CN110993508A - Packaging structure, manufacturing method thereof and electronic equipment - Google Patents
Packaging structure, manufacturing method thereof and electronic equipment Download PDFInfo
- Publication number
- CN110993508A CN110993508A CN201911160270.8A CN201911160270A CN110993508A CN 110993508 A CN110993508 A CN 110993508A CN 201911160270 A CN201911160270 A CN 201911160270A CN 110993508 A CN110993508 A CN 110993508A
- Authority
- CN
- China
- Prior art keywords
- metal layer
- circuit substrate
- layer
- exposed metal
- die sleeve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000010410 layer Substances 0.000 claims abstract description 119
- 239000002184 metal Substances 0.000 claims abstract description 100
- 229910052751 metal Inorganic materials 0.000 claims abstract description 100
- 239000000758 substrate Substances 0.000 claims abstract description 81
- 239000011241 protective layer Substances 0.000 claims abstract description 43
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052709 silver Inorganic materials 0.000 claims abstract description 34
- 239000004332 silver Substances 0.000 claims abstract description 34
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 238000000576 coating method Methods 0.000 claims abstract description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 18
- 238000005507 spraying Methods 0.000 claims description 12
- 238000007639 printing Methods 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 2
- 238000005538 encapsulation Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 238000007711 solidification Methods 0.000 claims 1
- 230000008023 solidification Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 235000011089 carbon dioxide Nutrition 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- -1 and then Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a packaging structure, a manufacturing method thereof and electronic equipment. The manufacturing method of the packaging structure comprises the following steps: providing a circuit substrate with a bare metal layer; coating a protective layer on the surface of the exposed metal layer; the surface of the circuit substrate provided with the exposed metal layer is pasted with an active device or a passive device, and a die sleeve is packaged, wherein the die sleeve completely covers the active device or the passive device; performing hole opening operation on the surface of the die sleeve, which is opposite to the circuit substrate, by using laser to obtain an electromagnetic shielding channel, wherein the electromagnetic shielding channel penetrates through the die sleeve and corresponds to the protective layer; and filling silver paste into the electromagnetic shielding channel, and solidifying the silver paste to obtain the packaging structure. The technical scheme of the invention can improve the reliability of the packaging structure.
Description
Technical Field
The present invention relates to the field of semiconductor packaging technologies, and in particular, to a package structure, a method for manufacturing the same, and an electronic device.
Background
In the related art, the substrate of the package structure usually employs a plating layer, such as electroplated gold or electroless gold, deposited on the surface of the substrate, and the plating layer is generally thin. With the gradual application of the electromagnetic interference shielding technology, when a packaging structure is manufactured, firstly, an active device or a passive device is assembled on the surface of a substrate, then, the substrate is packaged through a die sleeve, laser is adopted to perform grooving or perforating on the surface of the die sleeve to form an electromagnetic shielding channel, the electromagnetic shielding channel corresponds to a bare metal layer on the surface of the substrate, and then, silver paste is filled into the electromagnetic shielding channel and is solidified, so that the electromagnetic shielding effect of the active device or the passive device can be realized. However, in the process of grooving or perforating the die sleeve by using laser, the coating and the bare metal layer on the surface of the substrate are easily damaged due to large laser energy, so that the reliability of the packaging structure is poor.
The above is only for the purpose of assisting understanding of the technical aspects of the present invention, and does not represent an admission that the above is prior art.
Disclosure of Invention
The invention mainly aims to provide a packaging structure, a manufacturing method thereof and electronic equipment, and aims to improve the reliability of the packaging structure.
In order to achieve the above object, the manufacturing method of the package structure provided by the present invention comprises the following steps:
providing a circuit substrate with a bare metal layer;
coating a protective layer on the surface of the exposed metal layer;
the surface of the circuit substrate provided with the exposed metal layer is pasted with an active device or a passive device, and a die sleeve is packaged, wherein the die sleeve completely covers the active device or the passive device;
performing hole opening operation on the surface of the die sleeve, which is opposite to the circuit substrate, by using laser to obtain an electromagnetic shielding channel, wherein the electromagnetic shielding channel penetrates through the die sleeve and corresponds to the protective layer;
and filling silver paste into the electromagnetic shielding channel, and solidifying the silver paste to obtain the packaging structure.
Optionally, the protective layer completely covers the bare metal layer.
Optionally, the thickness of the overcoat layer ranges from 50 μm to 80 μm.
Optionally, the protective layer is a tin layer.
Optionally, the step of coating a protective layer on the surface of the bare metal layer includes:
and coating a tin layer on the surface of the exposed metal layer by adopting a tin paste printing or tin paste spraying mode.
Optionally, the circuit substrate is further provided with a via hole on the surface of the exposed metal layer, and the via hole penetrates through two opposite surfaces of the circuit substrate;
after the step of coating a tin layer on the surface of the bare metal layer by adopting a tin paste printing or tin paste spraying mode, the method further comprises the following steps:
and melting the tin layer at a temperature ranging from 230 ℃ to 265 ℃ to fill and level the pits on the surface of the exposed metal layer, and cooling and solidifying to obtain a solidified tin layer.
Optionally, the step of filling silver paste into the electromagnetic shielding channel and curing the silver paste includes:
and filling silver paste into the electromagnetic shielding channel in a spraying mode, and solidifying the silver paste in a sintering mode.
The invention also provides a package structure, which comprises: the circuit board comprises a circuit substrate, a protective layer and a metal layer, wherein a bare metal layer is arranged on the surface of the circuit substrate, and the protective layer is arranged on the surface of the bare metal layer; the active device or the passive device is attached to the surface of the circuit substrate, which is provided with the exposed metal layer; and the die sleeve is packaged on the surface of the exposed metal layer of the circuit substrate and covers the active device or the passive device, the die sleeve faces away from the surface of the circuit substrate, an electromagnetic shielding channel is formed in the surface of the circuit substrate and penetrates through the die sleeve and corresponds to the protective layer, and the electromagnetic shielding channel is filled with solidified silver paste.
Optionally, the circuit substrate is further provided with a via hole on the surface of the exposed metal layer, the via hole penetrates through two opposite surfaces of the circuit substrate, a metal trace is arranged in the via hole, and the metal trace is connected to the exposed metal layer and the metal layer inside the circuit substrate.
The invention also provides an electronic device, which includes a package structure, the package structure including: the circuit board comprises a circuit substrate, a protective layer and a metal layer, wherein a bare metal layer is arranged on the surface of the circuit substrate, and the protective layer is arranged on the surface of the bare metal layer; the active device or the passive device is attached to the surface of the circuit substrate, which is provided with the exposed metal layer; and the die sleeve is packaged on the surface of the exposed metal layer of the circuit substrate and covers the active device or the passive device, the die sleeve faces away from the surface of the circuit substrate, an electromagnetic shielding channel is formed in the surface of the circuit substrate and penetrates through the die sleeve and corresponds to the protective layer, and the electromagnetic shielding channel is filled with solidified silver paste.
According to the technical scheme, firstly, a protective layer is coated on the surface of a bare metal layer of a circuit substrate, then an active device or a passive device is pasted on the surface of the circuit substrate provided with the bare metal layer, a die sleeve is packaged, and the die sleeve completely covers the active device or the passive device; and then, adopting laser to perform hole opening operation on the surface of the die sleeve, which is back to the circuit substrate, to obtain an electromagnetic shielding channel, wherein the electromagnetic shielding channel corresponds to the protective layer, finally filling silver paste into the electromagnetic shielding channel, and solidifying the silver paste to obtain a packaging structure, wherein the packaging structure has the electromagnetic shielding performance. In addition, before the die sleeve is subjected to hole opening operation by adopting laser, the protective layer is coated on the surface of the exposed metal layer, so that the laser damage resistance of the exposed metal layer on the surface of the circuit substrate can be effectively improved, and the reliability of the packaging structure is favorably improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic flow chart illustrating a process of fabricating a package structure according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart illustrating a process of fabricating a package structure according to another embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a package structure according to an embodiment of the invention;
fig. 4 is a schematic structural diagram of another view angle of the package structure of fig. 3.
The reference numbers illustrate:
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the technical solutions in the embodiments of the present invention may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The present invention provides a method for manufacturing a package structure 100.
Referring to fig. 1, in an embodiment of the manufacturing method of the package structure 100 of the present invention, the manufacturing method of the package structure 100 includes the following steps:
step S10, providing the circuit substrate 10 with the exposed metal layer 11;
step S20, coating a protective layer 12 on the surface of the bare metal layer 11;
step S30, mounting an active device or a passive device 20 on the surface of the circuit substrate 10 where the bare metal layer 11 is disposed, and encapsulating a mold cover 30, where the mold cover 30 completely covers the active device or the passive device 20;
step S40, performing a hole opening operation on the surface of the die sleeve 30 opposite to the circuit substrate 10 by using a laser method to obtain an electromagnetic shielding channel 31, where the electromagnetic shielding channel 31 penetrates through the die sleeve 30 and corresponds to the protective layer 12;
step S50, filling silver paste into the electromagnetic shielding channel 31, and curing the silver paste 33 to obtain the package structure 100.
Here, the circuit board 10 is obtained by etching and laminating a wiring on the surface of the board, and is generally a copper plate, and the exposed metal layer 11 is an exposed copper sheet. Firstly, a protective layer 12 is coated on the surface of the copper sheet exposed on the surface of the circuit substrate 10 to protect the copper sheet, thereby effectively avoiding the damage to the exposed metal layer 11 on the surface of the circuit substrate 10 during the subsequent hole opening operation. Next, an active device or passive device 20 is mounted on the surface of the circuit substrate 10, where the active device or passive device 20 may be a photodiode, a light emitting diode or other active device or passive device 20, and the active device or passive device 20 is generally provided with a plurality of exposed metal layers 11 separating one of the active device or passive device 20 from the other devices. Then, a mold sleeve 30 is packaged on the surface of the circuit substrate 10, the mold sleeve 30 covers the active device or the passive device 20, and a laser method is adopted to perform a hole opening operation on the surface of the mold sleeve 30, which is opposite to the surface of the circuit substrate 10, to obtain an electromagnetic shielding channel 31, wherein the electromagnetic shielding channel 31 corresponds to the protective layer 12, so that the electromagnetic shielding channel 31 separates one active device or passive device 20 from other active devices or passive devices 20, and a cavity-splitting shielding effect is achieved. Finally, filling silver paste into the electromagnetic shielding channel 31, and curing the silver paste, so as to obtain the package structure 100, wherein the active device or the passive device 20 in the package structure 100 has an electromagnetic shielding effect. Since the protective layer 12 is coated on the surface of the exposed metal layer 11 before the die case 30 is opened by using laser, the laser damage resistance of the circuit substrate 10 can be effectively improved, thereby facilitating the improvement of the reliability of the package structure 100.
It should be noted that, generally, before filling the silver paste into the electromagnetic shielding channel 31, dry ice is used to clean the electromagnetic shielding channel 31, so as to facilitate smooth filling of the silver paste.
Therefore, it can be understood that, according to the technical solution of the present invention, a protective layer 12 is first coated on the surface of the exposed metal layer 11 of the circuit substrate 10, then the active device or the passive device 20 is attached to the surface of the circuit substrate 10 where the exposed metal layer 11 is disposed, and the mold sleeve 30 is encapsulated, and the mold sleeve 30 completely covers the active device or the passive device 20; then, a hole is opened on the surface of the die sleeve 30, which faces away from the circuit substrate 10, by using laser, so as to obtain an electromagnetic shielding channel 31, the electromagnetic shielding channel 31 corresponds to the protective layer 12, and finally, silver paste is filled into the electromagnetic shielding channel 31 and is solidified, so that the packaging structure 100 is obtained, and the packaging structure 100 has electromagnetic shielding performance. Moreover, before the die sleeve 30 is holed by laser, the protective layer 12 is coated on the surface of the exposed metal layer 11, so that the laser damage resistance of the exposed metal layer 11 on the surface of the circuit substrate 10 can be effectively improved, and the reliability of the package structure 100 can be improved.
Alternatively, in order to more effectively and sufficiently protect the circuit substrate 10 from being damaged by the laser, the protection layer 12 completely covers the exposed metal layer 11, which may more effectively improve the reliability of the package structure 100.
Optionally, the protective layer 12 has a thickness in the range of 50 μm to 80 μm. In order to further improve the laser damage resistance of the circuit substrate 10 and save the manufacturing cost of the protective layer 12, it is desirable to control the thickness of the protective layer 12, for example, the thickness of the tin layer to be coated is 50 μm, 60 μm, 70 μm or 80 μm.
Optionally, the protective layer 12 is a tin layer. The tin layer is selected as the protective layer 12, so that the exposed metal layer 11 on the surface of the circuit substrate 10 can be effectively protected, the laser can be prevented from damaging the exposed metal layer 11 on the surface of the circuit substrate 10, and the reliability of the packaging structure 100 is effectively improved.
Referring to fig. 2, in an embodiment of the present invention, step S20 includes:
step S21, a tin layer is coated on the surface of the bare metal layer 11 by solder paste printing or solder paste spraying.
The specific operations of solder paste printing and solder paste spraying are the prior art, and are not repeated herein, one of the methods can be selected to coat a solder layer on the surface of the exposed metal layer 11 during the specific operations, and the uniformity of the solder layer coated by the solder paste printing and solder paste spraying methods is better. Moreover, the tin layer completely covers the exposed metal layer 11 to protect the exposed metal layer 11, so that the exposed metal layer 11 is prevented from being damaged by laser, and the reliability of the device is improved.
Referring to fig. 2 again, in an embodiment of the invention, the circuit substrate 10 further has a via hole 13 on the surface of the exposed metal layer 11, and the via hole 13 penetrates through two opposite surfaces of the circuit substrate 10;
after step S21, the method further includes:
and step S22, melting the tin layer at a temperature ranging from 230 ℃ to 265 ℃ to fill and level the pits on the surface of the exposed metal layer 11, and cooling and solidifying to obtain a solidified tin layer.
Here, the circuit substrate 10 is provided with a via hole 13 on the surface of the exposed metal layer 11, a metal trace 14 is disposed in the via hole 13, and the metal trace 14 is connected to the exposed metal layer 11 on the surface and is connected to the metal trace 14 inside the circuit substrate 10. Since the via hole 13 is formed on the surface of the exposed metal layer 11, a pit is left on the surface of the exposed metal layer 11 during the operation of forming the via hole 13. And, because the melting point of tin is 225 ℃, any temperature in the range of 230 ℃ to 265 ℃ is adopted here to melt the tin layer, so that the tin layer is in a molten state and can flow on the surface of the exposed metal layer 11, so that pits on the surface of the exposed metal layer 11 can be filled up, and finally the tin layer is cooled and solidified to obtain a solidified tin layer, the solidified tin layer has a relatively flat surface, the flat surface of the tin layer can effectively improve the collection and energy control of laser, the burr generated by laser hole opening is reduced, so that the inner wall of the electromagnetic shielding channel 31 is relatively smooth, thereby being beneficial to the subsequent dry ice cleaning and silver paste filling operation, and further effectively improving the electromagnetic shielding performance of the packaging structure 100.
Further, step S50 includes: and filling silver paste into the electromagnetic shielding channel 31 in a spraying mode, and solidifying the silver paste in a sintering mode. Here, the silver paste can be quickly filled into the electromagnetic shielding channel 31 by spraying, and then the silver paste in the electromagnetic shielding channel 31 is solidified by high-temperature sintering, so that the package structure 100 with electromagnetic shielding performance can be obtained.
The invention further provides a package structure 100, wherein the package structure 100 is manufactured by the manufacturing method of the package structure 100.
Referring to fig. 3 and 4, in an embodiment of the package structure 100 of the present invention, the package structure 100 includes: the circuit board comprises a circuit board 10, wherein a bare metal layer 11 is arranged on the surface of the circuit board 10, and a protective layer 12 is arranged on the surface of the bare metal layer 11; the active device or the passive device 20, the active device or the passive device 20 is attached to the surface of the circuit substrate 10 provided with the exposed metal layer 11; the die sleeve 30 is packaged on the surface of the circuit substrate 10, where the exposed metal layer 11 is arranged, of the die sleeve 30, the active device or the passive device 20 is covered, the surface of the die sleeve 30, which faces away from the circuit substrate 10, is provided with an electromagnetic shielding channel 31, the electromagnetic shielding channel 31 penetrates through the die sleeve 30 and is arranged corresponding to the protective layer 12, and the electromagnetic shielding channel 31 is filled with the solidified silver paste 33.
Here, the circuit board 10 is obtained by etching and laminating a wiring on the surface of the board, and is generally a copper plate, and the exposed metal layer 11 is an exposed copper sheet. The protective layer 12 is coated on the surface of the copper sheet exposed on the surface of the circuit substrate 10, and is generally obtained by coating in a solder paste spraying or printing manner, and the protective layer 12 can protect the copper sheet, thereby effectively avoiding the damage to the exposed metal layer 11 on the surface of the circuit substrate 10 during the subsequent hole opening operation. The active or passive device 20 is generally attached to the surface of the circuit substrate 10 provided with the exposed metal layer 11 by glue, and the active or passive device 20 may be a photodiode, a light emitting diode or other active or passive device 20, where the active or passive device 20 is generally provided with a plurality of exposed metal layers 11 separating one of the active or passive devices 20 from the other devices. The mold sleeve 30 is encapsulated on the surface of the circuit substrate 10 and covers the active device or the passive device 20, the surface of the mold sleeve 30, which faces away from the circuit substrate 10, is provided with an electromagnetic shielding channel 31, and the electromagnetic shielding channel 31 penetrates through the mold sleeve 30 and corresponds to the protective layer 12, so that the electromagnetic shielding channel 31 separates one active device or passive device 20 from the other active devices or passive devices 20, and the cavity-splitting shielding effect is realized. And the electromagnetic shielding channel 31 is filled with solidified silver paste. As such, the active device or passive device 20 in the package structure 100 has an electromagnetic shielding effect. Because the protective layer 12 is disposed on the surface of the exposed metal layer 11, the laser damage resistance of the circuit substrate 10 can be effectively improved, thereby facilitating the improvement of the reliability of the package structure 100.
Furthermore, the circuit substrate 10 is further provided with a via hole 13 on the surface of the exposed metal layer 11, the via hole 13 penetrates through two opposite surfaces of the circuit substrate 10, a metal trace 14 is arranged in the via hole 13, and the metal trace 14 is connected to the exposed metal layer 11 and the metal layer inside the circuit substrate 10.
Here, the plurality of vias 13 are provided, the plurality of vias 13 are distributed at intervals along the length of the exposed metal layer 11, a metal trace 14 is provided in each via 13, and the metal trace 14 is electrically connected to the exposed metal layer 11 on the surface of the circuit substrate 10 and the metal layer inside the circuit substrate 10.
The present invention also provides an electronic device, which includes the package structure 100 as described above, and the specific structure of the package structure 100 refers to the foregoing embodiments. Since the electronic device adopts all technical solutions of all the foregoing embodiments, at least all the beneficial effects brought by the technical solutions of the foregoing embodiments are achieved, and no further description is given here.
Generally, the electronic device further includes a housing, and the package structure 100 is mounted in the housing by a snap-fit, an adhesive, or other mounting methods.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A manufacturing method of a packaging structure is characterized by comprising the following steps:
providing a circuit substrate with a bare metal layer;
coating a protective layer on the surface of the exposed metal layer;
the surface of the circuit substrate provided with the exposed metal layer is pasted with an active device or a passive device, and a die sleeve is packaged, wherein the die sleeve completely covers the active device or the passive device;
performing hole opening operation on the surface of the die sleeve, which is opposite to the circuit substrate, by using laser to obtain an electromagnetic shielding channel, wherein the electromagnetic shielding channel penetrates through the die sleeve and corresponds to the protective layer;
and filling silver paste into the electromagnetic shielding channel, and solidifying the silver paste to obtain the packaging structure.
2. The method of claim 1, wherein the protective layer completely covers the exposed metal layer.
3. The method of claim 1, wherein the protective layer has a thickness in a range from 50 μm to 80 μm.
4. The method of claim 1, wherein the protective layer is a tin layer.
5. The method of claim 4, wherein the step of coating a protective layer on the surface of the exposed metal layer comprises:
and coating a tin layer on the surface of the exposed metal layer by adopting a tin paste printing or tin paste spraying mode.
6. The method for manufacturing the package structure according to claim 5, wherein the circuit substrate further has a via hole formed on the surface of the exposed metal layer, the via hole penetrating through two opposite surfaces of the circuit substrate;
after the step of coating a tin layer on the surface of the bare metal layer by adopting a tin paste printing or tin paste spraying mode, the method further comprises the following steps:
and melting the tin layer at a temperature ranging from 230 ℃ to 265 ℃ to fill and level the pits on the surface of the exposed metal layer, and cooling and solidifying to obtain a solidified tin layer.
7. The method for manufacturing the package structure according to any one of claims 1 to 6, wherein the step of filling silver paste into the electromagnetic shielding trench and curing the silver paste includes:
and filling silver paste into the electromagnetic shielding channel in a spraying mode, and solidifying the silver paste in a sintering mode.
8. A package structure, comprising:
the circuit board comprises a circuit substrate, a protective layer and a metal layer, wherein a bare metal layer is arranged on the surface of the circuit substrate, and the protective layer is arranged on the surface of the bare metal layer;
the active device or the passive device is attached to the surface of the circuit substrate, which is provided with the exposed metal layer; and
the die sleeve, the die sleeve encapsulation is in circuit substrate is equipped with the surface of exposed metal layer, and cover active device or passive device, the die sleeve is dorsad the electromagnetic shield channel has been seted up on circuit substrate's surface, the electromagnetic shield channel runs through the die sleeve, and correspond to the inoxidizing coating sets up, the electromagnetic shield channel intussuseption is filled with solidification silver thick liquid.
9. The package structure of claim 8, wherein the circuit substrate further comprises a via hole formed on the surface of the exposed metal layer, the via hole penetrating through two opposite surfaces of the circuit substrate, and a metal trace disposed in the via hole and connected to the exposed metal layer and the metal layer inside the circuit substrate.
10. An electronic device, characterized in that the electronic device comprises a package structure according to any one of claims 8 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911160270.8A CN110993508A (en) | 2019-11-22 | 2019-11-22 | Packaging structure, manufacturing method thereof and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911160270.8A CN110993508A (en) | 2019-11-22 | 2019-11-22 | Packaging structure, manufacturing method thereof and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110993508A true CN110993508A (en) | 2020-04-10 |
Family
ID=70086109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911160270.8A Pending CN110993508A (en) | 2019-11-22 | 2019-11-22 | Packaging structure, manufacturing method thereof and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110993508A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111933636A (en) * | 2020-09-27 | 2020-11-13 | 立讯电子科技（昆山）有限公司 | Semiconductor packaging structure and packaging method |
| CN113543617A (en) * | 2021-07-19 | 2021-10-22 | 深圳佑驾创新科技有限公司 | Electromagnetic compatibility shielding device and electronic equipment |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1585114A (en) * | 2003-08-22 | 2005-02-23 | 全懋精密科技股份有限公司 | Semiconductor sealing baseplate structure of electric padding metal protective layer and producing method thereof |
| TW200715432A (en) * | 2005-10-07 | 2007-04-16 | Advanced Semiconductor Eng | Soldering process for a substrate |
| CN102446870A (en) * | 2010-10-13 | 2012-05-09 | 矽品精密工业股份有限公司 | Packaging component with electrostatic discharge and anti-interference of electromagnetic wave functions |
| CN102456669A (en) * | 2010-10-25 | 2012-05-16 | 环旭电子股份有限公司 | Chip-grade electromagnetic interference shielding structure and manufacturing method thereof |
| CN104868015A (en) * | 2015-05-15 | 2015-08-26 | 无锡奥特维科技有限公司 | Solder strip shaping mechanism |
| CN105140138A (en) * | 2015-09-16 | 2015-12-09 | 江苏长电科技股份有限公司 | Electromagnetic shielding encapsulation method and encapsulation structure |
| CN108305868A (en) * | 2017-01-12 | 2018-07-20 | 艾马克科技公司 | Semiconductor packages with electromagnetic interference shield and its manufacturing method |
| CN108573964A (en) * | 2017-03-17 | 2018-09-25 | 日月光半导体制造股份有限公司 | Semiconductor encapsulation device and the method for manufacturing semiconductor encapsulation device |
-
2019
- 2019-11-22 CN CN201911160270.8A patent/CN110993508A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1585114A (en) * | 2003-08-22 | 2005-02-23 | 全懋精密科技股份有限公司 | Semiconductor sealing baseplate structure of electric padding metal protective layer and producing method thereof |
| TW200715432A (en) * | 2005-10-07 | 2007-04-16 | Advanced Semiconductor Eng | Soldering process for a substrate |
| CN102446870A (en) * | 2010-10-13 | 2012-05-09 | 矽品精密工业股份有限公司 | Packaging component with electrostatic discharge and anti-interference of electromagnetic wave functions |
| CN102456669A (en) * | 2010-10-25 | 2012-05-16 | 环旭电子股份有限公司 | Chip-grade electromagnetic interference shielding structure and manufacturing method thereof |
| CN104868015A (en) * | 2015-05-15 | 2015-08-26 | 无锡奥特维科技有限公司 | Solder strip shaping mechanism |
| CN105140138A (en) * | 2015-09-16 | 2015-12-09 | 江苏长电科技股份有限公司 | Electromagnetic shielding encapsulation method and encapsulation structure |
| CN108305868A (en) * | 2017-01-12 | 2018-07-20 | 艾马克科技公司 | Semiconductor packages with electromagnetic interference shield and its manufacturing method |
| CN108573964A (en) * | 2017-03-17 | 2018-09-25 | 日月光半导体制造股份有限公司 | Semiconductor encapsulation device and the method for manufacturing semiconductor encapsulation device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111933636A (en) * | 2020-09-27 | 2020-11-13 | 立讯电子科技（昆山）有限公司 | Semiconductor packaging structure and packaging method |
| CN111933636B (en) * | 2020-09-27 | 2021-10-12 | 立讯电子科技（昆山）有限公司 | Semiconductor packaging structure and packaging method |
| US11764163B2 (en) | 2020-09-27 | 2023-09-19 | Luxshare Electronic Technology (Kunshan) Ltd. | Semiconductor encapsulation structure and encapsulation method |
| CN113543617A (en) * | 2021-07-19 | 2021-10-22 | 深圳佑驾创新科技有限公司 | Electromagnetic compatibility shielding device and electronic equipment |
| CN113543617B (en) * | 2021-07-19 | 2023-03-24 | 深圳佑驾创新科技有限公司 | Electromagnetic compatibility shielding device and electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10074614B2 (en) | EMI/RFI shielding for semiconductor device packages | |
| US8487426B2 (en) | Semiconductor package with embedded die and manufacturing methods thereof | |
| KR101484494B1 (en) | Method of packaging a semiconductor device and a prefabricated connector | |
| KR102212827B1 (en) | Pcb, package substrate and a manufacturing method thereof | |
| US8686556B2 (en) | Wafer level applied thermal heat sink | |
| US8956918B2 (en) | Method of manufacturing a chip arrangement comprising disposing a metal structure over a carrier | |
| CN106165554A (en) | Printed circuit board (PCB), base plate for packaging and manufacture method thereof | |
| JP7038169B2 (en) | Package substrate and its manufacturing method | |
| CN104347533B (en) | Semiconductor package and method of manufacturing the same | |
| US20220254695A1 (en) | Embedded package structure and preparation method therefor, and terminal | |
| EP2763518A1 (en) | Component embedded substrate mounting body, method for manufacturing same and component embedded substrate | |
| TW202105604A (en) | Semiconductor device and manufacturing method thereof | |
| CN105359268B (en) | Heat insulation structural used in bandwidth interconnections | |
| CN110993508A (en) | Packaging structure, manufacturing method thereof and electronic equipment | |
| US9105562B2 (en) | Integrated circuit package and packaging methods | |
| CN105359267B (en) | Including having the interconnection system of the interconnection piece of the multiple metal cores at least partly surrounded by dielectric layer | |
| KR101383002B1 (en) | Semiconductor package substrate, Package system using the same and method for manufacturing thereof | |
| US20130082386A1 (en) | Integrated circuit package and a method for manufacturing an integrated circuit package | |
| KR101382843B1 (en) | Semiconductor package substrate, Package system using the same and method for manufacturing thereof | |
| CN106571347A (en) | Insulated die | |
| CN106298692B (en) | The production method of chip-packaging structure | |
| WO2021143242A1 (en) | Packaging structure and preparation method therefor | |
| JPH0413874B2 (en) | ||
| KR102026197B1 (en) | Printed circuit board and display device having the same and method of manufacturing the same | |
| CN210167326U (en) | Glass substrate structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200410 |