CN111029287A - 晶圆自动上下片系统 - Google Patents
晶圆自动上下片系统 Download PDFInfo
- Publication number
- CN111029287A CN111029287A CN201911197490.8A CN201911197490A CN111029287A CN 111029287 A CN111029287 A CN 111029287A CN 201911197490 A CN201911197490 A CN 201911197490A CN 111029287 A CN111029287 A CN 111029287A
- Authority
- CN
- China
- Prior art keywords
- wafer
- unit
- disc
- loading
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 235000012431 wafers Nutrition 0.000 claims abstract description 256
- 238000000034 method Methods 0.000 claims abstract description 50
- 238000003860 storage Methods 0.000 claims abstract description 39
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000012797 qualification Methods 0.000 abstract description 3
- 238000005240 physical vapour deposition Methods 0.000 description 24
- 229910010271 silicon carbide Inorganic materials 0.000 description 8
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007115 recruitment Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911197490.8A CN111029287B (zh) | 2019-11-29 | 2019-11-29 | 晶圆自动上下片系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911197490.8A CN111029287B (zh) | 2019-11-29 | 2019-11-29 | 晶圆自动上下片系统 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111029287A true CN111029287A (zh) | 2020-04-17 |
CN111029287B CN111029287B (zh) | 2021-01-12 |
Family
ID=70203259
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911197490.8A Active CN111029287B (zh) | 2019-11-29 | 2019-11-29 | 晶圆自动上下片系统 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111029287B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116145113A (zh) * | 2023-02-13 | 2023-05-23 | 上海福赛特机器人股份有限公司 | 一种mocvd晶圆集成上下片装置 |
TWI828481B (zh) * | 2021-12-28 | 2024-01-01 | 大陸商北京北方華創微電子裝備有限公司 | 半導體製程設備及其晶圓傳輸系統 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04125948A (ja) * | 1990-09-17 | 1992-04-27 | Tokyo Electron Sagami Ltd | 熱処理方法 |
JPH07153721A (ja) * | 1993-11-26 | 1995-06-16 | Seiko Seiki Co Ltd | ダイシング装置 |
CN102414810A (zh) * | 2009-09-23 | 2012-04-11 | 应用材料公司 | 自动基板加载站 |
CN109712923A (zh) * | 2018-12-26 | 2019-05-03 | 上海福赛特机器人有限公司 | 一种晶圆周转装置及晶圆周转方法 |
CN209133482U (zh) * | 2019-01-11 | 2019-07-19 | 上海福赛特机器人有限公司 | 一种晶圆类产品的立体仓存储装置 |
CN209487475U (zh) * | 2019-04-09 | 2019-10-11 | 新睿精密股份有限公司 | 全自动晶圆键合机 |
-
2019
- 2019-11-29 CN CN201911197490.8A patent/CN111029287B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04125948A (ja) * | 1990-09-17 | 1992-04-27 | Tokyo Electron Sagami Ltd | 熱処理方法 |
JPH07153721A (ja) * | 1993-11-26 | 1995-06-16 | Seiko Seiki Co Ltd | ダイシング装置 |
CN102414810A (zh) * | 2009-09-23 | 2012-04-11 | 应用材料公司 | 自动基板加载站 |
CN109712923A (zh) * | 2018-12-26 | 2019-05-03 | 上海福赛特机器人有限公司 | 一种晶圆周转装置及晶圆周转方法 |
CN209133482U (zh) * | 2019-01-11 | 2019-07-19 | 上海福赛特机器人有限公司 | 一种晶圆类产品的立体仓存储装置 |
CN209487475U (zh) * | 2019-04-09 | 2019-10-11 | 新睿精密股份有限公司 | 全自动晶圆键合机 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI828481B (zh) * | 2021-12-28 | 2024-01-01 | 大陸商北京北方華創微電子裝備有限公司 | 半導體製程設備及其晶圓傳輸系統 |
CN116145113A (zh) * | 2023-02-13 | 2023-05-23 | 上海福赛特机器人股份有限公司 | 一种mocvd晶圆集成上下片装置 |
CN116145113B (zh) * | 2023-02-13 | 2024-05-03 | 上海福赛特机器人股份有限公司 | 一种mocvd晶圆集成上下片装置 |
Also Published As
Publication number | Publication date |
---|---|
CN111029287B (zh) | 2021-01-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 200233 room 1101, building 2, No. 188, Yizhou Road, Xuhui District, Shanghai Applicant after: SHANGHAI FORESIGHT ROBOTICS Co.,Ltd. Address before: Room 305-308, Kaike International Building, Area A, 1801 Hongmei Road, Xuhui District, Shanghai, 2003 Applicant before: SHANGHAI FORESIGHT ROBOTICS Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 201702 Building 2, No. 338, Jiuye Road, Qingpu District, Shanghai Patentee after: Shanghai Forsyte Robot Co.,Ltd. Address before: Room 1101, building 2, 188 Yizhou Road, Xuhui District, Shanghai Patentee before: SHANGHAI FORESIGHT ROBOTICS Co.,Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 201712 Building 2, No. 338, Jiuye Road, Qingpu District, Shanghai Patentee after: Shanghai Fosaite Technology Co.,Ltd. Country or region after: China Address before: 201702 Building 2, No. 338, Jiuye Road, Qingpu District, Shanghai Patentee before: Shanghai Forsyte Robot Co.,Ltd. Country or region before: China |