CN108955528A - A kind of test method using photoelectric sensor detection PCBA - Google Patents
A kind of test method using photoelectric sensor detection PCBA Download PDFInfo
- Publication number
- CN108955528A CN108955528A CN201810892531.4A CN201810892531A CN108955528A CN 108955528 A CN108955528 A CN 108955528A CN 201810892531 A CN201810892531 A CN 201810892531A CN 108955528 A CN108955528 A CN 108955528A
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- CN
- China
- Prior art keywords
- photoelectric sensor
- pcba
- test method
- voltage signal
- sensor detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
Abstract
A kind of test method using photoelectric sensor detection PCBA of the present invention, emit infrared ray by photoelectric sensor transmitting terminal, it is irradiated to PCB back reflection, receiving end is different according to the infrared intensity of the reflection received, export linear voltage signal, the low and high level that the voltage signal is converted into 3.3V is exported by processing circuit, to confirm whether PCBA is put just, it is laid flat, and this method has saved many sensor costs, valuable space is provided in the test equipment for having high request to volume, and is installed and set up convenient and simple.
Description
Technical field
The present invention relates to a kind of test methods, more specifically to a kind of survey using photoelectric sensor detection PCBA
Method for testing.
Background technique
In traditional manufacture, whether test PCBA puts the sensor for being just laid flat needs, and quantity needs 3 or so, and body
Product is bigger, and cost is very high, and common sensor can not meet requirement when having high request to volume, and install more multiple
It is miscellaneous, there is higher requirement to route is walked also.
Summary of the invention
The technical problem to be solved in the present invention is that, the sensing that is laid flat whether upright for detection PCBA in the prior art
Body product is big, defect at high cost, provides a kind of detection PCBA and whether puts the test method just put well.
The technical solution adopted by the present invention to solve the technical problems is: constructing a kind of utilization photoelectric sensor detection PCBA
Test method, by the transmitting, reflection, reception of infrared ray, to confirm whether PCBA is put just, be laid flat, and this method saving
Volume, can be made small by many sensor costs, and valuable sky is provided in the test equipment for having high request to volume
Between, and install and set up convenient and simple.
Photoelectric sensor is utilized of the present invention, whether detection PCBA is put in the test method just put well, described
PCBA is put into measured position, and photoelectric sensor transmitting terminal emits infrared ray, is irradiated to PCB back reflection, and receiving end is according to receiving
The infrared intensity of reflection it is different, export linear voltage signal.
Photoelectric sensor is utilized of the present invention, whether detection PCBA is put in the test method just put well, the electricity
Pressure signal is exported the low and high level that the voltage signal is converted into 3.3V by processing circuit.
Photoelectric sensor is utilized of the present invention, whether detection PCBA is put in the test method just put well, the light
Contain small size photoelectric sensor chip in electric transducer.
Implement of the invention a kind of using photoelectric sensor, whether detection PCBA puts the test method just put well, have with
Lower to be irradiated to PCB back reflection the utility model has the advantages that the present invention emits infrared ray by photoelectric sensor transmitting terminal, receiving end is according to connecing
The infrared intensity of the reflection received is different, exports linear voltage signal, is converted into the voltage signal by processing circuit
The low and high level of 3.3V exports, to confirm whether PCBA is put just, is laid flat, and this method has saved many sensor costs,
Valuable space is provided to the test equipment that volume has high request, and is installed and set up convenient and simple.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples, in attached drawing:
Fig. 1 is the test method schematic diagram of the invention using photoelectric sensor detection PCBA；
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Such as Fig. 1, it is of the invention it is a kind of utilize photoelectric sensor, whether detection PCBA is put in the test method just put well,
The PCBA is put into measured position, and photoelectric sensor transmitting terminal emits infrared ray, is irradiated to PCB back reflection, and receiving end is according to connecing
The infrared intensity of the reflection received is different, exports linear voltage signal.
Further, the low and high level which is converted into 3.3V by processing circuit by the voltage signal is defeated
Out, it to confirm whether PCBA is put just, is laid flat.
Further, small size photoelectric sensor chip is contained in the photoelectric sensor.In this way, with prior art phase
Than compact is at low cost, supports multi-way detecting, and installation and erection are convenient.
The horizontal distance on detected pcb board side and the center sensor is less than equal to 1mm, and detected pcb board is opposite
The vertical range at the center sensor is less than equal to 2mm.
Although being disclosed by above embodiments to the present invention, scope of protection of the present invention is not limited thereto,
Under conditions of without departing from present inventive concept, deformation, the replacement etc. done to above each component will fall into right of the invention
In claimed range.
Claims (3)
1. a kind of test method using photoelectric sensor detection PCBA, which is characterized in that the PCBA is put into measured position, light
Electric transducer transmitting terminal emits infrared ray, is irradiated to PCB back reflection, and infrared intensity is reflected not according to what is received in receiving end
Together, linear voltage signal is exported.
2. the test method according to claim 1 using photoelectric sensor detection PCBA, which is characterized in that the voltage
Signal is exported the low and high level that the voltage signal is converted into 3.3V by processing circuit.
3. the test method according to claim 2 using photoelectric sensor detection PCBA, which is characterized in that the photoelectricity
Contain small size photoelectric sensor chip in sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810892531.4A CN108955528A (en) | 2018-08-07 | 2018-08-07 | A kind of test method using photoelectric sensor detection PCBA |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810892531.4A CN108955528A (en) | 2018-08-07 | 2018-08-07 | A kind of test method using photoelectric sensor detection PCBA |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108955528A true CN108955528A (en) | 2018-12-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810892531.4A Pending CN108955528A (en) | 2018-08-07 | 2018-08-07 | A kind of test method using photoelectric sensor detection PCBA |
Country Status (1)
| Country | Link |
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| CN (1) | CN108955528A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110823079A (en) * | 2019-11-19 | 2020-02-21 | 深圳市明信测试设备有限公司 | Utilize sensor to detect test fixture of PCBA board |
| CN111006588A (en) * | 2019-12-25 | 2020-04-14 | 深圳市明信测试设备有限公司 | Test fixture and detection method for detecting PCBA (printed circuit board assembly) board by using laser sensor |
| CN111045100A (en) * | 2019-06-05 | 2020-04-21 | 深圳市明信测试设备有限公司 | Test method for detecting PCBA (printed circuit board assembly) by utilizing reflection-type laser sensor |
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| CN203241044U (en) * | 2013-05-24 | 2013-10-16 | 苏州工业园区世纪福科技有限公司 | Non-contact printing circuit board flattening and detecting device |
| CN103363928A (en) * | 2012-03-28 | 2013-10-23 | 北大方正集团有限公司 | Method and device for detecting smoothness of PCB (printed circuit board) |
| CN105572562A (en) * | 2015-12-14 | 2016-05-11 | 浪潮电子信息产业股份有限公司 | Method for detecting position deviation of PCBA |
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| CN205619902U (en) * | 2016-04-14 | 2016-10-05 | 深圳市明信测试设备有限公司 | Cell -phone flatness detecting device |
| CN207473044U (en) * | 2017-08-15 | 2018-06-08 | 深圳市奥高德科技有限公司 | A kind of CCD fine tuning modules of PCB electric logging devices |
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2018
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Patent Citations (6)
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| CN103363928A (en) * | 2012-03-28 | 2013-10-23 | 北大方正集团有限公司 | Method and device for detecting smoothness of PCB (printed circuit board) |
| CN203241044U (en) * | 2013-05-24 | 2013-10-16 | 苏州工业园区世纪福科技有限公司 | Non-contact printing circuit board flattening and detecting device |
| CN105572562A (en) * | 2015-12-14 | 2016-05-11 | 浪潮电子信息产业股份有限公司 | Method for detecting position deviation of PCBA |
| CN205619902U (en) * | 2016-04-14 | 2016-10-05 | 深圳市明信测试设备有限公司 | Cell -phone flatness detecting device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111045100A (en) * | 2019-06-05 | 2020-04-21 | 深圳市明信测试设备有限公司 | Test method for detecting PCBA (printed circuit board assembly) by utilizing reflection-type laser sensor |
| CN110823079A (en) * | 2019-11-19 | 2020-02-21 | 深圳市明信测试设备有限公司 | Utilize sensor to detect test fixture of PCBA board |
| CN111006588A (en) * | 2019-12-25 | 2020-04-14 | 深圳市明信测试设备有限公司 | Test fixture and detection method for detecting PCBA (printed circuit board assembly) board by using laser sensor |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 518000 the first floor, second floor, third floor, fourth floor and fifth floor of 16 workshops in antuoshan high tech Industrial Park, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Mingxin testing equipment Co., Ltd Address before: Baoan District manhole Street Xinsha road Shenzhen city Guangdong province 518000 security supporting mountain High-tech Industrial Park 16 Applicant before: SHENZHEN MASON TEST EQUIPMENT Co.,Ltd. |
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| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181207 |
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| RJ01 | Rejection of invention patent application after publication |