CN111007338A - A device and method for measuring deformation of flexible electronic devices in a vacuum variable temperature environment - Google Patents
A device and method for measuring deformation of flexible electronic devices in a vacuum variable temperature environment Download PDFInfo
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- CN111007338A CN111007338A CN201911239339.6A CN201911239339A CN111007338A CN 111007338 A CN111007338 A CN 111007338A CN 201911239339 A CN201911239339 A CN 201911239339A CN 111007338 A CN111007338 A CN 111007338A
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- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000012360 testing method Methods 0.000 claims abstract description 109
- 238000005452 bending Methods 0.000 claims abstract description 72
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 48
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 25
- 238000005485 electric heating Methods 0.000 claims abstract description 16
- 238000005057 refrigeration Methods 0.000 claims abstract description 7
- 238000001704 evaporation Methods 0.000 claims abstract description 4
- 238000005086 pumping Methods 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 12
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000012546 transfer Methods 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 abstract 1
- 238000005259 measurement Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
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- G—PHYSICS
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/20—Investigating strength properties of solid materials by application of mechanical stress by applying steady bending forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
- G01N2203/0023—Bending
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0058—Kind of property studied
- G01N2203/006—Crack, flaws, fracture or rupture
- G01N2203/0067—Fracture or rupture
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Abstract
一种真空变温环境下柔性电子器件形变测量装置及方法，装置包括真空室、试件弯扭机构、电加热管、制冷管及热沉筒；真空室内设有伸缩式滑台，试件弯扭机构设在伸缩式滑台上；热沉筒安装在真空室内，伸缩式滑台和试件弯扭机构均位于热沉筒内部；制冷管和电加热管分别螺旋缠绕套装在热沉筒内外筒壁上；真空室内设有设有氮气输入管。方法为：在柔性电子器件表面蒸镀上叉指电极；将柔性电子器件夹持到试件弯扭机构中；封闭真空室；设定弯扭速度、弯扭角度、弯扭次数、压强、变温前温度及变温后温度；抽真空；启动电加热管，直到达到变温前温度；对柔性电子器件进行弯扭且启动制冷管，直到达到变温后温度；充氮气恢复常压常温；取出柔性电子器件。
A flexible electronic device deformation measurement device and method in a vacuum temperature-variable environment, the device comprises a vacuum chamber, a test piece bending and twisting mechanism, an electric heating tube, a refrigeration tube and a heat sink; The mechanism is set on the telescopic sliding table; the heat sink tube is installed in the vacuum chamber, and the telescopic sliding table and the specimen bending and torsion mechanism are located inside the heat sink tube; the refrigeration tube and the electric heating tube are spirally wrapped around the inner and outer tubes of the heat sink tube. On the wall; a nitrogen input pipe is provided in the vacuum chamber. The method is as follows: evaporation of interdigitated electrodes on the surface of the flexible electronic device; clamping the flexible electronic device in the bending and twisting mechanism of the specimen; closing the vacuum chamber; Before and after temperature change; vacuumize; start the electric heating tube until the temperature before the temperature change is reached; bend and twist the flexible electronic device and start the refrigeration tube until the temperature after the temperature change is reached; fill with nitrogen to return to normal pressure and normal temperature; take out the flexible electronic device .
Description
Technical Field
The invention belongs to the technical field of testing of flexible electronic devices, and particularly relates to a device and a method for measuring deformation of a flexible electronic device in a vacuum temperature-changing environment.
Background
In recent years, people have increasingly high demands on portability, flexibility, wearability and the like of electronic products, which effectively promote the rapid development of flexible electronic technology, and flexible electronic devices have been widely applied in many fields including information, energy, medical treatment and the like due to their unique flexibility and ductility.
At present, temperature factors are always influence factors which cannot be avoided by a flexible electronic device, the change of temperature can obviously influence the conductivity, the limiting voltage, the limiting current, the switching characteristic and the like of the flexible electronic device, particularly in high-latitude areas, the outdoor temperature can be reduced to below zero in winter, and the temperature of individual areas can even be reduced to below-20 ℃, taking a flexible display screen device as an example, the flexible display screen device can work at the variable temperature under the condition that the room temperature suddenly comes to the outdoor low-temperature environment, whether good ductility, good conductivity and other physicochemical optical characteristics can be maintained, whether the electronic device of the flexible display screen can normally work after being bent, and the flexible display screen device need to be tested before being delivered from a factory. However, the conventional test of the flexible electronic device is generally a test under constant temperature, that is, a certain temperature threshold is set and then the test is carried out, and the test result has obvious limitation because the use working condition under the condition of variable temperature is ignored.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a device and a method for measuring the deformation of a flexible electronic device in a vacuum temperature-changing environment, which can effectively simulate the use condition of the flexible electronic device in the temperature-changing environment, can measure whether the flexible electronic device can maintain good physicochemical optical properties such as ductility and conductivity in the temperature-changing environment, and can measure whether the flexible electronic device can normally work after being bent in the temperature-changing environment.
In order to achieve the purpose, the invention adopts the following technical scheme: a flexible electronic device deformation measuring device under a vacuum temperature-changing environment comprises a vacuum chamber, a test piece bending and twisting mechanism, an electric heating pipe, a refrigerating pipe and a heat sinking cylinder; the vacuum chamber is of a cylindrical structure and is horizontally arranged, a telescopic sliding table is horizontally arranged in the vacuum chamber, and the test piece bending mechanism is arranged on the telescopic sliding table; the heat sink cylinder is concentrically and fixedly arranged in the vacuum chamber, and the telescopic sliding table and the test piece bending mechanism are both positioned in the heat sink cylinder; the electric heating pipe is spirally wound and sleeved on the outer cylinder wall of the heat sink cylinder; the refrigeration pipe is spirally wound and sleeved on the inner cylinder wall of the hot sinking cylinder.
The test piece bending and twisting mechanism comprises a test piece bending driving motor, a lead screw, a nut slide block, a first test piece chuck, a test piece twisting driving motor, a transfer block, a second test piece chuck and a base; the base is arranged on the telescopic sliding table, the test piece bending driving motor is horizontally arranged on the base, a motor shaft of the test piece bending driving motor is connected with one end of a lead screw through a coupler, and the other end of the lead screw is connected to the base through a bearing; the screw sliding block is sleeved on the screw rod and can linearly move along the screw rod, and the first test piece chuck is hinged to the upper surface of the screw sliding block; the test piece distortion driving motor is horizontally arranged on the base, the installation height of the test piece distortion driving motor is larger than that of the test piece bending driving motor, the switching block is fixedly arranged on a motor shaft of the test piece distortion driving motor, the second test piece chuck is hinged to the switching block, and the flexible electronic device is clamped between the first test piece chuck and the second test piece chuck.
The test piece is characterized in that a nitrogen input pipe is arranged in a circumferential space between the test piece bending mechanism and the refrigerating pipe, a plurality of nitrogen nozzles are installed on a pipe body of the nitrogen input pipe, and the air injection direction of the nitrogen nozzles faces the surface of the flexible electronic device.
And a vacuum gauge is arranged on the wall of the vacuum chamber.
And a thermocouple is arranged on the wall of the vacuum chamber.
And an illuminating lamp is arranged on the telescopic sliding table.
And an observation window is arranged on the sealing door of the vacuum chamber.
The wall of the vacuum chamber is respectively provided with a high vacuum pumping hole and a low vacuum pumping hole.
A method for measuring the deformation of a flexible electronic device in a vacuum temperature-changing environment adopts a device for measuring the deformation of the flexible electronic device in the vacuum temperature-changing environment, and comprises the following steps:
the method comprises the following steps: selecting a flexible electronic device to be tested, evaporating an upper interdigital electrode on the surface of the flexible electronic device, and cleaning the surface of the flexible electronic device;
step two: opening a sealing door of the vacuum chamber, pulling the telescopic sliding table out of the vacuum chamber, and moving the test piece bending mechanism on the telescopic sliding table out of the vacuum chamber together;
step three: accurately clamping the flexible electronic device to be tested with the vapor-deposited interdigital electrode between a first test piece chuck and a second test piece chuck;
step four: pushing the telescopic sliding table into a vacuum chamber, moving a test piece bending mechanism clamping the flexible electronic device into the vacuum chamber together, closing a sealing door of the vacuum chamber, and simultaneously lighting an illuminating lamp;
step five: completing the parameter setting of bending speed, bending angle, bending times, twisting speed, twisting angle, twisting times, pressure, temperature before and after temperature changing in a computer;
step six: vacuumizing the inner cavity of the vacuum chamber to remove water vapor and oxygen in the inner cavity of the vacuum chamber, and selecting whether to introduce nitrogen into the inner cavity of the vacuum chamber according to a pressure set value until the pressure in the inner cavity of the vacuum chamber reaches the set value;
step seven: starting the electric heating pipe until the thermocouple detects that the actual temperature reaches a temperature set value before the temperature is changed, and then closing the electric heating pipe;
step eight: when the bending test of the flexible electronic device is carried out, starting a test piece bending driving motor, bending the flexible electronic device according to the set bending speed, bending angle and bending times, simultaneously starting a refrigerating pipe until the actual temperature detected by a thermocouple reaches a temperature set value after the temperature is changed, and then closing the test piece bending driving motor and the refrigerating pipe; when the distortion test of the flexible electronic device is carried out, starting a test piece distortion driving motor, twisting the flexible electronic device according to the set twisting speed, twisting angle and twisting frequency, simultaneously starting a refrigerating pipe until the actual temperature detected by a thermocouple reaches a temperature set value after the temperature is changed, and then closing the test piece distortion driving motor and the refrigerating pipe; when a bending or torsion test is carried out, current data and voltage data measured in real time are synchronously transmitted back to a computer through the interdigital electrode, and the current data and the voltage data are analyzed in real time through the computer;
step nine: and introducing nitrogen into the inner cavity of the vacuum chamber through the nitrogen input pipe until the pressure in the inner cavity of the vacuum chamber is balanced with the atmospheric pressure, opening a sealing door of the vacuum chamber after a thermocouple detects that the actual temperature is recovered to the room temperature, pulling the telescopic sliding table out of the vacuum chamber, taking down the flexible electronic device, observing the fracture condition of the flexible electronic device, and further carrying out physicochemical optical property test on the flexible electronic device if the flexible electronic device is not fractured.
The invention has the beneficial effects that:
the device and the method for measuring the deformation of the flexible electronic device in the vacuum temperature-changing environment can effectively simulate the use condition of the flexible electronic device in the temperature-changing environment, can measure whether the flexible electronic device can maintain good physicochemical optical properties such as ductility and conductivity in the temperature-changing environment, and can measure whether the flexible electronic device can normally work after being bent in the temperature-changing environment.
Drawings
FIG. 1 is a schematic structural diagram of a device for measuring deformation of a flexible electronic device in a vacuum temperature-varying environment according to the present invention;
FIG. 2 is a schematic structural diagram of a test piece bending mechanism of the present invention;
in the figure, 1-vacuum chamber, 2-test piece bending and twisting mechanism, 3-electric heating pipe, 4-refrigerating pipe, 5-heat sink, 6-telescopic sliding table, 7-test piece bending driving motor, 8-lead screw, 9-slide block, 10-first test piece chuck, 11-test piece twisting driving motor, 12-switching block, 13-second test piece chuck, 14-base, 15-flexible electronic device, 16-nitrogen input pipe, 17-nitrogen nozzle, 18-vacuum gauge, 19-thermocouple, 20-lighting lamp, 21-high vacuum pumping hole, 22-low vacuum pumping hole.
Detailed Description
The invention is described in further detail below with reference to the figures and the specific embodiments.
As shown in fig. 1 and 2, a device for measuring deformation of a flexible electronic device in a vacuum temperature-changing environment comprises a vacuum chamber 1, a test piece bending mechanism 2, an electric heating pipe 3, a refrigerating pipe 4 and a heat sink barrel 5; the vacuum chamber 1 is of a cylindrical structure, the vacuum chamber 1 is horizontally arranged, a telescopic sliding table 6 is horizontally arranged in the vacuum chamber 1, and the test piece bending mechanism 2 is arranged on the telescopic sliding table 5; the heat sinking cylinder 5 is concentrically and fixedly arranged in the vacuum chamber 1, and the telescopic sliding table 6 and the test piece bending and twisting mechanism 2 are both positioned in the heat sinking cylinder 5; the electric heating pipe 3 is spirally wound and sleeved on the outer cylinder wall of the heat sinking cylinder 5; the refrigeration pipe 4 is spirally wound and sleeved on the inner wall of the hot sinking cylinder 5.
The test piece bending and twisting mechanism 2 comprises a test piece bending driving motor 7, a lead screw 8, a nut slide block 9, a first test piece chuck 10, a test piece twisting driving motor 11, a switching block 12, a second test piece chuck 13 and a base 14; the base 14 is installed on the telescopic sliding table 5, the test piece bending driving motor 7 is horizontally installed on the base 14, a motor shaft of the test piece bending driving motor 7 is connected with one end of a screw rod 8 through a coupler, and the other end of the screw rod 8 is connected to the base 14 through a bearing; the screw sliding block 9 is sleeved on the screw 8, the screw sliding block 9 can move linearly along the screw 8, and the first test piece chuck 10 is hinged to the upper surface of the screw sliding block 9; the test piece distortion driving motor 11 is horizontally arranged on the base 14, the installation height of the test piece distortion driving motor 11 is larger than that of the test piece bending driving motor 7, the transfer block 12 is fixedly arranged on a motor shaft of the test piece distortion driving motor 11, the second test piece chuck 13 is hinged on the transfer block 12, and the flexible electronic device 15 is clamped between the first test piece chuck 10 and the second test piece chuck 13.
A nitrogen input pipe 16 is arranged in the circumferential space between the test piece bending mechanism 2 and the refrigerating pipe 4, a plurality of nitrogen nozzles 17 are mounted on the pipe body of the nitrogen input pipe 16, and the air injection direction of the nitrogen nozzles 17 faces the surface of the flexible electronic device 15.
The wall of the vacuum chamber 1 is provided with a vacuum gauge 18, and the pressure change of the inner cavity of the vacuum chamber 1 is detected in real time through the vacuum gauge 18.
A thermocouple 19 is installed on the wall of the vacuum chamber 1, and the temperature change is detected in real time through the thermocouple 19.
Install light 20 on telescopic slip table 5 be provided with the observation window on real empty room 1's the sealing door, because real empty room 1 seals the back, real empty room 1 is inside can be very dim, can't be through the audio-visual test piece turn round condition of watching of observation window, lights light 20 this moment after, can illuminate real empty room 1 inner chamber space, this moment through the observation window alright clear audio-visual test piece turn round condition of watching.
The wall of the vacuum chamber 1 is respectively provided with a high vacuum pumping hole 21 and a low vacuum pumping hole 22, the caliber of the low vacuum pumping hole 22 is larger than that of the high vacuum pumping hole 21, the low vacuum pumping hole 22 is used for quickly pumping air at the initial stage, and the high vacuum pumping hole 21 is used for finely pumping air at the later stage so as to ensure the requirement of vacuum degree.
A method for measuring the deformation of a flexible electronic device in a vacuum temperature-changing environment adopts a device for measuring the deformation of the flexible electronic device in the vacuum temperature-changing environment, and comprises the following steps:
the method comprises the following steps: selecting a flexible electronic device 15 to be tested, evaporating and plating an interdigital electrode on the surface of the flexible electronic device 15, and cleaning the surface of the flexible electronic device 15;
step two: opening a sealing door of the vacuum chamber 1, pulling the telescopic sliding table 5 out of the vacuum chamber 1, and moving the test piece bending mechanism 2 on the telescopic sliding table out of the vacuum chamber 1 together;
step three: accurately clamping the to-be-tested flexible electronic device 15 with the vapor-deposited interdigital electrode between a first test piece chuck 10 and a second test piece chuck 13;
step four: pushing the telescopic sliding table 5 into the vacuum chamber 1 to move the test piece bending mechanism 2 holding the flexible electronic device 15 into the vacuum chamber 1 together, then closing a sealing door of the vacuum chamber 1 and simultaneously lighting the illuminating lamp 20;
step five: completing the parameter setting of bending speed, bending angle, bending times, twisting speed, twisting angle, twisting times, pressure, temperature before and after temperature changing in a computer;
step six: vacuumizing the inner cavity of the vacuum chamber 1 to remove water vapor and oxygen in the inner cavity of the vacuum chamber 1, and selecting whether to introduce nitrogen into the inner cavity of the vacuum chamber 1 according to a pressure set value until the pressure in the inner cavity of the vacuum chamber 1 reaches the set value;
step seven: starting the electric heating tube 3 until the thermocouple 19 detects that the actual temperature reaches the temperature set value before the temperature changes, and then closing the electric heating tube 3;
step eight: when the bending test of the flexible electronic device 15 is carried out, starting the test piece bending driving motor 7, bending the flexible electronic device 15 according to the set bending speed, bending angle and bending times, simultaneously starting the refrigerating tube 4 until the thermocouple 19 detects that the actual temperature reaches the temperature set value after the temperature is changed, and then closing the test piece bending driving motor 7 and the refrigerating tube 4; when the distortion test of the flexible electronic device 15 is carried out, starting the test piece distortion driving motor 11, twisting the flexible electronic device 15 according to the set twisting speed, twisting angle and twisting frequency, simultaneously starting the refrigerating tube 4 until the thermocouple 19 detects that the actual temperature reaches the temperature set value after the temperature is changed, and then closing the test piece distortion driving motor 11 and the refrigerating tube 4; when a bending or torsion test is carried out, current data and voltage data measured in real time are synchronously transmitted back to a computer through the interdigital electrode, and the current data and the voltage data are analyzed in real time through the computer; in this embodiment, a PID control system is used to realize accurate temperature control in the whole process.
Step nine: introducing nitrogen into the inner cavity of the vacuum chamber 1 through the nitrogen input pipe 16 until the pressure in the inner cavity of the vacuum chamber 1 is balanced with the atmospheric pressure, opening a sealing door of the vacuum chamber 1 after the thermocouple 19 detects that the actual temperature is recovered to the room temperature, pulling the telescopic sliding table 5 out of the vacuum chamber 1, taking down the flexible electronic device 15, observing the fracture condition of the flexible electronic device 15, and further performing physicochemical optical property test on the flexible electronic device 15 if the flexible electronic device 15 is not fractured.
The embodiments are not intended to limit the scope of the present invention, and all equivalent implementations or modifications without departing from the scope of the present invention are intended to be included in the scope of the present invention.
Claims (9)
1. The utility model provides a flexible electron device deformation measuring device under vacuum alternating temperature environment which characterized in that: comprises a vacuum chamber, a test piece bending and twisting mechanism, an electric heating pipe, a refrigeration pipe and a heat sinking cylinder; the vacuum chamber is of a cylindrical structure and is horizontally arranged, a telescopic sliding table is horizontally arranged in the vacuum chamber, and the test piece bending mechanism is arranged on the telescopic sliding table; the heat sink cylinder is concentrically and fixedly arranged in the vacuum chamber, and the telescopic sliding table and the test piece bending mechanism are both positioned in the heat sink cylinder; the electric heating pipe is spirally wound and sleeved on the outer cylinder wall of the heat sink cylinder; the refrigeration pipe is spirally wound and sleeved on the inner cylinder wall of the hot sinking cylinder.
2. The device for measuring the deformation of the flexible electronic device in the vacuum temperature-changing environment according to claim 1, wherein: the test piece bending and twisting mechanism comprises a test piece bending driving motor, a lead screw, a nut slide block, a first test piece chuck, a test piece twisting driving motor, a transfer block, a second test piece chuck and a base; the base is arranged on the telescopic sliding table, the test piece bending driving motor is horizontally arranged on the base, a motor shaft of the test piece bending driving motor is connected with one end of a lead screw through a coupler, and the other end of the lead screw is connected to the base through a bearing; the screw sliding block is sleeved on the screw rod and can linearly move along the screw rod, and the first test piece chuck is hinged to the upper surface of the screw sliding block; the test piece distortion driving motor is horizontally arranged on the base, the installation height of the test piece distortion driving motor is larger than that of the test piece bending driving motor, the switching block is fixedly arranged on a motor shaft of the test piece distortion driving motor, the second test piece chuck is hinged to the switching block, and the flexible electronic device is clamped between the first test piece chuck and the second test piece chuck.
3. The device for measuring the deformation of the flexible electronic device in the vacuum temperature-changing environment according to claim 1, wherein: the test piece is characterized in that a nitrogen input pipe is arranged in a circumferential space between the test piece bending mechanism and the refrigerating pipe, a plurality of nitrogen nozzles are installed on a pipe body of the nitrogen input pipe, and the air injection direction of the nitrogen nozzles faces the surface of the flexible electronic device.
4. The device for measuring the deformation of the flexible electronic device in the vacuum temperature-changing environment according to claim 1, wherein: and a vacuum gauge is arranged on the wall of the vacuum chamber.
5. The device for measuring the deformation of the flexible electronic device in the vacuum temperature-changing environment according to claim 1, wherein: and a thermocouple is arranged on the wall of the vacuum chamber.
6. The device for measuring the deformation of the flexible electronic device in the vacuum temperature-changing environment according to claim 1, wherein: and an illuminating lamp is arranged on the telescopic sliding table.
7. The device for measuring the deformation of the flexible electronic device in the vacuum temperature-changing environment according to claim 1, wherein: and an observation window is arranged on the sealing door of the vacuum chamber.
8. The device for measuring the deformation of the flexible electronic device in the vacuum temperature-changing environment according to claim 1, wherein: the wall of the vacuum chamber is respectively provided with a high vacuum pumping hole and a low vacuum pumping hole.
9. A method for measuring the deformation of a flexible electronic device in a vacuum temperature-changing environment by using the device for measuring the deformation of the flexible electronic device in the vacuum temperature-changing environment as claimed in claim 1 is characterized by comprising the following steps:
the method comprises the following steps: selecting a flexible electronic device to be tested, evaporating an upper interdigital electrode on the surface of the flexible electronic device, and cleaning the surface of the flexible electronic device;
step two: opening a sealing door of the vacuum chamber, pulling the telescopic sliding table out of the vacuum chamber, and moving the test piece bending mechanism on the telescopic sliding table out of the vacuum chamber together;
step three: accurately clamping the flexible electronic device to be tested with the vapor-deposited interdigital electrode between a first test piece chuck and a second test piece chuck;
step four: pushing the telescopic sliding table into a vacuum chamber, moving a test piece bending mechanism clamping the flexible electronic device into the vacuum chamber together, closing a sealing door of the vacuum chamber, and simultaneously lighting an illuminating lamp;
step five: completing the parameter setting of bending speed, bending angle, bending times, twisting speed, twisting angle, twisting times, pressure, temperature before and after temperature changing in a computer;
step six: vacuumizing the inner cavity of the vacuum chamber to remove water vapor and oxygen in the inner cavity of the vacuum chamber, and selecting whether to introduce nitrogen into the inner cavity of the vacuum chamber according to a pressure set value until the pressure in the inner cavity of the vacuum chamber reaches the set value;
step seven: starting the electric heating pipe until the thermocouple detects that the actual temperature reaches a temperature set value before the temperature is changed, and then closing the electric heating pipe;
step eight: when the bending test of the flexible electronic device is carried out, starting a test piece bending driving motor, bending the flexible electronic device according to the set bending speed, bending angle and bending times, simultaneously starting a refrigerating pipe until the actual temperature detected by a thermocouple reaches a temperature set value after the temperature is changed, and then closing the test piece bending driving motor and the refrigerating pipe; when the distortion test of the flexible electronic device is carried out, starting a test piece distortion driving motor, twisting the flexible electronic device according to the set twisting speed, twisting angle and twisting frequency, simultaneously starting a refrigerating pipe until the actual temperature detected by a thermocouple reaches a temperature set value after the temperature is changed, and then closing the test piece distortion driving motor and the refrigerating pipe; when a bending or torsion test is carried out, current data and voltage data measured in real time are synchronously transmitted back to a computer through the interdigital electrode, and the current data and the voltage data are analyzed in real time through the computer;
step nine: and introducing nitrogen into the inner cavity of the vacuum chamber through the nitrogen input pipe until the pressure in the inner cavity of the vacuum chamber is balanced with the atmospheric pressure, opening a sealing door of the vacuum chamber after a thermocouple detects that the actual temperature is recovered to the room temperature, pulling the telescopic sliding table out of the vacuum chamber, taking down the flexible electronic device, observing the fracture condition of the flexible electronic device, and further carrying out physicochemical optical property test on the flexible electronic device if the flexible electronic device is not fractured.
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| CN201911239339.6A CN111007338B (en) | 2019-12-06 | 2019-12-06 | A device and method for measuring deformation of flexible electronic devices in a vacuum variable temperature environment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111624093A (en) * | 2020-07-08 | 2020-09-04 | 重庆渝微电子技术研究院有限公司 | Two-dimensional flexible material testing system |
| CN111780661A (en) * | 2020-07-22 | 2020-10-16 | 华中科技大学 | An accurate measurement method and system for bending strain of flexible electronic devices |
| CN116499894A (en) * | 2023-06-30 | 2023-07-28 | 江苏弘光显示技术有限公司 | Flexible screen bending testing device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111624093A (en) * | 2020-07-08 | 2020-09-04 | 重庆渝微电子技术研究院有限公司 | Two-dimensional flexible material testing system |
| CN111780661A (en) * | 2020-07-22 | 2020-10-16 | 华中科技大学 | An accurate measurement method and system for bending strain of flexible electronic devices |
| CN111780661B (en) * | 2020-07-22 | 2021-10-08 | 华中科技大学 | An accurate measurement method and system for bending strain of flexible electronic devices |
| CN116499894A (en) * | 2023-06-30 | 2023-07-28 | 江苏弘光显示技术有限公司 | Flexible screen bending testing device |
| CN116499894B (en) * | 2023-06-30 | 2023-08-25 | 江苏弘光显示技术有限公司 | Flexible screen bending testing device |
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