CN111018334A - Laser processing method and laser processing device for fluorescent glass ceramic - Google Patents
Laser processing method and laser processing device for fluorescent glass ceramic Download PDFInfo
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- CN111018334A CN111018334A CN201911382974.XA CN201911382974A CN111018334A CN 111018334 A CN111018334 A CN 111018334A CN 201911382974 A CN201911382974 A CN 201911382974A CN 111018334 A CN111018334 A CN 111018334A
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- film
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- fluorescent sheet
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
Abstract
The invention discloses a laser processing method of fluorescent glass ceramic, which comprises the following steps: film pasting: pasting a film on the fluorescent sheet to be processed; processing: processing the fluorescent sheet with the film by adopting a laser processing device; membrane decomposing: processing the fluorescent sheet with the film, and putting the processed fluorescent sheet into a glue-dissolving machine to reduce the viscosity of the film and the fluorescent sheet; and (3) film pouring: sticking the fluorescent sheet after the glue release on another adhesive film in a film-reversing mode; expanding a membrane: stretching the inverted fluorescent sheet and the film in multiple directions simultaneously to separate fluorescent sheet particles from each other; and (4) checking: judging whether the fluorescent sheet particles are qualified or not by identifying the fluorescent sheet particles; placing a plate: and placing the fluorescent sheet particles qualified through inspection on a packaging film for packaging through an automatic tray placing device. The invention realizes the effective laser processing and avoids the error regions of laser micro-processing inertial thinking. Meanwhile, on the basis of designing the experiment, a large number of process experiments are carried out, and finally, the efficient and good processing of the fluorescent sheet is realized.
Description
Technical Field
The invention relates to the field of laser processing, in particular to a laser processing method and a laser processing device for fluorescent glass ceramics.
Background
In the lighting industry and the automobile industry, the white light source needs RGB (red, green, blue) three-color synthesis, the cost is high, after blue light appears, the white light source generated by stimulating fluorescent powder through the blue light gradually becomes mainstream, and a mixed novel fluorescent sheet formed after the fluorescent powder is mixed with glass or the fluorescent powder is mixed with ceramic is a hard and brittle fluorescent sheet which is difficult to process in the industry all the time, the hard and brittle fluorescent sheet is cut by a water knife at home, the water knife cutting cannot process special shapes and can only go straight, the efficiency is extremely low, and the environment is polluted, so that the laser processing is a necessary way, however, the fluorescent sheet is hard and brittle, the common laser is difficult to process the fluorescent sheet, and the fluorescent sheet is not melted but cracked.
Disclosure of Invention
The invention provides a laser processing method of fluorescent glass ceramic, which realizes special-shaped processing through laser processing, solves the problem that only linear processing can be realized, improves the processing efficiency and avoids environmental pollution.
To achieve these objects and other advantages in accordance with the purpose of the invention, there is provided a laser processing method of a fluorescent glass-ceramic, comprising the steps of:
s1, film pasting: pasting a film on the fluorescent sheet to be processed;
s2, processing: processing the fluorescent sheet with the film by adopting a laser processing device;
s3, membrane decomposition: processing the fluorescent sheet with the film, and putting the processed fluorescent sheet into a glue-dissolving machine to reduce the viscosity of the film and the fluorescent sheet;
s4, film pouring: sticking the fluorescent sheet after the glue release on another adhesive film in a film-reversing mode;
s5, film expanding: stretching the inverted fluorescent sheet and the film in multiple directions simultaneously to separate fluorescent sheet particles from each other;
s6, checking: judging whether the fluorescent sheet particles are qualified or not by identifying the fluorescent sheet particles;
s7, swinging: and (4) placing the fluorescent sheets qualified for inspection on a packaging film for packaging through an automatic tray placing device according to a set rule.
Preferably, in the S1 step, the film is a UV film having a thickness of 150 um.
Preferably, in step S2, when the rectangular shape is machined, the entire machining is performed using a "well" model.
Preferably, in the step S2, when the circular hole or the ring shape is machined, the machining is performed using a concentric circle model or a spiral model.
Preferably, the laser processing device is further provided with a dynamic mirror vibration mode, and the dynamic mirror vibration mode controls the lifting of the mirror vibration by a motor.
Preferably, in the step S3, the dispergator adopts an ultraviolet lamp with power of 200-400W, and the dispergation time is 15-20 seconds.
Preferably, in the step S4, the thickness of the film is between 100-150 um.
It is another object of the present invention to provide a laser processing apparatus for fluorescent glass-ceramics, comprising: the laser emission assembly is used for emitting laser beams and adjusting the laser beams; the processing assembly is used for two-dimensional scanning and light beam focusing processing; wherein the laser generating assembly comprises: the device comprises a laser for emitting laser beams, a beam expander for expanding the beams and processing divergence angles, and a light blue for filtering stray light and shaping the beams; the processing assembly comprises: the scanning device is used for two-dimensional scanning, and is a focusing mirror used for focusing and processing light beams, and the scanning device is a two-dimensional scanning galvanometer; and a reflector is arranged between the laser generation assembly and the processing assembly.
Preferably, the laser uses light having a wavelength band of 400nm or more, and the pulse width of the laser is in the order of nanoseconds or femtoseconds.
Preferably, in the processing assembly, the scanning device may also be a rotating prism.
Compared with the prior art, the invention can prevent processing splash by pasting the UV film on the fluorescent sheet, and effectively solves the problem that special-shaped processing cannot be realized by laser processing.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic process flow diagram according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a processing apparatus according to an embodiment of the present invention.
FIG. 3 is a diagram illustrating the rectangular processing effect of the embodiment of the present invention.
FIG. 4 is a diagram illustrating the effect of circular processing according to the embodiment of the present invention.
Detailed Description
The present invention is further described in detail below with reference to the attached drawings so that those skilled in the art can implement the invention by referring to the description text.
It will be understood that terms such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more other elements or groups thereof.
The invention provides a laser processing method of fluorescent glass ceramic, as shown in figure 1, comprising the following steps: s1, film pasting: pasting a film on the fluorescent sheet to be processed; s2, processing: processing the fluorescent sheet with the film by adopting a laser processing device; s3, membrane decomposition: processing the fluorescent sheet with the film, and putting the processed fluorescent sheet into a glue-dissolving machine to reduce the viscosity of the film and the fluorescent sheet; s4, film pouring: sticking the fluorescent sheet after the glue release on another adhesive film in a film-reversing mode; s5, film expanding: stretching the inverted fluorescent sheet and the film in multiple directions simultaneously to separate fluorescent sheet particles from each other; s6, checking: judging whether the fluorescent sheet is qualified or not by identifying particles on the fluorescent sheet; s7, swinging: and (4) placing the fluorescent sheets qualified for inspection on a packaging film for packaging through an automatic tray placing device according to a set rule. The invention utilizes the principle of phosphor powder light-light conversion, adopts color laser with single photon energy level lower than blue light energy level as processing selection laser, so that the laser in the wave band stimulates the phosphor powder, the phosphor powder can be effectively absorbed to generate physical changes such as melting, gasification and ablation, and the characteristic of converting high-energy photons and fluorescence into white light is avoided, thereby realizing laser effective processing and avoiding some error areas of laser micromachining inertia thinking.
Optionally, since the fluorescent sheet is fragile and easily splashed during the processing, and needs to be protected, in the processing method provided by the present invention, in step S1, the film is a UV film, and the thickness of the UV film is 150 um;
it can be understood that, due to the excellent heat conductivity of the phosphor sheet, the negative influence of excessive heat energy is taken into consideration during the processing, and the repeated heating of the same position in a short time is avoided as much as possible, so that the "well" character model is used for the entire processing when the rectangular shape is processed in the step S2.
It is to be understood that, in the step S2, when the circular hole or the ring shape is processed, the concentric circle pattern or the spiral pattern is used for the processing.
It can be understood that when processing the fluorescence piece that is relatively thick, can't once only process and accomplish, need will shake the mirror and reciprocate, and remove at every turn and decide according to the depth of focus of focusing mirror, so need control the mirror that shakes, consequently, laser processing device still is equipped with the developments mode of shaking the mirror, the developments mode of shaking the mirror is shaken by the lift of motor control mirror.
Optionally, in the step S3, the disperger uses an ultraviolet lamp with power of 200-400W, and the dispergation time is 15-20 seconds.
Optionally, in step S4, the thickness of the film is between 100-.
As shown in fig. 2, the present invention also provides a laser processing apparatus for fluorescent glass-ceramics, comprising:
the laser emission assembly is used for emitting laser beams and adjusting the laser beams; the processing assembly is used for two-dimensional scanning and light beam focusing processing; wherein the laser generating assembly comprises: the device comprises a laser 1 for emitting laser beams, a beam expander 2 for beam expanding and divergence angle processing, and a light blue 3 for filtering stray light and shaping the beams; the processing assembly comprises: the scanning device 5 is used for two-dimensional scanning, and the focusing mirror 6 is used for focusing and processing light beams, and the scanning device 5 is a two-dimensional scanning galvanometer; and a reflecting mirror 4 is arranged between the laser generating assembly and the processing assembly.
It can be understood that the fluorescent sheet is characterized by strong brittleness and fragility, and can effectively absorb blue photons and convert the blue photons into white light to be output. Meanwhile, the characteristics of high threshold required by processing need small focusing point and high power density. In addition, burrs generated by melting are taken into consideration, so that the laser adopts light with a wave band of more than 400nm in the processing device provided by the invention, and the pulse width of the laser is in a nanosecond level or a femtosecond level.
In the embodiment, green laser is selected as the wavelength selected for processing, the wavelength is not limited to green light in practice, the selected wavelength is contained in blue light above 405nm, and picosecond-level pulse width is selected on the laser pulse width, and meanwhile, the picosecond-level pulse width not only comprises picosecond level, and can be selectively used under nanosecond and femtosecond.
The wavelength of blue light can be selected, i.e. the wavelength of the laser is above 400nm, such as 510-550nm, 800nm, 1030nm, 1064nm, etc. The pulse width of the laser is chosen to be in the order of nanoseconds to femtoseconds, in this example the wavelength is 532nm and the pulse width is in the order of picoseconds.
Optionally, in the processing assembly, the scanning device may also be a rotating prism.
The fluorescent sheet has a small size of hundreds of micrometers, a circle and a circular arc of several millimeters, and even a size of tens of millimeters. The figures are circular, rectangular, circular arcs sleeved by rectangles, concentric rings and the like. The thickness of the phosphor sheet also has various specifications. Commonly used such as 0.15 mm; 0.3mm, etc.
The fluorescent sheet has the characteristics of strong brittleness and frangibility, and can effectively absorb blue light photons to be converted into white light for output. Meanwhile, the characteristics of high threshold required by processing need small focusing point and high power density. Again, the burr created by melting is taken into account. Therefore, picosecond green light is adopted in the design, and under the action of ultrashort pulses, the fluorescent sheet can fully absorb light energy, and the problem of overheating and melting of the fluorescent sheet is avoided.
The processing provided by the present invention is described in detail below.
S1, pasting a film;
in the scanning processing, due to the characteristic fragility of the fluorescent sheet and the splashing characteristic in the processing process, a layer of mucous membrane is required to be attached to the bottom of the fluorescent sheet in advance during the processing.
Further, due to the key-releasing factor after the fluorescent sheet is processed, the film needs to be capable of acting through an ultraviolet lamp or other heat source light sources, so that the colloid can be decomposed and lose activity.
Further pad pasting needs to be level and smooth, and no bubble can be in the clearance, avoids pasting insecurely, causes and splashes.
Further, the film is preferably a UV film having a thickness of 150 um.
S2, processing: the processing is divided into rectangular processing or round hole/annular processing;
when rectangular processing is carried out, due to the brittle characteristic and the excellent heat-conducting property of the fluorescent sheet, the situation that a single rectangular body is directly processed is avoided during processing, scanning is required to be carried out for multiple times in an overall cyclic processing mode, meanwhile, negative influence factors of excessive heat energy are considered, and further, a 'well' word line mode is adopted for overall scribing during processing.
Further avoid when processing arouses overheated problem in the position of # -shaped line intersect, carry out horizontal whole scanning or carry out vertical whole scanning first, the circulation is cut through the back, carries out whole scanning to another direction again.
Further to reduce the generation of glitches, a single line pattern is used on each scan lane of the well-word line.
After the cutting is finished, the rectangular burr is within 10um, and after the cutting is finished, the small rectangle at the millimeter level can be erected on the plane to be a standard.
And then, processing a round hole/annular processing by adopting a concentric circle model or a spiral line model, setting the distance between the parallel lines to be 5-20um, controlling the number of the parallel lines to be 2-10 and controlling the width of the whole runway to be 20-100 um. The progressive size of the lines in the racetrack may vary appropriately depending on spot size and power density.
And further, in a processing link, scanning and processing are carried out for multiple times by adopting an integral circulation mode.
Further, in the circular processing, the distribution of the circular patterns on the fluorescent sheets adopts a quincunx cloth plate mode with three tangent circles. Or an array mode is adopted, but the output of the fluorescent sheet is considered to adopt a quincunx distribution mode, after cutting is finished, the edge burrs are within 20um, the edge is clean and has no blackening, no edge breakage and no melting trace.
When a thicker fluorescent sheet is processed, the focus position of a focus shaft needs to be properly lifted, the cutting efficiency is improved by adopting focus lifting, and the focus lifting can adopt a dynamic galvanometer lifting mode or a galvanometer lifting mode replaced by a motor module. Each lifting is determined according to the Rayleigh focal depth of the focusing lens.
As shown in fig. 3 and 4, the effect of the rectangular and circular processing of the present invention is shown.
S3, membrane decomposition;
the mucosa adopts the UV membrane, and after finishing processing, send into the bale splitter with fluorescence piece and membrane together, the colloid decomposes the solidification, fluorescence piece and UV membrane viscidity reduction.
The glue dispenser adopts a high-power ultraviolet lamp, the power is between 200 and 400w, and the single-chip glue dispensing time is about 15 to 20 seconds.
S4, pouring the film;
and sticking the dispergated fluorescent sheet to another film with lower viscosity in a film-reversing mode. Further, the film has relatively strong flexibility, relatively low viscosity and relatively thin thickness of between 100 and 150 microns.
S5, expanding the membrane;
carry out diversified simultaneous stretching to the fluorescence piece that falls the membrane and film for fluorescence piece granule separates each other, and is great between the granule interval, is the millimeter level.
S6, detecting;
by visual identification, it is judged which fluorescent particles are good products and which products are bad products.
S7, placing a plate;
and (3) placing the qualified fluorescent sheet particles subjected to film expansion on a specific packaging film according to a set rule through automatic tray placing equipment to prepare a complete product, delivering the complete product to a packaging client, and entering a subsequent semiconductor packaging process.
The invention is mainly used for LED illumination, laser components, automobile lamps, fluorescence color-changing instruments, LED chips, laser semiconductors (LD), televisions and other semiconductors and related packaging industries.
While embodiments of the invention have been disclosed above, it is not limited to the applications listed in the description and the embodiments. It can be applied to all kinds of fields suitable for the present invention. Additional modifications will readily occur to those skilled in the art. It is therefore intended that the invention not be limited to the exact details and illustrations described and illustrated herein, but fall within the scope of the appended claims and equivalents thereof.
Claims (10)
1. The laser processing method of the fluorescent glass ceramic is characterized by comprising the following steps:
s1, film pasting: pasting a film on the fluorescent sheet to be processed;
s2, processing: processing the fluorescent sheet with the film by adopting a laser processing device;
s3, membrane decomposition: processing the fluorescent sheet with the film, and putting the processed fluorescent sheet into a glue-dissolving machine to reduce the viscosity of the film and the fluorescent sheet;
s4, film pouring: sticking the fluorescent sheet after the glue release on another adhesive film in a film-reversing mode;
s5, film expanding: stretching the inverted fluorescent sheet and the film in multiple directions simultaneously to separate fluorescent sheet particles from each other;
s6, checking: judging whether the fluorescent sheet particles are qualified or not by identifying the fluorescent sheet particles;
s7, swinging: and (4) placing the fluorescent sheet particles qualified for inspection on a packaging film for packaging through an automatic tray placing device according to a set rule.
2. The laser processing method of fluorescent glass-ceramic according to claim 1, wherein in step S1, the film is a UV film having a thickness of 150 um.
3. The laser processing method of a fluorescent glass-ceramic according to claim 1, wherein in the step of S2, when the rectangular shape is processed, the whole processing is performed using a well model.
4. The laser processing method of a fluorescent glass-ceramic according to claim 1, wherein in the step of S2, when processing a circular hole or a ring shape, a concentric circle pattern or a spiral pattern is used for processing.
5. The laser processing method of fluorescent glass-ceramic according to claim 3 or 4, wherein the laser processing apparatus further comprises a dynamic galvanometer mode, and the dynamic galvanometer mode is controlled by a motor to move up and down.
6. The laser processing method of fluorescent glass-ceramic as claimed in claim 1, wherein in step S3, the disperger employs an ultraviolet lamp with power of 200-400W, and the dispergation time is 15-20 seconds.
7. The laser processing method of fluorescent glass-ceramic as claimed in claim 1, wherein in step S4, the thickness of said thin film is between 100-150 um.
8. A laser processing apparatus for fluorescent glass-ceramics, comprising:
the laser emission assembly is used for emitting laser beams and adjusting the laser beams;
the processing assembly is used for two-dimensional scanning and light beam focusing processing;
wherein the content of the first and second substances,
the laser generating assembly includes: the device comprises a laser for emitting laser beams, a beam expander for expanding the beams and processing divergence angles, and a light blue for filtering stray light and shaping the beams;
the processing assembly comprises: the scanning device is used for two-dimensional scanning, and is a focusing mirror used for focusing and processing light beams, and the scanning device is a two-dimensional scanning galvanometer;
and a reflector is arranged between the laser generation assembly and the processing assembly.
9. The laser processing apparatus for fluorescent glass-ceramics of claim 8, wherein the laser uses light having a wavelength band of 400nm or more, and the pulse width of the laser is in the order of nanoseconds or femtoseconds.
10. The laser processing apparatus for fluorescent glass-ceramics of claim 8, wherein in the processing assembly, the scanning device can also be a rotating prism.
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| CN201911382974.XA CN111018334A (en) | 2019-12-28 | 2019-12-28 | Laser processing method and laser processing device for fluorescent glass ceramic |
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| CN201911382974.XA CN111018334A (en) | 2019-12-28 | 2019-12-28 | Laser processing method and laser processing device for fluorescent glass ceramic |
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| CN109994588A (en) * | 2017-12-31 | 2019-07-09 | 刘艳 | A kind of decomposition technique of LED chip |
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| US6970414B1 (en) * | 1998-11-25 | 2005-11-29 | Eugen Pavel | Three-dimensional optical memory with fluorescent photosensitive material |
| CN201087172Y (en) * | 2006-12-28 | 2008-07-16 | 上海市激光技术研究所 | Ultra-thin glass substrate laser cutting machine |
| CN101138807A (en) * | 2007-10-16 | 2008-03-12 | 友达光电股份有限公司 | Cutting equipment and cutting manufacturing technology |
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Application publication date: 20200417 |