CN221010572U - Data center cooling system and data center - Google Patents
Data center cooling system and data center Download PDFInfo
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- CN221010572U CN221010572U CN202322406793.4U CN202322406793U CN221010572U CN 221010572 U CN221010572 U CN 221010572U CN 202322406793 U CN202322406793 U CN 202322406793U CN 221010572 U CN221010572 U CN 221010572U
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- 238000001816 cooling Methods 0.000 title claims abstract description 128
- 239000000110 cooling liquid Substances 0.000 claims abstract description 41
- 239000007788 liquid Substances 0.000 claims abstract description 38
- 239000007921 spray Substances 0.000 claims description 13
- 239000000945 filler Substances 0.000 claims description 8
- 230000005484 gravity Effects 0.000 claims description 8
- 238000007654 immersion Methods 0.000 claims description 7
- 238000005192 partition Methods 0.000 claims description 7
- 238000012546 transfer Methods 0.000 claims description 4
- 239000004215 Carbon black (E152) Chemical class 0.000 claims description 3
- 239000012809 cooling fluid Substances 0.000 claims description 3
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical class FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 3
- 229930195733 hydrocarbon Chemical class 0.000 claims description 3
- 150000002430 hydrocarbons Chemical class 0.000 claims description 3
- 238000012856 packing Methods 0.000 claims description 3
- 238000003491 array Methods 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 229920001296 polysiloxane Chemical class 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 12
- 238000005057 refrigeration Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 2
- 238000009835 boiling Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses a data center cooling system and a data center, wherein the data center cooling system at least comprises a closed area and a first equipment group, wherein the first equipment group comprises air cooling equipment, equipment to be cooled and immersed liquid cooling equipment; the first equipment set is installed in the enclosed area; the equipment to be cooled is immersed in the immersed liquid cooling equipment to cool and dissipate heat of the equipment to be cooled; the air cooling equipment and the immersed liquid cooling equipment are arranged at intervals so as to exchange heat with cooling liquid of the immersed liquid cooling equipment. According to the application, the air cooling and liquid cooling are integrated to dissipate heat of the equipment to be cooled, so that the heat dissipation efficiency is improved.
Description
Technical Field
The application relates to the field of data centers, in particular to a data center cooling system and a data center.
Background
With the rapid development of related technologies of data centers in recent years, the centralized configuration of servers in a machine room is changed along with the change of servers and storage systems, and the power density and the heat density of the servers are rapidly increased, so that the heat generated by the data centers is rapidly increased, and the requirements of the data centers on refrigeration systems are also higher and higher.
The existing data center can not meet the refrigeration requirement of the high-density data center by adopting a single air-cooled air conditioner or a single liquid-cooled radiator.
Disclosure of utility model
The application aims to provide a data center cooling system and a data center, which are used for improving heat dissipation efficiency.
In order to achieve the above object, according to one aspect of the present application, there is provided a cooling system for a data center, at least including a closed area and a first equipment set, where the first equipment set includes an air cooling device, a device to be cooled, and an immersed liquid cooling device;
the first equipment set is installed in the enclosed area;
The equipment to be cooled is immersed in the immersed liquid cooling equipment to cool and dissipate heat of the equipment to be cooled;
The air cooling equipment and the immersed liquid cooling equipment are arranged at intervals so as to exchange heat with cooling liquid of the immersed liquid cooling equipment.
Optionally, the first equipment group is provided with a second equipment group side by side, and the equipment to be cooled of the first equipment group is arranged at intervals with the equipment to be cooled of the second equipment group; a closed channel is formed between the first device group and the second device group.
Optionally, the air cooling device of the first device group and the device to be cooled of the second device group are arranged oppositely.
Optionally, two ends of the first device group and the second device group are respectively provided with a partition board, so that the closed channel is formed among the first device group, the second device group and two partition boards.
Optionally, the immersion liquid cooling apparatus comprises at least;
The cooling tower is arranged above the equipment to be cooled and is used for condensing the cooling liquid and enabling the condensed cooling liquid to flow back into the immersed liquid cooling equipment under the action of gravity.
Optionally, the number of cooling towers is a plurality.
Optionally, the cooling tower comprises a condenser, a filler, a pre-cooling section and a spray pump;
The condenser is used for condensing the cooling liquid and enabling the condensed cooling liquid to flow into the filler under the action of gravity;
The filler is arranged below the pre-cooling section and used for prolonging the residence time of the cooling liquid and increasing the heat transfer area of the cooling liquid.
The pre-cooling section is arranged below the spray pump and used for cooling the cooling liquid;
the spray pump is used for spraying the pre-cooling section;
Optionally, the cooling fluid comprises one or a combination of more of a fluorocarbon, a hydrocarbon, and an organosilicon compound.
Optionally, a plurality of devices to be cooled of the first device group and the second device group are provided, and a plurality of linear arrays of the devices to be cooled are arranged in the enclosed area.
In order to achieve the above object, another aspect of the present application further provides a data center, which at least includes a plurality of equipment rooms, and each of the equipment rooms is provided with the cooling system of the data center.
Therefore, according to the technical scheme provided by the application, the immersed liquid cooling equipment is immersed in the equipment to be cooled, the liquid cooling is carried out on the equipment to be cooled, the air cooling equipment and the immersed liquid cooling equipment are arranged at intervals so as to exchange heat with cooling liquid, so that hot gas generated by the equipment to be cooled can be cooled partially through the cooling liquid, and the other part of hot gas can be cooled through the air cooling equipment, so that the equipment to be cooled forms a cold environment, and the equipment to be cooled dissipates heat. Therefore, the heat dissipation is carried out on the equipment to be cooled through liquid cooling and air cooling, the integrated air cooling and the liquid cooling are integrated, the heat dissipation efficiency is effectively improved, and the heat dissipation requirement is met.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a data center cooling system in one embodiment provided by the present application;
fig. 2 is a schematic structural view of a cooling system for a data center according to an embodiment of the present application.
In the figure: 1. a closed region; 2. a first device group; 3. a second device group; 21. air cooling equipment; 22. a device to be cooled; 231. a cooling liquid; 4. a partition plate; 5. closing the channel; 2321. a condenser; 2322. a filler; 2323. a pre-cooling section; 2324. a spray pump; 6. a heat exchanger; 7. and a column head cabinet.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the embodiments of the present application will be described in further detail with reference to the accompanying drawings. Terms such as "upper," "lower," "first end," "second end," "one end," "the other end," and the like used herein to refer to a spatially relative position are used for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The term spatially relative position may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Furthermore, the terms "mounted," "disposed," "provided," "connected," "slidingly connected," "secured," and "sleeved" are to be construed broadly. For example, "connected" may be in a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
The centralized configuration of the servers in the machine room, along with the servers and the storage systems, has changed, and their power density and heat density have increased rapidly, resulting in a concomitant surge in heat generated by the data center, which has led to an increasing demand on the refrigeration system by the data center.
The existing data center adopts a mode of an independent air-cooled air conditioner or an independent liquid-cooled radiator to perform refrigeration, but the heat dissipation effect of the existing data center cannot meet the refrigeration requirement of the high-density data center. Therefore, the application provides the data center cooling system and the data center, which integrate air cooling and liquid cooling into a whole and improve the heat dissipation efficiency.
The technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. It should be apparent that the described embodiments of the application are only some, but not all, embodiments of the application. All other embodiments, based on the embodiments of the application, which a person skilled in the art would obtain without making any inventive effort, are within the scope of the application.
As shown in fig. 1 and 2, in one implementation, a data center cooling system may include at least an enclosed area 1 and a first equipment set 2, where the first equipment set 2 includes an air cooling equipment 21, equipment to be cooled 22, and submerged liquid cooling equipment; the first equipment set 2 is installed in the enclosed area 1; the equipment to be cooled 22 is immersed in the immersed liquid cooling equipment to cool and dissipate heat of the equipment to be cooled 22; the air cooling device 21 and the immersion liquid cooling device are arranged at intervals to exchange heat with the cooling liquid 231 of the immersion liquid cooling device. Thus, the immersion liquid cooling apparatus can rapidly absorb heat of the apparatus 22 to be cooled, so as to rapidly dissipate heat of the apparatus 22 to be cooled. The air cooling device 21 can exchange heat with the cooling liquid 231 to quickly absorb heat of the cooling liquid 231, and the air cooling device 21 can also cool the device 22 to be cooled in an air-cooling manner, so that a cold environment in the enclosed area 1 is maintained.
An air cooling device 21 may also be provided outside the enclosed area 1 to rapidly dissipate heat from the air within the enclosed area 1.
Therefore, according to the technical scheme provided by the application, the immersed liquid cooling equipment is immersed in the equipment to be cooled, the liquid cooling is carried out on the equipment to be cooled, the air cooling equipment and the immersed liquid cooling equipment are arranged at intervals so as to exchange heat with cooling liquid, so that hot gas generated by the equipment to be cooled can be cooled partially through the cooling liquid, and the other part of hot gas can be cooled through the air cooling equipment, so that the equipment to be cooled forms a cold environment, and the equipment to be cooled dissipates heat. Therefore, the heat dissipation is carried out on the equipment to be cooled through liquid cooling and air cooling, the integrated air cooling and the liquid cooling are integrated, the heat dissipation efficiency is effectively improved, and the heat dissipation requirement is met.
In a possible embodiment, the first device group 2 is provided with a second device group 3 side by side, and the devices to be cooled 22 of the first device group 2 are arranged at intervals from the devices to be cooled 22 of the second device group 3; a closed channel 5 is formed between the first device group 2 and the second device group 3.
In one possible embodiment, the air cooling device 21 of the first device group 2 and the device to be cooled 22 of the second device group 3 are disposed opposite to each other. In this way, the air cooling device 21 of one device group can face the device 22 to be cooled of the other device group, the air cooling device 21 of one device group can rapidly take away the heat of the device 22 to be cooled of the other device group, and the device 22 to be cooled can be cooled more rapidly.
In a possible embodiment, the two ends of the first equipment set 2 and the second equipment set 3 are respectively provided with a partition board 4, so that the closed channel 5 is formed between the first equipment set 2, the second equipment set 3 and the two partition boards 4. The heat generated in the first equipment set 2 and the second equipment set 3 flows into the closed channel 5, and the air cooling equipment 21 can cool the heat in the closed channel 5.
Of course, in actual use, the bottom surfaces of the first device group 2 and the second device group 3 may be provided with floors, and the top surfaces thereof with cover plates, so as to close the upper and lower ends of the closed channel 5.
In a possible embodiment, both the first equipment set 2 and the second equipment set 3 are provided with a heat exchanger 6 at one end. The other ends of the first equipment set 2 and the second equipment set 3 are respectively provided with a row head cabinet 7, and the row head cabinets 7 are used for supplying power to the corresponding equipment sets. Through distributing heat exchanger 6 and row first cabinet 7 at the both ends of equipment set, so can avoid heat exchanger 6 weeping to a certain extent to row first cabinet 7's influence. The heat exchanger 6 can be in communication with an air cooling device arranged outside the enclosed area 1 via a pipe.
In one possible embodiment, the immersion liquid cooling apparatus comprises at least;
And the cooling tower is arranged above the equipment 22 to be cooled and is used for condensing the cooling liquid 231 and enabling the condensed cooling liquid 231 to flow back into the immersed liquid cooling equipment under the action of gravity.
The cooling liquid 231 in the immersed liquid cooling device absorbs heat of the device 22 to be cooled, is vaporized into a cooling tower, condenses in the cooling tower to release heat, flows back into the immersed liquid cooling device under the action of gravity, and continues to absorb heat of the device 22 to be cooled.
In one possible embodiment, the number of the cooling towers is plural to quickly absorb the heat of the cooling liquid 231 to quickly radiate the heat of the device to be cooled 22.
In one possible embodiment, the cooling tower includes a condenser 2321, a packing 2322, a pre-cooling section 2323, and a spray pump 2324;
the condenser 2321 is configured to condense the cooling liquid 231, and make the condensed cooling liquid 231 flow into the filler 2322 under the action of gravity;
The packing 2322 is disposed below the pre-cooling section 2323, and is configured to extend the residence time of the cooling liquid 231 and increase the heat transfer area of the cooling liquid 231.
The pre-cooling section 2323 is disposed below the spray pump 2324, and is configured to cool the cooling liquid 231;
the spray pump 2324 is configured to spray the precooling segment 2323.
The cooling liquid 231 after heat exchange enters the cooling tower, the condenser 2321 condenses the cooling liquid 231, the condensed cooling liquid 231 flows into the precooling section 2323 under the action of gravity, at the moment, the spray pump 2324 is in an on state, and the cooling liquid 231 cooled by the spray pump 2324, the precooling section 2323 and the filler 2322 exchanges heat with the outdoor air, so that the time of the cooling liquid 231 is prolonged, the heat transfer area of the cooling liquid 231 is increased, the heat dissipation capacity is increased, and the temperature of the cooling liquid 231 is reduced.
In one possible embodiment, the cooling fluid 231 includes cooling fluorocarbon, hydrocarbon, and silicone compounds. Such a cooling medium has a low boiling point and is easily vaporized.
In a possible embodiment, a plurality of devices to be cooled 22 of the first device group 2 and the second device group 3 are provided, and a plurality of the devices to be cooled 22 are arranged in a linear array in the enclosed area 1.
The equipment 22 to be cooled may be a conventional server rack or the like that generates a large amount of heat during normal operation. The first equipment set 2 and the second equipment set 3 may each include a plurality of equipment to be cooled 22, so that the air cooling equipment 21 of two adjacent equipment sets can mutually cool the equipment to be cooled 22.
In practical use, the data center cooling system described above may be applied to cooling service racks in a data center. Correspondingly, the air cooling device 21 may be an inter-row air conditioner, and the device to be cooled 22 may be a server cabinet. The immersion liquid cooling apparatus is used to dissipate heat from the CPU and GPU in the server cabinet in the apparatus to be cooled 22. The heat generated by the server cabinet in the equipment to be cooled 22 heats the air to form hot air, and the hot air can enter the closed channel 5, so that the temperature of the whole air is reduced through the air cooling equipment 21, and the rest heating components of the server cabinet are further reduced.
It should be noted that, although the data center cooling system of the present application is applied to the data center to dissipate heat of the server cabinet in the above practical application, the present application is not limited thereto. The data center cooling system can be applied to other equipment except the data center, and further, the other equipment can be subjected to efficient heat dissipation and cooling.
Based on the same inventive concept, the application also provides a data center which at least comprises a plurality of equipment rooms, wherein each equipment room is provided with the cooling system of the data center.
It should be noted that, for the specific structure of the data center cooling system applied to the data center, reference may be made to the foregoing, and details thereof will not be repeated herein.
The foregoing description of the preferred embodiments of the application is not intended to limit the application to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the application are intended to be included within the scope of the application.
Claims (10)
1. A data center cooling system, comprising at least a closed area and a first equipment set, wherein the first equipment set comprises air cooling equipment, equipment to be cooled and immersed liquid cooling equipment;
the first equipment set is installed in the enclosed area;
The equipment to be cooled is immersed in the immersed liquid cooling equipment to cool and dissipate heat of the equipment to be cooled;
The air cooling equipment and the immersed liquid cooling equipment are arranged at intervals so as to exchange heat with cooling liquid of the immersed liquid cooling equipment.
2. The data center cooling system of claim 1, wherein the first equipment group is provided with a second equipment group side by side, and the equipment to be cooled of the first equipment group is spaced apart from the equipment to be cooled of the second equipment group; a closed channel is formed between the first device group and the second device group.
3. The data center cooling system of claim 2, wherein the air cooling equipment of the first equipment group and the equipment to be cooled of the second equipment group are disposed opposite each other.
4. The data center cooling system of claim 2, wherein the first equipment set and the second equipment set are each provided with a partition at both ends thereof such that the closed channel is formed between the first equipment set, the second equipment set, and both the partitions.
5. The data center cooling system of any one of claims 1 to 4, wherein the immersion liquid cooling apparatus comprises at least;
The cooling tower is arranged above the equipment to be cooled and is used for condensing the cooling liquid and enabling the condensed cooling liquid to flow back into the immersed liquid cooling equipment under the action of gravity.
6. The data center cooling system of claim 5, wherein the number of cooling towers is a plurality.
7. The data center cooling system of claim 5, wherein the cooling tower comprises a condenser, a packing, a pre-cooling section, and a spray pump;
The condenser is used for condensing the cooling liquid and enabling the condensed cooling liquid to flow into the filler under the action of gravity;
the filler is arranged below the pre-cooling section and is used for prolonging the residence time of the cooling liquid and increasing the heat transfer area of the cooling liquid;
the pre-cooling section is arranged below the spray pump and used for cooling the cooling liquid;
And the spray pump is used for spraying the pre-cooling section.
8. The data center cooling system of claim 1, wherein the cooling fluid comprises one or a combination of cooling fluorocarbon, hydrocarbon, and silicone compounds.
9. The data center cooling system of claim 1, wherein a plurality of the equipment to be cooled of the first equipment set and the second equipment set is provided, and a plurality of the linear arrays of equipment to be cooled is provided within the enclosed area.
10. A data center comprising at least a plurality of equipment rooms, each of said equipment rooms having installed therein a data center cooling system according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322406793.4U CN221010572U (en) | 2023-09-05 | 2023-09-05 | Data center cooling system and data center |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322406793.4U CN221010572U (en) | 2023-09-05 | 2023-09-05 | Data center cooling system and data center |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221010572U true CN221010572U (en) | 2024-05-24 |
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ID=91090301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322406793.4U Active CN221010572U (en) | 2023-09-05 | 2023-09-05 | Data center cooling system and data center |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221010572U (en) |
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2023
- 2023-09-05 CN CN202322406793.4U patent/CN221010572U/en active Active
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