CN111078608A - 电子信号处理装置 - Google Patents

电子信号处理装置 Download PDF

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CN111078608A
CN111078608A CN201811322975.0A CN201811322975A CN111078608A CN 111078608 A CN111078608 A CN 111078608A CN 201811322975 A CN201811322975 A CN 201811322975A CN 111078608 A CN111078608 A CN 111078608A
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signal processing
electronic signal
circuit board
printed circuit
processing device
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萧心端
蔡国仰
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Bizlink International Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/7005Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011Locking or fixing a connector to a PCB
    • H01R12/7052Locking or fixing a connector to a PCB characterised by the locating members
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716Coupling device provided on the PCB
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38Information transfer, e.g. on bus
    • G06F13/382Information transfer, e.g. on bus using universal interface adapter
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38Information transfer, e.g. on bus
    • G06F13/40Bus structure
    • G06F13/4063Device-to-bus coupling
    • G06F13/4068Electrical coupling
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/7076Coupling devices for connection between PCB and component, e.g. display
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/77Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/79Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473Impedance matching
    • H01R13/6474Impedance matching by variation of conductive properties, e.g. by dimension variations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • H05K1/0243Printed circuits associated with mounted high frequency components
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    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
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    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10356Cables
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/209Auto-mechanical connection between a component and a PCB or between two PCBs

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  • Engineering & Computer Science (AREA)
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  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

本发明公开了一种电子信号处理装置,其包含有印刷电路板、信号处理晶片、多个导电线路、多个铜垫以及固定装置。信号处理晶片安装于印刷电路板之上,多个导电线路形成于印刷电路板之上并连接信号处理晶片。铜垫则分别形成在导电线路的末端。固定装置设置于印刷电路板之上,并露出上述的铜垫,以用来连接线材组件,进而提升信号完整度。

Description

电子信号处理装置
技术领域
本发明是有关于一种电子信号处理装置。特别是有关于一种高频电子信号处理装置。
背景技术
随着各类电子产品的技术的持续进步与不断创新,新的电子产品相对地需要更多的频宽。因此,现今世界也越来越依赖于信息快速与可靠的传递。
当半导体在技术上持续的突破,已经在PC总线架构、网路基础设施、数字无线通讯得到广泛的应用。在个人电脑,特别是在伺服器处理器的速度已经升级到GHz的范围内,同时储存器的传输量和内部总线速度也随之上升。高速的数据传输技术支援更为强大的电脑应用,如3D游戏和电脑辅助设计程序。先进的三维图像需要大量的数据在CPU、储存器、显示卡中进行传输。
然而,电脑技术只是频宽信息时代的一个部分。数字通讯设备设计工程师也正逐步采用更高频的数据传输技术。与此同时,在数字高画质影像信息技术领域,正在设计下一代传输高画质、互动影像信息的设备。众多技术不断驱使数据传输率进步。新兴的串列总线正在打破平行总线构架的瓶颈。
逐渐增长的频宽,为数字是统设计带来的挑战,曾经在毫秒时间内发生的数据互动,现在要以纳秒来衡量。为了能更精确地传送所需的信号,如何能提高信号传输的正确性与速率,为业者与使用者所企盼。
发明内容
发明内容旨在提供本揭示内容的简化摘要,以使阅读者对本揭示内容具备基本的理解。此发明内容并非本揭示内容的完整概述,且其用意并非在指出本发明实施例的重要/关键元件或界定本发明的范围。
本发明内容的一目的是在提供一种电子信号处理装置,可以有效地提升高频信号完整度,进而增加高频信号传输的品质与速率。
为达上述目的,本发明内容的一技术方面是关于一种电子信号处理装置,包含有印刷电路板、信号处理晶片、多个导电线路、多个铜垫以及固定装置。
信号处理晶片安装于印刷电路板之上,多个导电线路形成于印刷电路板之上并连接信号处理晶片。铜垫,例如是金手指,则分别形成在导电线路的末端。固定装置设置于印刷电路板之上,并露出上述的铜垫,以用来连接线材组件。
在一些实施例中,固定装置包含有U型保护壳,固定于印刷电路板之上。
在一些实施例中,固定装置还包含有一保护盖,连接于U型保护壳。
在一些实施例中,保护盖包含有枢轴,枢接于U型保护壳。
在一些实施例中,保护盖包含有固定凸起,U型保护壳包含有固定凹槽,以将保护盖固定在U型保护壳。
在一些实施例中,U型保护壳包含有定位凹槽,以用来定位线材组件的一定位凸缘。此外,保护盖还包含压制凸缘,以将线材组件的定位凸缘固定于定位凹槽之中。
在一些实施例中,线材组件包含有多个电接触件,电接触件则包含有多个变化宽度电接触件,例如是具有变化宽度的信号传输电接触件。
综上所述,电子信号处理装置不仅可以方便地与线材组件耦合,且线材组件的电接触件可以直接接触电路板上的铜垫,减少讯号处理晶片与线材之间所需的连接元件,有效地提升信号完整度,进而增加信号传输的品质与速率。此外,通过电接触件的尺寸变化,在进行高频信号传输时,高频信号完整度可以更有效地被提升,更进一步地增加高频信号传输的品质与速率。
附图说明
为让本发明的上述和其他目的、特征、优点与实施例能更明显易懂,所附附图说明如下:
图1是依照本发明的一实施例所绘示的一种电子信号处理装置的示意图。
图2是依照本发明的一实施例所绘示的一种电子信号处理装置的后视示意图。
图3是依照本发明的一实施例所绘示的一种电子信号处理装置的线材组件之电接触件的正视示意图。
具体实施方式
下文是举实施例配合所附附图进行详细说明,但所提供的实施例并非用以限制本发明所涵盖的范围,而结构运作的描述非用以限制其执行的顺序,任何由元件重新组合的结构,所产生具有均等功效的装置,皆为本发明所涵盖的范围。另外,附图仅以说明为目的,并未依照原尺寸作图。为使便于理解,下述说明中相同元件或相似元件将以相同的符号标示来说明。
另外,在全篇说明书与权利要求所使用的用词(terms),除有特别注明外,通常具有每个用词使用在此领域中、在此公开的内容中与特殊内容中的平常意义。某些用以描述本发明的用词将于下或在此说明书的别处讨论,以提供本领域技术人员在有关本发明的描述上额外的引导。
在实施方式与权利要求中,除非内文中对于冠词有所特别限定,否则“一』与“该』可泛指单一个或多个。而步骤中所使用之编号仅是用来标示步骤以便于说明,而非用来限制前后顺序及实施方式。
其次,在本文中所使用的用词“包含”、“包括”、“具有”、“含有”等等,均为开放性的用语,即意指包含但不限于。
参阅图1至图3,图1根据本发明的一实施例所绘示的一种电子信号处理装置的示意图,图2是其后视示意图,而图3则是电子信号处理装置的线材组件的电接触件的正视示意图。
如图所示,电子信号处理装置600包含有印刷电路板610、信号处理晶片620、多个导电线路640、多个铜垫(pad)650以及固定装置630。
信号处理晶片620安装于印刷电路板610之上,而导电线路640形成于印刷电路板610之上,并用以电性连接信号处理晶片620,多个铜垫650则分别形成在导电线路640的末端。固定装置630亦设置于印刷电路板610之上,并露出前述的铜垫650,以用来连接线材组件100。其中,铜垫650可直接与线材组件100的电接触件120相互接触,且印刷电路板610上无需另外安装电连接器,线材组件100的电接触件120直接连接印刷电路板610上的铜垫650,例如是金手指,故可以有效地降低信号的衰减或变异,进而提升信号完整度,更增加信号传输的品质与速率。
在一些实施例中,固定装置630包含有U型保护壳632以及保护盖634,U型保护壳632固定于印刷电路板610之上,以形成容置空间636,并使铜垫650外露于容置空间636,而保护盖634利用枢轴635枢接于U型保护壳632,并可盖在U型保护壳632之上。
在一些实施例中,保护盖634包含有固定凸起637,例如是弹性钢珠或凸块,当保护盖634盖在U型保护壳632之上时,保护盖634的固定凸起637耦合U型保护壳632的固定凹槽633,以将保护盖634固定在U型保护壳632,然本发明并不限定于此,其可以利用其他的固定装置,或将固定凸起637与固定凹槽633的位置互换,其均不脱离本发明的精神与范围。
在一些实施例中,U型保护壳632包含有定位凹槽638,以用来定位线材组件100的定位凸缘138。且当保护盖634盖在U型保护壳632之上时,利用保护盖634上的压制凸缘639,以将线材组件100的定位凸缘138固定于定位凹槽638之中,进而有效地确保印刷电路板610上的铜垫650与线材组件100的电接触件120相互接触,以稳定的传输信号。
在一些实施例中,线材组件100的电接触件120至少包含多个变化宽度电接触件121。且变化宽度电接触件121可以有效地传输高频信号,例如是信号传输电接触件。
同时参阅图1至图3,线材组件100包含有多个线材110、多个电接触件120、保护壳130以及固定器140。
线材110分别固定于电接触件120,并利用固定器140,固定电接触件120,然后,将固定器140、线材110以及电接触件120安装于保护壳130。
电接触件120则依序形成有接触段302、外露段304、固定段306以及线材连接段308。电接触件120的接触段302用以电性连接电路板,例如是主机板等电子装置的印刷电路板等,上裸露的金手指等。
电接触件120的线材连接段308则用来连接线材110,以使两者电性连接,其可以是利用焊接等方式,将两者加以连接。
电接触件120至少包含一个以上的变化宽度电接触件121,用来进行信号传输,通过变化宽度,有效地提升信号完整度(signal integrity;SI),进而增加信号传输的品质与速率,特别是高频的信号完整度,例如是使用在5吉赫(gigahertz;GHz)以上的信号传输时,有效地提升信号完整度,以增加信号传输的品质与速率。
变化宽度电接触件121可以包含有第一宽度310、第二宽度320、第三宽度330、第四宽度340以及第五宽度350。
在一些实施例中,第一宽度310与第二宽度320设置于外露段304,其中,第一宽度310邻近接触段302,而第二宽度320位于第一宽度310与固定段306之间。第一宽度310不同于第二宽度320,以改变变化宽度电接触件121的信号传输的宽度,有效地提升信号完整度,进而增加信号传输的品质与速率,特别是高频的信号完整度。
在一些实施例中,第一宽度310大于第二宽度320。在另一些实施例中,第一宽度310小于第二宽度320。
此外,第三宽度330形成在固定段306之中。在一些实施例中,第一宽度310大于第三宽度330。在另一些实施例中,第一宽度310小于第三宽度330。
第四宽度340以及第五宽度350则形成在线材连接段308之中。在一些实施例中,第一宽度310大于第四宽度340。在另一些实施例中,第一宽度310小于第四宽度340。
在一些实施例中,第一宽度310等于第五宽度350。在另一些实施例中,第一宽度310不等于第五宽度350。
经由实验可知,当使用变化宽度电接触件121进行高频信号传输时,通过变化宽度,可以有效地提升信号完整度,进而增加信号传输的品质与速率。
综上所述,电子信号处理装置不仅可以方便地与线材组件耦合,且线材组件的电接触件可以直接接触电路板上的铜垫,减少讯号处理晶片与线材之间所需的连接元件,有效地提升信号完整度,进而增加信号传输的品质与速率。此外,通过电接触件的尺寸变化,在进行高频信号传输时,高频信号完整度可以更有效地被提升,更进一步地增加高频信号传输的品质与速率。
虽然本发明已以实施方式公开如上,然其并非用以限定本发明,任何本领域的技术人员,在不脱离本发明的精神和范围内,当可作各种的更动与润饰,因此本发明的保护范围当视权利要求所界定的为准。

Claims (10)

1.一种电子信号处理装置,其特征在于,包含:
印刷电路板;
信号处理晶片,安装于所述印刷电路板之上;
多个导电线路,形成于所述印刷电路板之上,并连接所述信号处理晶片;
多个铜垫,分别形成在所述多个导电线路的末端;以及
固定装置,设置于所述印刷电路板之上,并露出所述多个铜垫,以用来连接线材组件。
2.如权利要求1所述的电子信号处理装置,其特征在于,所述固定装置包含U型保护壳,固定于所述印刷电路板之上。
3.如权利要求2所述的电子信号处理装置,其特征在于,所述固定装置还包含保护盖,连接于所述U型保护壳。
4.如权利要求3所述的电子信号处理装置,其特征在于,所述保护盖包含枢轴,枢接于所述U型保护壳。
5.如权利要求3所述的电子信号处理装置,其特征在于,所述保护盖包含固定凸起,而所述U型保护壳包含固定凹槽,以固定所述保护盖在所述U型保护壳。
6.如权利要求5所述的电子信号处理装置,其特征在于,所述U型保护壳包含定位凹槽,以用来定位所述线材组件的定位凸缘。
7.如权利要求6所述的电子信号处理装置,其特征在于,所述保护盖还包含压制凸缘,以将所述线材组件的所述定位凸缘固定于所述定位凹槽之中。
8.如权利要求1所述的电子信号处理装置,其特征在于,所述线材组件包含多个电接触件。
9.如权利要求8所述的电子信号处理装置,其特征在于,所述多个电接触件包含多个变化宽度电接触件。
10.如权利要求9所述的电子信号处理装置,其特征在于,所述多个变化宽度电接触件为信号传输电接触件。
CN201811322975.0A 2018-10-19 2018-11-08 电子信号处理装置 Pending CN111078608A (zh)

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