CN111081625B - Silicon-based micro display chip cover plate, display device and manufacturing method thereof - Google Patents
Silicon-based micro display chip cover plate, display device and manufacturing method thereof Download PDFInfo
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- CN111081625B CN111081625B CN201911400285.7A CN201911400285A CN111081625B CN 111081625 B CN111081625 B CN 111081625B CN 201911400285 A CN201911400285 A CN 201911400285A CN 111081625 B CN111081625 B CN 111081625B
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- display chip
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 145
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 145
- 239000010703 silicon Substances 0.000 title claims abstract description 145
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 42
- 238000005520 cutting process Methods 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 25
- 238000005530 etching Methods 0.000 claims description 12
- 238000010030 laminating Methods 0.000 claims description 12
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 230000002411 adverse Effects 0.000 abstract description 3
- 239000003292 glue Substances 0.000 description 35
- 238000010586 diagram Methods 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000003405 preventing effect Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 241000724291 Tobacco streak virus Species 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a silicon-based micro display chip cover plate, a display device and a manufacturing method thereof. The silicon-based micro display chip cover plate is used for being oppositely attached to the silicon-based micro display chip, the silicon-based micro display chip comprises a display area and a bonding pad area positioned on at least one side of the display area, and a through hole is formed in the position, corresponding to the bonding pad area, of the cover plate. According to the technical scheme, the technical problems that an existing display chip and a cover plate are high in bonding process difficulty and high in cost and the chip is easy to damage are solved, other cutting or hole digging procedures after comprehensive bonding are reduced, adverse effects on the display chip caused by the cutting or hole digging procedures are avoided, the production process difficulty is reduced, investment of production equipment is reduced, and production cost is saved.
Description
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to a silicon-based micro display chip cover plate, a display device and a manufacturing method thereof.
Background
At present, the main bonding method of the display chip and the cover plate thereof in the market is small-band frame glue bonding or full bonding. The small tape frame glue is glued and is required to be glued by laminating equipment with high precision and high stability, and the cost is high. The full lamination needs to adopt the technology of through silicon vias (Through Silicon Via, TSVs), holes are dug on the display device after full lamination to realize electrical interconnection, the surface of the chip is easy to damage, and the difficulty of the production process is increased.
Disclosure of Invention
The embodiment of the invention provides a silicon-based micro display chip cover plate, a display device and a manufacturing method thereof, which are used for simplifying the production process, reducing the difficulty of the production process, reducing the investment of production equipment and saving the production cost.
In a first aspect, an embodiment of the present invention provides a cover plate for a silicon-based micro display chip, where the cover plate is used for being oppositely attached to the silicon-based micro display chip, and the silicon-based micro display chip includes a display area and a pad area located at least one side of the display area;
and a through hole is formed in the corresponding position of the cover plate and the bonding pad area.
Optionally, the through hole is strip-shaped, and the through hole penetrates through the cover plate along a direction perpendicular to the cover plate so as to expose the pad area.
Optionally, the surface of the cover plate used for attaching the silicon-based micro display chip is provided with a groove, the cover plate further comprises a display unit attaching region corresponding to the display region, and the groove is at least arranged between the display unit attaching region and the through hole.
Optionally, the groove is disposed around the periphery of the attaching region of the display unit.
Optionally, the surface of the groove includes a plurality of planes or the surface of the groove is a cambered surface.
In a second aspect, an embodiment of the present invention further provides a method for manufacturing a display device, where the method for manufacturing a display device includes:
providing a standby silicon-based micro display chip and a standby cover plate;
etching a plurality of strip-shaped through holes which are arranged in parallel on the standby cover plate;
the surface of the standby silicon-based micro display chip provided with the bonding pad area is oppositely attached to the standby cover plate;
and cutting the attached standby silicon-based micro display chip and the standby cover plate by taking the area where each display area and the corresponding bonding pad area of the standby silicon-based micro display chip are located as a cutting unit to form the display device.
Optionally, etching to form a plurality of strip-shaped through holes arranged in parallel on the standby cover plate includes:
etching the spare cover plate along the direction perpendicular to the spare cover plate to form a plurality of strip-shaped through holes penetrating through the spare cover plate; and after the surface of the standby silicon-based micro display chip provided with the bonding pad area is oppositely attached to the standby cover plate, the strip-shaped through holes expose the bonding pad area.
Optionally, before the surface of the standby silicon-based micro display chip provided with the pad area and the standby cover plate are oppositely attached, the method further comprises:
and etching the surface of the standby cover plate, which is attached to the standby silicon-based micro display chip, to form a plurality of grooves, wherein after the surface of the standby silicon-based micro display chip, which is provided with a bonding pad area, is attached to the standby cover plate in an opposite mode, the grooves are at least positioned between the display unit attaching area of the standby cover plate and the strip-shaped through holes.
Optionally, after the surface of the standby silicon-based micro display chip provided with the pad area is oppositely attached to the standby cover plate, the groove surrounds the periphery of the attaching area of the display unit.
In a third aspect, an embodiment of the present invention further provides a display device obtained by the method for manufacturing a display device according to the second aspect, where the display device includes:
the display device comprises a silicon-based micro display chip and a silicon-based micro display chip cover plate, wherein the cover plate is oppositely attached to the silicon-based micro display chip, and the silicon-based micro display chip comprises a display area and a bonding pad area positioned on at least one side of the display area;
and a step is arranged at the corresponding position of the cover plate and the bonding pad area.
The embodiment of the invention provides a silicon-based micro display chip cover plate, a display device and a manufacturing method thereof, wherein the silicon-based micro display chip cover plate is used for being oppositely attached to a silicon-based micro display chip, the silicon-based micro display chip comprises a display area and a bonding pad area positioned on at least one side of the display area, a through hole is formed in a position, corresponding to the bonding pad area, of the cover plate, and the bonding pad area of the display chip is exposed through the through hole after the cover plate is fully attached to the silicon-based micro display chip, so that the display chip and other components are electrically interconnected. According to the technical scheme, the problem that when the existing display chip is attached to the cover plate, if the silicon-based chip is cut and then packaged, dislocation or rotation angle is easy to generate when packaging and stamping in the chip is attached to the chip because the side length of the micro display is small is solved, and poor effect is caused; if the cover plate and the silicon-based chip wafer are integrally attached and packaged, and then cut, the packaging cover plate covers the golden finger area, and if the glass cover plate part on the golden finger area is removed at the moment, the golden finger area is easily damaged, the process difficulty is high, the cost is high, and the technical problem of chip damage is easily solved.
Drawings
FIG. 1 is a schematic top view of a cover plate of a silicon-based micro display chip according to an embodiment of the present invention;
FIG. 2 is a schematic top view of a silicon-based micro display chip according to an embodiment of the present invention;
fig. 3 is a schematic cross-sectional view of a display device according to an embodiment of the invention;
FIG. 4 is a schematic top view of another silicon-based micro-display chip cover plate according to an embodiment of the present invention;
fig. 5 is a schematic cross-sectional view of another display device according to an embodiment of the present invention;
FIG. 6 is a schematic top view of another silicon-based micro-display chip cover plate according to an embodiment of the present invention;
fig. 7 is a schematic cross-sectional view of another display device according to an embodiment of the present invention;
fig. 8 is a schematic cross-sectional view of another display device according to an embodiment of the present invention;
fig. 9 is a flowchart of a method for manufacturing a display device according to an embodiment of the present invention;
FIG. 10 is a schematic diagram of a spare cover plate according to an embodiment of the present invention;
FIG. 11 is a schematic diagram of a standby silicon-based micro-display chip according to an embodiment of the present invention;
FIG. 12 is a schematic view of a structure of a processed spare cover plate according to an embodiment of the present invention;
fig. 13 is a schematic cross-sectional view of another display device according to an embodiment of the present invention;
FIG. 14 is a schematic diagram showing the positions of scribe lines on a standby silicon-based micro-display chip according to an embodiment of the present invention;
FIG. 15 is a schematic view showing the positions of cutting lines on a processed spare cover plate according to an embodiment of the present invention;
FIG. 16 is a schematic view of another alternate cover plate according to an embodiment of the present invention;
FIG. 17 is a schematic view of another alternate cover plate according to an embodiment of the present invention;
fig. 18 is a schematic structural diagram of another spare cover plate according to an embodiment of the present invention.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
FIG. 1 is a schematic top view of a cover plate of a silicon-based micro display chip according to an embodiment of the present invention; FIG. 2 is a schematic top view of a silicon-based micro display chip according to an embodiment of the present invention; fig. 3 is a schematic cross-sectional view of a display device according to an embodiment of the invention. Fig. 3 schematically illustrates a cross-sectional structure along a straight line AA' after the silicon-based micro-display chip cover plate shown in fig. 1 and the silicon-based micro-display chip shown in fig. 2 are fully bonded. Referring to fig. 1 to 3, the cover plate 1 is used for being attached to the silicon-based micro display chip 2 in an opposite manner, and the silicon-based micro display chip 2 comprises a display area 21 and a bonding pad area 22 positioned on at least one side of the display area 21; the cover plate 1 is provided with a through hole 11 at a position corresponding to the pad region 22.
Referring to fig. 1 to 3, in particular, a silicon-based Micro display chip 2 may include a silicon substrate and a plurality of Micro organic light Emitting Diode (Micro OLED) chips on the silicon substrate, which can be applied to a virtual reality head mounted display device or the like. The pad area 22 of the silicon-based micro display chip 2 is used to realize electrical interconnection of the silicon-based micro display chip 2 with other components, for example, the pad area 22 can be soldered to a flexible circuit board through which connection with a driving chip in a display device provided with the silicon-based micro display chip 2 is made.
The through holes 11 on the cover plate 1 correspond to the positions of the bonding pad areas 22, so that after the cover plate 1 is oppositely attached to the silicon-based micro display chip 2, the bonding pad areas 22 can be exposed by the through holes 11, and the silicon-based micro display chip 2 can be electrically interconnected with other components through the bonding pad areas 22. In the existing production process, the untreated complete cover plate is generally directly attached to the silicon-based micro display chip 2, and since the cover plate completely covers the silicon-based micro display chip 2 after attachment, cutting or hole digging is needed on the position of the cover plate corresponding to the bonding pad area 22 after attachment is completed to expose the bonding pad area 22, however, the size of the silicon-based micro display chip 2 is smaller, the surface of the bonding pad area 22 is easily damaged during hole digging, and the electrical interconnection between the silicon-based micro display chip 2 and other components is affected, so that the hole digging process has high accuracy requirement, the processing difficulty is high, and if high-accuracy processing equipment is adopted for hole digging, the production cost is increased.
According to the technical scheme, through holes 11 corresponding to the bonding pad areas 22 are preset in the cover plate 1, so that the bonding pad areas 22 can be directly exposed after the cover plate 1 is fully attached to the silicon-based micro display chip 2, other cutting or hole digging procedures and the like after the high-precision processing equipment is not needed, adverse effects on electrical characteristics of the silicon-based micro display chip 2 caused by the bonding pad areas 22 of the silicon-based micro display chip 2 due to the cutting or hole digging procedures and the like are avoided, investment of production and processing equipment is saved, production process flows are simplified, and production process difficulty is reduced.
Referring to fig. 1 to 3, alternatively, the through-hole 11 is in a stripe shape, and the through-hole 11 penetrates the cap plate 1 in a direction perpendicular to the cap plate 1 to expose the pad region 22. Specifically, the position of the through hole 11 corresponds to the position of the pad region 22, and the opening of the through hole 11 can be set, so that the vertical projection area of the through hole 11 on the cover plate 1 is covered or larger than the area where the pad region 22 is located, so that the pad region 22 of the silicon-based micro display chip 2 is directly exposed after the cover plate 1 is fully attached to the silicon-based micro display chip 2, the working procedures such as cutting or hole digging after the cover plate 1 is fully attached to the silicon-based micro display chip 2 are omitted, the investment of production and processing equipment is saved, the production process flow is simplified, and the production process difficulty is reduced. In addition, the through holes 11 are arranged to be strip-shaped, so that the through holes 11 are formed on the cover plate 1 conveniently, and the area where the strip-shaped through holes 11 are located can completely cover the bonding pad area 22, and the processing technology is further simplified.
FIG. 4 is a schematic top view of another silicon-based micro-display chip cover plate according to an embodiment of the present invention; fig. 5 is a schematic cross-sectional view of another display device according to an embodiment of the invention. Fig. 5 schematically illustrates a cross-sectional structure along a straight line BB' after the silicon-based micro-display chip cover plate shown in fig. 4 and the silicon-based micro-display chip shown in fig. 2 are fully bonded. Referring to fig. 4 and 5, alternatively, the surface of the cover plate 1 for the silicon-based micro-display chip 2, which is used for attaching the silicon-based micro-display chip, is provided with a groove 13, the cover plate 1 further includes a display unit attaching region 12 corresponding to the display region 21, and the groove 13 is at least disposed between the display unit attaching region 12 and the through hole 11.
Specifically, an adhesive, such as a thermosetting glue, is applied to the display unit attaching region 12 of the cover plate 1 to attach the cover plate 1 and the silicon-based micro display chip 2. Since glue is liable to overflow during bonding, the electrical interconnection of the silicon-based micro-display chip 2 and other components may be affected if glue overflows from the display unit bonding region 12 and covers the pad region 22. A groove 13 may be disposed at least between the display unit attaching region 12 and the through hole 11, so that the overflowed glue is guided into the groove 13, and the overflowed glue is prevented from covering the pad region 22, thereby affecting the performance of the silicon-based micro display chip 2.
Optionally, referring to fig. 4, the length of the recess 13 is greater than the length of the adjacent edge of the display unit attachment region 12 to the recess. Since the glue may overflow from the edge of the display unit attaching region 12 to the external directions when the cover plate 1 and the silicon-based micro display chip 2 are fully attached, for example, the glue may overflow from the upper right corner of the display unit attaching region 12 shown in fig. 4 to the pad region 22 or overflow from the lower right corner of the display unit attaching region 12 to the pad region 22, and the length of the groove 13 is greater than the length of the adjacent edge of the display unit attaching region 12, so that the glue overflowed from each position of the display unit attaching region 12 near the edge of the pad region 22 can be effectively guided.
Fig. 6 is a schematic top view of another silicon-based micro-display chip cover plate according to an embodiment of the invention. Fig. 7 is a schematic cross-sectional view of another display device according to an embodiment of the invention. Fig. 7 schematically illustrates a cross-sectional structure along a straight line BB' after the silicon-based micro-display chip cover plate shown in fig. 6 and the silicon-based micro-display chip shown in fig. 2 are fully bonded. Alternatively, in combination with fig. 6 and fig. 7, the groove 13 is disposed around the periphery of the display unit attaching region 12. The length that recess 13 extended like this can be expanded, the inner space that recess 13 was used for water conservancy diversion display element laminating district 12 to overflow has been enlarged, more glue that overflows can be stored, when further reduced apron 1 and the comprehensive laminating of silica-based micro-display chip 2, the probability that the glue in display element laminating district 12 overflowed to pad district 22. Meanwhile, the grooves 13 form communicated annular grooves, so that the circulation of glue inside the grooves 13 is facilitated, and the overflow of glue in a certain area from the edges of the grooves 13 due to excessive overflow of glue is avoided.
Preferably, in order to achieve a better glue overflow preventing effect, referring to fig. 4 to 7, when the size of the display chip 2 is 11.4mm by 15.23mm, the size of the display area 21 is 10mm by 13mm, and the distance between the display area 21 and the pad area 22 is 1.2mm, a direction perpendicular to the extending direction of the groove 13 may be set, the width of the groove 13 ranges from 0.2mm to 0.4mm, the distance between the groove 13 near one side of the through hole 11 and the through hole 11 ranges from 0.3mm to 1mm, the depth of the groove 13 in the direction perpendicular to the bonding surface of the cover plate 1 and the silicon-based micro display chip 2 ranges from 0.2mm to 0.4mm, and due to the smaller size of the silicon-based micro display chip 2, the overall size of the cover plate 1 is also smaller, the width and the depth of the groove 13 are set, so that the groove 13 can accommodate a sufficient volume of glue while not excessively occupying the space inside the cover plate 1, the distance between the groove 13 and the through hole 11 is set, so that a sufficient space between the groove 13 and the pad area 22 is reserved, and the glue 22 is prevented from being accidentally coated, for example, and the glue overflow preventing the excessive glue from overflowing from the cover plate area. It will be appreciated that the dimensions described above may be adapted to the specific dimensions of the display chip 2.
Alternatively, referring to fig. 5 and 7, the surface of the silicon-based micro display chip cover plate groove 13 may include a plurality of planes. The surface provided with the groove 13 comprises a plurality of planes, so that the processing can be facilitated, the difficulty of a production process for manufacturing the groove 13 is reduced, and meanwhile, the glue is effectively prevented from overflowing. Fig. 8 is a schematic cross-sectional view of another display device according to an embodiment of the invention. Fig. 8 shows another cross-sectional structure along the direction of the straight line BB' after the silicon-based micro-display chip cover plate shown in fig. 6 and the silicon-based micro-display chip shown in fig. 2 are fully bonded. Referring to fig. 8, and taking the groove 13 in the structure shown in fig. 7 as a corresponding scheme, alternatively, the surface of the groove 13 of the silicon-based micro display chip cover plate may be an arc surface. The surface that sets up recess 13 is the cambered surface, helps glue to flow in recess 13 inside, and simultaneously, contrast plane recess and cambered surface recess, the cambered surface recess can avoid glue unable inflow recess 13 bottom (keep away from the right angle space of silica-based micro display chip 2 one side), to the same plane recess of volume and cambered surface recess, cambered surface recess water conservancy diversion glue's space is bigger, therefore the surface that sets up recess 13 also can reduce the apron space that recess 13 occupy for the cambered surface, has further prevented glue excessive simultaneously.
The embodiment of the invention also provides a manufacturing method of the display device, which is used for manufacturing the display device provided by the embodiment of the invention. Fig. 9 is a flowchart of a method for manufacturing a display device according to an embodiment of the invention. As shown in fig. 9, the method for manufacturing the display device specifically includes:
s110, providing a standby silicon-based micro display chip and a standby cover plate.
FIG. 10 is a schematic diagram of a spare cover plate according to an embodiment of the present invention; FIG. 11 is a schematic diagram of a standby silicon-based micro-display chip according to an embodiment of the present invention. Referring to fig. 10 and 11, the standby silicon-based micro display chip 20 is illustratively a standby chip including a plurality of the silicon-based micro display chips 2 shown in fig. 2 before dicing, each silicon-based micro display chip 2 including a display area 21 and a corresponding pad area 22. The spare cover plate 10a is used for being attached to the spare silicon-based micro display chip 20 in a facing manner, and fig. 10 shows the structure of the spare cover plate 10a before processing.
S120, etching the standby cover plate to form a plurality of strip-shaped through holes which are arranged in parallel.
Fig. 12 is a schematic structural diagram of a processed spare cover plate according to an embodiment of the present invention. Specifically, referring to fig. 11 and 12, a plurality of parallel strip-shaped through holes 110 may be etched on the standby cover plate 10 through a mask with a corresponding pattern, so that when the standby cover plate 10 is fully attached to the standby silicon-based micro display chip 20, the area where each strip-shaped through hole 110 in the standby cover plate 10 is located can fully cover the area where a corresponding row of a plurality of pad areas 22 in the standby silicon-based micro display chip 20 are located, and thus after the standby cover plate 10 is fully attached to the standby silicon-based micro display chip 20, one strip-shaped through hole 110 in the standby cover plate 10 can expose the corresponding row of a plurality of pad areas 22 in the standby silicon-based micro display chip 20.
Optionally, etching the spare cover plate to form a plurality of strip-shaped through holes arranged in parallel includes: etching a plurality of strip-shaped through holes 110 penetrating through the standby cover plate 10 on the standby cover plate 10 along the direction perpendicular to the standby cover plate 10; after the surface of the standby silicon-based micro display chip 20 provided with the pad area 22 is oppositely attached to the standby cover plate 10, the pad area 22 is exposed by the bar-shaped through hole 110. Specifically, a plurality of parallel stripe-shaped through holes 110 penetrate through the standby cover plate 10, so that after the standby cover plate 10 and the standby silicon-based micro display chip 20 are oppositely attached, each stripe-shaped through hole 110 exposes a row of pad areas 22. In the existing production process, the untreated complete standby cover plate 10a shown in fig. 10 is generally directly attached to the standby silicon-based micro display chip 20, and since the standby cover plate 10a after attachment can completely cover the standby silicon-based micro display chip 20, cutting or hole digging is required to be performed on the position of the standby cover plate 10a corresponding to each bonding pad area 22 in the standby silicon-based micro display chip 20 after attachment is completed to expose the bonding pad area 22, however, the size of the standby silicon-based micro display chip 20 is smaller, the surface of the bonding pad area 22 is easily damaged during hole digging, the electrical interconnection between the standby silicon-based micro display chip 20 and other components is affected, and a plurality of bonding pad areas 22 are required to be corresponding to perform hole digging, so that the precision requirement on the hole digging process is high, the processing difficulty is high, and if high-precision processing equipment is adopted to perform hole digging, the production cost is increased. In the technical solution of this embodiment, a plurality of strip-shaped through holes 110 corresponding to a row of pad areas 22 are preset in the standby cover plate 10 as shown in fig. 12, so that the pad areas 22 can be directly exposed after the standby cover plate 10 is fully attached to the standby silicon-based micro display chip 20, other working procedures such as cutting or hole digging after the full attachment by adopting high-precision processing equipment are not needed, adverse effects caused by the working procedures such as cutting or hole digging on the electrical characteristics of the standby silicon-based micro display chip 20 due to the pad areas 22 of the standby silicon-based micro display chip 20 are avoided, investment of production and processing equipment is saved, production process flows are simplified, and production process difficulty is reduced.
And S130, oppositely attaching the surface of the standby silicon-based micro display chip provided with the pad area and the standby cover plate.
Specifically, the standby cover 10 includes display unit attaching regions 12 corresponding to the display regions 21 in the standby silicon-based micro display chip 20, and an adhesive, such as a thermosetting glue, may be applied to each display unit attaching region 12, and the adhesive may be applied to the display unit attaching region 12 in an X-shape or Z-shape along a direction parallel to the through holes 110 or a direction perpendicular to the through holes 110, so that the display unit attaching region 12 is attached to each position of the display region 21. And bonding the manufactured standby cover plate 10 and the standby silicon-based micro display chip 20 by adopting a chip mounter, and curing at high pressure and Wen Tuopao after bonding.
And S140, cutting the attached standby silicon-based micro display chip and the standby cover plate by taking the area where each display area and the corresponding bonding pad area of the standby silicon-based micro display chip are located as a cutting unit to form the display device.
Fig. 13 is a schematic cross-sectional view of another display device according to an embodiment of the invention. Referring to fig. 11-13, for example, a plurality of dicing lines perpendicular to the bar-shaped through holes 110 and a plurality of dicing lines parallel to the bar-shaped through holes 110 may be provided, and the area where each of the display area 21 and the pad area 22 of the standby silicon-based micro-display chip 20 is located is used as a dicing unit to dice the bonded display chip and cover plate, for example, the area where the dicing unit 100 is located is used as a dicing unit, and dicing is performed along the corresponding dicing lines, where the dicing unit 100 can form one display device shown in fig. 13, and similarly, dicing is performed along all dicing lines, so that the bar-shaped through holes 110 on the standby cover plate 10 in each display device can completely expose the pad area 22 in the standby silicon-based micro-display chip 20.
Preferably, in combination with fig. 11 and fig. 12, the cutting line parallel to the strip-shaped through hole 110 is located at the edge of the side of the strip-shaped through hole 110 away from the display unit attaching region 12, and the display device shown in fig. 13 formed after cutting forms a step 14 at the position corresponding to the bonding pad region 22 on the cover plate 1, and the bonding pad region 22 is completely exposed through the step 14, so that the electrical connection between the silicon-based micro display chip 2 and other components is facilitated. FIG. 14 is a schematic diagram showing the positions of scribe lines on a standby silicon-based micro-display chip according to an embodiment of the present invention; fig. 15 is a schematic view showing the positions of cutting lines on a processed spare cover plate according to an embodiment of the present invention. In connection with fig. 14 and 15, in practical application, a cutting line parallel to the through hole 110 may be disposed at other positions near the through hole 110, for example, between the through hole 110 and the display unit attaching region 12 of the adjacent cutting unit 100, and the specific position of the cutting line may be set in connection with the practical application, which is not limited in the embodiment of the present invention.
Fig. 16 is a schematic structural view of another spare cover plate according to an embodiment of the present invention. Referring to fig. 14 and 16, optionally, before the surface of the standby silicon-based micro display chip provided with the pad area and the standby cover plate are oppositely attached, the method further includes: a plurality of grooves 13 are etched on the surface of the standby cover plate 10, which is attached to the standby silicon-based micro display chip 20, wherein after the surface of the standby silicon-based micro display chip 20, which is provided with the pad area 22, is attached to the standby cover plate 10 in an opposite manner, the grooves 13 are at least located between the display unit attaching area 12 of the standby cover plate 10 and the bar-shaped through holes 110.
Specifically, the plurality of grooves 13 may be formed by etching through a mask of a corresponding pattern, and the glue is easy to overflow when attaching the standby cover plate 10 and the standby silicon-based micro-display chip 20, and the electrical interconnection of the standby silicon-based micro-display chip 20 and other components may be affected if the glue covers the pad region 22. A groove 13 may be disposed at least between the display unit attaching region 12 and the bar-shaped through hole 110, so that the overflowed glue is guided into the groove 13, and the overflowed glue is prevented from covering the pad region 22, thereby affecting the performance of the display chip. Fig. 17 is a schematic structural diagram of another spare cover plate according to an embodiment of the present invention. As shown in fig. 17, alternatively, a groove 13b may be provided on a side of the display unit attaching region 12 away from the bar-shaped through hole 110 to prevent glue from overflowing and covering the pad region 22 corresponding to the left adjacent bar-shaped through hole 110.
Fig. 8 is a schematic structural diagram of another spare cover plate according to an embodiment of the present invention. Referring to fig. 14 and 18, alternatively, after the surface of the standby silicon-based micro display chip 20 provided with the pad region 22 and the standby cover plate 10 are bonded opposite to each other, the recess 13 surrounds the periphery of the display unit bonding region 12. The length that recess 13 extended like this can be expanded, the inner space that recess 13 was used for water conservancy diversion display element laminating district 12 to overflow has been enlarged, more glue that overflows can be stored, when reserve apron 10 and reserve silicon-based micro-display chip 20 paste comprehensively, the probability that the glue in display element laminating district 12 overflowed to pad district 22 has further been reduced. Meanwhile, the grooves 13 form communicated annular grooves, so that the circulation of glue inside the grooves 13 is facilitated, and the overflow of glue in a certain area from the edges of the grooves 13 due to excessive overflow of glue is avoided.
The embodiment of the invention also provides a display device, which is obtained by using the manufacturing method of the display device provided by the embodiment of the invention, and referring to fig. 13, the display device comprises: the display device comprises a silicon-based micro display chip 2 and a silicon-based micro display chip cover plate 1, wherein the cover plate 1 is oppositely attached to the silicon-based micro display chip 2, and the silicon-based micro display chip 2 comprises a display area 21 and a bonding pad area 22 positioned on at least one side of the display area 21; the cover plate 1 is provided with a step 14 at a position corresponding to the pad region 22. The display device provided by the embodiment of the invention is obtained by using the manufacturing method of the display device provided by the embodiment of the invention, and comprises the silicon-based micro display chip cover plate provided by the embodiment of the invention, so that the display device has the beneficial effects and is not repeated here.
According to the invention, the problem that when the existing display chip is attached to the cover plate, if the silicon-based chip is cut and then packaged, because the side length of the micro display is smaller, dislocation or para-deflection is easy to occur when the packaging seal in the chip is attached to the chip, and the defect is caused, and although the through hole is not reflected on a product when the through hole is cut again, the chip can be consistent with the opening of the cover plate by adopting the cutting method; if the cover plate and the silicon-based chip wafer are integrally attached and packaged, and then the gold finger area is covered by the packaging cover plate when the cutting is carried out, if the glass cover plate part on the gold finger area is removed at the moment, the gold finger area is easily damaged, and the technical problems of high process difficulty and high cost and the chip is easily damaged are solved.
Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Claims (8)
1. The cover plate is used for being oppositely attached to the silicon-based micro display chip, and the silicon-based micro display chip comprises a display area and a bonding pad area positioned on at least one side of the display area;
a through hole is formed in the corresponding position of the cover plate and the bonding pad area;
the cover plate is used for being attached the surface of silicon-based micro display chip is provided with the recess, the cover plate still includes the display element laminating district that corresponds to the display area, the recess sets up at least between the display element laminating district with the through-hole, silicon-based micro display chip cover plate still includes the cutting line, the cutting line is located the through-hole is kept away from the edge of display element laminating district one side, and is located the through-hole is kept away from one side of recess.
2. The silicon-based micro display chip cover plate according to claim 1, wherein the through holes are stripe-shaped, and penetrate through the cover plate in a direction perpendicular to the cover plate to expose the pad area.
3. The cover plate of claim 1, wherein the recess is disposed around the periphery of the display unit attachment region.
4. The cover plate of silicon-based micro display chip as claimed in claim 1, wherein the surface of the groove comprises a plurality of planes or the surface of the groove is a cambered surface.
5. A method for manufacturing a display device, comprising:
providing a standby silicon-based micro display chip and a standby cover plate;
etching a plurality of strip-shaped through holes which are arranged in parallel on the standby cover plate;
the surface of the standby silicon-based micro display chip provided with the bonding pad area is oppositely attached to the standby cover plate;
cutting the attached standby silicon-based micro display chip and the standby cover plate by taking the area where each display area and the corresponding bonding pad area of the standby silicon-based micro display chip are located as a cutting unit to form the display device;
before the surface of the standby silicon-based micro display chip provided with the pad area is oppositely attached to the standby cover plate, the method further comprises the following steps:
etching on the surface of reserve apron laminating reserve silicon-based micro display chip forms a plurality of recesses, wherein, will reserve silicon-based micro display chip is provided with the surface of pad district with the back is laminated in reserve apron opposition, the recess is located at least reserve apron's display element laminating district with between the bar through-hole, reserve silicon-based micro display chip with reserve apron's cutting line is located the through-hole is kept away from the edge of display element laminating district one side, and is located the through-hole is kept away from one side of recess.
6. The method of manufacturing a display device according to claim 5, wherein etching the plurality of parallel stripe-shaped through holes on the spare cover plate comprises:
etching the spare cover plate along the direction perpendicular to the spare cover plate to form a plurality of strip-shaped through holes penetrating through the spare cover plate; and after the surface of the standby silicon-based micro display chip provided with the bonding pad area is oppositely attached to the standby cover plate, the strip-shaped through holes expose the bonding pad area.
7. The method according to claim 5, wherein the recess surrounds the periphery of the display unit bonding region after the surface of the standby silicon-based micro-display chip provided with the bonding pad region and the standby cover plate are bonded in opposition.
8. A display device obtained by the manufacturing method of the display device according to any one of claims 5 to 7, comprising:
the display device comprises a silicon-based micro display chip and a silicon-based micro display chip cover plate, wherein the cover plate is oppositely attached to the silicon-based micro display chip, and the silicon-based micro display chip comprises a display area and a bonding pad area positioned on at least one side of the display area;
and a step is arranged at the corresponding position of the cover plate and the bonding pad area.
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