CN111065245A - Server liquid cooling device - Google Patents
Server liquid cooling device Download PDFInfo
- Publication number
- CN111065245A CN111065245A CN201911385751.9A CN201911385751A CN111065245A CN 111065245 A CN111065245 A CN 111065245A CN 201911385751 A CN201911385751 A CN 201911385751A CN 111065245 A CN111065245 A CN 111065245A
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- liquid
- injection
- area
- plate
- server
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- 239000007788 liquid Substances 0.000 title claims abstract description 104
- 238000001816 cooling Methods 0.000 title claims abstract description 24
- 238000002347 injection Methods 0.000 claims abstract description 70
- 239000007924 injection Substances 0.000 claims abstract description 70
- 239000000872 buffer Substances 0.000 claims abstract description 49
- 238000007654 immersion Methods 0.000 claims abstract description 30
- 239000000110 cooling liquid Substances 0.000 claims abstract description 18
- 238000005192 partition Methods 0.000 claims abstract description 14
- 230000008859 change Effects 0.000 claims description 3
- 239000012809 cooling fluid Substances 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- 238000005516 engineering process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000002826 coolant Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000019771 cognition Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a server liquid cooling device, which comprises an immersion area, a liquid return buffer area and a liquid injection area, wherein the immersion area comprises a server and cooling liquid for immersing the server; the liquid return buffer area is arranged on the side face of the immersed area, is divided from the immersed area through a partition plate, is sealed at the outer side by the inner box body of the device, is provided with a plurality of rows of adjusting holes and nuts, and is matched with the adjusting holes so that the adjusting holes can be completely sealed when the nuts are screwed in the adjusting holes; the liquid injection area is arranged at the bottom of the immersion area and the liquid return buffer area and comprises a liquid inlet and an injection plate, and the cooling liquid enters the immersion area through a plurality of through holes in the injection plate after passing through the liquid inlet. The invention ensures uniform heat dissipation of the server and realizes rapid heat dissipation.
Description
Technical Field
The present invention relates to the field of computers, and more particularly, to a server liquid cooling apparatus.
Background
With the rapid development of mobile data, cloud computing and big data services, the scale of data center construction is larger and larger, and the energy-saving appeal of a data center owner to the data center is gradually highlighted. In recent years, a plurality of new energy-saving technologies for data centers appear, and with the generation of a direct immersion type liquid cooling server adopting an electronic refrigerant technology, the advantages of high availability, high density, ultra-low PUE and the like are generated, so that the technical cognition of energy saving and consumption reduction for the data centers in the industry is compelled. The direct immersion type liquid cooling server is completely immersed in the cooling liquid, and the cooling liquid is adopted to dissipate heat of the server; in the process, how to ensure that the cooling liquid after absorbing heat can be rapidly cooled, especially ensuring that the heat dissipation of the server is uniform, and realizing rapid heat dissipation is very important.
Disclosure of Invention
In view of this, an object of the embodiments of the present invention is to provide a server liquid cooling device to ensure uniform heat dissipation of a server and achieve rapid heat dissipation.
In view of the above objects, an aspect of the embodiments of the present invention provides a server liquid cooling device, including a submerging area, a liquid return buffer area, and a liquid ejecting area, wherein,
the immersion area comprises a server and a cooling liquid for immersing the server;
the liquid return buffer area is arranged on the side face of the immersed area, is divided from the immersed area through a partition plate, is sealed at the outer side by the inner box body of the device, is provided with a plurality of rows of adjusting holes and nuts, and is matched with the adjusting holes so that the adjusting holes can be completely sealed when the nuts are screwed in the adjusting holes;
the liquid injection area is arranged at the bottom of the immersion area and the liquid return buffer area and comprises a liquid inlet and an injection plate, and the cooling liquid enters the immersion area through a plurality of through holes in the injection plate after passing through the liquid inlet.
In some embodiments, the submerged area further comprises a U-tag, a guide rail is arranged below the U-tag, and the server is fixed on the U-tag along the guide rail.
In some embodiments, the cooling fluid is a non-phase change fluorinated fluid or transformer oil.
In some embodiments, the liquid-returning buffer area includes a first liquid-returning buffer area and a second liquid-returning buffer area, the first liquid-returning buffer area and the second liquid-returning buffer area are respectively disposed at two sides of the immersion area, and liquid outlets are disposed at lower portions of the first liquid-returning buffer area and the second liquid-returning buffer area.
In some embodiments, the two adjacent rows of adjusting holes on the partition plate are arranged in a staggered manner.
In some embodiments, the liquid injection zone further comprises injection tubes provided with spaced through holes, the injection tubes being connected to the liquid inlet in the same number as the liquid inlet.
In some embodiments, a set of injection pipes and liquid inlets are respectively arranged below the injection plates at two sides of the liquid injection area, and the liquid inlets are connected with the injection pipes at the same side.
In some embodiments, the liquid injection region further comprises a flow distribution plate, and the cooling liquid flows out of the injection pipe, is distributed by the flow distribution plate, and then enters the immersion region through the injection plate.
In some embodiments, the splitter plate is a plurality of elongated vertical plates spaced apart and arranged in front-to-back staggered end portions between the injection plate and the bottom inner box of the device.
In some embodiments, the height of the flow distribution plate is less than the height of the space between the injection plate and the bottom device inner box, and the flow distribution plate is sequentially fixed on the injection plate or the bottom device inner box in a staggered manner up and down between the injection plate and the bottom device inner box.
The invention has the following beneficial technical effects: according to the liquid cooling device for the server, provided by the embodiment of the invention, the purpose of improving the cooling safety and reliability of the server chip is achieved through a liquid cooling technology, a bottom spraying technology and a liquid return buffering technology, the uniform heat dissipation of the server is ensured, and the rapid heat dissipation is realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other embodiments can be obtained by using the drawings without creative efforts.
FIG. 1 is a schematic diagram of a server liquid cooling arrangement according to the present invention;
FIG. 2 is a schematic illustration of a removed side cabinet of the server liquid chiller of FIG. 1;
FIG. 3 is a schematic illustration of the server liquid cooling apparatus of FIG. 1 with two side tanks removed;
FIG. 4 is a schematic illustration of the server of FIG. 3 with the submerged area removed;
FIG. 5 is an enlarged, fragmentary view of the upper right side of FIG. 4;
FIG. 6 is a schematic view of a buffer division plate according to the present invention;
FIG. 7 is a schematic view of the return buffer divider of FIG. 6 with the lock nuts removed from the first row of adjustment holes;
FIG. 8 is an enlarged, fragmentary view of the bottom of FIG. 4;
fig. 9 is a schematic view of the liquid ejection area with the ejection plate removed.
The reference numbers in the drawings are as follows:
1 cooling device outer case; 2, a submerging area; 3. a 3' return buffer zone; 4, a server; 5. a 5' liquid inlet; 6. a 6' liquid outlet; 7. 7' a separator; 8, cooling the inner box body of the device; 9 a liquid ejection zone; 10 a spray plate; 11 a flow distribution plate; 12. 12' a jet pipe; 13 locking the nut; 14 an adjustment aperture; 15U mark; 16 guide rails.
Detailed Description
Embodiments of the present invention are described below. However, it is to be understood that the disclosed embodiments are merely examples and that other embodiments may take various and alternative forms. The figures are not necessarily to scale; certain features may be exaggerated or minimized to show details of particular components. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art to variously employ the present invention. As one of ordinary skill in the art will appreciate, various features illustrated and described with reference to any one of the figures may be combined with features illustrated in one or more other figures to produce embodiments that are not explicitly illustrated or described. The combination of features shown provides a representative embodiment for a typical application. However, various combinations and modifications of the features consistent with the teachings of the present invention may be desired for certain specific applications or implementations.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following embodiments of the present invention are described in further detail with reference to the accompanying drawings.
In view of the above purpose, an aspect of the embodiments of the present invention provides a server liquid cooling device, including an immersion area, a liquid return buffer area, and a liquid injection area, where the immersion area includes a server 4 and a cooling liquid for immersing the server 4; the liquid return buffer area is arranged on the side face of the immersed area, is divided from the immersed area through a partition plate 7, and is sealed by the inner box body 8 of the device on the outer side, a plurality of rows of adjusting holes 14 and screw caps 13 are arranged on the partition plate 7, and the screw caps 13 are matched with the adjusting holes 14 so that the adjusting holes 14 can be completely sealed when the screw caps 13 are screwed in the adjusting holes 14; the liquid injection area is arranged at the bottom of the immersion area and the liquid return buffer area and comprises a liquid inlet 5 and an injection plate 10, and the cooling liquid enters the immersion area through a plurality of through holes in the injection plate 10 after passing through the liquid inlet 5.
In some embodiments, the liquid-returning buffer zone includes a first liquid-returning buffer zone 3 and a second liquid-returning buffer zone 3 ', the first liquid-returning buffer zone 3 and the second liquid-returning buffer zone 3 ' are respectively disposed at two sides of the immersing zone 2, and liquid outlets are disposed at lower portions of the first liquid-returning buffer zone 3 and the second liquid-returning buffer zone 3 '. As shown in fig. 1, a liquid outlet 6 is disposed at the lower portion of the liquid return buffer 3, a liquid outlet 6 'is disposed at the lower portion of the liquid return buffer 3', and two sets of liquid return buffers are redundant to each other.
In some embodiments, the cooling fluid may be a non-phase change fluorinated fluid or transformer oil.
In some embodiments, as shown in fig. 2, the cooling device according to the present invention includes an outer tank 1 and an inner tank 8, a first liquid-returning buffer 3 is formed between the inner tank 8 and the partition 7, and a second liquid-returning buffer 3 'is formed between the inner tank 8 and the partition 7'. The middle of the partition plate 7 and the partition plate 7' forms an immersion area, and the server 4 is fixed in the immersion area to be immersed by the cooling liquid for cooling. The bottom of the immersion area and the liquid return buffer area form a liquid injection area 9.
In some embodiments, the liquid injection zone 9 further comprises injection tubes provided with spaced through holes, the injection tubes being connected to the liquid inlet and being in the same number as the liquid inlet. In some embodiments, there are a set of injection pipes and liquid inlets below the injection plates 10 on both sides of the liquid injection zone 9, the liquid inlets connecting the injection pipes on the same side. In fig. 3, injection pipes 12 and 12 ' are shown, one on each side of the liquid injection zone 9 and below the injection plate 10, the injection pipes 12 being connected to the liquid inlet 5 as in fig. 1, and the injection pipes 12 ' being connected to the liquid inlet 5 ' as in fig. 1. The cooling liquid enters the injection pipes 12, 12 ' from the liquid inlets 5, 5 ', enters the lower part of the injection plate 10 from a plurality of through holes on the injection pipes 12, 12 ', and then enters the immersion area 2 from the injection plate 10. The two liquid inlet systems are mutually redundant.
In some embodiments, the submerged area 2 further comprises a U-tag 15, a guide rail 16 is arranged below the U-tag 15, and the server 4 is fixed on the U-tag 15 along the guide rail 16, as shown in fig. 4 and 5. The server 4 is fixed on the U-shaped label 15, a guide rail 16 is arranged below the U-shaped label 15, the server 4 is arranged up and down, and the server 4 is a soaking server.
In some embodiments, the two rows of adjusting holes adjacent to each other on the upper and lower sides of the partition 7, 7' are offset from each other. Liquid buffer 3 returns and cuts apart with 2 baffle 7 in submergence district, returns liquid buffer 3 'and cuts apart with 2 baffle 7' in submergence district. As shown in fig. 6 and 7, a plurality of liquid level height adjusting holes 14 and lock nuts 13 are provided on the partition plates 7 and 7' for adjusting the liquid level height in the immersion area, and if the liquid level is lowered, one row of nuts can be removed. According to the project requirement, corresponding immersion height is set, namely the row number of the adjusting holes 14 is set according to the project requirement, corresponding number of the locking nuts 13 is correspondingly set, and the upper row of the adjusting holes 14 and the lower row of the adjusting holes 14 are arranged in a staggered mode, so that the locking nuts 13 can be conveniently disassembled by a wrench. The liquid in the submerged region 2 flows through the regulating holes 14 into the liquid return buffer regions 3, 3'. The partition plates 7 and 7' have the same structure and are symmetrically arranged at two sides of the immersion area 2.
According to the soaking height requirement of different servers, dismantle the lock nut 13 of corresponding height for the coolant liquid flows back liquid buffer 3, 3' through adjusting hole 14. If the liquid level of submergence district 2 need be raised, then only need install one row or several rows of lock nut 13 can, time easy operation easily realizes, and with low costs, the leakproofness is good, is difficult for the weeping.
In some embodiments, the liquid injection region 9 further includes a flow dividing plate 11, and the cooling liquid flows out of the injection pipes 12, 12', is divided by the flow dividing plate 11, and then enters the immersion region 2 through the injection plate 10. The through holes of the injection plate 10 may be arranged according to project requirements, as shown in fig. 8.
In some embodiments, the diverter plate 11 is a plurality of elongated vertical plates spaced apart and offset in front-to-back positions at the ends between the injector plate 10 and the bottom device inner housing. As shown in fig. 9, the number of the diversion plates 11 may be set according to the requirement, and they are arranged in a staggered manner in the longitudinal direction for the cooling liquid to flow through.
In some embodiments, the height of the flow distribution plate 11 is less than the height of the space between the injection plate 10 and the bottom device internal box, and the flow distribution plate 11 is sequentially fixed on the injection plate 10 or the bottom device internal box in a staggered manner up and down between the injection plate 10 and the bottom device internal box. For example, from left to right, a first manifold 11 is fixed to the injection plate 10, a second manifold 11 is fixed to the bottom device inner case, and a third manifold 11 is fixed to the injection plate 10.
The cooling liquid is pressurized by the pump and then enters the liquid inlet 5, 5 'into the injection pipe 12, 12', and after being shunted by the shunting plate 11, enters the immersion area 2 through the through hole on the injection plate 10. The two liquid inlet systems are mutually redundant. The heat that the server gived off is constantly absorbed to the coolant liquid, and liquid after the intensification flows back liquid buffer 3, 3 ' from the top of submergence district 2, flows out the extrinsic cycle by liquid outlet 6, 6 ' of returning liquid buffer 3, 3 ', cools off the server once more after the cooling, has improved heat exchange efficiency greatly, is favorable to the cooling of equipment more.
Where technically feasible, the technical features listed above for the different embodiments may be combined with each other or changed, added, omitted, etc. to form further embodiments within the scope of the invention.
It can be seen from the foregoing embodiments that, the server liquid cooling device provided in the embodiments of the present invention achieves the purpose of improving the safety and reliability of server chip cooling by using a liquid cooling technique, a bottom spraying technique, and a liquid return buffer technique, thereby ensuring uniform heat dissipation of the server and achieving rapid heat dissipation.
It should be understood that, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly supports the exception. It should also be understood that "and/or" as used herein is meant to include any and all possible combinations of one or more of the associated listed items. The numbers of the embodiments disclosed in the embodiments of the present invention are merely for description, and do not represent the merits of the embodiments.
The above-described embodiments are possible examples of implementations and are presented merely for a clear understanding of the principles of the invention. Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, of embodiments of the invention is limited to these examples; within the idea of an embodiment of the invention, also technical features in the above embodiment or in different embodiments may be combined and there are many other variations of the different aspects of an embodiment of the invention as described above, which are not provided in detail for the sake of brevity. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of the embodiments of the present invention are intended to be included within the scope of the embodiments of the present invention.
Claims (10)
1. A server liquid cooling device is characterized by comprising an immersion area, a liquid return buffer area and a liquid injection area, wherein,
the immersion area comprises a server and a cooling liquid for immersing the server;
the liquid return buffer area is arranged on the side face of the immersed area, is divided from the immersed area through a partition plate, is sealed at the outer side by the inner box body of the device, is provided with a plurality of rows of adjusting holes and nuts, and is matched with the adjusting holes so that the adjusting holes can be completely sealed when the nuts are screwed in the adjusting holes;
the liquid injection area is arranged at the bottom of the immersion area and the liquid return buffer area and comprises a liquid inlet and an injection plate, and the cooling liquid enters the immersion area through a plurality of through holes in the injection plate after passing through the liquid inlet.
2. The apparatus of claim 1, wherein the submerged area further comprises a U-tag, a guide rail is disposed below the U-tag, and the server is fixed to the U-tag along the guide rail.
3. The apparatus of claim 1, wherein the cooling fluid is a non-phase change fluorinated fluid or transformer oil.
4. The device according to claim 1, wherein the liquid-returning buffer zone comprises a first liquid-returning buffer zone and a second liquid-returning buffer zone, the first liquid-returning buffer zone and the second liquid-returning buffer zone are respectively arranged at two sides of the immersion zone, and liquid outlets are respectively arranged at the lower parts of the first liquid-returning buffer zone and the second liquid-returning buffer zone.
5. The device of claim 1, wherein the two adjacent rows of adjustment holes on the partition are offset.
6. The apparatus of claim 1, wherein the liquid injection zone further comprises injection tubes provided with spaced through holes, the injection tubes being connected to the liquid inlet in the same number as the liquid inlet.
7. The apparatus of claim 6, wherein a set of injection pipes and liquid inlets are respectively arranged below the injection plates at two sides of the liquid injection region, and the liquid inlets are connected with the injection pipes at the same side.
8. The apparatus of claim 1, wherein the liquid injection zone further comprises a flow distribution plate, and the cooling liquid is distributed by the flow distribution plate after flowing out of the injection pipe and then enters the immersion zone through the injection plate.
9. The apparatus of claim 8 wherein said manifold comprises a plurality of elongated vertical plates spaced apart and offset one behind the other at the ends between said spray plate and said bottom inner housing.
10. The apparatus according to claim 9, wherein the height of the flow dividing plate is smaller than the height of a space between the injection plate and the apparatus internal case at the bottom, and the flow dividing plate is sequentially fixed to the injection plate or the apparatus internal case at the bottom between the injection plate and the apparatus internal case at the bottom in a staggered manner up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911385751.9A CN111065245B (en) | 2019-12-29 | 2019-12-29 | Server liquid cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911385751.9A CN111065245B (en) | 2019-12-29 | 2019-12-29 | Server liquid cooling device |
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| Publication Number | Publication Date |
|---|---|
| CN111065245A true CN111065245A (en) | 2020-04-24 |
| CN111065245B CN111065245B (en) | 2022-02-22 |
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| CN201911385751.9A Active CN111065245B (en) | 2019-12-29 | 2019-12-29 | Server liquid cooling device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113347507A (en) * | 2021-07-01 | 2021-09-03 | 山西兴潮科技有限公司 | Liquid submergence cooling formula switch and exchange unit |
| WO2022012469A1 (en) * | 2020-07-14 | 2022-01-20 | 北京嘉楠捷思信息技术有限公司 | Immersion-type liquid-cooled heat dissipation system |
| CN115023075A (en) * | 2022-06-02 | 2022-09-06 | 超聚变数字技术有限公司 | Computing equipment and cabinet |
| TWI804354B (en) * | 2022-06-20 | 2023-06-01 | 英業達股份有限公司 | Immersion-typed server |
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| Publication number | Publication date |
|---|---|
| CN111065245B (en) | 2022-02-22 |
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