature.
Alternatively, the surface treatment step comprises: corona treatment or plasma treatment is performed on the surface of the main insulating layer using high frequency and high voltage.
By adopting the technical scheme, the surface of the main insulating layer is treated, the interface bonding force is enhanced, the linear polymer in the primer is changed into the polymer with a three-dimensional space network structure through treatment, and the solvent is evaporated through high-temperature heating treatment; corona treatment is used to oxidize and polarize the molecules on the surface of the primary insulating layer to increase its surface adhesion.
Another object of the present invention is to provide a method for installing a fused cold-shrink terminal, which has the advantages of good fused interface between the product and the cable accessory, less possibility of generating air gaps and sharp ends, and avoidance of partial discharge.
The technical purpose of the invention is realized by the following technical scheme:
a method for installing a fusion cold-shrink terminal at least comprises the following steps:
s1, taking a cable, sequentially and gradually peeling the outer sheath, the steel armor and the inner sheath from outside to inside, and exposing three wire core structures inside;
s2, sleeving a three-finger sleeve at the root of the wire core structure, sleeving a cold-shrinkage sheath tube on the wire core structure, and arranging a ground wire recovery structure in the three-finger sleeve;
s3, sequentially stripping the copper shielding layer, the semi-conducting layer, the main insulating layer and the wire core from outside to inside on each wire core structure;
s4, connecting a wiring terminal on the exposed wire core;
s5, determining a mounting positioning line on the outer side of the cable, and determining the position where the cable terminal is sleeved;
s6, taking the component A and the component B from the adhesive, mixing the component A and the component B at normal temperature, and coating the mixed adhesive on the surface of the main insulating layer;
s7, taking a cable terminal, shrinking and wrapping the cable terminal outside each wire core structure, shrinking the cable terminal after sleeving the cable terminal to the installation positioning line, and curing the cable terminal at normal temperature after shrinking;
and S8, arranging a sealing structure at the end of the cold-shrink terminal, which is positioned at one side of the wiring terminal.
By adopting the technical scheme, the self-made adhesive layer is adopted, the original coating silicone grease connection is changed, the original compression type abutting is changed into the mutual connection of the main insulating layer and the cold-contraction joint through the adhesive layer, the crosslinked polyethylene material and the silicone rubber material are fused into an integral structure by the adhesive layer in a chemical mode, the existence and the generation possibility of air gaps are fundamentally eliminated, the voltage resistance is improved, and the air gap discharge is avoided; because the existence on sticky layer has certain repair ability, can eliminate the construction defect that produces in the work progress, sticky layer has certain thickness after the solidification to utilize this thickness, repair sword trace, the pit that produces main insulation when the construction, avoid the production of small air gap and pointed end, can prevent again that steam from sinle silk and outside along compressing tightly interface infiltration, the breakdown accident that leads to.
Further setting: in step S3, the method further includes a step of performing a surface treatment on the main insulating layer, where the step of performing the surface treatment includes: and chamfering the tail end of the semi-conductive layer by using a cutter, and uniformly and annularly grinding the surface of the main insulating layer by using abrasive paper to remove residual semi-conductive particles and tool mark marks on the surface.
By adopting the technical scheme, potential air gaps are always left on the surface of the main insulating layer due to the fact that the outer semi-conducting layer is too deep when being stripped, the air gaps are not easy to be detected by naked eyes, and the position of a knife mark can cause field intensity concentration under the operating voltage to cause partial discharge. After the semiconductive layer is peeled off from the surface of the main insulating layer, semiconductive particles remain on the surface of the main insulating layer, and the semiconductive particles cause uneven electric field distribution on the surface of the main insulating layer to cause partial discharge. The residual semiconductive particles and tool mark marks on the surface are removed by using sand paper, so that the electric field distribution on the surface of the insulating layer is improved, and the voltage resistance of the main insulating layer is improved.
Further setting: in step S3, the method further includes a step of performing a surface treatment on the main insulating layer, where the step of performing the surface treatment includes: and uniformly coating a primer on the surface of the main insulating layer, wherein the material of the primer is the same as that of the self-made adhesive.
Alternatively, the surface treatment step comprises: and uniformly heating the surface of the main insulating layer at high temperature.
Alternatively, corona treatment or plasma treatment is performed on the surface of the main insulating layer using high frequency and high voltage.
By adopting the technical scheme, the surface of the main insulating layer is treated, the interface bonding force is enhanced, the linear polymer in the primer is changed into the polymer with a three-dimensional space network structure through treatment, and the solvent is evaporated through high-temperature heating treatment; corona treatment is used to oxidize and polarize the molecules on the surface of the primary insulating layer to increase its surface adhesion.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
First preferred embodiment
A method for installing a fusion cold-shrink intermediate joint at least comprises the following steps:
s1, taking two cables, and sequentially stripping the outer sheath 1, the steel armor 2, the inner sheath 3, the copper shielding layer 4, the semi-conducting layer 5, the main insulating layer 6 and the wire core 7 layer by layer from outside to inside;
s2, preparing a cable intermediate joint and a copper mesh, and sleeving a fused cold-shrinkage intermediate joint and the copper mesh on one cable;
s3, connecting the conductor connecting pipe 8 on the two exposed wire cores 7, flattening edges and burrs on the connecting pipe, and cleaning metal particles;
s4, taking the component A and the component B for preparing the adhesive, and mixing the component A and the component B at normal temperature;
s5, determining an installation positioning point on the outer side of the cable, and coating the mixed adhesive on the surface of the main insulating layer 6;
s6, axially sleeving the fusion cold-shrink intermediate joint at the butt joint of the two cables in a different place, and shrinking, wherein when shrinking, the port of the intermediate joint is overlapped with the installation positioning point, and curing at normal temperature;
and S7, sequentially recovering the stripped copper shielding layer 4, the inner sheath 3, the steel armor 2 and the outer sheath 1.
In step S1 of the mounting method in the present embodiment, each sub-step is a construction method that is conventional for existing cold-shrink accessories. In step S1, the method further includes performing a surface treatment step on the primary insulating layer 6, the surface treatment step including: and chamfering the tail end of the semi-conductive layer 5 by using a cutter, and uniformly and circularly grinding the surface of the main insulating layer 6 by using sand paper to remove residual semi-conductive particles and cutter mark marks on the surface.
Further setting: in step S1, the method further includes a surface treatment step of the main insulating layer 6, where the surface treatment step includes: and uniformly coating a primer on the surface of the main insulating layer 6, wherein the material of the primer is the same as that of the self-made adhesive.
Alternatively, the surface treatment step comprises: the surface of the main insulating layer 6 is uniformly heated at high temperature.
Alternatively, the surface treatment step comprises: corona treatment or plasma treatment is performed on the surface of the main insulating layer 6 using high frequency and high voltage.
Before the surface treatment step, cleaning is required, the cleaning paper is wiped from the insulating end to the semi-conducting layer 5 along the length direction of the cable, the cleaning paper is replaced, and the steps are repeated until the alcohol on the main insulating layer 6 is completely volatilized.
The main insulating layer 6 is then treated,
in step S4 of the mounting method of this embodiment, a component a and a component B from the adhesive are taken and mixed at normal temperature;
in step S6 of the installation method of this embodiment, the cable intermediate connector is sleeved outside the cable, and the port of the connector main body is aligned to the installation positioning point to be shrunk and cured at normal temperature. Excess adhesive is removed after the joint has fully shrunk.
In the installation method step S7 of the present embodiment, each sub-step is a construction method that is conventional for existing cold-shrink accessories.
Second preferred embodiment
A method for installing a fusion cold-shrink terminal at least comprises the following steps:
s1, taking a cable, sequentially and gradually peeling the outer sheath 1, the steel armor 2 and the inner sheath 3 from outside, and exposing the three wire core structures 30 inside;
s2, sleeving a three-finger sleeve 12 at the root of the wire core structure 30, sleeving a cold-shrink sheath tube 39 on the wire core structure 30, and arranging a ground wire recovery structure in the three-finger sleeve 12;
s3, sequentially stripping the copper shielding layer 4, the semi-conducting layer 5, the main insulating layer 6 and the wire core 7 from outside to inside on each wire core structure 30;
s4, connecting the wiring terminal 38 on the exposed wire core 7;
s5, determining a mounting positioning line on the outer side of the cable, and determining the position where the cable terminal is sleeved;
s6, taking the component A and the component B for preparing the adhesive, mixing the component A and the component B at normal temperature, and coating the mixed adhesive on the surface of the main insulating layer 6;
s7, taking a cable terminal, shrinking and wrapping the cable terminal outside each wire core structure 30, shrinking the cable terminal after sleeving the cable terminal to the installation positioning line, and curing the cable terminal at normal temperature after shrinking;
s8, a seal structure is provided at the cold-shrink terminal 35 at the terminal end on the terminal 38 side.
In the mounting method of the present embodiment except for steps S6 to S7, each substep is a conventional construction method of the existing cold shrink attachment.
In step S3, the method further includes performing a surface treatment step on the primary insulating layer 6, the surface treatment step including: and chamfering the tail end of the semi-conductive layer 5 by using a cutter, and uniformly and circularly grinding the surface of the main insulating layer 6 by using sand paper to remove residual semi-conductive particles and cutter mark marks on the surface.
In step S3, the method further includes performing a surface treatment step on the primary insulating layer 6, the surface treatment step including: and uniformly coating a primer on the surface of the main insulating layer 6, wherein the material of the primer is the same as that of the self-made adhesive.
Alternatively, the surface treatment step comprises: the surface of the main insulating layer 6 is uniformly heated at high temperature.
Alternatively, corona treatment is performed on the surface of the main insulating layer 6 using high frequency and high voltage.
Before the surface treatment step, cleaning is required, the cleaning paper is wiped from the insulating end to the semi-conducting layer 5 along the length direction of the cable, the cleaning paper is replaced, and the steps are repeated until the alcohol on the main insulating layer 6 is completely volatilized.
The main insulating layer 6 is then treated,
in step S6 of the mounting method of the present embodiment, the component a and the component B are taken from the adhesive preparation, and the component a and the component B are mixed at normal temperature, and then the mixed adhesive is uniformly coated on the surface of the main insulating layer 6;
in the mounting method step S7 of the present embodiment, the cold-shrink terminals 35 are fitted around the outside of the respective core structures 30, aligned with the mounting positioning wires, and then shrunk. After shrinkage, the cured product was cured at room temperature.
In the mounting method of the present embodiment, in step S8, the glue remaining on the cold-shrink terminal 35 and the hardware is wiped clean with a cleaning paper, and then the silicone phase tape is wound around the port of the cold-shrink terminal 35 to reinforce the seal.
Third preferred embodiment example 1:
the adhesive for crosslinking polyethylene and silicone rubber comprises A and B, wherein A comprises the following components in parts by weight:
100 parts of hydroxyl silicone oil, 10 parts of a base crosslinking agent, 10 parts of an additional crosslinking agent and 5 parts of hydrophobic fumed silica;
the basic cross-linking agent consists of 2 parts of methyltrimethoxysilane, 2 parts of methyltriethoxysilane, 2 parts of vinyltrimethoxysilane, 2 parts of vinyltriethoxysilane and 2 parts of phenyltrimethoxysilane; the additional crosslinking agent consists of 2 parts of isocyanatopropyltriethoxysilane, 2 parts of vinyltriisopropenoxysilane, 2 parts of methyltriisopropenoxysilane, 2 parts of phenyltriisopropenoxysilane and 2 parts of tetramethylguanidinopropyltrimethoxysilane;
the B comprises the following components in parts by weight:
100 parts of hydroxyl silicone oil, 5 parts of hydrophobic fumed silica and 0.2 part of catalyst;
the catalyst is organic tin chelate.
The adhesive is prepared according to the preparation method.
Example 2:
the adhesive for crosslinking polyethylene and silicone rubber comprises A and B, wherein A comprises the following components in parts by weight:
100 parts of hydroxyl silicone oil, 20 parts of a base crosslinking agent, 20 parts of an additional crosslinking agent and 10 parts of hydrophobic fumed silica;
the basic cross-linking agent consists of 4 parts of methyltrimethoxysilane, 4 parts of methyltriethoxysilane, 4 parts of vinyltrimethoxysilane, 4 parts of vinyltriethoxysilane and 4 parts of phenyltrimethoxysilane;
the additional crosslinking agent consists of 4 parts of isocyanatopropyltriethoxysilane, 4 parts of vinyltriisopropenoxysilane, 4 parts of methyltriisopropenoxysilane, 4 parts of phenyltriisopropenoxysilane and 4 parts of tetramethylguanidinopropyltrimethoxysilane;
the B comprises the following components in parts by weight:
100 parts of hydroxyl silicone oil, 10 parts of hydrophobic fumed silica and 0.3 part of catalyst;
the catalyst is organic tin chelate.
The adhesive is prepared according to the preparation method.
Example 3:
the adhesive for crosslinking polyethylene and silicone rubber comprises A and B, wherein A comprises the following components in parts by weight:
100 parts of hydroxyl silicone oil, 25 parts of a base crosslinking agent, 30 parts of an additional crosslinking agent and 15 parts of hydrophobic fumed silica;
the basic cross-linking agent consists of 5 parts of methyltrimethoxysilane, 5 parts of methyltriethoxysilane, 5 parts of vinyltrimethoxysilane, 5 parts of vinyltriethoxysilane and 5 parts of phenyltrimethoxysilane; the additional crosslinking agent consists of 6 parts of isocyanatopropyltriethoxysilane, 6 parts of vinyltriisopropenoxysilane, 6 parts of methyltriisopropenoxysilane, 6 parts of phenyltriisopropenoxysilane and 6 parts of tetramethylguanidinopropyltrimethoxysilane;
the B comprises the following components in parts by weight:
100 parts of hydroxyl silicone oil, 15 parts of hydrophobic fumed silica and 0.5 part of catalyst;
the catalyst is organic tin chelate.
The adhesive is prepared according to the preparation method.
Example 4:
this embodiment is different from embodiment 2 only in that,
the base crosslinker consists of 4 parts of vinyltrimethoxysilane, 4 parts of vinyltriethoxysilane, 4 parts of phenyltrimethoxysilane, 4 parts of phenyltriethoxysilane, 4 parts of aminopropyltrimethoxysilane.
Example 5:
this embodiment is different from embodiment 2 only in that,
the base crosslinker consists of 10 parts methyltrimethoxysilane and 10 parts aminopropyltrimethoxysilane.
Example 6:
this embodiment is different from embodiment 2 only in that,
the additional crosslinking agent consists of 4 parts of gamma- (2, 3-glycidoxy) propyltrimethoxysilane, 4 parts of gamma- (2, 3-glycidoxy) propyltriethoxysilane, 4 parts of gamma-methacryloxypropyltrimethoxysilane, 4 parts of anilinomethyltrimethoxysilane and 4 parts of anilinomethyltriethoxysilane.
Example 7:
this embodiment is different from embodiment 2 only in that,
the additional crosslinker consists of 4 parts of aniline methyl triethoxysilane, 4 parts of aminoethyl aminopropyl methyl dimethoxysilane, 4 parts of diethylamino methyl triethoxysilane, 4 parts of gamma-methacryloxypropyl trimethoxysilane and 4 parts of gamma-methacryloxypropyl methyl dimethoxysilane.
Example 8:
this embodiment is different from embodiment 2 only in that,
the additional crosslinking agent is composed of 5 parts of isocyanatopropyltriethoxysilane, 5 parts of vinyltriisopropenoxysilane, 5 parts of methyltriisopropenoxysilane, and 5 parts of phenyltriisopropenoxysilane.
Example 9:
this embodiment is different from embodiment 2 only in that,
the catalyst is a guanidino catalyst.
Example 10:
this embodiment is different from embodiment 2 only in that,
the catalyst is a silane catalyst.
Comparative example 1:
this comparative example differs from example 2 only in that a does not contain a base crosslinker.
Comparative example 2:
this comparative example differs from example 2 only in that a does not contain an additional crosslinker.
Comparative example 3:
this comparative example differs from example 2 only in that a comprises 50 parts of the base crosslinker;
the base crosslinker consists of 10 parts methyltrimethoxysilane, 10 parts methyltriethoxysilane, 10 parts vinyltrimethoxysilane, 10 parts vinyltriethoxysilane, 10 parts phenyltrimethoxysilane.
Comparative example 4:
this comparative example differs from example 2 only in that a includes 50 parts of additional crosslinker;
the additional crosslinking agent was composed of 10 parts of isocyanatopropyltriethoxysilane, 10 parts of vinyltriisopropenoxysilane, 10 parts of methyltriisopropenoxysilane, 10 parts of phenyltriisopropenoxysilane, and 10 parts of tetramethylguanidinopropyltrimethoxysilane.
Comparative example 5:
this comparative example differs from example 2 only in that the catalyst in B is 10 parts.
Wherein examples 1-5 and comparative examples 1-3 both employ a first method of preparation and a first method of use; examples 6-10 and comparative examples 4-5 were both prepared using the second preparation method and the second method of use.
Comparative example 6:
kafft 704 glue was purchased from Higashi, New materials technology, Inc., Guangdong.
Comparative example 7:
kafft 703 glue was purchased from Higashi, New materials technology, Inc., Guangdong.
Comparative example 8:
3140 glue from Dow Corning.
Fifthly, performance detection:
1. detection items and test bases:
1-1: and (3) dielectric constant detection: reference is made to GB/T1409-2006 recommendation method for measuring permittivity and dielectric loss factor of an electrical insulating material under power frequency, audio frequency and high frequency (including meter wave wavelength);
1-2: and (3) detecting the insulating strength: reference is made to GB/T1408 insulating material electrical apparatus strength test method;
1-3: and (3) detecting the elongation: refer to HG/T3849 and 2008 determination of tensile strength and elongation at break of hard rubber;
1-4: and (3) detecting the shear strength: reference is made to GB/T7124-;
1-5: and (3) detecting the peeling strength: refer to GB/T2791-1995 adhesive T peel Strength test method for Flexible materials vs. Flexible materials.
As can be seen from the above tables, the adhesive prepared by the preparation method of the present application from crosslinked polyethylene and silicone rubber has good mechanical properties, especially glass strength, compared with those commonly used by those skilled in the art in the prior art, has outstanding performance advantages compared with the same type of product, and simultaneously ensures excellent insulating properties.
The above-mentioned embodiments are merely illustrative and not restrictive, and those skilled in the art can make modifications to the embodiments without inventive contribution as required after reading the present specification, but only protected by the patent laws within the scope of the claims.