CN111060340A - Heat dissipation performance test system and method for liquid cooling device - Google Patents
Heat dissipation performance test system and method for liquid cooling device Download PDFInfo
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Abstract
The embodiment of the application discloses a heat dispersion performance test system and method of a liquid cooling device, wherein a first temperature sensor unit is used for measuring the temperature of cooling liquid of the liquid cooling device; the flow meter unit measures the flow rate of the cooling liquid of the liquid cooling device; the heat load unit and the liquid cooling device exchange heat; the signal conditioning control unit receives the temperature signal, the flow signal and the heat exchange signal of the cooling liquid and conditions and controls the temperature signal, the flow signal and the heat exchange signal of the cooling liquid; the power supply unit provides voltage for the signal conditioning control unit and provides voltage power for the flow meter unit and the thermal load unit through the signal conditioning control unit; the signal acquisition and processing unit acquires and processes the temperature signal, the flow signal and the heat load unit signal of the cooling liquid conditioned by the signal conditioning control unit to obtain the heat dissipation parameters of the liquid cooling device. The method can realize accurate measurement of the heat dissipation parameters of the liquid cooling device and accurately evaluate the heat dissipation performance of the liquid cooling device.
Description
Technical Field
The present invention relates to a liquid cooling heat dissipation test technology, and more particularly, to a heat dissipation test system and method for a liquid cooling device of an electronic device.
Background
With the rapid development of electronic technology, the power consumption and heat flux density of chips are increasingly large, the normal and reliable operation of the high-power chips cannot be guaranteed by the traditional air-cooled heat dissipation mode, and compared with the air-cooled heat dissipation mode, the liquid-cooled heat dissipation mode has the advantages of high heat dissipation efficiency, high integration level, low noise and the like, so that the liquid-cooled heat dissipation mode becomes an ideal way for solving the heat dissipation of the high-power chip and is widely applied to high-power and high-heat-flux-density electronic equipment.
At present, the method and means for measuring and evaluating the heat dissipation performance of the liquid cooling device of the electronic equipment mainly depend on testing the junction temperature of a main chip and judging whether the heat dissipation effect of the liquid cooling device meets the use requirement, however, the test method has the problems of few sampling points, incomplete test data, low automation degree and the like, and the accurate heat dissipation characteristic and parameter of the liquid cooling device cannot be obtained due to the fact that the condition parameters such as chip power consumption and liquid cooling parameters are not clear.
Disclosure of Invention
In view of this, embodiments of the present application provide a heat dissipation testing system and method for a liquid cooling device, so as to accurately measure heat dissipation parameters of the liquid cooling device and accurately evaluate heat dissipation performance of the liquid cooling device.
According to an aspect of the present disclosure, there is provided a heat radiation performance test system of a liquid cooling apparatus, the apparatus including: the system comprises a first temperature sensor unit, a flowmeter unit, a thermal load unit, a signal conditioning control unit, a signal acquisition and processing unit and a power supply unit;
a first temperature sensor unit for measuring a temperature of a cooling liquid of the liquid cooling device;
a flow meter unit for measuring a flow rate of the cooling liquid of the liquid cooling device;
the heat load unit is used for carrying out heat exchange with the liquid cooling device;
the signal conditioning control unit is used for receiving the temperature signal, the flow signal and the heat exchange signal of the cooling liquid and conditioning and controlling the temperature signal, the flow signal and the heat exchange signal of the cooling liquid;
the power supply unit is used for supplying voltage to the signal conditioning control unit and supplying voltage to the flow meter unit and the thermal load unit through the signal conditioning control unit for power supply;
and the signal acquisition and processing unit is used for acquiring and processing the temperature signal, the flow signal and the heat load unit signal of the cooling liquid conditioned by the signal conditioning control unit to obtain the heat dissipation parameters of the liquid cooling device.
In one possible implementation, the first temperature sensor unit includes: a liquid outlet temperature sensor and a liquid return temperature sensor;
the liquid outlet temperature sensor is arranged at a liquid outlet of the liquid cooling device and used for measuring the liquid outlet temperature of cooling liquid of the liquid cooling device;
the liquid return temperature sensor is arranged at a liquid return port of the liquid cooling device and used for measuring the liquid return temperature of the cooling liquid of the liquid cooling device.
In one possible implementation, the heat load unit includes a heat load module; the thermal load module comprises a resistance unit and a third temperature sensor unit;
the number of the heat load modules is N, and N is a positive integer.
In one possible implementation, the third temperature sensor unit includes M temperature sensors, and the resistance unit includes M resistances;
m temperature sensor and M resistance one-to-one setting respectively for measure the temperature of M resistance, wherein, M is positive integer.
In one possible implementation manner, the signal conditioning control unit includes: and the N-way switch array unit is used for controlling the power supply unit to supply power to the heat load unit and the flow meter unit.
In a possible implementation manner, the signal processing device may further perform parameter setting on the signal conditioning control unit, the flow meter unit, and the thermal load unit.
In a possible implementation manner, the signal processing device communicates with the signal conditioning control unit, and performs parameter setting on the signal conditioning control unit.
In one possible implementation, the power supply unit converts an alternating voltage of 220V into a direct voltage.
In one possible implementation, the apparatus further includes: a second temperature sensor unit for measuring an ambient temperature of the cooling device.
According to another aspect of the disclosure, a method for testing heat dissipation performance of a liquid cooling device is provided, in which the heat dissipation performance testing system of the liquid cooling device is applied, the method includes:
s1: parameter configuration is carried out on the signal conditioning control unit and the heat load unit through the signal processing device;
s2: the signal conditioning control unit is used for supplying power to the heat load unit and the flowmeter according to the parameter configuration;
s3: the signal acquisition and processing unit acquires signals of the heat load unit, the flow meter and the temperature sensor unit which are conditioned by the signal conditioning control unit, and calculates to obtain heat dissipation parameters of the liquid cooling device, wherein the heat dissipation parameters comprise the total power consumption of the heat load unit and the heat dissipation capacity of the liquid cooling device.
Therefore, the embodiment of the application has the following beneficial effects:
in the heat dissipation performance test system of the liquid cooling device in the embodiment of the application, the temperature of the cooling liquid of the liquid cooling device is measured through the first temperature sensor unit; the flow meter unit measures the flow rate of the cooling liquid of the liquid cooling device; the heat load unit and the liquid cooling device exchange heat; the signal conditioning control unit receives the temperature signal, the flow signal and the heat exchange signal of the cooling liquid and conditions and controls the temperature signal, the flow signal and the heat exchange signal of the cooling liquid; the power supply unit provides voltage for the signal conditioning control unit and provides voltage power for the flow meter unit and the thermal load unit through the signal conditioning control unit; the signal acquisition and processing unit acquires and processes the temperature signal, the flow signal and the heat load unit signal of the cooling liquid conditioned by the signal conditioning control unit to obtain the heat dissipation parameters of the liquid cooling device. The method can realize accurate measurement of the heat dissipation parameters of the liquid cooling device and accurately evaluate the heat dissipation performance of the liquid cooling device.
Drawings
Fig. 1 is a schematic structural diagram illustrating a heat dissipation performance testing system of a liquid cooling device according to an embodiment of the present application;
fig. 2 is a block diagram illustrating a heat dissipation performance test system of a liquid cooling apparatus according to an embodiment of the present application;
fig. 3 is a schematic diagram illustrating a heat dissipation performance testing system of a liquid cooling device according to an embodiment of the application;
fig. 4 is a structural view illustrating a dispenser of a heat dissipation performance test system of a liquid cooling apparatus according to an embodiment of the present application;
fig. 5 is a block diagram illustrating a thermal load module of a heat dissipation performance test system of a liquid cooling apparatus according to an embodiment of the present application;
fig. 6 is a flowchart illustrating a method for testing heat dissipation performance of a liquid cooling device according to an embodiment of the application.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the drawings are described in detail below.
It should be noted that the liquid cooling device of the present invention is mainly applied to electronic equipment, and these are only one application example of the present invention, and do not limit the application of the embodiments of the present application.
In order to facilitate understanding of the operating principle of the heat dissipation performance test system of the liquid cooling device, the structure of the liquid cooling device is introduced first, fig. 2 shows a structural diagram of the heat dissipation performance test system of the liquid cooling device according to an embodiment of the present application, and fig. 3 shows a schematic diagram of the heat dissipation performance test system of the liquid cooling device according to an embodiment of the present application.
As shown in fig. 2 and fig. 3, the liquid cooling device includes a liquid cooling source, a dispenser, a plurality of cold plates, and a plurality of liquid cooling pipelines for connecting the liquid cooling source, the dispenser, and the cold plates. The liquid cold source is a power and heat dissipation part of the liquid cooling device and comprises a total liquid outlet pipeline and a total liquid return pipeline, and liquid outlet temperature and flow of cooling liquid are guaranteed.
Fig. 4 is a structural view illustrating a dispenser of a heat dissipation performance test system of a liquid cooling apparatus according to an embodiment of the present application. As shown in fig. 4, the liquid separator is divided into an outlet chamber and a return chamber. The liquid outlet cavity comprises a liquid outlet main pipeline and N liquid outlet branch pipelines, the liquid return cavity comprises a liquid return main pipeline and N liquid outlet branch pipelines, and N is a positive integer.
The liquid outlet main pipeline can be connected with a main liquid outlet pipeline of the liquid cooling source and receives liquid cooling liquid flowing out of the liquid cooling source; the liquid return main pipeline can be connected with the main liquid return pipeline of the liquid cooling source and can transmit the liquid cooling liquid after heat exchange to the liquid cooling source. The N liquid outlet branch pipelines and the N liquid return branch pipelines are respectively connected with a cold plate of the liquid cooling device and used for transmitting liquid cooling liquid between the liquid distributor and the cold plate. The cold plate is respectively fixedly arranged with each heat load unit, is tightly attached to the thermal resistance on the heat load unit and exchanges heat with the heat load unit.
Fig. 1 is a schematic structural diagram illustrating a heat dissipation performance testing system of a liquid cooling device according to an embodiment of the present application. As shown in fig. 1: the first temperature sensor unit, the second temperature sensor unit, the flowmeter unit, the heat load unit, the power supply unit and the signal acquisition and processing unit are respectively connected with the signal conditioning control unit.
As shown in fig. 1 and 3, the heat dissipation performance testing system of the liquid cooling apparatus includes:
first temperature sensor unitAnd the temperature measuring device is used for measuring the temperature of the cooling liquid of the liquid cooling device. Wherein, the first temperature sensor unit can comprise a liquid outlet temperature sensor (such as the temperature sensor 1 in fig. 3) and a liquid return temperature sensor (such as the temperature sensor 2 in fig. 3). The liquid outlet temperature sensor can be arranged at the liquid outlet of the liquid cooling device and is used for measuring the liquid outlet temperature T of the cooling liquid of the liquid cooling device1(ii) a The liquid return temperature sensor is arranged at a liquid return port of the liquid cooling device and is used for measuring the liquid return temperature T of the cooling liquid of the liquid cooling device2. As shown in fig. 3, the temperature sensor 1 is disposed at a liquid outlet of the main liquid outlet pipeline of the liquid cooling source, and measures a liquid outlet temperature T of the cooling liquid of the liquid cooling source1The temperature sensor 2 is arranged at a liquid return port of a total liquid return pipeline of the liquid cooling source and is used for measuring the liquid return temperature T of the cooling liquid of the liquid cooling source2。
A second temperature sensor unit (e.g., temperature sensor a in FIG. 3) capable of measuring the ambient temperature T of the cooling devicea。
And the flow meter unit is used for measuring the flow of the cooling liquid of the liquid cooling device. As shown in fig. 3, the flow meter unit includes flow meters 1, 2, and 3 …, where N is a positive integer. The N flow meters are connected in series in the N liquid outlet branch pipes of the liquid separator, and can measure the flow rate of the cooling liquid of each liquid outlet branch pipe of the liquid separator, and transmit the measured flow rate of the cooling liquid of each liquid outlet branch pipe to the signal conditioning control unit for conditioning, for example, the signal conditioning control unit can amplify, convert and the like the flow rate signal of each liquid outlet branch pipe.
And the heat load unit is used for carrying out heat exchange with the liquid cooling device. As shown in fig. 1, the heat load unit includes a heat load module, which in turn includes a resistance unit and a third temperature sensor unit. The heat load unit may include one heat load module or a plurality of heat load modules, and the number of the specific heat load modules may be flexibly set according to an actual heat source, which is not limited herein.
As shown in fig. 3, the heat load unit includes a heat load module 1, a heat load module 2, and a heat load module 3 …, which are N heat load modules. And heat load module 1 is connected with liquid cooling branch 1 through cold drawing 1, and heat load module 2 is connected with liquid cooling branch 2 through cold drawing 2, and heat load module 3 is connected … heat load module N through cold drawing N and liquid cooling branch 3 and is connected with liquid cooling branch N through cold drawing N with liquid cooling branch 3.
The thermal load module 1 includes a plurality of resistors 11, 12 …, 1M, and a plurality of temperature sensors 11, 12 …, 1M, where M is a positive integer. The thermal load module 2 includes a plurality of resistors, such as a resistor 21, a resistor 22 …, a resistor 2M, and a plurality of temperature sensors, such as a temperature sensor 21, a temperature sensor 22 …, and a temperature sensor 2M, and the … thermal load module N includes a plurality of resistors, such as a resistor N1, a resistor N2 …, and a resistor NM, and a plurality of temperature sensors, such as a temperature sensor N1, a temperature sensor N2 …, and a temperature sensor NM. Wherein the resistor may be a thermistor.
Fig. 5 is a block diagram illustrating a thermal load module of a heat dissipation performance test system of a liquid cooling apparatus according to an embodiment of the present application. As shown in fig. 5, a plurality of resistors are mounted on the thermal load fixture, and a temperature sensor is attached to each resistor. Each resistor and each temperature sensor are arranged in one-to-one correspondence, so that each temperature sensor can measure the temperature of each resistor. And a cold plate is fixedly arranged above the plurality of resistors.
As shown in fig. 3 and 5, a cold plate is fixedly mounted above the resistor of each heat load unit, and the cold plate is closely attached to the resistor and performs heat exchange with the resistor. For example, the cooling liquid in the liquid cooling device flows out from the water outlet of the main liquid outlet pipeline of the liquid cooling source through the main liquid outlet pipeline of the liquid separator, and then flows into the liquid outlet cavity of the liquid separator to be divided into N liquid outlet branch pipelines, the cooling liquid enters each cold plate through the N liquid outlet branch pipelines and the N flow meters, the cooling liquid flows into the liquid return cavity of the liquid separator through the N liquid return branch pipelines after being fully heat exchanged with the heat load unit through the cold plates, the cooling liquid paths of the N liquid return branch pipelines flow out through the main liquid outlet pipeline after being converged in the liquid return cavity of the liquid separator, the liquid cooling source flows into the liquid cooling source through the main liquid return pipeline, and the temperature T of the return liquid is measured by the temperature sensor 22。
And the power supply unit is connected with the signal conditioning control unit and can supply power to the signal conditioning control unit. The signal conditioning control unit is connected with the flowmeter unit and the thermal load unit, and the power supply unit can supply power to the flowmeter unit and the thermal load unit through the signal conditioning control unit. For example, the power supply unit may convert 220V ac mains power into dc voltage, and may provide dc voltage for the signal conditioning control unit, the flow meter unit, the thermal load unit, and the like.
And a signal conditioning control unit (such as a signal conditioning and switch matrix unit in fig. 2) for receiving the temperature signal, the flow signal and the heat exchange signal of the cooling liquid and performing conditioning control on the temperature signal, the flow signal and the heat exchange signal of the cooling liquid. As shown in fig. 2, the signal conditioning and switching matrix unit is connected to the flow meter and the thermal load module through a wired cable, and can receive and condition temperature signals of the liquid outlet temperature sensor and the liquid return temperature sensor of the cooling liquid, flow signals of the cooling liquid measured by the flow meter, and heat exchange signals of the thermal load module and the liquid cooling device, wherein the conditioning of the signal conditioning and switching matrix unit on the received temperature signals, flow signals, and heat exchange signals may be amplification and amplitude modulation of the signals, and conversion of analog signals such as temperature, flow, and heat exchange into corresponding electrical signals.
The signal conditioning and switch matrix unit can comprise a switch matrix unit, the switch matrix unit is respectively connected with the N flowmeters and the N heat load units, the N flowmeters and the N heat load modules can be subjected to power supply control through the switch matrix unit, and then a plurality of resistors distributed and arranged on any one heat load module can be subjected to power supply control, so that the output direct current of the signal conditioning control unit to the power supply unit is uniformly managed.
The signal conditioning control unit can also realize the control of the resistance value of the resistor on any heat load unit through the switch matrix unit, so that the power consumption and the distribution of each heat load unit can be flexibly adjusted according to actual requirements.
The signal acquisition and processing unit is in communication connection with the signal conditioning control unit and is used for setting parameters of the signal conditioning control unit. And the signal acquisition and processing unit is used for acquiring and processing the temperature signal, the flow signal and the heat load unit signal of the cooling liquid conditioned by the signal conditioning control unit to obtain the heat dissipation parameters of the liquid cooling device, wherein the heat dissipation parameters of the liquid cooling device comprise the total power consumption of the heat load unit and the heat dissipation capacity of the liquid cooling device.
As shown in fig. 2, the digital multimeter and the upper computer may communicate with the signal conditioning and switch matrix unit through a wired cable or wirelessly (e.g., wife, bluetooth, LAN, etc.), and the upper computer may set a resistance value of a resistor of any thermal load unit and set parameters of a switch array unit of the signal conditioning and switch matrix unit, thereby implementing power supply control and energy consumption control of the signal conditioning and switch matrix unit on the flow meter unit and the thermal load unit.
As shown in fig. 2, the signal acquisition and processing unit includes a digital multimeter and an upper computer (e.g., a PC terminal). The digital multimeter can regularly acquire the temperature electric signal, the flow electric signal and the heat exchange electric signal conditioned by the signal conditioning control unit, store the acquired electric signal in a storage unit (such as FLASH, RAM and the like) of the upper computer, and analyze and process the acquired electric signal by the upper computer to obtain the heat dissipation parameters of the liquid cooling device.
For example, the second temperature sensor unit of the liquid cooling heat dissipation performance test system of the liquid cooling device can measure the ambient temperature TaThe first temperature sensor module can measure the liquid outlet temperature T of outlet water of the total liquid outlet pipeline of the liquid cold source1And the return temperature T of the return water of the main return pipeline of the liquid cooling source2The flow meter unit can measure the flow Q of N liquid outlet branch pipes of the liquid separatorMThe third temperature sensor unit can measure the temperature T of each resistor of the heat load module11、T12…TNMAnd waiting for the heat radiation parameters of the liquid cooling device.
According to the heat source in the simulated actual environment, the voltage U of the heat load unit can be set through the upper computer11、U12…UNMAnd a resistance R11、R12…RNMAnd the like. According to heat loadVoltage U of the cell11、U12…UNMAnd resistance value R11、R12…RNMThe following thermal characteristic parameters can be further determined:
total power consumption of thermal load unit:
wherein, UMVoltage being resistance, RMIs the resistance of the resistor.
The flow Q of N liquid outlet branch pipes of the liquid separator is measured according to the flow meter unitMAnd the specific heat capacity C of the cooling liquid and the density rho of the cooling liquid, the heat dissipation capacity of the liquid cooling device can be calculated as follows:
the sectional areas of the liquid cooling branch pipes and the flow channels of the liquid separator are known, and when the compression of the cooling liquid is negligible, the flow velocity of the cooling liquid of the liquid outlet branch pipe can be calculated: v. ofM＝QM/SMWherein Q isMThe flow rate of the coolant of the Mth liquid cooling branch pipe, SMThe cross section of the pipeline or the flow passage of the Mth liquid cooling branch pipe.
The heat dissipation performance parameters of the liquid cooling device, such as the temperature of the cooling liquid, the ambient temperature, the temperature of the heat source and the like, can be measured through the heat dissipation performance test system of the liquid cooling device, and the heat dissipation performance parameters of the liquid cooling device, such as the total power consumption of the heat source, the heat dissipation capacity of the liquid cooling device, the flowing speed of the cooling liquid and the like, can be obtained through calculation according to the known and measured parameters.
In the heat dissipation performance test system of the liquid cooling device in the embodiment of the application, the temperature of the cooling liquid of the liquid cooling device is measured through the first temperature sensor unit; the flow meter unit measures the flow rate of the cooling liquid of the liquid cooling device; the heat load unit and the liquid cooling device exchange heat; the signal conditioning control unit receives the temperature signal, the flow signal and the heat exchange signal of the cooling liquid and conditions and controls the temperature signal, the flow signal and the heat exchange signal of the cooling liquid; the power supply unit provides voltage for the signal conditioning control unit and provides voltage power for the flow meter unit and the thermal load unit through the signal conditioning control unit; the signal acquisition and processing unit acquires and processes the temperature signal, the flow signal and the heat load unit signal of the cooling liquid conditioned by the signal conditioning control unit to obtain the heat dissipation parameters of the liquid cooling device. The method can realize accurate measurement of the heat dissipation parameters of the liquid cooling device and accurately evaluate the heat dissipation performance of the liquid cooling device.
Based on the heat dissipation performance test system of the liquid cooling device provided by the above embodiments, a heat dissipation performance test method of the liquid cooling device with the heat dissipation performance test system is provided. As shown in fig. 6:
and S1, configuring parameters of the signal conditioning control unit and the heat load unit through the signal processing device.
When the test is started, as shown in fig. 2, the heat dissipation performance system may be configured with parameters, including parameters of the switch array unit of the signal conditioning control unit and resistance values of the resistors of the thermal load unit, by using an upper computer or a PC terminal.
S2: and the signal conditioning control unit is used for supplying power to the heat load unit and the flowmeter according to the parameter configuration.
As shown in fig. 2, the parameters of the switch array unit of the control unit are conditioned according to the resistance values of the resistors of the thermal load unit set at the upper computer or the PC terminal and the signal. The signal conditioning and switch matrix unit can supply power to the heat load unit and the flowmeter according to the parameters of the switch array unit.
S3: the signal acquisition and processing unit acquires signals of the heat load unit, the flow meter and the temperature sensor unit which are conditioned by the signal conditioning control unit, and the heat dissipation parameters of the liquid cooling device are obtained through calculation.
As shown in fig. 2, the signal conditioning and switching matrix unit may amplify, condition, and convert analog signals of the first temperature sensor and the third temperature sensor, the flow meter unit, the thermal load unit, and the like into corresponding electrical signals, then, the digital multimeter periodically collects the electrical signals conditioned by the signal conditioning control unit, and transmits the collected electrical signals to an upper computer or a PC for analysis and processing in a wired or wireless communication manner, so as to calculate heat dissipation parameters such as total power consumption, heat dissipation capacity, and the like of the liquid cooling device.
The heat dissipation performance test system and method of the liquid cooling device of the electronic equipment solve the problem that the heat dissipation performance test means and method of the liquid cooling device of the electronic equipment are deficient. The temperature sensor, the flowmeter, the digital multimeter and the upper computer/PC involved in the test system and the test method are mature products in the market, the system is low in cost, high in automation degree, convenient to operate and high in universality, and can be widely applied to heat dispersion test of the liquid cooling device of the electronic equipment.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A heat dispersion test system of a liquid cooling device, the device comprising: the system comprises a first temperature sensor unit, a flowmeter unit, a thermal load unit, a signal conditioning control unit, a signal acquisition and processing unit and a power supply unit;
a first temperature sensor unit for measuring a temperature of a cooling liquid of the liquid cooling device;
a flow meter unit for measuring a flow rate of the cooling liquid of the liquid cooling device;
the heat load unit is used for carrying out heat exchange with the liquid cooling device;
the signal conditioning control unit is used for receiving the temperature signal, the flow signal and the heat exchange signal of the cooling liquid and conditioning and controlling the temperature signal, the flow signal and the heat exchange signal of the cooling liquid;
the power supply unit is used for supplying voltage to the signal conditioning control unit and supplying voltage to the flow meter unit and the thermal load unit through the signal conditioning control unit for power supply;
and the signal acquisition and processing unit is used for acquiring and processing the temperature signal, the flow signal and the heat load unit signal of the cooling liquid conditioned by the signal conditioning control unit to obtain the heat dissipation parameters of the liquid cooling device.
2. The heat dissipation performance test system according to claim 1, wherein the first temperature sensor unit includes: a liquid outlet temperature sensor and a liquid return temperature sensor;
the liquid outlet temperature sensor is arranged at a liquid outlet of the liquid cooling device and used for measuring the liquid outlet temperature of cooling liquid of the liquid cooling device;
the liquid return temperature sensor is arranged at a liquid return port of the liquid cooling device and used for measuring the liquid return temperature of the cooling liquid of the liquid cooling device.
3. The heat dissipation performance test system according to claim 1, wherein the heat load unit includes a heat load module:
the thermal load module comprises a resistance unit and a third temperature sensor unit;
the number of the heat load modules is N, and N is a positive integer.
4. The heat dissipation performance test system according to claim 3, wherein the third temperature sensor unit includes M temperature sensors, and the resistance unit includes M resistances;
m temperature sensor and M resistance one-to-one setting respectively for measure the temperature of M resistance, wherein, M is positive integer.
5. The heat dissipation performance test system of claim 1, wherein the signal conditioning control unit comprises: and the N-way switch array unit is used for controlling the power supply unit to supply power to the heat load unit and the flow meter unit.
6. The heat dissipation performance test system according to claim 1, wherein the signal processing device is further configured to perform parameter setting on a signal conditioning control unit, a flow meter unit, and a thermal load unit.
7. The heat dissipation performance test system of claim 6, wherein the signal processing device communicates with the signal conditioning control unit and sets parameters for the signal conditioning control unit.
8. The heat dissipation performance test system according to claim 1, wherein the power supply unit converts an alternating-current voltage of 220V into a direct-current voltage.
9. The heat dissipation performance testing system of claim 1, further comprising: a second temperature sensor unit for measuring an ambient temperature of the cooling device.
10. A method for testing heat dissipation performance of a liquid cooling apparatus, which applies the system for testing heat dissipation performance of a liquid cooling apparatus according to any one of claims 1 to 9, wherein:
s1: parameter configuration is carried out on the signal conditioning control unit and the heat load unit through the signal processing device;
s2: the signal conditioning control unit is used for supplying power to the heat load unit and the flowmeter according to the parameter configuration;
s3: the signal acquisition and processing unit acquires signals of the heat load unit, the flow meter and the temperature sensor unit which are conditioned by the signal conditioning control unit, and calculates to obtain heat dissipation parameters of the liquid cooling device, wherein the heat dissipation parameters comprise the total power consumption of the heat load unit and the heat dissipation capacity of the liquid cooling device.
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| US11567017B2 (en) | 2021-05-20 | 2023-01-31 | Kuwait Institute For Scientific Research | Apparatus for measuring performance of suspension for cooling computer processing unit |
| CN117433821A (en) * | 2023-12-19 | 2024-01-23 | 北京蓝威技术有限公司 | Method for testing heat dissipation of serial liquid cooling radiator under forced convection |
| CN118464491A (en) * | 2024-07-10 | 2024-08-09 | 南通图芃设备有限公司 | Cooling performance test method and system for cooling device of annular plastic mold |
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