CN111030670A - Infrared imaging processing circuit and infrared detection system - Google Patents
Infrared imaging processing circuit and infrared detection system Download PDFInfo
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- CN111030670A CN111030670A CN201911326602.5A CN201911326602A CN111030670A CN 111030670 A CN111030670 A CN 111030670A CN 201911326602 A CN201911326602 A CN 201911326602A CN 111030670 A CN111030670 A CN 111030670A
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Abstract
The application discloses an infrared imaging processing circuit, which comprises a signal conditioning unit, an analog-to-digital conversion unit, a main control unit, a storage unit and a transmission unit; the signal conditioning unit comprises an operational amplifier and an active low-pass filter, the operational amplifier is used for receiving the image analog signals of the infrared detector and amplifying the image analog signals, and the active low-pass filter is used for filtering the amplified image analog signals and transmitting the filtered image analog signals to the analog-to-digital conversion unit. The signal conditioning unit comprises an operational amplifier and an active low-pass filter, the operational amplifier amplifies and adjusts the image analog signals, and the active low-pass filter can effectively filter power supply noise, thermal noise and the like, so that the signal-to-noise ratio is improved, the signal-to-noise ratio of the image digital signals obtained by converting the image analog signals by the analog-to-digital conversion unit is improved, images generated by the main control unit are clearer, and the image quality is improved. The present application further provides an infrared detection system having the above advantages.
Description
Technical Field
The application relates to the technical field of electronic application, in particular to an infrared imaging processing circuit and an infrared detection system.
Background
The infrared imaging technology is a high and new technology with a wide prospect, all objects can radiate infrared rays, and therefore an infrared image formed by continuous infrared rays can be obtained by utilizing the infrared ray difference between a measurement target and a background.
In the existing shortwave infrared imaging processing circuit, a focal plane detector outputs an image analog signal to a pre-amplification unit, the pre-amplification unit processes the analog signal and then outputs the processed analog signal to an analog-to-digital conversion unit, and because the pre-amplification unit consists of an operational amplifier, power supply noise, thermal noise and the like are easily introduced into the pre-amplification unit, the signal-to-noise ratio is reduced, so that the image quality is poor and the image is unclear when an image is generated according to an image digital signal converted by the analog-to-digital conversion unit.
Therefore, how to solve the above technical problems should be a great concern to those skilled in the art.
Disclosure of Invention
The utility model aims at providing an infrared imaging processing circuit and infrared detection system to promote infrared imaging processing circuit's imaging quality.
In order to solve the technical problem, the application provides an infrared imaging processing circuit, which comprises a signal conditioning unit, an analog-to-digital conversion unit, a main control unit, a storage unit and a transmission unit;
the signal conditioning unit comprises an operational amplifier and an active low-pass filter, the operational amplifier is used for receiving image analog signals of the infrared detector and amplifying the image analog signals, and the active low-pass filter is used for filtering the amplified image analog signals and transmitting the filtered image analog signals to the analog-to-digital conversion unit.
Optionally, the low-pass filter is an active second-order low-pass filter.
Optionally, the storage unit includes an image buffer unit and a non-uniformity correction parameter storage unit.
Optionally, the image cache unit is an SRAM memory.
Optionally, the image cache unit includes two SRAM memories, and the two SRAM memories store image data in a ping-pong manner.
Optionally, when the main control unit calculates the non-uniformity correction parameter, the fitting calculation is performed by using a six-temperature-point non-uniformity correction method.
Optionally, the transmission unit includes an optical fiber interface and a parallel LVDS interface.
Optionally, the analog-to-digital conversion unit is an AD9240 analog-to-digital conversion chip.
Optionally, the main control unit is an XC4VLX25 type FPGA.
The application also provides an infrared detection system, which comprises an infrared detector and any one of the infrared imaging processing circuits.
The infrared imaging processing circuit comprises a signal conditioning unit, an analog-to-digital conversion unit, a main control unit, a storage unit and a transmission unit; the signal conditioning unit comprises an operational amplifier and an active low-pass filter, the operational amplifier is used for receiving image analog signals of the infrared detector and amplifying the image analog signals, and the active low-pass filter is used for filtering the amplified image analog signals and transmitting the filtered image analog signals to the analog-to-digital conversion unit.
It can be seen that, the signal conditioning unit in the infrared imaging processing circuit in this application includes operational amplifier and active low pass filter, operational amplifier amplifies the image analog signal of infrared detector and adjusts, in order to satisfy the input requirement of analog-to-digital conversion unit, active low pass filter can effectively filter power noise, thermal noise etc., improve the SNR, and then make analog-to-digital conversion unit improve the SNR of the image digital signal that image analog signal conversion obtained, thereby make the image that main control unit generated according to image digital signal clearer, promote image quality, and active low pass filter's small, light in weight, do not need the magnetic screen, can not bring negative effects for infrared imaging processing circuit. In addition, the application also provides an infrared detection system with the advantages.
Drawings
For a clearer explanation of the embodiments or technical solutions of the prior art of the present application, the drawings needed for the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an infrared imaging processing circuit according to an embodiment of the present disclosure;
fig. 2 is a schematic diagram of various data transmission links provided in the embodiment of the present application.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
As described in the background section, the signal conditioning unit in the prior art is composed of an operational amplifier, and power noise, thermal noise, and the like are easily introduced into the signal conditioning unit, so that the signal-to-noise ratio is reduced, and thus, when an image is generated according to an image digital signal converted by the analog-to-digital conversion unit, the image quality is poor and unclear.
In view of this, the present application provides an infrared imaging processing circuit, please refer to fig. 1, where fig. 1 is a schematic structural diagram of an infrared imaging processing circuit provided in an embodiment of the present application, and the infrared imaging processing circuit includes a signal conditioning unit 1, an analog-to-digital conversion unit 2, a main control unit 3, a storage unit 4, and a transmission unit 5;
the signal conditioning unit 1 comprises an operational amplifier and an active low-pass filter, the operational amplifier is used for receiving the image analog signal of the infrared detector 6 and amplifying the image analog signal, and the active low-pass filter is used for filtering the amplified image analog signal and transmitting the filtered image analog signal to the analog-to-digital conversion unit 2.
Preferably, the signal conditioning unit 1 converts the single-ended analog signal into the differential signal by using the AD8132 single-ended differential operational amplifier, and transmits the differential signal to the analog-to-digital conversion unit 2, so as to improve the transmission capability of the analog signal, suppress the common mode noise interference to the maximum extent, and improve the signal-to-noise ratio.
Optionally, the infrared imaging processing circuit further includes a communication unit 7 and a power supply voltage stabilizing unit 8. Wherein, the communication unit 7 adopts RS-422 communication protocol, and the power supply voltage stabilizing unit 8 provides the power demand meeting each unit.
Specifically, the storage unit 4 includes an image buffer unit 41 and an unevenness correction parameter storage unit 42. The image buffer unit 41 is used to buffer the digital image signal, and the non-uniformity correction parameter storage unit 42 is used to store non-uniformity correction parameters.
The analog-to-digital conversion unit 2 is configured to convert the filtered image analog signal into an image digital signal.
Preferably, the analog-to-digital conversion unit 2 is an AD9240 analog-to-digital conversion chip, and has the characteristics of 14-bit quantization, high precision and low power consumption of 10MSPS sampling rate. The AD9240 analog-to-digital conversion chip selects a differential input mode, the differential input range is-2.5V- +2.5V, and the common mode voltage is + 2.5V.
The main control unit 3 is used for integrating the image digital signals transmitted by the analog-to-digital conversion unit 2 to obtain a 640 x 512 image; the device is used for providing driving time sequence signals required by the infrared detector 6, the analog-to-digital conversion unit 2, the storage unit 4, the transmission unit 5 and the communication unit 7; the system is used for calculating the non-uniformity correction parameters and storing the obtained non-uniformity correction parameters into a non-uniformity correction parameter storage list; the transmission unit 5 is used for driving the corrected image data to be transmitted to the platform data fusion center through the transmission unit 5; and driving an external communication interface, analyzing the communication instruction and executing the platform command.
Specifically, the main control unit 3 is an XC4VLX25 type FPGA.
Preferably, the low-pass filter is an active second-order low-pass filter.
The signal conditioning unit 1 in the infrared imaging processing circuit in this embodiment includes an operational amplifier and an active low pass filter, the operational amplifier amplifies and adjusts the image analog signal of the infrared detector 6, so as to meet the input requirement of the analog-to-digital conversion unit 2, the active low pass filter can effectively filter power supply noise, thermal noise and the like, the signal-to-noise ratio is improved, and further the signal-to-noise ratio of the image digital signal obtained by converting the image analog signal by the analog-to-digital conversion unit 2 is improved, so that the image generated by the main control unit 3 according to the image digital signal is clearer, the image quality is improved, and the active low pass filter is small in size, light in weight, does not need magnetic shielding, and does not bring negative effects to the infrared imaging. The active low-pass filter can dynamically filter power supply noise and thermal noise harmonic waves when filtering the power supply noise and the thermal noise, and resonance can not be generated.
In an embodiment of the present application, the image caching unit 41 is an SRAM memory, specifically a 72-Mbit (2M × 36) SRAM memory, the operating frequency can reach 250MHz, and the fast access speed can provide hardware support for image caching by a circuit.
Preferably, the image buffer unit 41 includes two SRAM memories, and the two SRAM memories store image data in a ping-pong manner, so that the reading speed is very high.
On the basis of any of the above embodiments, in an embodiment of the present application, the main control unit 3 performs fitting calculation by using a six-temperature-point non-uniformity correction method when calculating the non-uniformity correction parameters.
Specifically, each temperature point accesses 5 frames of images for averaging, average image data of two adjacent temperature points are calculated to obtain non-uniform correction parameters of a temperature section formed by the adjacent temperature points, namely, the non-uniform correction parameters are averagely divided into 5 temperature sections, compared with the prior art that linear fitting is carried out by utilizing 2 temperature sections, a signal-temperature change curve of the whole temperature section can be more accurately fitted, and distortion is reduced to the maximum extent.
The non-uniformity correction parameters of each temperature section comprise two parameters, namely a correction coefficient K and a correction offset B, so that 5K and 5B are required to be stored, each K and B is a 640 x 512 matrix, and if elements in the K and B matrices are 14-bit, the required hardware storage space is 3.125M x 14 bit.
Preferably, the non-uniformity correction parameter storage unit 42 adopts a FLASH with model number S29GL256P, and the FLASH has a storage capacity of 16M × 16bit to meet the storage capacity requirement.
On the basis of any of the above embodiments, in an embodiment of the present application, the transmission unit 5 includes an optical fiber interface and a parallel LVDS interface, and a plurality of data transmission interfaces are adopted, so that the optical fiber interface and the parallel LVDS interface can simultaneously download image data.
Specifically, the optical fiber interface adopts an FC interface single-fiber bidirectional transceiving integrated optical module, but only needs to adopt the sending function of the optical transceiving module, image data is encoded by a high-speed serializer TLK2711, a 14-bit data stream and a corresponding accompanying clock are subjected to 8B/10B encoding on input parallel data by the accompanying clock, and then the data is transmitted in a high-speed differential serial (LVDS) output mode according to the frequency which is 20 times of the original accompanying clock. The level standard of the interface of the sending signals (TX + and TX-) of the light emitting part is LVPECL, is the same as the level standard of the differential output pin of the TLK2711, and is connected with the high-speed differential output pin (DOUTTXP and DOUTTXN) of the TLK2711 in an alternating current coupling mode; and the interface levels of the transmission enable pins (TDIS) are all LVTTL, are compatible with the level standard of the I/O pins of the FPGA and are directly connected with the I/O pins of the FPGA. The parallel LVDS interface is used for transmitting 8-bit image data in parallel, accompanied by an accompanying clock and a frame synchronization signal, 3 DS90LV047A four-channel differential driving chips are adopted, an FPGA supplements 0 for 14-bit image data to form a 16-bit image, each pixel consists of 8 high bits and 8 low bits, each accompanying clock transmits 8-bit data, when the frame synchronization signal is high, each 16-bit data is transmitted from left to right and from top to bottom of the image, and after 655360 accompanying clocks, transmission of one frame of image is completed. Please refer to fig. 2 for various data transmission links.
The application also provides an infrared detection system, which comprises an infrared detector 6 and the infrared imaging processing circuit in any embodiment.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The infrared imaging processing circuit and the infrared detection system provided by the present application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
Claims (10)
1. An infrared imaging processing circuit is characterized by comprising a signal conditioning unit, an analog-to-digital conversion unit, a main control unit, a storage unit and a transmission unit;
the signal conditioning unit comprises an operational amplifier and an active low-pass filter, the operational amplifier is used for receiving image analog signals of the infrared detector and amplifying the image analog signals, and the active low-pass filter is used for filtering the amplified image analog signals and transmitting the filtered image analog signals to the analog-to-digital conversion unit.
2. The infrared imaging processing circuit of claim 1, wherein the low pass filter is an active second order low pass filter.
3. The infrared imaging processing circuit as set forth in claim 1, wherein the storage unit includes an image buffer unit and a non-uniformity correction parameter storage unit.
4. The infrared imaging processing circuit of claim 3, wherein the image cache unit is an SRAM memory.
5. The infrared imaging processing circuit of claim 4, wherein the image cache unit comprises two of the SRAM memories, and the two SRAM memories store image data in a ping-pong manner.
6. The infrared imaging processing circuit as set forth in claim 1, wherein the main control unit performs the fitting calculation using a six temperature point non-uniformity correction method when calculating the non-uniformity correction parameters.
7. The infrared imaging processing circuit of claim 1, wherein the transmission unit comprises a fiber optic interface and a parallel LVDS interface.
8. The infrared imaging processing circuit of claim 1, wherein the analog-to-digital conversion unit is an AD9240 analog-to-digital conversion chip.
9. The infrared imaging processing circuit of claim 1 wherein the main control unit is an XC4VLX25 type FPGA.
10. An infrared detection system comprising an infrared detector and an infrared imaging processing circuit as claimed in any one of claims 1 to 9.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112787668A (en) * | 2020-12-28 | 2021-05-11 | 中国科学院长春光学精密机械与物理研究所 | Medium wave infrared detector imaging driving device |
| CN114040156A (en) * | 2021-11-03 | 2022-02-11 | 西安交通大学 | FPGA system and method for video format and image quality processing |
| CN114526824A (en) * | 2022-03-08 | 2022-05-24 | 云南师范大学 | Infrared imaging system based on Zynq SOPC framework |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102338665A (en) * | 2011-06-10 | 2012-02-01 | 中国船舶重工集团公司第七一七研究所 | Infrared thermal imager and method for detecting infrared objective image by using same |
| CN104748858A (en) * | 2015-03-18 | 2015-07-01 | 北京空间机电研究所 | InGaAs shortwave infrared detector signal processing system |
| CN109743513A (en) * | 2018-12-17 | 2019-05-10 | 中国科学院长春光学精密机械与物理研究所 | A kind of infrared imaging processing circuit and infrared detection system |
-
2019
- 2019-12-20 CN CN201911326602.5A patent/CN111030670A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102338665A (en) * | 2011-06-10 | 2012-02-01 | 中国船舶重工集团公司第七一七研究所 | Infrared thermal imager and method for detecting infrared objective image by using same |
| CN104748858A (en) * | 2015-03-18 | 2015-07-01 | 北京空间机电研究所 | InGaAs shortwave infrared detector signal processing system |
| CN109743513A (en) * | 2018-12-17 | 2019-05-10 | 中国科学院长春光学精密机械与物理研究所 | A kind of infrared imaging processing circuit and infrared detection system |
Non-Patent Citations (8)
| Title |
|---|
| 何力，杨定江，倪国强: "《先进焦平面技术导论》", 31 January 2011, 国防工业出版社 * |
| 佟飞: "《Camera Link接口的红外图像增强器设计与实现》", 《中国学术期刊（光盘版）电子杂志社》 * |
| 刘辉: "《红外光电探测原理》", 30 April 2016, 国防工业出版社 * |
| 吴厚航: "《博客藏经阁丛书 深入浅出玩转FPGA 第3版》", 30 June 2017, 北京航空航天大学出版社 * |
| 张宁3: "《非制冷红外探测器噪声抑制技术研究》", 《中国学术期刊（光盘版）电子杂志社》 * |
| 张诚，林志贵: "《电子系统设计 电路篇》", 31 January 2014, 北京航空航天大学出版社 * |
| 彭真明，雍杨，杨先明编著: "《光电图像处理及应用》", 30 April 2013 * |
| 李长昆: "《基于FPGA的非制冷红外焦平面图像采集系统的研究》", 《中国学术期刊（光盘版）电子杂志社》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112787668A (en) * | 2020-12-28 | 2021-05-11 | 中国科学院长春光学精密机械与物理研究所 | Medium wave infrared detector imaging driving device |
| CN114040156A (en) * | 2021-11-03 | 2022-02-11 | 西安交通大学 | FPGA system and method for video format and image quality processing |
| CN114040156B (en) * | 2021-11-03 | 2022-08-16 | 西安交通大学 | FPGA system and method for video format and image quality processing |
| CN114526824A (en) * | 2022-03-08 | 2022-05-24 | 云南师范大学 | Infrared imaging system based on Zynq SOPC framework |
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Application publication date: 20200417 |