CN111069095B - Silicon material screening device and processing method - Google Patents
Silicon material screening device and processing method Download PDFInfo
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- CN111069095B CN111069095B CN201911410570.7A CN201911410570A CN111069095B CN 111069095 B CN111069095 B CN 111069095B CN 201911410570 A CN201911410570 A CN 201911410570A CN 111069095 B CN111069095 B CN 111069095B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C2501/00—Sorting according to a characteristic or feature of the articles or material to be sorted
- B07C2501/0036—Sorting out metallic particles
Abstract
The invention discloses a silicon material screening device, which comprises a feeding box, a silicon material screening belt, a transmission vibrator, a circuit controller, a grabbing device and a material receiving box, the discharge end of the feeding box is connected with one end of the silicon material screening belt, the transmission vibrator is arranged below the silicon material screening belt, the gripping device is arranged above the silicon material screening belt, the other end of the silicon material screening belt is connected with the feeding end of the material receiving box, a plurality of metal strips with preset intervals are arranged in parallel along the transmission direction of the silicon material screening belt, the metal strips are connected with the circuit controller, so that a plurality of energized circuits are formed among the metal strips, the circuit controller comprises a circuit detection module, the grabbing device is linked with the circuit detection module, and enabling the grabbing device to carry out grabbing operation according to the circuit detection result and a preset positioning program.
Description
Technical Field
The invention relates to the technical field of raw material treatment, in particular to a silicon material screening device and a silicon material treatment method.
Background
The primary polycrystal used in the crystal pulling process needs material blocks with different diameters in the charging process, so that the silicon material is crushed by more processes, the difference of different processes is larger, and each process can generate some tiny metal impurities which are difficult to find. The metal content has a large influence on the quality of the single crystal, and the impurities mixed in the silicon material cannot be removed by naked eyes, so that a large amount of crushed materials cannot be used, and the material is greatly wasted. How to effectively control the metal impurities in the silicon material to enter the furnace body so as to improve the quality of the silicon material and the economic benefit is very important.
In the prior art, metal is generally removed by material cleaning, and the treatment method has the following defects: the small blocks are not thoroughly cleaned, the cleaning treatment period is long, and the water consumption and the acid consumption are reduced.
Disclosure of Invention
In order to solve the problems in the prior art, the embodiment of the invention provides a silicon material screening device and a silicon material processing method, which can effectively improve the capability of distinguishing silicon materials with metal impurities, reduce the acid pickling ratio and play a positive role in reducing the water consumption. The technical scheme is as follows:
on one hand, the silicon material screening device comprises a feeding box, a feeding box vibrator, a silicon material screening belt, a transmission vibrator, a circuit controller, a grabbing device and a receiving box, wherein the feeding box vibrator is arranged below the feeding box, the discharging end of the feeding box is connected with one end of the silicon material screening belt in a supporting mode, the transmission vibrator is arranged below the silicon material screening belt, the grabbing device is arranged above the silicon material screening belt, the other end of the silicon material screening belt is connected with the feeding end of the receiving box in a supporting mode, a plurality of metal strips with preset intervals are arranged in parallel along the transmission direction of the silicon material screening belt, the metal strips are connected with the circuit controller, a plurality of power-on circuits are formed between two adjacent metal strips in the metal strips, the circuit controller comprises a circuit detection module, and the circuit detection module is linked with the grabbing device, and enabling the grabbing device to carry out grabbing operation according to the circuit detection result and a preset positioning program.
Preferably, the silicon material screening belt is composed of a non-metal vibration belt and the plurality of metal strips.
Preferably, silicon troughs are correspondingly arranged along two adjacent metal strips of the plurality of metal strips, and the width of each silicon trough is not less than the preset distance.
Preferably, the predetermined distance is within the diameter range of the processed silicon material.
Preferably, the gripping device comprises a manipulator and an automatic controller which are connected, and the automatic controller is connected with the circuit detection module.
Preferably, the manipulator is a suction gripper.
Preferably, the upper end of the grabbing device is sequentially communicated with a vertical rail and a transverse rail, and the grabbed silicon materials are conveyed to the transverse rail through the vertical rail.
Preferably, the preset positioning program is configured to: and one or more of the current data, the voltage data and the resistance data of each electrified circuit among the plurality of metal strips respectively form a mapping relation with the corresponding preset unit coordinate position of the silicon material screening belt, so that the corresponding grabbing position of the grabbing operation is determined according to the mapping relation and one or more of the current data, the voltage data and the resistance data of each electrified circuit.
Preferably, the circuit controller is further connected with a buzzer and/or a warning lamp, and when the grabbing position is determined, the circuit controller controls the buzzer and/or the warning lamp to be connected. In another aspect, a silicon material screening method of the silicon material screening apparatus according to any one of the above aspects is provided, the method including:
feeding through the feeding box, wherein silicon enters the silicon screening belt from the discharge end of the feeding box;
the silicon material screening belt detects that the electrified circuit changes, and data of a circuit detection result is obtained;
determining the grabbing position of the grabbing operation according to the circuit detection result and a preset positioning program;
and the grabbing device carries out grabbing operation according to the grabbing position.
Preferably, the preset positioning program is configured to: and one or more of the current data, the voltage data and the resistance data of each electrified circuit among the plurality of metal strips respectively form a mapping relation with the corresponding preset unit coordinate position of the silicon material screening belt, so that the corresponding grabbing position of the grabbing operation is determined according to the mapping relation and one or more of the current data, the voltage data and the resistance data of each electrified circuit.
Preferably, the circuit controller is further connected with a buzzer and/or a warning lamp, and when the grabbing position is determined, the circuit controller controls the buzzer and/or the warning lamp to be connected. The technical scheme provided by the embodiment of the invention has the following beneficial effects:
1. by utilizing the metal conductivity, the specific position of the silicon material containing the metal impurities is determined according to the change of the electrified circuit detected by the circuit detection module through a plurality of metal strip arrangement structures which are arranged in parallel along the transmission direction of the silicon material and have preset intervals, and then the grabbing device carries out grabbing operation on the silicon material containing the metal impurities according to the circuit detection result and the preset positioning program, so that the silicon material containing the metal impurities can be accurately removed, the impurity removal effect of the material is improved, the production efficiency is good, and the screening efficiency of the silicon material is greatly improved;
2. moreover, the scheme is different from the traditional pickling scheme, so that the consumption of pickling solution and water is reduced to a certain extent, and the pickling device has the advantages of simple structure and operation, convenience, rapidness, energy conservation and environmental protection.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a silicon material screening apparatus provided in embodiment 1 of the present invention;
fig. 2 is a flow chart of a silicon material screening method of the silicon material screening apparatus provided in embodiment 2 of the present invention;
FIG. 3 is a schematic view of a via circuit for different span-to-space combinations between multiple metal strips;
fig. 4 is a control schematic of the circuit of fig. 3.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the descriptions of the present invention with respect to the directions of "above", "below", etc. are defined based on the relationship of the orientation or position shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device described must be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; the connection can be mechanical connection, electrical connection or communication connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
According to the silicon material screening device and the silicon material processing method provided by the embodiment of the invention, the specific position of the silicon material containing the metal impurities is determined according to the change of the electrified circuit detected by the circuit detection module by utilizing the metal conductivity through the arrangement structure of the plurality of metal strips which are arranged in parallel along the silicon material transmission direction and have preset intervals, and then the grabbing device carries out grabbing operation on the silicon material containing the metal impurities according to the circuit detection result and the preset positioning program, so that the silicon material containing the metal impurities can be accurately removed, the impurity removal effect of the material is improved, the silicon material screening device has good production utility, the silicon material screening efficiency is greatly improved, and the scheme is different from the traditional pickling scheme, the consumption of pickling solution and the consumption of water are reduced to a certain extent, and the silicon material screening device has the advantages of simple structure and operation, convenience, quickness, energy conservation and environmental protection. Therefore, the silicon material screening device and the processing method are suitable for application scenes of screening and removing metal impurity components contained in various silicon materials (such as monocrystalline silicon, polycrystalline silicon and the like), and are particularly suitable for silicon material screening scenes with the diameter range of 2mm to 40 mm.
The following describes the silicon material screening apparatus and the processing method provided by the embodiment of the present invention in detail with reference to the specific embodiment and the accompanying drawings.
Example 1
Fig. 1 is a schematic structural diagram of a silicon material screening apparatus provided in embodiment 1 of the present invention. As shown in fig. 1, the silicon material screening apparatus provided by the embodiment of the present invention mainly includes a feeding box 1, a feeding box vibrator 2, a silicon material screening belt 4, a transmission vibrator 5, a circuit controller 6, a gripping device 11, and a receiving box 7.
Specifically, feeder box vibrator 2 is installed in feeder box 1 below for with the silicon material in feeder box 1 according to the automatic feed of silicon material output rate who sets for, thereby carry the silicon material to the discharge end of feeder box 1. Preferably, a support column 3 is also provided at the hopper vibrator 2, serving to support the hopper 1, the hopper vibrator 2 and to set the hopper 1 to a desired height.
The discharge end of the feeding box 1 is connected with one end of the silicon material screening belt 4, and the transmission vibrator 5 is arranged below the silicon material screening belt 4. A plurality of metal strips 41 with a predetermined pitch are arranged in parallel along the conveying direction of the silicon material sieving belt 4, and the plurality of metal strips 41 are connected with the circuit controller 6, so that a plurality of energized circuits are formed among the plurality of metal strips 41. Preferably, the circuit controller 6 is provided below the conveying vibrator 5.
In addition, the silicon material screening belt 4 is preferably composed of a non-metal vibration belt and a plurality of metal strips 41, and more preferably, the metal strips are made of wear-resistant alloy, wherein the wear-resistant alloy is an alloy developed for improving the wear resistance of mechanical equipment and is the most commonly used alloy of certain typical friction pairs, and the alloy comprises various tool steels, bearing steels, high manganese steels for crushing machines, various wear-resistant cast irons and the like.
In addition, preferably, silicon material grooves are correspondingly arranged along two adjacent metal strips of the plurality of metal strips 41, and the width of each silicon material groove is not less than the maximum particle size of the silicon material to be screened.
Further preferably, the predetermined pitch is set to a value within a diameter range of the processed silicon material, for example, the no-clean silicon material crushing process is classified into 2mm or less, 2-5mm, 5-10mm, 10-30mm, 30-60mm according to the diameter of the block, and then the predetermined pitch may be set to a value within a corresponding diameter range of the silicon material so as to more effectively remove the silicon material containing the metal impurities. It is further preferable that the value range of the predetermined pitch is set to 0.01 to 1mm, preferably 0.1mm, and the smaller the value set for the predetermined pitch, the higher the degree of discrimination of the metal impurities of the silicon material, because when the predetermined pitch is set to a smaller value, by the control detection of the energization circuit formed of the plurality of metal strips, finer metal impurities and conductive impurities can be discriminated so as to obtain a better silicon material impurity removal effect.
Preferably, the preset positioning program is configured to: one or more of the current data, the voltage data and the resistance data of each electrified circuit among the plurality of metal strips 41 form a mapping relation with the corresponding preset unit coordinate position of the silicon material screening belt 4, so that the corresponding grabbing position of grabbing operation is determined according to the mapping relation and one or more of the current data, the voltage data and the resistance data of each electrified circuit, and then the grabbing device 11 grabs the silicon material at the grabbing position. Further preferably, the circuit controller 6 is further connected with a buzzer and/or a warning light (not shown in the figure), and the circuit controller controls the buzzer and/or the warning light to be turned on while determining the grabbing position. In addition, preferably, when the buzzer and/or the warning light are/is turned on, the bin vibrator 2 and the transmission vibrator 5 can be triggered to stop through a preset positioning program, and the equipment returns to normal work after silicon material is grabbed.
In addition, preferably, the path circuit formed by combining the metal strips at different span distances can meet the requirement of convenience and easiness in selection when silicon materials with different silicon material diameters are processed by controlling the on-off condition of the path circuit.
Fig. 3 is a schematic diagram of a via circuit for different span-pitch combinations between a plurality of metal strips, and fig. 4 is a schematic diagram of a circuit control of fig. 3. As shown in fig. 3 and 4, (1), (3), (5), (7), (9), (11), (13) are metal strips connected to the negative electrode of the power supply, and (2), (4), (6), (8), (10), (12), and (14) are metal strips connected to the positive electrode of the power supply. Illustratively, the via circuit control can be set according to the diameter size of the processed silicon material as follows: (1) forming a path of identification circuit (2), forming two paths of identification circuits (3) and (4), and controlling the first path, the second path and the third path to be path circuits through a controller in the same way; or (1) and (4) form a path I, (3) and (6) form a path II, and (5) and (8) form a path III, and so on, and the paths I, II and III are controlled to be electrified circuits by the controller; (1) the circuit A is formed by the circuit A and the circuit B by the circuit B and the circuit A, B is controlled by the controller to be an electrified circuit.
Example 2
Fig. 2 is a flow chart of a silicon material screening method of the silicon material screening apparatus provided in embodiment 2 of the present invention. As shown in fig. 1 and 2, the silicon material screening method includes:
101. feeding through a feeding box 1, wherein silicon materials enter a silicon material screening belt 4 from the discharging end of the feeding box under the action of a feeding box vibrator 2;
102. the silicon material screening belt 4 detects that the electrified circuit changes, and obtains data of a circuit detection result;
103. determining a grabbing position of grabbing operation according to a circuit detection result and a preset positioning program;
104. the grasping means 11 performs grasping operation according to the grasping position.
Preferably, the preset positioning program is configured to: one or more of the current data, the voltage data and the resistance data of each electrified circuit among the plurality of metal strips 41 form a mapping relation with the corresponding preset unit coordinate position of the silicon material screening belt 4, so that the corresponding grabbing position of grabbing operation is determined according to the mapping relation and one or more of the current data, the voltage data and the resistance data of each electrified circuit, and then the grabbing device 11 grabs the silicon material at the grabbing position. Further preferably, the circuit controller 6 is further connected with a buzzer and/or a warning light (not shown in the figure), and the circuit controller controls the buzzer and/or the warning light to be turned on while determining the grabbing position. In addition, preferably, when the buzzer and/or the warning light are/is turned on, the bin vibrator 2 and the transmission vibrator 5 can be triggered to stop through a preset positioning program, and the equipment returns to normal work after silicon material is grabbed. Preferably, the silicon material with metal impurities is intensively collected, and the silicon material is packed and output after reaching the set weight, so that the silicon material with the metal impurities is intensively treated.
In addition, preferably, the path circuit formed by combining a plurality of metal strips at different span distances can meet the screening of silicon materials with different metal impurity distributions by controlling the on-off condition of the path circuit.
As shown in fig. 3 and 4, (1), (3), (5), (7), (9), (11), (13) are metal strips connected to the negative electrode of the power supply, and (2), (4), (6), (8), (10), (12), and (14) are metal strips connected to the positive electrode of the power supply. Illustratively, the via circuit control can be set according to the diameter size of the processed silicon material as follows: (1) forming a path of identification circuit (2), forming two paths of identification circuits (3) and (4), and controlling the first path, the second path and the third path to be path circuits through a controller in the same way; or (1) and (4) form a path I, (3) and (6) form a path II, and (5) and (8) form a path III, and so on, and the paths I, II and III are controlled to be electrified circuits by the controller; (1) the circuit A is formed by the circuit A and the circuit B by the circuit B and the circuit A, B is controlled by the controller to be an electrified circuit.
It should be noted that: when the silicon material screening device provided in the above embodiment performs the silicon material screening service, only the division of the above functional modules is taken as an example, and in practical applications, the above function distribution may be completed by different functional modules according to needs, that is, the internal structure of the device is divided into different functional modules, so as to complete all or part of the above described functions. In addition, the silicon material screening method provided by the embodiment and the silicon material screening device belong to the same concept, and the specific implementation process is described in the method embodiment and is not described herein again.
All the above-mentioned optional technical solutions can be combined arbitrarily to form the optional embodiments of the present invention, and are not described herein again.
In summary, the silicon material screening device and the processing method provided by the embodiment of the invention have the following beneficial effects compared with the prior art:
1. by utilizing the metal conductivity, the specific position of the silicon material containing the metal impurities is determined according to the change of the electrified circuit detected by the circuit detection module through a plurality of metal strip arrangement structures which are arranged in parallel along the transmission direction of the silicon material and have preset intervals, and then the grabbing device carries out grabbing operation on the silicon material containing the metal impurities according to the circuit detection result and the preset positioning program, so that the silicon material containing the metal impurities can be accurately removed, the impurity removal effect of the material is improved, the production efficiency is good, and the recovery rate and the utilization rate of the silicon material are greatly improved;
2. moreover, the scheme is different from the traditional pickling scheme, so that the consumption of pickling solution and water is reduced to a certain extent, and the pickling device has the advantages of simple structure and operation, convenience, rapidness, energy conservation and environmental protection.
It will be understood by those skilled in the art that all or part of the steps for implementing the above embodiments may be implemented by hardware, or may be implemented by a program instructing relevant hardware, where the program may be stored in a computer-readable storage medium, and the above-mentioned storage medium may be a read-only memory, a magnetic disk or an optical disk, etc.
Embodiments of the present application are described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
While preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all changes and modifications that fall within the true scope of the embodiments of the present application.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. A silicon material screening device is characterized by comprising a feeding box, a silicon material screening belt, a transmission vibrator, a circuit controller, a grabbing device and a material receiving box, the discharge end of the feeding box is connected with one end of the silicon material screening belt, the transmission vibrator is arranged below the silicon material screening belt, the gripping device is arranged above the silicon material screening belt, the other end of the silicon material screening belt is connected with the feeding end of the material receiving box, a plurality of metal strips with preset intervals are arranged in parallel along the transmission direction of the silicon material screening belt, the metal strips are connected with the circuit controller, so that a plurality of energized circuits are formed among the metal strips, the circuit controller comprises a circuit detection module, the grabbing device is linked with the circuit detection module, and enabling the grabbing device to carry out grabbing operation according to the circuit detection result and a preset positioning program.
2. The silicon material screening apparatus of claim 1, further comprising a feeder box vibrator mounted below the feeder box.
3. The silicon material screening apparatus according to claim 1, wherein the silicon material screening belt is composed of a non-metallic vibrating belt and the plurality of metal strips.
4. The silicon material screening device according to claim 3, wherein the non-metal vibration belt is provided with a silicon material groove parallel to the metal strip, and the width of the silicon material groove is not less than the maximum grain size of the silicon material to be screened.
5. The silicon material screening device according to claim 1, wherein the predetermined interval takes a value within a maximum particle size range of the silicon material to be screened.
6. The silicon material screening device of claim 1, wherein the gripping device comprises a manipulator and an automatic controller which are connected, the automatic controller is connected with the circuit detection module, and the manipulator is a suction gripper.
7. The silicon material screening device as claimed in claim 1, wherein the upper end of the grabbing device is sequentially communicated with a vertical rail and a transverse rail, and the grabbed silicon material is conveyed to the transverse rail through the vertical rail.
8. The silicon material screening device according to any one of claims 1 to 7, wherein the preset positioning program is set as follows: and one or more of the current data, the voltage data and the resistance data of each electrified circuit among the plurality of metal strips respectively form a mapping relation with the corresponding preset unit coordinate position of the silicon material screening belt, so that the corresponding grabbing position of the grabbing operation is determined according to the mapping relation and one or more of the current data, the voltage data and the resistance data of each electrified circuit.
9. The silicon material screening device according to claim 8, wherein the circuit controller is further connected with a buzzer and/or a warning lamp, and the circuit controller controls the buzzer and/or the warning lamp to be connected while the grabbing position is determined.
10. A silicon material screening method of the silicon material screening apparatus according to any one of claims 1 to 9, characterized by comprising:
feeding through the feeding box, wherein silicon enters the silicon screening belt from the discharge end of the feeding box;
enabling the silicon material containing the metal impurities to enter a silicon material screening belt to cause a power-on circuit to change, detecting the change of the power-on circuit, and acquiring data of a circuit detection result;
determining the grabbing position of the grabbing operation according to the circuit detection result and a preset positioning program;
and the grabbing device carries out grabbing operation according to the grabbing position.
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Effective date of registration: 20220905 Address after: 055550 Jing Long Street, Ningjin County, Xingtai, Hebei Patentee after: JA SOLAR Co.,Ltd. Address before: 055550 high tech Development Zone, Ningjin County, Xingtai City, Hebei Province Patentee before: NINGJIN JINGXING ELECTRONIC MATERIAL Co.,Ltd. |