CN111058039A - Ceramic particle planting process based on spark discharge - Google Patents
Ceramic particle planting process based on spark discharge Download PDFInfo
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- CN111058039A CN111058039A CN202010029518.3A CN202010029518A CN111058039A CN 111058039 A CN111058039 A CN 111058039A CN 202010029518 A CN202010029518 A CN 202010029518A CN 111058039 A CN111058039 A CN 111058039A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
- C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
Abstract
A ceramic particle planting process based on spark discharge is characterized in that a conductive film is prepared on the surface of a ceramic particle to be planted; placing the coated ceramic particles on the surface of a metal matrix according to requirements; on an electric spark deposition device, connecting an electrode to an anode, connecting a metal matrix to a cathode, and adjusting relevant technological parameters after electrifying to contact the electrode with the top of the particles; pulse discharge between the electrode and the particle conducting film generates heat to melt the electrode to generate molten drops, and the molten drops drop on the surface of the ceramic particles and wrap the ceramic particles; pulse discharge is carried out between the ceramic particle conductive film and the metal matrix to melt the matrix to form pits and wrap the particles; and fusing the electrode molten drops and the molten drops formed by melting the substrate mutually to form a metallurgically bonded wrapping layer, thereby finishing the ceramic particle planting process. The invention utilizes the ultra-fast and high-energy-density micro-welding metallurgical characteristics of spark pulse discharge to obtain the abrasive coating for metallurgically bonding the ceramic particles and the matrix, and has little thermal influence on the matrix.
Description
Technical Field
The invention relates to a ceramic particle planting process based on spark discharge, and belongs to the technical field of abrasive tool preparation.
Background
Abrasive tools play an important role in the industrial field. Currently, abrasive tools are mainly classified into three major categories according to the manufacturing process, namely, electroplated abrasive tools, brazed abrasive tools, sintered abrasive tools, and the like. The electroplating abrasive tool takes nickel or nickel alloy as a coating metal bonding agent, and has the advantages of simple electroplating process, convenient preparation and use, less equipment investment, no need of trimming, high precision and the like, but because only a mechanical embedding effect exists between the abrasive and the coating metal, the coating metal has low holding strength on the abrasive, the tool is easy to lose effectiveness as the abrasive falls off or the coating metal flakes off in the heavy-load high-efficiency grinding process, if the holding strength on the abrasive is improved by adopting a method of increasing the thickness of the coating metal, the exposed height of the abrasive and the chip containing space are reduced, the tool is easy to block, the heat dissipation effect is poor, and the surface of a workpiece is easy to burn. The sintered abrasive tool adopts cobalt, iron, bronze and nickel alloy as main matrix metal bonding agent materials, but as the abrasive is only mechanically embedded in the matrix metal, the matrix bonding agent has small holding strength to the diamond abrasive, and the tool has poor cutting capability, the surface of the tool is easy to block, so that the surface of a workpiece is burnt, and the dressing and sharpening are difficult. The brazing abrasive tool realizes firm combination by chemical and metallurgical reactions among the active brazing filler metal, the abrasive and the substrate by using a high-temperature brazing method, and ensures the abrasive to be firmly held. The brazing abrasive tool forms chemical metallurgical bonding with the abrasive by using active elements (such as Cr, Ti, Mo and W) in the brazing filler metal, fundamentally improves the bonding strength between the abrasive and a metal bonding agent, can firmly hold the abrasive in high-efficiency grinding of heavy load only by controlling the thickness of the metal bonding agent layer to be 20-30% of the height of the abrasive, greatly improves the utilization rate of the abrasive and the service life of the tool, and increases the sharpness of the abrasive and the chip containing space, so that the grinding wheel is not easy to block, and the grinding force, the grinding specific energy and the grinding temperature are reduced. However, high-temperature brazing also causes great thermal damage to abrasives (such as diamond, cubic boron nitride and the like which are commonly used), and the loss of mechanical properties (strength and wear resistance) of the abrasives is great, so that the brazed abrasive tool cannot ideally exert the processing performance advantage thereof, and therefore, how to avoid or reduce the thermal damage to the abrasives caused by the high-temperature brazing process is one of the important research points in the future.
In summary, the existing abrasive tools basically have the defects of weak bonding force, thermal damage to the abrasives in the preparation process and the like, and a new preparation process needs to be developed to avoid the problems, so that the use effect and the service life of the abrasive tool are improved.
Disclosure of Invention
The invention aims to provide a spark discharge-based ceramic particle planting process aiming at the problems in the preparation process of the existing abrasive tool and aiming at improving the use effect and prolonging the service life of the abrasive tool.
The technical scheme of the invention is that the ceramic particle planting process based on spark discharge is provided by utilizing the characteristics of extremely high energy density and extremely high cooling speed of spark discharge. The process is used for preparing a conductive film on the surface of ceramic particles to be planted; placing the coated ceramic particles on the surface of a metal matrix according to requirements; on an electric spark deposition device, connecting an electrode to an anode, connecting a metal matrix to a cathode, and adjusting relevant technological parameters after electrifying to contact the electrode with the top of the particles; pulse discharge between the electrode and the particle conducting film generates heat to melt the electrode to generate molten drops, and the molten drops drop on the surface of the ceramic particles and wrap the ceramic particles; pulse discharge is carried out between the ceramic particle conductive film and the metal matrix to melt the matrix to form pits and wrap the particles; and fusing the electrode molten drops and the molten drops formed by melting the substrate mutually to form a metallurgically bonded wrapping layer, and fixing the ceramic particles on the surface of the substrate to finish the ceramic particle planting process.
The electrode material used for the electric spark deposition is a metal material with good conductivity, and MCrAlY, stainless steel, high-temperature alloy, copper alloy, aluminum alloy or titanium alloy can be selected according to the using conditions; the electrode is cylindrical, and has a diameter of 3-10 mm and a length of 10-100 mm.
The electrode is prepared by a machining method, including wire cutting; the electrode material is taken from a cast/forged compact metal block or a block directly sintered or sintered by a powder metallurgy method.
The conductive film is prepared on the surface of the ceramic particles to be planted by adopting a preparation method comprising coating processes such as electrodeposition, PVD, magnetron sputtering or chemical plating.
The ceramic particles comprise a carbide, boride, oxide, nitride, oxide, or diamond ceramic material; the shape of the particles is irregular, and the particle size of the particles is 10 meshes to 150 meshes.
The conductive film material is a metal material with good conductivity, and a nickel-based alloy, an aluminum alloy, an iron-based alloy, a titanium alloy or a copper alloy material is selected; the conductive film covers the surface of the ceramic particles, and the thickness of the conductive film is 10-500 mu m.
The coated ceramic particles are uniformly spread on the surface of the metal matrix according to the requirement, or are placed on the surface of the metal matrix according to a certain pattern; in order to ensure the fixed position of the particles, pits are processed in the area to be planted, the shape is determined according to the requirement, and the depth is 0-500 mu m.
The relevant process parameters include: the discharge voltage is 0-200V, the capacitance is 0-1000 muF, the discharge frequency is 0-1000 Hz, the electrode vibration frequency is 0-1000 Hz, and the flow of the protective gas is 0-30L/min.
The electric spark deposition equipment adopts pulse capacitance discharge.
The method has the advantages that the method utilizes the ultra-fast (microsecond level) and high-energy density micro-welding metallurgical characteristics of spark pulse discharge to obtain the grinding material coating for metallurgically bonding the ceramic particles and the matrix, and simultaneously has little heat influence on the matrix, thereby reducing the generation of tissue damage and thermal deformation on the matrix. The method has great potential in the field of high-precision coating preparation (such as preparation of wear-resistant coatings of blade tips of single crystal superalloy blades). In the implementation process of the invention, the electrode and the base material are relatively independent, and the high-temperature resistant material can be selected according to the requirement, so that the defect that the use temperature range of the abrasive coating is limited due to the lower temperature of the brazing filler metal in the brazing process can be overcome, and the abrasive coating with wear resistance and oxidation resistance under the high-temperature condition can be obtained. The ceramic particle planting process has extremely high speed, can avoid the aggregation behavior of floating or sinking of particles caused by density difference in the brazing process, and has the advantages of simple and convenient operation, small equipment investment and easily realized personalized customization of the distribution form of the particles.
Drawings
FIG. 1 is a schematic diagram of a spark discharge based ceramic particle implantation process;
wherein 1 is an arc; 2 is an electric spark; 3 is a molten electrode material; 4 is the molten workpiece material; 5 is decomposed ceramic particles; 6 is a mixture of electrode and workpiece material;
FIG. 2 is a morphology chart of spark-discharge implanted TaC particles; wherein FIG. 2(a) is a cross-sectional profile and FIG. 2(b) is a surface profile;
FIG. 3 shows Al implantation by spark discharge2O3A topography of the particle; wherein FIG. 3(a) is a cross-sectional profile and FIG. 3(b) is a surface profile
FIG. 4 is a flow chart of the ceramic particle planting process based on spark discharge according to the present invention.
Detailed Description
An embodiment of the present invention is shown in fig. 4.
The present embodiment is a ceramic particle planting process based on spark discharge, including the following steps:
(1) the oxide layer on the surface of the metal matrix to be processed is removed by mechanical polishing, and the surface is cleaned by absolute ethyl alcohol or acetone to remove oil stains and impurities on the surface.
(2) Preparing an electric spark discharge electrode, cutting the electrode from a cast/forged block material and a powder metallurgy block material by adopting a linear cutting or other machining means, wherein the electrode is cylindrical, has the diameter of 3-10 mm and the length of 10-100 mm, and is made of a metal material with good conductivity, including but not limited to MCrAlY, stainless steel, high-temperature alloy, copper alloy, aluminum alloy, titanium alloy and the like; the ceramic particles are irregular and have a particle size of 10-150 meshes, and include but are not limited to carbides, borides, oxides, nitrides, oxides or diamond and other ceramic materials.
(3) Preparing a conductive film on the surface of ceramic particles to be planted, wherein for non-conductive ceramic, the conductive film is required to be prepared on the surface of ceramic, the conductive film is made of a metal material with good conductivity, including but not limited to nickel-based alloy, aluminum alloy, iron-based alloy, titanium alloy, copper alloy and other metal materials, the conductive film covers the surface of the ceramic particles completely, the thickness of the conductive film is 10-500 mu m, and the preparation method of the conductive film includes but not limited to PVD, chemical plating, electroplating, direct coating and other processes; for the conductive ceramics, the preparation process of the conductive film can be omitted and the conductive ceramics can be directly planted.
(4) The method is characterized in that the surface area of a metal matrix to be planted is directly and uniformly paved on the surface of the metal matrix or a pit is processed according to the requirement, the shape of the pit is determined according to the requirement, the depth of the pit is 0-500 mu m, and the effect of fixing ceramic particles is achieved.
(5) And on the electric spark deposition equipment, connecting the electrode to the anode, and connecting the metal matrix to the cathode. Ceramic particles with the prepared conductive film (or conductive ceramic particles without the conductive film) are put into the pits. Adopting an electric spark deposition device with pulse capacitance discharge to connect an electrode to a positive electrode and a metal matrix to a negative electrode, as shown in figure 1 (a);
(6) and pulse discharge is carried out between the electrode and the ceramic particle conducting film, so that the ceramic particle planting is completed. After electrification, relevant process parameters are adjusted to enable the electrode to be in contact with the top of the particle, electric arcs 1 and electric sparks 2 are formed through pulse discharge between the electrode and a particle conducting film, heat is generated, and molten electrode materials 3 generate molten drops, as shown in a figure 1 (b); dropping on the surface of the ceramic particles and wrapping the ceramic particles, and on the other hand, pulse discharge between the conductive film of the ceramic particles and the metal matrix melts the matrix to form pits and wrap the particles, as shown in FIG. 1 (c); the electrode molten drops and molten drops formed by workpiece materials 4 molten in the matrix are fused with each other to form a metallurgical bonding coating, and decomposed ceramic particles 5 are fixed on the surface of the matrix by a mixture 6 of the electrode and the workpiece materials to complete the spark discharge planting process of the ceramic particles.
The technological parameter range required to be adjusted is as follows: the discharge voltage is 0-200V, the capacitance is 0-1000 muF, the discharge frequency is 0-1000 Hz, the electrode vibration frequency is 0-1000 Hz (or the rotation speed is 0-3000 r/min), and the flow rate of the protective gas is 0-30L/min.
Example 1:
the metal substrate of the embodiment is made of high-temperature alloy Inconel625, the surface to be planted is polished by 600# and 1500# abrasive paper, then is ultrasonically cleaned by absolute alcohol, and then is dried by an electric heating blower for later use.
Spark discharge deposition electrodes of 4mm diameter and 60mm length were cut by wire cutting from powder metallurgy sintered Ni-based alloy (NiCoCrAlYTa) blocks.
TaC ceramic particles (conductive ceramic without preparing a conductive film) are selected as planting particles, the particle size is-100 meshes to +150 meshes, and the planting particles are irregular. Uniformly spreading TaC ceramic particles on the surface of a high-temperature alloy substrate, connecting an electrode to a positive electrode and a metal substrate to a negative electrode by adopting electric spark deposition equipment, and adjusting process parameters: the method comprises the following steps of discharging at a voltage of 100-120V, a capacitance of 350-420 muF, a discharging frequency of 300Hz, an electrode rotating speed of 1000r/min and a protective gas (99.95% pure argon) flow rate of 18-23L/min, directly contacting the electrode with the top end of TaC particles to finish a spark discharge planting process of the ceramic particles, wherein the shapes of the TaC particles planted by spark discharge are shown in figure 2, wherein figure 2(a) is a cross-section shape graph, and figure 2(b) is a surface shape graph.
Example 2:
the metal substrate of the embodiment is made of high-temperature alloy DZ125L, the surface to be planted is polished by 600# and 1500# sandpaper, then is ultrasonically cleaned by absolute alcohol, and then is dried by an electric heating blower for later use.
A spark discharge deposition electrode of 5mm diameter and 80mm length was cut out of a Ni-based alloy GH4169 block by wire cutting.
Selecting Al2O3The ceramic is used as planting particles, the particle size is-100 meshes to +150 meshes, and the ceramic is irregular. Due to Al2O3The ceramic is a poor electric conductor, a conductive film is required to be prepared on the surface of the ceramic before the particles are planted, the conductive film is made of pure Ni, a chemical plating process is adopted, and the thickness of the conductive film is 22 mu m. Mixing Al2O3Ceramic particles are uniformly spread on the surface of the high-temperature alloy substrate, an electric spark deposition device is adopted,connecting an electrode into a positive electrode, connecting a metal matrix into a negative electrode, and adjusting technological parameters: a discharge voltage of 90-100V, a capacitance of 420-490 muF, a discharge frequency of 300Hz, an electrode rotation speed of 800r/min, a flow rate of a protective gas (99.95% pure argon) of 15-18L/min, and a step of mixing the electrode with Al2O3The top ends of the particles are in direct contact to complete the spark discharge planting process of the ceramic particles, and Al is planted by the spark discharge2O3The morphology of the particles is shown in fig. 3, wherein fig. 3(a) is a cross-sectional morphology and fig. 3(b) is a surface morphology.
Claims (9)
1. A ceramic particle planting process based on spark discharge is characterized in that a conductive film is prepared on the surface of a ceramic particle to be planted; placing the coated ceramic particles on the surface of a metal matrix according to requirements; on an electric spark deposition device, connecting an electrode to an anode, connecting a metal matrix to a cathode, and adjusting relevant technological parameters after electrifying to contact the electrode with the top of the particles; pulse discharge between the electrode and the particle conducting film generates heat to melt the electrode to generate molten drops, and the molten drops drop on the surface of the ceramic particles and wrap the ceramic particles; pulse discharge is carried out between the ceramic particle conductive film and the metal matrix to melt the matrix to form pits and wrap the particles; and fusing the electrode molten drops and the molten drops formed by melting the substrate mutually to form a metallurgically bonded wrapping layer, and fixing the ceramic particles on the surface of the substrate to finish the ceramic particle planting process.
2. The spark discharge-based ceramic particle implantation process as claimed in claim 1, wherein the electrode material for spark deposition is a metal material with good electrical conductivity, and MCrAlY, stainless steel, high temperature alloy, copper alloy, aluminum alloy or titanium alloy can be selected according to the using conditions; the electrode is cylindrical, and has a diameter of 3-10 mm and a length of 10-100 mm.
3. The spark discharge based ceramic particle planting process of claim 2, wherein the electrode is prepared by machining methods including wire cutting; the electrode material is taken from a cast/forged compact metal block or a block directly sintered or sintered by a powder metallurgy method.
4. The spark discharge-based ceramic particle planting process as claimed in claim 1, wherein the conductive film is prepared on the surface of the ceramic particles to be planted by a preparation method including electrodeposition, PVD, magnetron sputtering or chemical plating.
5. The spark discharge based ceramic particle planting process of claim 1, wherein the ceramic particles comprise carbide, boride, oxide, nitride, oxide or diamond ceramic materials; the shape of the particles is irregular, and the particle size of the particles is 10 meshes to 150 meshes.
6. The spark discharge-based ceramic particle planting process as claimed in claim 4, wherein the conductive film material is a metal material with good conductivity, and is selected from nickel-based alloy, aluminum alloy, iron-based alloy, titanium alloy or copper alloy material; the conductive film covers the surface of the ceramic particles, and the thickness of the conductive film is 10-500 mu m.
7. The spark discharge-based ceramic particle planting process as claimed in claim 1, wherein the coated ceramic particles are uniformly spread on the surface of the metal substrate or placed on the surface of the metal substrate according to a certain pattern; in order to ensure the fixed position of the particles, pits are processed in the area to be planted, the shape is determined according to the requirement, and the depth is 0-500 mu m.
8. The spark discharge based ceramic particle planting process of claim 1, wherein the relevant process parameters include: the discharge voltage is 0-200V, the capacitance is 0-1000 muF, the discharge frequency is 0-1000 Hz, the electrode vibration frequency is 0-1000 Hz, and the flow of the protective gas is 0-30L/min.
9. The spark discharge based ceramic particle implantation process of claim 1, wherein said spark deposition equipment employs pulsed capacitive discharge.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115354321A (en) * | 2022-09-22 | 2022-11-18 | 南昌航空大学 | Automatic particle planting device and method based on spark discharge |
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| CN115354321A (en) * | 2022-09-22 | 2022-11-18 | 南昌航空大学 | Automatic particle planting device and method based on spark discharge |
| CN115354321B (en) * | 2022-09-22 | 2023-06-02 | 南昌航空大学 | Automatic particle planting device and method based on spark discharge |
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