CN111007338B - Device and method for measuring deformation of flexible electronic device in vacuum temperature-changing environment - Google Patents
Device and method for measuring deformation of flexible electronic device in vacuum temperature-changing environment Download PDFInfo
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- CN111007338B CN111007338B CN201911239339.6A CN201911239339A CN111007338B CN 111007338 B CN111007338 B CN 111007338B CN 201911239339 A CN201911239339 A CN 201911239339A CN 111007338 B CN111007338 B CN 111007338B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/20—Investigating strength properties of solid materials by application of mechanical stress by applying steady bending forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
- G01N2203/0023—Bending
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0058—Kind of property studied
- G01N2203/006—Crack, flaws, fracture or rupture
- G01N2203/0067—Fracture or rupture
Abstract
A flexible electronic device deformation measuring device and method under vacuum variable temperature environment, the device includes vacuum chamber, test piece bending mechanism, electric heating tube, refrigeration tube and heat sinking cylinder; a telescopic sliding table is arranged in the vacuum chamber, and the test piece bending mechanism is arranged on the telescopic sliding table; the heat sinking cylinder is arranged in the vacuum chamber, and the telescopic sliding table and the test piece bending mechanism are both positioned in the heat sinking cylinder; the refrigeration pipe and the electric heating pipe are respectively spirally wound and sleeved on the inner and outer cylinder walls of the heat sink cylinder; the vacuum chamber is internally provided with a nitrogen input pipe. The method comprises the following steps: evaporating an upper interdigital electrode on the surface of the flexible electronic device; clamping the flexible electronic device to a test piece bending mechanism; sealing the vacuum chamber; setting a bending speed, a bending angle, bending times, pressure intensity, a temperature before temperature changing and a temperature after temperature changing; vacuumizing; starting the electric heating pipe until reaching the temperature before temperature change; bending and twisting the flexible electronic device and starting the refrigerating pipe until the temperature reaches the temperature after the temperature is changed; filling nitrogen to restore normal pressure and normal temperature; and taking out the flexible electronic device.
Description
Technical Field
The invention belongs to the technical field of testing of flexible electronic devices, and particularly relates to a device and a method for measuring deformation of a flexible electronic device in a vacuum temperature-changing environment.
Background
In recent years, people have increasingly high demands on portability, flexibility, wearability and the like of electronic products, which effectively promote the rapid development of flexible electronic technology, and flexible electronic devices have been widely applied in many fields including information, energy, medical treatment and the like due to their unique flexibility and ductility.
At present, temperature factors are always influence factors which cannot be avoided by a flexible electronic device, the change of temperature can obviously influence the conductivity, the limiting voltage, the limiting current, the switching characteristic and the like of the flexible electronic device, particularly in high-latitude areas, the outdoor temperature can be reduced to below zero in winter, and the temperature of individual areas can even be reduced to below-20 ℃, taking a flexible display screen device as an example, the flexible display screen device can work at the variable temperature under the condition that the room temperature suddenly comes to the outdoor low-temperature environment, whether good ductility, good conductivity and other physicochemical optical characteristics can be maintained, whether the electronic device of the flexible display screen can normally work after being bent, and the flexible display screen device need to be tested before being delivered from a factory. However, the conventional test of the flexible electronic device is generally a test under constant temperature, that is, a certain temperature threshold is set and then the test is carried out, and the test result has obvious limitation because the use working condition under the condition of variable temperature is ignored.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a device and a method for measuring the deformation of a flexible electronic device in a vacuum temperature-changing environment, which can effectively simulate the use condition of the flexible electronic device in the temperature-changing environment, can measure whether the flexible electronic device can maintain good physicochemical optical properties such as ductility and conductivity in the temperature-changing environment, and can measure whether the flexible electronic device can normally work after being bent in the temperature-changing environment.
In order to achieve the purpose, the invention adopts the following technical scheme: a flexible electronic device deformation measuring device under a vacuum temperature-changing environment comprises a vacuum chamber, a test piece bending and twisting mechanism, an electric heating pipe, a refrigerating pipe and a heat sinking cylinder; the vacuum chamber is of a cylindrical structure and is horizontally arranged, a telescopic sliding table is horizontally arranged in the vacuum chamber, and the test piece bending mechanism is arranged on the telescopic sliding table; the heat sink cylinder is concentrically and fixedly arranged in the vacuum chamber, and the telescopic sliding table and the test piece bending mechanism are both positioned in the heat sink cylinder; the electric heating pipe is spirally wound and sleeved on the outer cylinder wall of the heat sink cylinder; the refrigeration pipe is spirally wound and sleeved on the inner cylinder wall of the hot sinking cylinder.
The test piece bending and twisting mechanism comprises a test piece bending driving motor, a lead screw, a nut slide block, a first test piece chuck, a test piece twisting driving motor, a transfer block, a second test piece chuck and a base; the base is arranged on the telescopic sliding table, the test piece bending driving motor is horizontally arranged on the base, a motor shaft of the test piece bending driving motor is connected with one end of a lead screw through a coupler, and the other end of the lead screw is connected to the base through a bearing; the screw sliding block is sleeved on the screw rod and can linearly move along the screw rod, and the first test piece chuck is hinged to the upper surface of the screw sliding block; the test piece distortion driving motor is horizontally arranged on the base, the installation height of the test piece distortion driving motor is larger than that of the test piece bending driving motor, the switching block is fixedly arranged on a motor shaft of the test piece distortion driving motor, the second test piece chuck is hinged to the switching block, and the flexible electronic device is clamped between the first test piece chuck and the second test piece chuck.
The test piece is characterized in that a nitrogen input pipe is arranged in a circumferential space between the test piece bending mechanism and the refrigerating pipe, a plurality of nitrogen nozzles are installed on a pipe body of the nitrogen input pipe, and the air injection direction of the nitrogen nozzles faces the surface of the flexible electronic device.
And a vacuum gauge is arranged on the wall of the vacuum chamber.
And a thermocouple is arranged on the wall of the vacuum chamber.
And an illuminating lamp is arranged on the telescopic sliding table.
And an observation window is arranged on the sealing door of the vacuum chamber.
The wall of the vacuum chamber is respectively provided with a high vacuum pumping hole and a low vacuum pumping hole.
A method for measuring the deformation of a flexible electronic device in a vacuum temperature-changing environment adopts a device for measuring the deformation of the flexible electronic device in the vacuum temperature-changing environment, and comprises the following steps:
the method comprises the following steps: selecting a flexible electronic device to be tested, evaporating an upper interdigital electrode on the surface of the flexible electronic device, and cleaning the surface of the flexible electronic device;
step two: opening a sealing door of the vacuum chamber, pulling the telescopic sliding table out of the vacuum chamber, and moving the test piece bending mechanism on the telescopic sliding table out of the vacuum chamber together;
step three: accurately clamping the flexible electronic device to be tested with the vapor-deposited interdigital electrode between a first test piece chuck and a second test piece chuck;
step four: pushing the telescopic sliding table into a vacuum chamber, moving a test piece bending mechanism clamping the flexible electronic device into the vacuum chamber together, closing a sealing door of the vacuum chamber, and simultaneously lighting an illuminating lamp;
step five: completing the parameter setting of bending speed, bending angle, bending times, twisting speed, twisting angle, twisting times, pressure, temperature before and after temperature changing in a computer;
step six: vacuumizing the inner cavity of the vacuum chamber to remove water vapor and oxygen in the inner cavity of the vacuum chamber, and selecting whether to introduce nitrogen into the inner cavity of the vacuum chamber according to a pressure set value until the pressure in the inner cavity of the vacuum chamber reaches the set value;
step seven: starting the electric heating pipe until the thermocouple detects that the actual temperature reaches a temperature set value before the temperature is changed, and then closing the electric heating pipe;
step eight: when the bending test of the flexible electronic device is carried out, starting a test piece bending driving motor, bending the flexible electronic device according to the set bending speed, bending angle and bending times, simultaneously starting a refrigerating pipe until the actual temperature detected by a thermocouple reaches a temperature set value after the temperature is changed, and then closing the test piece bending driving motor and the refrigerating pipe; when the distortion test of the flexible electronic device is carried out, starting a test piece distortion driving motor, twisting the flexible electronic device according to the set twisting speed, twisting angle and twisting frequency, simultaneously starting a refrigerating pipe until the actual temperature detected by a thermocouple reaches a temperature set value after the temperature is changed, and then closing the test piece distortion driving motor and the refrigerating pipe; when a bending or torsion test is carried out, current data and voltage data measured in real time are synchronously transmitted back to a computer through the interdigital electrode, and the current data and the voltage data are analyzed in real time through the computer;
step nine: and introducing nitrogen into the inner cavity of the vacuum chamber through the nitrogen input pipe until the pressure in the inner cavity of the vacuum chamber is balanced with the atmospheric pressure, opening a sealing door of the vacuum chamber after a thermocouple detects that the actual temperature is recovered to the room temperature, pulling the telescopic sliding table out of the vacuum chamber, taking down the flexible electronic device, observing the fracture condition of the flexible electronic device, and further carrying out physicochemical optical property test on the flexible electronic device if the flexible electronic device is not fractured.
The invention has the beneficial effects that:
the device and the method for measuring the deformation of the flexible electronic device in the vacuum temperature-changing environment can effectively simulate the use condition of the flexible electronic device in the temperature-changing environment, can measure whether the flexible electronic device can maintain good physicochemical optical properties such as ductility and conductivity in the temperature-changing environment, and can measure whether the flexible electronic device can normally work after being bent in the temperature-changing environment.
Drawings
FIG. 1 is a schematic structural diagram of a device for measuring deformation of a flexible electronic device in a vacuum temperature-varying environment according to the present invention;
FIG. 2 is a schematic structural diagram of a test piece bending mechanism of the present invention;
in the figure, 1-vacuum chamber, 2-test piece bending and twisting mechanism, 3-electric heating pipe, 4-refrigerating pipe, 5-heat sink, 6-telescopic sliding table, 7-test piece bending driving motor, 8-lead screw, 9-slide block, 10-first test piece chuck, 11-test piece twisting driving motor, 12-switching block, 13-second test piece chuck, 14-base, 15-flexible electronic device, 16-nitrogen input pipe, 17-nitrogen nozzle, 18-vacuum gauge, 19-thermocouple, 20-lighting lamp, 21-high vacuum pumping hole, 22-low vacuum pumping hole.
Detailed Description
The invention is described in further detail below with reference to the figures and the specific embodiments.
As shown in fig. 1 and 2, a device for measuring deformation of a flexible electronic device in a vacuum temperature-changing environment comprises a vacuum chamber 1, a test piece bending mechanism 2, an electric heating pipe 3, a refrigerating pipe 4 and a heat sink barrel 5; the vacuum chamber 1 is of a cylindrical structure, the vacuum chamber 1 is horizontally arranged, a telescopic sliding table 6 is horizontally arranged in the vacuum chamber 1, and the test piece bending mechanism 2 is arranged on the telescopic sliding table 5; the heat sinking cylinder 5 is concentrically and fixedly arranged in the vacuum chamber 1, and the telescopic sliding table 6 and the test piece bending and twisting mechanism 2 are both positioned in the heat sinking cylinder 5; the electric heating pipe 3 is spirally wound and sleeved on the outer cylinder wall of the heat sinking cylinder 5; the refrigeration pipe 4 is spirally wound and sleeved on the inner wall of the hot sinking cylinder 5.
The test piece bending and twisting mechanism 2 comprises a test piece bending driving motor 7, a lead screw 8, a nut slide block 9, a first test piece chuck 10, a test piece twisting driving motor 11, a switching block 12, a second test piece chuck 13 and a base 14; the base 14 is installed on the telescopic sliding table 5, the test piece bending driving motor 7 is horizontally installed on the base 14, a motor shaft of the test piece bending driving motor 7 is connected with one end of a screw rod 8 through a coupler, and the other end of the screw rod 8 is connected to the base 14 through a bearing; the screw sliding block 9 is sleeved on the screw 8, the screw sliding block 9 can move linearly along the screw 8, and the first test piece chuck 10 is hinged to the upper surface of the screw sliding block 9; the test piece distortion driving motor 11 is horizontally arranged on the base 14, the installation height of the test piece distortion driving motor 11 is larger than that of the test piece bending driving motor 7, the transfer block 12 is fixedly arranged on a motor shaft of the test piece distortion driving motor 11, the second test piece chuck 13 is hinged on the transfer block 12, and the flexible electronic device 15 is clamped between the first test piece chuck 10 and the second test piece chuck 13.
A nitrogen input pipe 16 is arranged in the circumferential space between the test piece bending mechanism 2 and the refrigerating pipe 4, a plurality of nitrogen nozzles 17 are mounted on the pipe body of the nitrogen input pipe 16, and the air injection direction of the nitrogen nozzles 17 faces the surface of the flexible electronic device 15.
The wall of the vacuum chamber 1 is provided with a vacuum gauge 18, and the pressure change of the inner cavity of the vacuum chamber 1 is detected in real time through the vacuum gauge 18.
A thermocouple 19 is installed on the wall of the vacuum chamber 1, and the temperature change is detected in real time through the thermocouple 19.
Install light 20 on telescopic slip table 5 be provided with the observation window on real empty room 1's the sealing door, because real empty room 1 seals the back, real empty room 1 is inside can be very dim, can't be through the audio-visual test piece turn round condition of watching of observation window, lights light 20 this moment after, can illuminate real empty room 1 inner chamber space, this moment through the observation window alright clear audio-visual test piece turn round condition of watching.
The wall of the vacuum chamber 1 is respectively provided with a high vacuum pumping hole 21 and a low vacuum pumping hole 22, the caliber of the low vacuum pumping hole 22 is larger than that of the high vacuum pumping hole 21, the low vacuum pumping hole 22 is used for quickly pumping air at the initial stage, and the high vacuum pumping hole 21 is used for finely pumping air at the later stage so as to ensure the requirement of vacuum degree.
A method for measuring the deformation of a flexible electronic device in a vacuum temperature-changing environment adopts a device for measuring the deformation of the flexible electronic device in the vacuum temperature-changing environment, and comprises the following steps:
the method comprises the following steps: selecting a flexible electronic device 15 to be tested, evaporating and plating an interdigital electrode on the surface of the flexible electronic device 15, and cleaning the surface of the flexible electronic device 15;
step two: opening a sealing door of the vacuum chamber 1, pulling the telescopic sliding table 5 out of the vacuum chamber 1, and moving the test piece bending mechanism 2 on the telescopic sliding table out of the vacuum chamber 1 together;
step three: accurately clamping the to-be-tested flexible electronic device 15 with the vapor-deposited interdigital electrode between a first test piece chuck 10 and a second test piece chuck 13;
step four: pushing the telescopic sliding table 5 into the vacuum chamber 1 to move the test piece bending mechanism 2 holding the flexible electronic device 15 into the vacuum chamber 1 together, then closing a sealing door of the vacuum chamber 1 and simultaneously lighting the illuminating lamp 20;
step five: completing the parameter setting of bending speed, bending angle, bending times, twisting speed, twisting angle, twisting times, pressure, temperature before and after temperature changing in a computer;
step six: vacuumizing the inner cavity of the vacuum chamber 1 to remove water vapor and oxygen in the inner cavity of the vacuum chamber 1, and selecting whether to introduce nitrogen into the inner cavity of the vacuum chamber 1 according to a pressure set value until the pressure in the inner cavity of the vacuum chamber 1 reaches the set value;
step seven: starting the electric heating tube 3 until the thermocouple 19 detects that the actual temperature reaches the temperature set value before the temperature changes, and then closing the electric heating tube 3;
step eight: when the bending test of the flexible electronic device 15 is carried out, starting the test piece bending driving motor 7, bending the flexible electronic device 15 according to the set bending speed, bending angle and bending times, simultaneously starting the refrigerating tube 4 until the thermocouple 19 detects that the actual temperature reaches the temperature set value after the temperature is changed, and then closing the test piece bending driving motor 7 and the refrigerating tube 4; when the distortion test of the flexible electronic device 15 is carried out, starting the test piece distortion driving motor 11, twisting the flexible electronic device 15 according to the set twisting speed, twisting angle and twisting frequency, simultaneously starting the refrigerating tube 4 until the thermocouple 19 detects that the actual temperature reaches the temperature set value after the temperature is changed, and then closing the test piece distortion driving motor 11 and the refrigerating tube 4; when a bending or torsion test is carried out, current data and voltage data measured in real time are synchronously transmitted back to a computer through the interdigital electrode, and the current data and the voltage data are analyzed in real time through the computer; in this embodiment, a PID control system is used to realize accurate temperature control in the whole process.
Step nine: introducing nitrogen into the inner cavity of the vacuum chamber 1 through the nitrogen input pipe 16 until the pressure in the inner cavity of the vacuum chamber 1 is balanced with the atmospheric pressure, opening a sealing door of the vacuum chamber 1 after the thermocouple 19 detects that the actual temperature is recovered to the room temperature, pulling the telescopic sliding table 5 out of the vacuum chamber 1, taking down the flexible electronic device 15, observing the fracture condition of the flexible electronic device 15, and further performing physicochemical optical property test on the flexible electronic device 15 if the flexible electronic device 15 is not fractured.
The embodiments are not intended to limit the scope of the present invention, and all equivalent implementations or modifications without departing from the scope of the present invention are intended to be included in the scope of the present invention.
Claims (2)
1. The utility model provides a flexible electron device deformation measuring device under vacuum alternating temperature environment which characterized in that: comprises a vacuum chamber, a test piece bending and twisting mechanism, an electric heating pipe, a refrigeration pipe and a heat sinking cylinder; the vacuum chamber is of a cylindrical structure and is horizontally arranged, a telescopic sliding table is horizontally arranged in the vacuum chamber, and the test piece bending mechanism is arranged on the telescopic sliding table; the heat sink cylinder is concentrically and fixedly arranged in the vacuum chamber, and the telescopic sliding table and the test piece bending mechanism are both positioned in the heat sink cylinder; the electric heating pipe is spirally wound and sleeved on the outer cylinder wall of the heat sink cylinder; the cooling pipe is spirally wound and sleeved on the inner cylinder wall of the hot sinking cylinder; the test piece bending and twisting mechanism comprises a test piece bending driving motor, a lead screw, a nut slide block, a first test piece chuck, a test piece twisting driving motor, a transfer block, a second test piece chuck and a base; the base is arranged on the telescopic sliding table, the test piece bending driving motor is horizontally arranged on the base, a motor shaft of the test piece bending driving motor is connected with one end of a lead screw through a coupler, and the other end of the lead screw is connected to the base through a bearing; the screw sliding block is sleeved on the screw rod and can linearly move along the screw rod, and the first test piece chuck is hinged to the upper surface of the screw sliding block; the test piece distortion driving motor is horizontally arranged on the base, the installation height of the test piece distortion driving motor is larger than that of the test piece bending driving motor, the switching block is fixedly arranged on a motor shaft of the test piece distortion driving motor, the second test piece chuck is hinged on the switching block, and the flexible electronic device is clamped between the first test piece chuck and the second test piece chuck; a nitrogen input pipe is arranged in the circumferential space between the test piece bending mechanism and the refrigerating pipe, a plurality of nitrogen nozzles are mounted on the pipe body of the nitrogen input pipe, and the air injection direction of the nitrogen nozzles faces the surface of the flexible electronic device; a vacuum gauge is arranged on the wall of the vacuum chamber; a thermocouple is arranged on the wall of the vacuum chamber; an illuminating lamp is arranged on the telescopic sliding table; an observation window is arranged on the sealing door of the vacuum chamber; the wall of the vacuum chamber is respectively provided with a high vacuum pumping hole and a low vacuum pumping hole.
2. A method for measuring the deformation of a flexible electronic device in a vacuum temperature-changing environment by using the device for measuring the deformation of the flexible electronic device in the vacuum temperature-changing environment as claimed in claim 1 is characterized by comprising the following steps:
the method comprises the following steps: selecting a flexible electronic device to be tested, evaporating an upper interdigital electrode on the surface of the flexible electronic device, and cleaning the surface of the flexible electronic device;
step two: opening a sealing door of the vacuum chamber, pulling the telescopic sliding table out of the vacuum chamber, and moving the test piece bending mechanism on the telescopic sliding table out of the vacuum chamber together;
step three: accurately clamping the flexible electronic device to be tested with the vapor-deposited interdigital electrode between a first test piece chuck and a second test piece chuck;
step four: pushing the telescopic sliding table into a vacuum chamber, moving a test piece bending mechanism clamping the flexible electronic device into the vacuum chamber together, closing a sealing door of the vacuum chamber, and simultaneously lighting an illuminating lamp;
step five: completing the parameter setting of bending speed, bending angle, bending times, twisting speed, twisting angle, twisting times, pressure, temperature before and after temperature changing in a computer;
step six: vacuumizing the inner cavity of the vacuum chamber to remove water vapor and oxygen in the inner cavity of the vacuum chamber, and selecting whether to introduce nitrogen into the inner cavity of the vacuum chamber according to a pressure set value until the pressure in the inner cavity of the vacuum chamber reaches the set value;
step seven: starting the electric heating pipe until the thermocouple detects that the actual temperature reaches a temperature set value before the temperature is changed, and then closing the electric heating pipe;
step eight: when the bending test of the flexible electronic device is carried out, starting a test piece bending driving motor, bending the flexible electronic device according to the set bending speed, bending angle and bending times, simultaneously starting a refrigerating pipe until the actual temperature detected by a thermocouple reaches a temperature set value after the temperature is changed, and then closing the test piece bending driving motor and the refrigerating pipe; when the distortion test of the flexible electronic device is carried out, starting a test piece distortion driving motor, twisting the flexible electronic device according to the set twisting speed, twisting angle and twisting frequency, simultaneously starting a refrigerating pipe until the actual temperature detected by a thermocouple reaches a temperature set value after the temperature is changed, and then closing the test piece distortion driving motor and the refrigerating pipe; when a bending or torsion test is carried out, current data and voltage data measured in real time are synchronously transmitted back to a computer through the interdigital electrode, and the current data and the voltage data are analyzed in real time through the computer;
step nine: and introducing nitrogen into the inner cavity of the vacuum chamber through the nitrogen input pipe until the pressure in the inner cavity of the vacuum chamber is balanced with the atmospheric pressure, opening a sealing door of the vacuum chamber after a thermocouple detects that the actual temperature is recovered to the room temperature, pulling the telescopic sliding table out of the vacuum chamber, taking down the flexible electronic device, observing the fracture condition of the flexible electronic device, and further carrying out physicochemical optical property test on the flexible electronic device if the flexible electronic device is not fractured.
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| CN201911239339.6A CN111007338B (en) | 2019-12-06 | 2019-12-06 | Device and method for measuring deformation of flexible electronic device in vacuum temperature-changing environment |
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| CN201911239339.6A CN111007338B (en) | 2019-12-06 | 2019-12-06 | Device and method for measuring deformation of flexible electronic device in vacuum temperature-changing environment |
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| CN111007338B true CN111007338B (en) | 2021-09-07 |
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| CN111624093A (en) * | 2020-07-08 | 2020-09-04 | 重庆渝微电子技术研究院有限公司 | Two-dimensional flexible material testing system |
| CN111780661B (en) * | 2020-07-22 | 2021-10-08 | 华中科技大学 | Method and system for accurately measuring bending strain of flexible electronic device |
| CN116499894B (en) * | 2023-06-30 | 2023-08-25 | 江苏弘光显示技术有限公司 | Flexible screen bending testing device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5984524A (en) * | 1997-03-18 | 1999-11-16 | Fujitsu Limited | Apparatus and method for testing product heat-resistance |
| CN101886978A (en) * | 2010-07-07 | 2010-11-17 | 四川大学 | Vacuum high/low temperature environmental simulation electromechanical transmission mechanism comprehensive performance experimental system |
| CN102001617A (en) * | 2010-09-28 | 2011-04-06 | 清华大学 | Displacement loading device and method for flexible electronic device |
| CN105334112A (en) * | 2015-09-24 | 2016-02-17 | 合肥通用机械研究院 | Creep fatigue test device under high-temperature vacuum inflatable environment |
| CN107941161A (en) * | 2017-11-27 | 2018-04-20 | 上海卫星装备研究所 | A kind of antenna plane thermal deformation non-contact measurement system under hot vacuum environment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104777050B (en) * | 2015-04-17 | 2017-06-20 | 东北大学 | A kind of resistance changing film low temperature bending tester and method of testing |
| CN109693366A (en) * | 2019-01-22 | 2019-04-30 | 威海新元化工有限公司 | A kind of experimental provision and method of bi-directional synchronization oriented film |
-
2019
- 2019-12-06 CN CN201911239339.6A patent/CN111007338B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5984524A (en) * | 1997-03-18 | 1999-11-16 | Fujitsu Limited | Apparatus and method for testing product heat-resistance |
| CN101886978A (en) * | 2010-07-07 | 2010-11-17 | 四川大学 | Vacuum high/low temperature environmental simulation electromechanical transmission mechanism comprehensive performance experimental system |
| CN102001617A (en) * | 2010-09-28 | 2011-04-06 | 清华大学 | Displacement loading device and method for flexible electronic device |
| CN105334112A (en) * | 2015-09-24 | 2016-02-17 | 合肥通用机械研究院 | Creep fatigue test device under high-temperature vacuum inflatable environment |
| CN107941161A (en) * | 2017-11-27 | 2018-04-20 | 上海卫星装备研究所 | A kind of antenna plane thermal deformation non-contact measurement system under hot vacuum environment |
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