CN111045100A - Test method for detecting PCBA (printed circuit board assembly) by utilizing reflection-type laser sensor - Google Patents
Test method for detecting PCBA (printed circuit board assembly) by utilizing reflection-type laser sensor Download PDFInfo
- Publication number
- CN111045100A CN111045100A CN201910488243.7A CN201910488243A CN111045100A CN 111045100 A CN111045100 A CN 111045100A CN 201910488243 A CN201910488243 A CN 201910488243A CN 111045100 A CN111045100 A CN 111045100A
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- Prior art keywords
- pcba
- signal
- sensor
- pcb
- test method
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V8/00—Prospecting or detecting by optical means
- G01V8/10—Detecting, e.g. by using light barriers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C15/00—Surveying instruments or accessories not provided for in groups G01C1/00 - G01C13/00
Abstract
The invention relates to a test method for detecting PCBA by using a reflection-type laser sensor, which comprises the following steps: 1) mounting a reflective sensor 5MM away from the PCB; 2) after the PCBA is placed in the PCB, the edge of the PCB reflects a signal of the transmitting end of the sensor to the signal receiving end, a low-voltage signal is output, and the PCBA is judged to be in place; when no PCB exists, the signal cannot be reflected, the receiving end does not receive the signal, and a high-voltage signal is output, so that the situation that the PCBA is not in place is judged. The method saves a lot of sensor cost, can make the volume very small, provides precious space for the test equipment with high requirement on the volume, and is convenient and simple to install and erect.
Description
Technical Field
The invention relates to a test method, in particular to a test method for detecting PCBA by using a reflection-type laser sensor.
Background
In traditional manufacturing, whether test PCBA is just laid, the sensor that the level needs, the quantity needs about 3, and the volume ratio is bigger, and the cost is very high, and ordinary sensor can not satisfy the requirement when having high requirement to the volume, and the installation is more complicated, also has higher requirement to walking the line.
Disclosure of Invention
The invention aims to solve the technical problem of providing a test method for detecting PCBA by using a reflection-type laser sensor, aiming at the defects of the prior art that the size of a sensor for detecting whether PCBA is aligned, the size of the sensor for leveling is large and the cost is high.
The technical scheme adopted by the invention for solving the technical problems is as follows: a testing method for detecting PCBA by using a reflection-type laser sensor is constructed, wherein the reflection-type sensor is arranged beside a PCB placing area, when the PCBA is placed, the signal of a sensor transmitting end is reflected to a signal receiving end by the board edge of the PCB, a low-voltage signal is output, and the PCBA is judged to be in place; when no PCB exists, the signal cannot be reflected, the receiving end does not receive the signal, and a high-voltage signal is output, so that the situation that the PCBA is not in place is judged, the cost of the sensor is saved, the size can be reduced, precious space is provided for test equipment with high requirements on the size, and the installation and the erection are convenient and simple.
The test method for detecting whether the PCBA is properly placed or not by using the photoelectric sensor has the following beneficial effects: the invention judges whether the position of the PCBA is in place by installing the reflection-type sensor beside the PCB placement area, saves a lot of sensor cost, can make the volume small, provides precious space for test equipment with high requirement on the volume, and is convenient and simple to install and erect.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a schematic diagram of a test method for detecting PCBA using a reflective laser sensor according to the present invention;
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, the test method for detecting PCBA by using the reflective laser sensor includes the following steps: 1) mounting a reflective sensor 5MM away from the PCB; 2) after the PCBA is placed in the PCB, the edge of the PCB reflects a signal of the transmitting end of the sensor to the signal receiving end, a low-voltage signal is output, and the PCBA is judged to be in place; when no PCB exists, the signal cannot be reflected, the receiving end does not receive the signal, and a high-voltage signal is output, so that the situation that the PCBA is not in place is judged.
The sensor has a specific reflection distance, which is 5-15 mm.
Although the present invention has been described with reference to the above embodiments, the scope of the present invention is not limited thereto, and modifications, substitutions and the like of the above members are intended to fall within the scope of the claims of the present invention without departing from the spirit of the present invention.
Claims (2)
1. A test method for detecting PCBA by using a reflection-type laser sensor is characterized by comprising the following steps: 1) mounting a reflective sensor 5MM away from the PCB; 2) after the PCBA is placed in the PCB, the edge of the PCB reflects a signal of the transmitting end of the sensor to the signal receiving end, a low-voltage signal is output, and the PCBA is judged to be in place; when no PCB exists, the signal cannot be reflected, the receiving end does not receive the signal, and a high-voltage signal is output, so that the situation that the PCBA is not in place is judged.
2. The test method for detecting PCBA as recited in claim 1, wherein the sensor has a specified reflective distance, the specified reflective distance being 5-15 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910488243.7A CN111045100A (en) | 2019-06-05 | 2019-06-05 | Test method for detecting PCBA (printed circuit board assembly) by utilizing reflection-type laser sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910488243.7A CN111045100A (en) | 2019-06-05 | 2019-06-05 | Test method for detecting PCBA (printed circuit board assembly) by utilizing reflection-type laser sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111045100A true CN111045100A (en) | 2020-04-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910488243.7A Pending CN111045100A (en) | 2019-06-05 | 2019-06-05 | Test method for detecting PCBA (printed circuit board assembly) by utilizing reflection-type laser sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111045100A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108955528A (en) * | 2018-08-07 | 2018-12-07 | 深圳市明信测试设备有限公司 | A kind of test method using photoelectric sensor detection PCBA |
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2019
- 2019-06-05 CN CN201910488243.7A patent/CN111045100A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108955528A (en) * | 2018-08-07 | 2018-12-07 | 深圳市明信测试设备有限公司 | A kind of test method using photoelectric sensor detection PCBA |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 518000 the first floor, second floor, third floor, fourth floor and fifth floor of 16 workshops in antuoshan high tech Industrial Park, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Mingxin testing equipment Co., Ltd Address before: Baoan District manhole Street Xinsha road Shenzhen city Guangdong province 518000 security supporting mountain High-tech Industrial Park 16 Applicant before: SHENZHEN MASON TEST EQUIPMENT Co.,Ltd. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200421 |