CN111356337B - Server bottom spraying liquid cooling device - Google Patents

Server bottom spraying liquid cooling device Download PDF

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Publication number
CN111356337B
CN111356337B CN202010102648.5A CN202010102648A CN111356337B CN 111356337 B CN111356337 B CN 111356337B CN 202010102648 A CN202010102648 A CN 202010102648A CN 111356337 B CN111356337 B CN 111356337B
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China
Prior art keywords
liquid
box body
pipe
server
injection pipe
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Active
Application number
CN202010102648.5A
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Chinese (zh)
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CN111356337A (en
Inventor
单翠云
周相峰
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Suzhou Inspur Intelligent Technology Co Ltd
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Suzhou Inspur Intelligent Technology Co Ltd
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Priority to CN202010102648.5A priority Critical patent/CN111356337B/en
Publication of CN111356337A publication Critical patent/CN111356337A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • H05K7/20781Liquid cooling without phase change within cabinets for removing heat from server blades
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20263Heat dissipaters releasing heat from coolant
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20281Thermal management, e.g. liquid flow control

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The application provides a cooling device for spraying liquid at the bottom of a server, which relates to the technical field of server cooling and comprises a box body with a hollow interior, wherein a box body cover is arranged at the top of the box body, and a U mark for fixing the server and an immersion area for containing cooling liquid are arranged in the box body; a liquid inlet is arranged on one side of the top of the box body, and a liquid return port is arranged on the other side of the top of the box body; the inside feed liquor pipe, return liquid pipe and the injection pipe of being equipped with of box, the upper end of injection pipe passes through feed liquor pipe and inlet intercommunication, and the low side and the submergence district intercommunication of injection pipe, submergence district through return liquid pipe and return liquid mouth intercommunication, the inside injection pipe height adjusting part that is equipped with of box. By adopting the liquid cooling technology, the safety and the reliability of the cooling of the server chip are improved.

Description

Server bottom spraying liquid cooling device
Technical Field
The application relates to the technical field of server cooling, in particular to a cooling device for liquid sprayed at the bottom of a server.
Background
With the rapid development of mobile data, cloud computing and big data services, the scale of data center construction is larger and larger, and the energy-saving appeal of a data center owner to the data center is gradually highlighted. In recent years, a plurality of new energy-saving technologies for data centers appear, and with the generation of a direct immersion type liquid cooling server adopting an electronic refrigerant technology, the advantages of high availability, high density, ultra-low PUE and the like are generated, so that the technical cognition of energy saving and consumption reduction for the data centers in the industry is compelled. The direct immersion type liquid cooling server is completely immersed in the cooling liquid, and the cooling liquid is adopted to dissipate heat of the server. In the prior art, the cooling liquid is not uniformly sprayed, so that the heat dissipation of the server is not uniform, the purpose of rapid cooling cannot be achieved, and meanwhile, the same cooling liquid box body can only cool the server with one height and cannot meet the cooling requirements of the servers with multiple different heights.
Disclosure of Invention
To the problem that exists among the prior art, this application provides a server bottom jet liquid cooling device to reach the heat exchange efficiency who improves the coolant liquid greatly, realize the beneficial effect of the rapid cooling of server.
The application provides a cooling device for spraying liquid at the bottom of a server, which comprises a box body with a hollow interior, wherein a box body cover is arranged at the top of the box body, and a U mark for fixing the server and an immersion area for containing cooling liquid are arranged in the box body; a liquid inlet is arranged on one side of the top of the box body, and a liquid return port is arranged on the other side of the top of the box body; the inside feed liquor pipe, return liquid pipe and the injection pipe of being equipped with of box, the upper end of injection pipe passes through feed liquor pipe and inlet intercommunication, and the low side and the submergence district intercommunication of injection pipe, submergence district through return liquid pipe and return liquid mouth intercommunication, the inside injection pipe height adjusting part that is equipped with of box. By adopting the liquid cooling technology, the safety and the reliability of the cooling of the server chip are improved.
Further, the direction of height of feed liquor pipe edge box extends, the injection pipe is on a parallel with bottom half place plane, is equipped with a plurality of interval distribution's jet orifice on the injection pipe, and the interval between the adjacent jet orifice is 1U. And the bottom spraying technology is adopted, so that uniform heat dissipation of the server can be realized.
Further, the injection pipe includes a plurality of liquid separating pipes, and a plurality of upper ends of liquid separating pipes all communicate with the feed liquor pipe, and a plurality of lower extremes of liquid separating pipes are equipped with the branch liquid mouth respectively, and the interval between the adjacent branch liquid mouths is adjustable. The cooling liquid flows into the immersion box through the liquid separation port, the opening and closing of the liquid separation holes can be adjusted according to the number and the placing positions of the servers, the cooling liquid flows towards the servers directly, and the heat exchange efficiency is improved.
Further, injection pipe height-adjusting part includes injection pipe installation journal angle and fixed subassembly, and fixed subassembly is including fixing the mounting that the multirow is parallel to each other on the box lateral wall, the direction of height of every row of mounting equal perpendicular to box, and the direction of height interval distribution of multirow mounting along the box, feed liquor pipe pass through injection pipe installation journal angle and fix on the mounting. The position of the injection pipe can be adjusted up and down according to different heights of the immersed servers, so that the immersion system is suitable for multiple servers.
Furthermore, the liquid return pipe is connected with each other in sequence through a plurality of liquid return pipe monomers, and the length of the liquid return pipe is adjustable. The height of the immersion liquid can be adjusted by adjusting the length of the liquid return pipe.
Furthermore, the liquid inlet pipe adopts a hose.
Furthermore, the injection pipe is provided with a cover plate for opening and closing the injection hole. The cooling liquid flows into the immersion box through the jet holes, and the opening and closing of the jet holes can be adjusted according to the number and the placing positions of the servers, so that the cooling liquid directly flows towards the servers, and the heat exchange efficiency is improved.
Furthermore, the box body is formed by welding stainless steel.
Further, the cooling liquid is 3m of non-phase change fluorinated liquid or transformer oil.
Furthermore, the box body cover is rotatably connected with the box body, so that the box body can be opened and closed conveniently.
The beneficial effect of this application lies in:
according to the cooling device for the liquid sprayed at the bottom of the server, the liquid cooling technology is adopted, so that the safety and the reliability of cooling of a server chip are improved; the bottom spraying technology is adopted, so that uniform heat dissipation of the server can be realized; the height adjusting part of the injection pipe is arranged in the box body, so that the height adjustment of the injection pipe can be realized, and the position of the injection pipe can be adjusted up and down according to different heights of immersed servers, so that the immersion system is suitable for multiple types of servers; the cooling liquid flows into the immersion box through the liquid separation ports, and the opening and closing of the liquid separation holes can be adjusted according to the number and the placement positions of the servers, so that the cooling liquid flows directly towards the servers, and the heat exchange efficiency is improved; the liquid return pipe is designed into a multi-section structure, and the height of the immersion liquid can be adjusted by adjusting the length of the liquid return pipe; in the actual working process, cooling liquid enters the injection pipe from the liquid inlet, and enters the immersion area after being separated by the liquid separating pipe. The heat that the server gived off is constantly absorbed to the coolant liquid, and the extrinsic cycle is flowed out from the top in submergence district to the liquid after the intensification, cools off the server once more after the cooling, has improved heat exchange efficiency greatly, is favorable to the cooling of equipment more.
In addition, the design principle of the application is reliable, the structure is simple, and the application prospect is very wide.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic view of an external structure of a case in one embodiment of the present application.
Fig. 2 is a first schematic view of the internal structure of the box in an embodiment of the present application.
Fig. 3 is a schematic diagram of an internal structure of a box in an embodiment of the present application.
Fig. 4 is a schematic view of a connection structure of a liquid inlet pipe in one embodiment of the present application.
In the figure, 1, a box body, 2, a box body cover, 3, a U mark, 4, an immersion area, 5, a liquid inlet, 6, a liquid return port, 7, a liquid inlet pipe, 8, a liquid return pipe, 9, an injection pipe, 10, an injection hole, 11, an injection pipe installation supporting angle, 12 and a server.
Detailed Description
In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The following explains key terms appearing in the present application.
The application provides a server bottom spray liquid cooling device,
fig. 1 is a schematic view of the external structure of a case 1 according to an embodiment of the present invention. As shown in fig. 1, the box body 1 is comprised, in this embodiment, the box body 1 is a rectangular parallelepiped structure, and the box body 1 is formed by welding stainless steel.
The top of box 1 is equipped with box 1 lid, and box 1 lid is connected through hinge and box 1 rotation, and box 1 lid is used for sealed box 1.
The interior of the box body 1 is hollow and is provided with an immersion area 4, and the immersion area 4 is used for containing cooling liquid. The cooling liquid is used for immersing the cooling server, in the embodiment, the cooling liquid is a 3m non-phase-change fluorinated liquid, and in other embodiments, the cooling liquid may also be other cooling liquids such as transformer oil.
The inside of box 1 is equipped with the U mark 3 that is used for fixed server, and server 12 fixes on U mark 3, and server 12 arranges from top to bottom, server 12 is the soaking server.
As shown in fig. 2, a liquid inlet 5 is arranged on the right side of the top of the box body 1, and a liquid return port 6 is arranged on the left side of the top of the box body 1; liquid inlet 5 and liquid outlet all set up in box 1 top, prevent the weeping.
The inside feed liquor pipe 7, liquid return pipe 8 and injection pipe 9 that is equipped with of box 1, the upper end of injection pipe 9 is through feed liquor pipe 7 and inlet 5 intercommunication, and the low side and the submergence of injection pipe 9 are distinguished 4 and are communicated, and submergence district 4 is through returning liquid pipe 8 and returning liquid mouth 6 intercommunication.
As shown in fig. 2, the liquid inlet pipe 7 extends along the height direction of the box body 1, and the liquid inlet pipe 7 is a hose. In this embodiment, the injection pipe 9 is parallel to the plane of the bottom of the box 1, the injection pipe 9 is provided with a plurality of injection holes 10 distributed at intervals, and the distance between adjacent injection holes 10 is 1U.
The injection pipe 9 is provided with a cover plate for opening and closing the injection holes 10, and the opening and closing of the injection holes 10 can be adjusted according to the number and the installation positions of the immersion servers.
In other embodiments, the injection pipe 9 includes a plurality of liquid distribution pipes, upper ends of the plurality of liquid distribution pipes are all communicated with the liquid inlet pipe 7, lower ends of the plurality of liquid distribution pipes are respectively provided with liquid distribution ports, and a distance between adjacent liquid distribution ports can be adjusted according to a position of the server.
The liquid separating pipe is fixed on the fixed supporting angle of the injection pipe 9 through screws, the fixed supporting angle of the injection pipe 9 is fixed on the box body 1 through rivets on the side wall of the box body 1, and a plurality of rows of rivets are arranged on the side wall and used for adjusting the height of the liquid separating fixed supporting angle.
The cooling liquid flows into the immersion box through the liquid separation port, the opening and closing of the liquid separation holes can be adjusted according to the number and the placing positions of the servers, the cooling liquid flows towards the servers directly, and the heat exchange efficiency is improved.
The inside of the box body 1 is provided with a height adjusting component of the injection pipe 9. 9 altitude mixture control parts of injection pipe include injection pipe installation journal angle 11 and fixed subassembly, and fixed subassembly is including fixing the mounting that the multirow is parallel to each other on 1 lateral wall of box, and every row of mounting is all perpendicular to 1 of box's direction of height, and the multirow mounting is along 1 of box's direction of height interval distribution, and feed liquor pipe 7 passes through injection pipe installation journal angle 11 to be fixed on the mounting.
Specifically, the mounting adopts the rivet, and the fixed angle of injection pipe 9 passes through fix with rivet on 1 lateral wall of box, sets up the rivet of multirow height difference on the lateral wall, can adjust the upper and lower position of injection pipe 9 according to the high difference of submergence server for jet orifice 10 and server mainboard are at same horizontal plane, increase heat exchange efficiency.
The liquid return pipes 8 are connected in sequence by a plurality of liquid return pipe 8 monomers, and the length of the liquid return pipes 8 is adjustable. The liquid return pipe 8 is designed in a multi-section mode, and the height of the immersion liquid can be adjusted by adjusting the length of the liquid return pipe 8. The liquid return pipe 8 is a stainless steel pipe, and the multiple sections of pipes are connected through threads.
The implementation manner of the embodiment is as follows:
cooling liquid gets into by inlet 5 on box 1 upper portion, and rethread injection pipe 9 evenly flows into submergence district 4, and the cooling liquid flows in from the lower right corner of submergence district 4, and the upper left corner flows out, fully absorbs the heat that the server gived off with the server contact, and the liquid after the intensification flows out the extrinsic cycle from the top of submergence district 4, cools off the server once more after the cooling, has improved heat exchange efficiency greatly, is favorable to the cooling of equipment more. The scheme achieves the purpose of improving the safety and the reliability of the cooling of the server chip through a liquid cooling technology, a bottom spraying technology and an adjustable liquid level technology.
Although the present application has been described in detail with reference to the accompanying drawings in conjunction with the preferred embodiments, the present application is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present application by those skilled in the art without departing from the spirit and scope of the present application, and these modifications or substitutions are intended to be covered by the present application/any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (8)

1. A server bottom spray liquid cooling device, characterized by: the server cooling system comprises a box body (1) with a hollow interior, wherein a box body cover (2) is arranged at the top of the box body (1), a U-shaped mark (3) for fixing a server and an immersion area (4) for containing cooling liquid are arranged in the box body (1); a liquid inlet (5) is arranged on one side of the top of the box body (1), and a liquid return port (6) is arranged on the other side; a liquid inlet pipe (7), a liquid return pipe (8) and an injection pipe (9) are arranged inside the box body (1), the upper end of the injection pipe (9) is communicated with the liquid inlet (5) through the liquid inlet pipe (7), the lower end of the injection pipe (9) is communicated with the immersion area (4), the immersion area (4) is communicated with the liquid return port (6) through the liquid return pipe (8), and an injection pipe height adjusting part is arranged inside the box body (1);
the spraying pipe (9) comprises a plurality of liquid separating pipes, the upper ends of the liquid separating pipes are communicated with the liquid inlet pipe (7), liquid separating ports are formed in the lower ends of the liquid separating pipes respectively, the distance between every two adjacent liquid separating ports is adjustable, and the liquid separating ports can be opened and closed; the liquid return pipe (8) is sequentially connected with a plurality of liquid return pipe monomers, and the length of the liquid return pipe is adjustable.
2. The server bottom spray liquid cooling arrangement of claim 1, wherein: the liquid inlet pipe (7) extends along the height direction of the box body (1), the injection pipe (9) is parallel to the plane of the bottom of the box body, a plurality of injection holes (10) distributed at intervals are arranged on the injection pipe (9), and the distance between every two adjacent injection holes (10) is 1U.
3. The server bottom spray liquid cooling arrangement of claim 2, wherein: the injection pipe height adjusting part comprises an injection pipe mounting support angle (11) and a fixing assembly, the fixing assembly comprises fixing pieces which are fixed on the side wall of the box body and are parallel to each other, each row of the fixing pieces are perpendicular to the height direction of the box body, the fixing pieces are distributed at intervals in the height direction of the box body, and the liquid inlet pipe (7) is fixed on the fixing pieces through the injection pipe mounting support angle (11).
4. The server bottom spray liquid cooling arrangement of claim 1, wherein: the liquid inlet pipe (7) adopts a hose.
5. The server bottom spray liquid cooling arrangement of claim 1, wherein: and a cover plate for opening and closing the injection hole is arranged on the injection pipe (9).
6. The server bottom spray liquid cooling arrangement of claim 1, wherein: the box body (1) is formed by welding stainless steel.
7. The server bottom spray liquid cooling arrangement of claim 1, wherein: the cooling liquid is 3m of non-phase change fluorinated liquid or transformer oil.
8. The server bottom spray liquid cooling arrangement of claim 1, wherein: the box body cover is rotationally connected with the box body (1).
CN202010102648.5A 2020-02-19 2020-02-19 Server bottom spraying liquid cooling device Active CN111356337B (en)

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CN111356337B true CN111356337B (en) 2022-05-27

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US11412636B2 (en) * 2021-01-12 2022-08-09 Cooler Master Co., Ltd. Single-phase immersion cooling system and method of the same
NL2029728B1 (en) * 2021-11-12 2023-06-08 Theodorus De Klein Christianus System and methods for the individual immersion cooling of hardware components

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CN207491417U (en) * 2017-12-05 2018-06-12 深圳市畅翔机电设备有限公司 A kind of network server cabinet that can quickly assemble
CN208762537U (en) * 2018-08-31 2019-04-19 张家港凯胜控制设备工程有限公司 A kind of heat treatment process fast cooling device

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CN204679944U (en) * 2015-06-03 2015-09-30 浪潮电子信息产业股份有限公司 A kind of Novel liquid cooling Rack server
CN207491417U (en) * 2017-12-05 2018-06-12 深圳市畅翔机电设备有限公司 A kind of network server cabinet that can quickly assemble
CN208762537U (en) * 2018-08-31 2019-04-19 张家港凯胜控制设备工程有限公司 A kind of heat treatment process fast cooling device

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