CN110996568A - Manufacturing method for solving pressing cavity of inner-layer open area in PCB mainboard - Google Patents
Manufacturing method for solving pressing cavity of inner-layer open area in PCB mainboard Download PDFInfo
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- CN110996568A CN110996568A CN202010017869.2A CN202010017869A CN110996568A CN 110996568 A CN110996568 A CN 110996568A CN 202010017869 A CN202010017869 A CN 202010017869A CN 110996568 A CN110996568 A CN 110996568A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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Abstract
In the center of the prior art, the PCB main board is formed by laminating the outer board and the inner board in different layers, and the same area in different layers of the inner board is designed in a copper-free open area, so that a laminating cavity is formed when laminating is easily caused. The invention provides a manufacturing method of a PCB mainboard, which can overcome the defect that a cavity is pressed in an empty area of an inner layer, and prevent the PCB mainboard after drilling and electroplating from being scrapped due to short circuit in an electrical test caused by copper infiltration in the cavity area.
Description
Technical Field
The invention relates to a production process of a Printed Circuit Board (PCB), in particular to a manufacturing method for solving a stitching cavity of an inner-layer open area in a PCB mainboard.
Background
Along with the rapid development of modern electronic products, the design of partial PCB multi-layer board products is more special, especially the mainboard, and the same region of different levels of inlayer is the open area design of no copper, and this gives PCB factory pressfitting process great difficulty, and open area position pressfitting in-process needs peripheral prepreg resin adhesive to melt to flow in and fill.
At present, the prepregs of the products are all in 1080 specifications, but the selection of the gel content is improper, the defects of insufficient glue filling and stitching holes are easy to occur after stitching in the position of a hollow area, and the electric test short circuit is scrapped due to copper infiltration in the hollow area after drilling and electroplating.
Fig. 1 is a state before lamination, a cavity is formed due to a copper-free empty region of an inner layer, 1 is an inner layer core plate, 2 is inner layer copper, 3 is an unpressed prepreg, and 4 is a copper-free region cavity.
Fig. 2 shows a state after lamination in the conventional process, where 1 is an inner core board, 2 is inner copper, 301 is a prepreg after lamination, and 401 is a void without copper area after lamination.
Meanwhile, in the prior art, the storage and moisture absorption problems of the prepreg are difficult to solve, the storage period is shortened due to the moisture absorption problem, and the quality of subsequent pressing cannot be guaranteed. In the prior art, the PCB multi-layer board is easy to crack, warp and deform due to stress in the laminating process, and unqualified products are formed due to cracking and warping.
The invention provides a manufacturing method of a PCB mainboard, which can overcome the defect that a cavity is pressed in an empty area of an inner layer, and prevent the PCB mainboard after drilling and electroplating from being scrapped due to short circuit in an electrical test caused by copper infiltration in the cavity area. Meanwhile, the moisture absorption resistance of the prepreg is improved, so that the storage performance of the prepreg is improved; and the stress release in the pressing process is facilitated to be solved, so that the binding force and deformation of the PCB are effectively controlled.
Disclosure of Invention
The invention provides a manufacturing method of a PCB mainboard, which can overcome the defect that a cavity is pressed in an empty area of an inner layer, and prevent the PCB mainboard after drilling and electroplating from being scrapped due to short circuit in an electrical test caused by copper infiltration in the cavity area. The method has the technical requirement on semi-cured tablets, and the resin content of the semi-cured tablets is more than 67 percent (mass fraction). By means of matching of pressing technological parameters, the glue filling amount of the copper-free open area can be effectively improved, the pressing cavity of the inner layer open area is effectively reduced, and the stability of a product is improved. Meanwhile, the moisture absorption resistance of the prepreg can be improved, so that the storage performance of the prepreg is improved; and the stress release in the pressing process is facilitated to be solved, so that the binding force and deformation of the PCB are effectively controlled.
According to the manufacturing method of the PCB mainboard, the prepreg with 1080 resin glue content larger than 67% is selected, and the resin glue content is enough to fill the open area.
Further, during fixing, heating to 180 ℃ to enable the PCB inner layer plate and the prepreg to be adhered and fixed; when laminating, the temperature is raised to 200 ℃ at the heating rate of 2.2-2.6 ℃/min, and the lamination is carried out for 5-10min under the pressure of 0.8MPa, so as to improve the glue filling amount of the inner layer open area.
Further, before the pre-stacking of the plates, the polyurethane resin glue is used for carrying out glue dispensing technology and coating on the surface of the inner layer, and then the plates are stacked and fixed to wait for pressing.
The PCB manufactured by the method has strong sealing performance and waterproofness, and the technical problem of the PCB pressing cavity can be solved.
In addition, the manufacturing method for solving the problem of the pressing cavity of the inner layer open area in the PCB mainboard is characterized in that the prepreg is prepared by modification, and the modification method comprises the following steps:
(1) selecting filler particles with the average particle size of 400-600nm, adding acetone with the mass multiple of 4-6 times, uniformly stirring, adding acrylic acid with the mass of 1/10-1/5 of the filler particles, reacting for 2-4h at room temperature, and evaporating the solvent to dryness for later use;
(2) adding 10-20 parts of the modified filler particles into 70-80 parts of cyanate ester resin, then adding 5-10 parts of aliphatic acrylate, 0.01 part of curing accelerator and 30-50 parts of acetone solvent, uniformly stirring, and performing centrifugal deaeration for 20-40min at 40 ℃, wherein the resin gel content of the resin liquid is kept to be more than 67% under the condition of removing the solvent;
(3) and (3) soaking the glass fiber cloth into the resin liquid obtained in the step (2), taking out, drying at 110 ℃ for 20min to remove the solvent, and then drying at 160 ℃ for 3-5min to prepare a prepreg.
The prepreg undergoes the following 2 steps in the laminating stage:
(1) when fixing, heating to 180 ℃ to ensure that the PCB inner layer plate and the prepreg are adhered and fixed; when laminating, the temperature is raised to 200 ℃ at the heating rate of 2.2-2.6 ℃/min, and the lamination is carried out for 5-10min under the pressure of 0.8MPa, so as to improve the glue filling amount of the inner layer open area;
(2) post-curing stage: and (3) putting the laminated plate finished in the step (1) into a 150 ℃ oven, and keeping for 4 hours to completely cure the aliphatic acrylate.
The filler particles comprise one or more of silicon oxide, aluminum oxide and silicon nitride, and preferably, the filler particles are silicon oxide: alumina: the mixed filler has the mass ratio of silicon nitride to silicon nitride of 2:1: 1.
The aliphatic acrylate comprises one or more of butyl acrylate, amyl acrylate and hexyl acrylate, and preferably, the aliphatic acrylate is butyl acrylate: amyl acrylate: the mass ratio of the hexyl acrylate is 2:2: 1.
The curing accelerator comprises one or more of 2-methylimidazole, 2-ethyl-4-methylimidazole and 2-phenylimidazole, and preferably, the curing accelerator is 2-methylimidazole: 2-ethyl-4-methylimidazole: the mass ratio of the 2-phenylimidazole is 1:1: 2.
The manufacturing method of the PCB mainboard provided by the invention has the following advantages:
1. according to the invention, 1080 prepreg with the resin content of more than 67% is selected for pressing, so that the amount of resin glue for pressing and filling the open area is increased; then the pressing temperature rise rate (the temperature rise rate reaches 2.2-2.6 ℃/min) is properly accelerated, the pressing pressure is increased (the pressure is increased by 20 percent), so that the molten resin adhesive flows more fully in the pressing process, the resin adhesive can be extruded by higher pressure to flow to the open area more, and the open area can be filled more conveniently;
2. by changing the production design mode and the production manufacturing mode, the processing and manufacturing capacity of a 1080-specification prepreg pressing and filling open area is improved, and short circuit scrapping caused by a pressing cavity is avoided;
3. by means of dispensing, the filling efficiency of the cavity is improved, and the sealing performance and the waterproof performance are improved;
4. by modifying the filler particles, the filler particles have stronger anchoring effect because of the acrylic acid grafting chains, the binding force is improved, and meanwhile, due to the existence of grafting, the stress generated during curing can be relieved through the extension and contraction of chain molecules, so that the stress of the filler particles in all directions is prevented from being uneven;
5. the strong water repellency of the aliphatic acrylate is utilized, so that the water repellency of the prepreg can be improved, the prepreg is difficult to absorb water, and the storage life and the quality stability of the prepreg are improved; the surface tension of the system is reduced, so that the substrate is easier to soak, and the effect of removing air is achieved;
6. the curing speed of the aliphatic acrylate is relatively slow, after the step (1) of pressing, a small part of the aliphatic acrylate is still in a free state and becomes a plasticizer of the cured layer, and the stress release of the cured layer is facilitated by utilizing the process of a post-curing section.
Drawings
FIG. 1 is a state diagram before lamination.
FIG. 2 is a state diagram of a conventional process after lamination.
Detailed Description
A batch of same batch, same size, same design PCB innerlayers were used, browned using the same process, and then applied and tested in each example and comparative example.
Example 1
20 PCB inner-layer boards were taken and divided into 10 groups of 2 boards. Firstly, polyurethane resin glue is used for carrying out glue dispensing process and coating on the surface of the inner layer, then 1080 prepreg with glue content of 68% (mass fraction) is placed between 2 PCB inner layer boards, and the 2 PCB inner layer boards and the prepreg are adhered and fixed by heating to 180 ℃. Then the mixture enters a pressing machine, the temperature is increased to 200 ℃ at the heating rate of 2.6 ℃/min, and the pressing is carried out for 5min at the pressure of 0.8 MPa. Taking out and naturally cooling for later use.
Example 2
20 PCB inner-layer boards were taken and divided into 10 groups of 2 boards. Firstly, polyurethane resin glue is used for carrying out glue dispensing process and coating on the surface of the inner layer, then 1080 prepreg with glue content of 74% (mass fraction) is placed between 2 PCB inner layer boards, and the 2 PCB inner layer boards and the prepreg are adhered and fixed by heating to 180 ℃. Then the mixture enters a pressing machine, the temperature is increased to 200 ℃ at the heating rate of 2.4 ℃/min, and the pressing is carried out for 8min at the pressure of 0.8 MPa. Taking out and naturally cooling for later use.
Example 3
20 PCB inner-layer boards were taken and divided into 10 groups of 2 boards. Firstly, polyurethane resin glue is used for carrying out glue dispensing process and coating on the surface of the inner layer, then 1080 prepreg with glue content of 80% (mass fraction) is placed between 2 PCB inner layer boards, and the 2 PCB inner layer boards and the prepreg are adhered and fixed by heating to 180 ℃. Then the mixture enters a pressing machine, the temperature is increased to 200 ℃ at the heating rate of 2.2 ℃/min, and the pressing is carried out for 10min at the pressure of 0.8 MPa. Taking out and naturally cooling for later use.
Example 4
The prepreg is prepared by modifying, and the modification method comprises the following steps:
(1) selecting silica filler particles with the average particle size of 400nm, adding acetone with the mass multiple of 6 times of the silica filler particles, uniformly stirring, adding acrylic acid with the mass of 1/5 of the filler particles, reacting for 2 hours at room temperature, and evaporating the solvent to dryness for later use;
(2) adding 10 parts of the modified filler particles into 70 parts of cyanate ester resin, then adding 10 parts of butyl acrylate, 0.01 part of 2-methylimidazole and 50 parts of acetone solvent, uniformly stirring, and then centrifugally defoaming at 40 ℃ for 40min, wherein the gel content of the resin is kept to be more than 67% under the condition that the solvent is removed;
(3) and (3) soaking the glass fiber cloth into the resin liquid obtained in the step (2), taking out, drying at 110 ℃ for 20min to remove the solvent, and then drying at 160 ℃ for 3min to prepare the prepreg.
The prepreg undergoes the following 2 steps in the laminating stage:
(1) when fixing, heating to 180 ℃ to ensure that the PCB inner layer plate and the prepreg are adhered and fixed; when laminating, the temperature is increased to 200 ℃ at the heating rate of 2.2 ℃/min, and the lamination is carried out for 10min under the pressure of 0.8MPa, so that the glue filling amount of the inner layer open area is increased;
(2) post-curing stage: and (3) putting the laminated plate finished in the step (1) into a 150 ℃ oven, and keeping for 4 hours to completely cure the aliphatic acrylate.
Example 5
The prepreg is prepared by modifying, and the modification method comprises the following steps:
(1) selecting alumina filler particles with the average particle size of 500nm, adding acetone with the mass multiple of 5 times of the alumina filler particles, uniformly stirring, adding acrylic acid with the mass of 1/8 of the filler particles, reacting at room temperature for 3 hours, and evaporating the solvent to dryness for later use;
(2) adding 15 parts of the modified filler particles into 75 parts of cyanate ester resin, then adding 8 parts of amyl acrylate, 0.01 part of 2-ethyl-4-methylimidazole and 40 parts of acetone solvent, uniformly stirring, and performing centrifugal defoaming at 40 ℃ for 30min, wherein the gel content of the resin is kept to be more than 67% under the condition that the solvent is removed;
(3) and (3) soaking the glass fiber cloth into the resin liquid obtained in the step (2), taking out, drying at 110 ℃ for 20min to remove the solvent, and then drying at 160 ℃ for 4min to prepare a prepreg.
The prepreg undergoes the following 2 steps in the laminating stage:
(1) when fixing, heating to 180 ℃ to ensure that the PCB inner layer plate and the prepreg are adhered and fixed; when laminating, the temperature is increased to 200 ℃ at the heating rate of 2.4 ℃/min, and the lamination is carried out for 8min under the pressure of 0.8MPa, so that the glue filling amount of the inner layer open area is increased;
(2) post-curing stage: and (3) putting the laminated plate finished in the step (1) into a 150 ℃ oven, and keeping for 4 hours to completely cure the aliphatic acrylate.
Example 6
The prepreg is prepared by modifying, and the modification method comprises the following steps:
(1) selecting silicon nitride filler particles with the average particle size of 600nm, adding acetone with the mass multiple of 4 times of the silicon nitride filler particles, uniformly stirring, adding acrylic acid with the mass of 1/10 of the filler particles, reacting for 4 hours at room temperature, and evaporating the solvent to dryness for later use;
(2) adding 20 parts of the modified filler particles into 80 parts of cyanate ester resin, then adding 5 parts of hexyl acrylate, 0.01 part of 2-phenylimidazole and 30 parts of acetone solvent, uniformly stirring, and performing centrifugal deaeration for 20min at 40 ℃, wherein the gel content of the resin liquid is kept to be more than 67% under the condition of removing the solvent;
(3) and (3) soaking the glass fiber cloth into the resin liquid obtained in the step (2), taking out, drying at 110 ℃ for 20min to remove the solvent, and then drying at 160 ℃ for 5min to prepare a prepreg.
The prepreg undergoes the following 2 steps in the laminating stage:
(1) when fixing, heating to 180 ℃ to ensure that the PCB inner layer plate and the prepreg are adhered and fixed; when laminating, the temperature is increased to 200 ℃ at the heating rate of 2.6 ℃/min, and the lamination is carried out for 5min under the pressure of 0.8MPa, so that the glue filling amount of the inner layer open area is increased;
(2) post-curing stage: and (3) putting the laminated plate finished in the step (1) into a 150 ℃ oven, and keeping for 4 hours to completely cure the aliphatic acrylate.
Example 7
The filler particles used were 400nm silica: alumina: the mass ratio of silicon nitride is 2:1:1, otherwise as in example 4.
Example 8
The aliphatic acrylate added is butyl acrylate: amyl acrylate: example 5 was followed with a 2:2:1 mixture of hexyl acrylate.
Example 9
The added curing accelerator is 2-methylimidazole: 2-ethyl-4-methylimidazole: example 6 was repeated except that the mass ratio of 2-phenylimidazole was 1:1: 2.
Comparative example 1
20 PCB inner-layer boards were taken and divided into 10 groups of 2 boards. Firstly, polyurethane resin glue is used for carrying out glue dispensing process and coating on the surface of the inner layer, then 1080 prepreg with glue content of 68% (mass fraction) is placed between 2 PCB inner layer boards, and the 2 PCB inner layer boards and the prepreg are adhered and fixed by heating to 180 ℃. Then the materials enter a pressing machine, the temperature is increased to 200 ℃ at the heating rate of 1.5 ℃/min, and the materials are pressed for 3min under the pressure of 0.6MPa of the common pressing process. Taking out and naturally cooling for later use.
Comparative example 2
20 PCB inner-layer boards were taken and divided into 10 groups of 2 boards. Firstly, polyurethane resin glue is used for carrying out glue dispensing process and coating on the surface of the inner layer, then 1080 prepreg with glue content of 68% (mass fraction) is placed between 2 PCB inner layer boards, and the 2 PCB inner layer boards and the prepreg are adhered and fixed by heating to 180 ℃. Then the materials enter a pressing machine, the temperature is increased to 200 ℃ at the heating rate of 3.2 ℃/min, and the pressing is carried out for 15min under the pressure of 1.0MPa of the common pressing process. Taking out and naturally cooling for later use.
Comparative example 3
1080 prepreg with 67 percent of glue content (mass fraction) is selected, and the rest of the pressing process is the same as that of the example 2.
Comparative example 4
The inner layer surface was dispensed and coated without using the urethane resin glue before lamination, and the rest of the lamination process was the same as example 2.
Comparative example 5
The procedure is as in example 5 except that the alumina filler particles used in the acrylic modified prepreg are not used.
Comparative example 6
After the alumina filler particles were modified, the prepreg resin system used no amyl acrylate and the process was the same as in example 5.
Comparative example 7
The prepreg modification method comprises the following steps:
(1) selecting alumina filler particles with the average particle size of 1 mu m, adding acetone with the mass multiple of 3 times of the alumina filler particles, uniformly stirring, adding acrylic acid with the mass of 1/20 of the filler particles, reacting for 1 hour at room temperature, and evaporating the solvent to dryness for later use;
(2) adding 21 parts of the modified filler particles into 68 parts of cyanate ester resin, then adding 3 parts of propyl acrylate, 0.01 part of 2-phenylimidazole and 20 parts of acetone solvent, uniformly stirring, and then performing centrifugal deaeration for 10min at 40 ℃, wherein the gel content of the resin is kept to be more than 67% under the condition that the solvent is removed;
(3) and (3) soaking the glass fiber cloth into the resin liquid obtained in the step (2), taking out, drying at 110 ℃ for 20min to remove the solvent, and then drying at 160 ℃ for 2min to prepare a prepreg.
The prepreg undergoes the following 2 steps in the laminating stage:
(1) when fixing, heating to 180 ℃ to ensure that the PCB inner layer plate and the prepreg are adhered and fixed; when laminating, the temperature is increased to 200 ℃ at the heating rate of 2.8 ℃/min, and the lamination is carried out for 12min at the pressure of 0.8 MPa;
(2) post-curing stage: and (3) putting the laminated plate finished in the step (1) into an oven at 120 ℃, and keeping for 2 hours.
The detection method comprises the following steps:
1. the laminate panels of the above examples and comparative examples were put in hot water at 60 ℃ and kept at temperature and soaked for 48 hours. And taking out and drying, observing whether cracking occurs or not, and checking the electrical properties. The test results were as follows:
2. about 10g of each of the prepregs of examples 1 to 7 and comparative examples 1 to 6, having an original mass of m1, exposed to an environment of 40 ℃ and a relative humidity of 90% for 60min, weighed as m2, was weighed out, and the calculated hygroscopicity was:
hygroscopicity = (m 2/m 1-1) × 100%
3. Testing the peel strength of the metal cover layer according to the experimental conditions of 'after thermal stress' in the IPC-TM-6502.4.8 method;
4. testing the deformation rates of the X axis and the Y axis, and then calculating the average deformation rate;
5. the warpage of PCB according to IPC-TM-650 2.4.22B is calculated as follows:
warp calculation method = warp height/length of curve x 100%.
To summarize: from the above results, it can be seen that the use of prepregs with different resin contents has a significant influence on the final sealing and waterproofing properties, and from the test results, the adhesion properties and the air void removal effects of examples 1 to 3 are superior to those of comparative examples 1 to 4, indicating that a resin content of more than 67% is an important index for prepregs. And parameters such as temperature and pressure of the pressing process and the pre-dispensing process also have influence on the final sealing performance and waterproof performance.
The test performance of examples 4-6 was better, and as compared to comparative examples 5-7, modification of the filler particles and use of aliphatic acrylates helped to improve the adhesive strength and release internal stresses, resulting in higher dimensional stability of the produced PCBs. In the pressing stage, partial aliphatic acrylate is remained in the step (1), and the aliphatic acrylate plays a role of a plasticizer in a cured layer, so that internal stress is released. And the residual aliphatic acrylate can be cured and crosslinked by the curing section, and the internal stress is continuously released, so that the properties of deformation, warping and the like are improved. Meanwhile, the aliphatic acrylate has strong water repellency, can improve the water repellency of the prepreg, improves the storage period and the quality stability of the prepreg, has low surface tension, enables the prepreg to be more easily soaked in the substrate, achieves the effect of air removal, is more easily soaked and occluded during curing, and improves the bonding strength. The modified filler particles can relieve stress generated during curing and prevent the stress of the filler particles from being uneven in all directions.
Finally, it is noted that the above examples and comparative examples are only intended to illustrate the technical solutions of the present invention and not to limit the same, and although the present invention has been described in detail by the above examples and comparative examples, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the scope of the present invention as defined by the appended claims.
Claims (9)
1. The utility model provides a solve PCB mainboard inlayer spacious district pressfitting cavity's manufacturing method which characterized in that:
and selecting a prepreg with 1080 resin glue content of more than 67 percent to ensure that the resin glue content is enough to fill the open area.
2. A manufacturing method for solving the problem of the stitching void in the inner void area of the PCB main board as claimed in claim 1, wherein:
when fixing, heating to 180 ℃ to ensure that the PCB inner layer plate and the prepreg are adhered and fixed; when laminating, the temperature is raised to 200 ℃ at the heating rate of 2.2-2.6 ℃/min, and the lamination is carried out for 5-10min under the pressure of 0.8MPa, so as to improve the glue filling amount of the inner layer open area.
3. A manufacturing method for solving the problem of the pressing void in the inner layer open area of the PCB main board according to claim 1 or 2, characterized in that: before each board is pre-stacked, polyurethane resin glue is used for carrying out glue dispensing technology and coating on the surface of the inner layer, and then the boards are stacked and fixed to wait for lamination.
4. A PCB main board manufactured by the manufacturing method of claim 3, wherein: can be soaked in hot water of 60 ℃ for 48 hours without cracking and water seepage.
5. The utility model provides a solve PCB mainboard inlayer spacious district pressfitting cavity's manufacturing method which characterized in that: the prepreg is prepared by modifying, and the modification method comprises the following steps:
(1) selecting filler particles with the average particle size of 400-600nm, adding acetone with the mass multiple of 4-6 times, uniformly stirring, adding acrylic acid with the mass of 1/10-1/5 of the filler particles, reacting for 2-4h at room temperature, and evaporating the solvent to dryness for later use;
(2) adding 10-20 parts of the modified filler particles into 70-80 parts of cyanate ester resin, then adding 5-10 parts of aliphatic acrylate, 0.01 part of curing accelerator and 30-50 parts of acetone solvent, uniformly stirring, and performing centrifugal deaeration for 20-40min at 40 ℃, wherein the resin gel content of the resin liquid is kept to be more than 67% under the condition of removing the solvent;
(3) and (3) soaking the glass fiber cloth into the resin liquid obtained in the step (2), taking out, drying at 110 ℃ for 20min to remove the solvent, and then drying at 160 ℃ for 3-5min to prepare a prepreg.
6. The manufacturing method for solving the problem of the pressing cavity of the inner layer open area in the PCB mainboard of claim 5 is characterized in that: the prepreg undergoes the following 2 steps in the laminating stage:
(1) when fixing, heating to 180 ℃ to ensure that the PCB inner layer plate and the prepreg are adhered and fixed; when laminating, the temperature is raised to 200 ℃ at the heating rate of 2.2-2.6 ℃/min, and the lamination is carried out for 5-10min under the pressure of 0.8MPa, so as to improve the glue filling amount of the inner layer open area;
(2) post-curing stage: and (3) putting the laminated plate finished in the step (1) into a 150 ℃ oven, and keeping for 4 hours to completely cure the aliphatic acrylate.
7. The manufacturing method for solving the problem of the pressing void of the inner layer void area in the PCB mainboard of the claims 5-6, characterized in that: the filler particles comprise one or more of silica, alumina, silicon nitride.
8. The manufacturing method for solving the problem of the pressing void of the inner layer void area in the PCB mainboard of the claims 5-6, characterized in that: the aliphatic acrylate comprises one or more of butyl acrylate, amyl acrylate and hexyl acrylate.
9. The manufacturing method for solving the problem of the pressing void of the inner layer void area in the PCB mainboard of the claims 5-6, characterized in that: the curing accelerator comprises one or more of 2-methylimidazole, 2-ethyl-4-methylimidazole and 2-phenylimidazole.
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| CN114245600A (en) * | 2021-10-25 | 2022-03-25 | 深圳崇达多层线路板有限公司 | Server, printed circuit board and press-fit manufacturing method thereof |
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