CN113543617B - Electromagnetic compatibility shielding device and electronic equipment - Google Patents
Electromagnetic compatibility shielding device and electronic equipment Download PDFInfo
- Publication number
- CN113543617B CN113543617B CN202110814787.5A CN202110814787A CN113543617B CN 113543617 B CN113543617 B CN 113543617B CN 202110814787 A CN202110814787 A CN 202110814787A CN 113543617 B CN113543617 B CN 113543617B
- Authority
- CN
- China
- Prior art keywords
- shielding
- circuit board
- groove
- width
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
Abstract
The present application relates to an electromagnetic compatibility shielding device and an electronic apparatus. The electromagnetic compatibility shielding apparatus includes: the circuit module shielding device comprises a printed circuit board, a shielding layer and a shielding layer, wherein the printed circuit board is provided with a circuit module to be shielded, a groove exposing a grounding end is formed in the printed circuit board, and the groove is arranged around the circuit module; and the shell comprises a shielding cover which is arranged right above the circuit module in a covering manner, and the side wall of the shielding cover is contacted with the groove and is used for being connected with the grounding end of the printed circuit board. The printed circuit board is provided with a groove exposing the grounding end, and the groove is arranged around the circuit module to be shielded; the shield cover that the cover was located directly over the circuit module contacts with the slot, can realize electromagnetic shield's effect, and the installation is simple, is convenient for maintain and dismouting to the shield cover only covers the top of locating the circuit module that needs shield, has reached reduction in production cost and has improved work efficiency's purpose.
Description
Technical Field
The present disclosure relates to electromagnetic compatibility technologies, and in particular, to an electromagnetic compatibility shielding apparatus and an electronic device.
Background
EMC (Electro Magnetic Compatibility), that is, electromagnetic Compatibility, refers to the ability of a device or system to operate in compliance with requirements in its electromagnetic environment and not to generate intolerable electromagnetic interference to any device in its environment, a typical EMC shield on a PCB design uses a shielding clip to press a shielding case and a steel mesh machine-attached shielding case bracket, but the shielding clip to press the shielding case and the steel mesh machine-attached shielding case bracket need to attach a shielding clip or a shielding bracket first, and then the shielding case is pressed and fastened onto the shielding clip or the shielding bracket, so that the installation steps are complicated, and the maintenance and the disassembly and assembly are not convenient.
Disclosure of Invention
In view of the above, there is a need to provide an electromagnetic compatibility shielding apparatus and an electronic device, which have simple installation steps and are convenient to maintain and disassemble.
An electromagnetic compatibility shielding device comprising:
the circuit module shielding device comprises a printed circuit board, a shielding layer and a shielding layer, wherein the printed circuit board is provided with a circuit module to be shielded, a groove exposing a grounding end is formed in the printed circuit board, and the groove is arranged around the circuit module;
and the shell comprises a shielding cover, the shielding cover is arranged right above the circuit module, and the side wall of the shielding cover is in contact with the groove and is used for being connected with the grounding end of the printed circuit board.
In one embodiment, the electromagnetic compatibility shielding apparatus further comprises:
and the silk screen printing layer is arranged on the upper surface of the protective layer outside the groove and used for protecting the protective layer outside the groove, and the protective layer is positioned on the upper surface of the printed circuit board.
In one embodiment, the width of the silk-screen layer is not less than a first preset width and not more than a second preset width;
wherein the first preset width is smaller than the second preset width.
In one embodiment, the material of the screen printing layer comprises white ink.
In one embodiment, the width of the trench is not less than the third preset width and not more than the fourth preset width;
wherein the third preset width is smaller than the fourth preset width.
In one embodiment, an orthographic projection of the side wall of the shield on the upper surface of the printed circuit board at least partially coincides with the groove.
In one embodiment, the difference between the width of the groove and the thickness of the side wall of the shielding case is not less than zero and not greater than a first preset difference;
wherein the first predetermined difference is a value greater than zero.
In one embodiment, the difference between the width of the groove and the thickness of the side wall of the shielding case is not less than a second preset difference;
the second preset difference is a value greater than zero and smaller than the first preset difference.
In one embodiment, the material of the shielding case comprises aluminum alloy, the size deviation of the shielding case is not larger than a deviation preset value, and the shielding case and the printed circuit board are fixedly connected through a connecting device in the mounting hole.
An electronic device comprising the emc shield of any of the above.
The electromagnetic compatibility shielding device and the electronic equipment comprise a printed circuit board, wherein the printed circuit board is loaded with a circuit module to be shielded, and is provided with a groove exposing a grounding end, and the groove is arranged around the circuit module; and the shell comprises a shielding cover, the shielding cover is arranged right above the circuit module, and the side wall of the shielding cover is in contact with the groove and is used for being connected with the grounding end of the printed circuit board. The printed circuit board is provided with a groove exposing the grounding end, and the groove is arranged around the circuit module to be shielded; the lateral wall and the slot contact of the shield cover that the cover was located directly over the circuit module can realize electromagnetic shield's effect, and the installation is simple, be convenient for maintenance and dismouting to the shield cover only covers the top of locating the circuit module that needs shield, has reached reduction in production cost and has improved work efficiency's purpose.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a top view of an exemplary electromagnetic compatibility shield apparatus;
FIG. 2 is a schematic top view of a printed circuit board according to an embodiment;
FIG. 3 is a schematic top view of an electromagnetic compatibility shield in a further embodiment;
FIG. 4 is a schematic top view of an electromagnetic compatibility shield in yet another embodiment.
Description of the reference numerals:
102. a printed circuit board; 104. a shield case; 106. a circuit module; 108. a trench; 110. silk-screen printing layer; 112. mounting holes; 114. a peripheral mounting hole; 116. and connecting ribs.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Embodiments of the present application are set forth in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
It will be understood that, as used herein, the terms "first," "second," and the like may be used herein to describe various elements, but these elements should not be limited by these terms. These terms are only used to distinguish one element from another.
Spatial relational terms, such as "under," "below," "under," "over," and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary terms "under" and "under" can encompass both an orientation of above and below. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or be connected to the other element through intervening elements. Further, "connection" in the following embodiments is understood to mean "electrical connection", "communication connection", or the like, if there is a transfer of electrical signals or data between the connected objects.
As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises/comprising," "includes" or "including," or "having," and the like, specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Also, as used in this specification, the term "and/or" includes any and all combinations of the associated listed items.
FIG. 1 is a top view of an exemplary electromagnetic compatibility shield apparatus.
Referring to fig. 1, in the present embodiment, there is provided an electromagnetic compatibility shielding apparatus including: a printed circuit board 102 and a housing including a shield 104. The printed circuit board 102 carries a circuit module 106 which needs to be shielded, that is, the printed circuit board 102 carries a plurality of circuit modules 106 which are sensitive to electromagnetism, the printed circuit board 102 is provided with a groove 108 which exposes a grounding end, and the groove 108 is arranged around the circuit module 106; specifically, the printed circuit board 102 has conductive copper therein, the surface of the printed circuit board 102 is covered with a layer of insulating material (e.g., green oil), the trench 108 is made of an insulating material corresponding to the surface of the printed circuit board 102, the exposing of the ground terminal by the trench 108 specifically means the exposing of the conductive copper inside the printed circuit board 102 by the trench, the shielding cover 104 is covered over the circuit module 106, the sidewall of the shielding cover 104 is in contact with the trench 108, specifically means the sidewall of the shielding cover 104 is located over the trench 108, that is, one end of the sidewall of the shielding cover 104 close to the printed circuit board 102 is in contact with the upper surface of the conductive copper exposed at the bottom of the trench 108 for connecting with the ground terminal of the printed circuit board 102, wherein the shielding cover 104 corresponds to the circuit module 106 one to one.
The electromagnetic compatibility shielding device and the electronic equipment comprise a printed circuit board, wherein the printed circuit board is provided with a circuit module which needs to be shielded, and a groove which exposes a grounding end is formed in the printed circuit board and is arranged around the circuit module; and the shell comprises a shielding cover, the shielding cover is arranged right above the circuit module, and the side wall of the shielding cover is in contact with the groove and is used for being connected with the grounding end of the printed circuit board. The printed circuit board is provided with a groove exposing the grounding end, and the groove is arranged around the circuit module to be shielded; the lateral wall and the slot contact of the shield cover that the cover was located directly over the circuit module can realize electromagnetic shield's effect, and the installation is simple, be convenient for maintenance and dismouting to the shield cover only covers the top of locating the circuit module that needs shield, has reached reduction in production cost and has improved work efficiency's purpose.
Further, the circuit module 106 includes at least one of a main control module and a connector.
Fig. 2 is a schematic top view of a printed circuit board according to an embodiment, referring to fig. 2, in one embodiment, the emc shielding apparatus further includes: a screen printed layer 110. The silk-screen layer 110 is disposed on an upper surface of the protective layer outside the groove 108, and is configured to protect the protective layer outside the groove 108, where the protective layer is located on an upper surface of the printed circuit board 102, that is, an interface between the groove 108 and the protective layer is located on a side of the silk-screen layer 110 close to the groove 108. Due to the arrangement of the silk-screen layer 110, abrasion of the protective layer outside the groove 108 when the shielding cover 104 is shifted can be avoided. Further, the silk-screen layer 110 is disposed on a side of the groove 108 close to the circuit module 106, so as to avoid the circuit module 106 from being too close to the groove. Further, the silk-screen layer 110 is disposed on a side of the groove 108 away from the circuit module 106, so as to prevent other devices around the circuit module 106 from approaching the groove. Further, a screen printing layer 110 is disposed on the upper surface of the protection layer on both sides of the trench 108.
With continued reference to fig. 2, in one embodiment, the width W1 of the silk-screen layer 110 is not less than the first preset width and not greater than the second preset width; wherein the first preset width is smaller than the second preset width.
Further, the width of the silk-screen layer 110 is not less than the alignment deviation when the shielding cover 104 is installed. For example, the alignment deviation when the shielding cover 104 is installed is ± 0.1 mm, and at this time, the first preset width is not less than 0.2 mm, for example, the first preset width is 0.2 mm, 0.4 mm, 0.8mm, etc., the second preset width is 2 mm, and further, the width W1 of the screen printing layer 110 is 1 mm. In other embodiments, the selection range of the width of the silk-screen layer 110 may be set as required.
In one embodiment, the material of the screen layer 110 includes white ink. In other embodiments, the wires may be formed from different insulating materials as desired to form the silk-screen layer 110.
In one embodiment, the width W2 of the trench 108 is not less than the third preset width and not more than the fourth preset width; wherein the third preset width is smaller than the fourth preset width.
Specifically, the width of the trench 108 satisfies the connection between the sidewall of the shield 104 and the exposed ground terminal of the trench, and in one embodiment, the third predetermined width is 0.8mm, and the fourth predetermined width is 2 mm, for example, the width of the trench 108 may be 0.8mm, 0.9mm, 1 mm, 1.2 mm, 1.3 mm, 1.5 mm, 1.8 mm, 2 mm, and the like. In practical applications, the width of the trench 108 is set as desired.
In one embodiment, an orthographic projection of the sidewall of the shield can 104 on the upper surface of the printed circuit board 102 at least partially coincides with the groove 108, for example, an orthographic projection of the sidewall of the shield can 104 on the upper surface of the printed circuit board 102 coincides with a portion of the groove 108 near the circuit module 106, an orthographic projection of the sidewall of the shield can 104 on the upper surface of the printed circuit board 102 coincides with a portion of the groove 108 far from the circuit module 106, an orthographic projection of the sidewall of the shield can 104 on the upper surface of the printed circuit board 102 completely coincides with the groove 108, an orthographic projection of the sidewall of the shield can 104 on the upper surface of the printed circuit board 102 is surrounded by the groove 108, and the like.
In one embodiment, the difference between the width of the trench 108 and the thickness of the sidewall of the shield can 104 is not less than zero and not greater than a first preset difference; wherein the first predetermined difference is a value greater than zero. I.e., the thickness of the sidewalls of shield 104 is less than the width of trench 108.
In one embodiment, the difference between the width of the trench 108 and the thickness of the sidewall of the shield can 104 is not less than a second predetermined difference; the second preset difference is a value greater than zero and smaller than the first preset difference.
Specifically, the shielding cover 104 in the housing is a closed cavity which is processed according to the position of the groove and has a good shielding effect, the first preset difference and the second preset difference are both related to the size deviation when the side wall of the shielding cover 104 is prepared according to the shape of the groove 108, and the influence of the process error for preparing the shielding cover 104 on the position deviation after the shielding cover 104 is installed on the groove 108 can be eliminated by setting the first preset difference and the second preset difference. Illustratively, the size deviation of the shield 104 is ± 0.1 mm, and in this case, the first predetermined difference is 0.2 mm and the second predetermined difference is 0.1 mm. In other embodiments, the difference between the width of the trench 108 and the thickness of the sidewalls of the shield can 104 may be set as desired.
In one embodiment, the material of the shielding cover 104 includes an aluminum alloy, the dimensional deviation of the shielding cover 104 is not greater than a deviation preset value, and the shielding cover 104 and the printed circuit board 102 are fixedly connected through a connecting device in the mounting hole.
In other embodiments, the shielding cage 104 is made of a high-conductivity material, such as a copper material, an aluminum material, a steel material, a conductive material, and the like.
In one embodiment, an elastic conductive adhesive is disposed between the sidewall of the shield 104 and the trench 108. The sidewall of the shield 104 fits better to the groove 108 by the resilient conductive adhesive. The thickness of the conductive elastic glue, such as 0.5mm, 1.0mm, etc., and the width of the conductive elastic glue, such as the width of the conductive elastic glue can be 0.5mm-1.0mm, such as 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1.0mm, etc., according to actual needs.
FIG. 3 is a top view of an electromagnetic compatibility shield in yet another embodiment. Referring to fig. 3, in one embodiment, the shield 104 is in a concave configuration corresponding to the mounting holes 112 on the printed circuit board 102, and the shield 104 is fixed to the printed circuit board 102 by the connection means in the mounting holes 112, such as by screws disposed in the mounting holes 112.
FIG. 4 is a schematic top view of an electromagnetic compatibility shield in yet another embodiment. As shown in fig. 4, in this embodiment, the shield 104 is secured to the printed circuit board 102 by peripheral mounting holes 114 in the housing. Further, the connection rib 116 on the edge of the housing contacts with the exposed copper position (conductive copper on the ground) on the printed circuit board 102, and the projection of the connection rib 116 on the edge of the housing on the printed circuit board 102 coincides with the exposed copper position on the printed circuit board 102. The number of peripheral mounting holes 114 on the housing is not limited to the number required to meet structural support requirements. In practical applications, the shield case 104 can be fixed on the printed circuit board 102 by selecting a suitable connection manner according to requirements.
As shown in the figure, in one embodiment, the number of the circuit modules 106 to be shielded carried on the printed circuit board 102 is greater than or equal to 2, in this case, the shielding covers 104 corresponding to the circuit modules 106 one to one are arranged in the housing, and the side walls of the shielding covers 104 are arranged along the edges of the circuit modules 106 to be shielded. Furthermore, the shielding cases 104 corresponding to adjacent circuit modules 106 share part of the side walls, so that the purpose of saving cost is achieved while electromagnetic shielding is achieved.
The present application further provides an electronic device including the electromagnetic compatibility shielding apparatus of any one of the above.
In the description herein, references to the description of "some embodiments," "other embodiments," "desired embodiments," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, a schematic description of the above terminology may not necessarily refer to the same embodiment or example.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is specific and detailed, but not to be understood as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (8)
1. An electromagnetic compatibility shielding device, comprising:
the circuit module shielding device comprises a printed circuit board, a shielding layer and a shielding layer, wherein the printed circuit board is loaded with a circuit module to be shielded, a groove exposing a grounding end is formed in the printed circuit board, and the groove is arranged around the circuit module;
the silk-screen layer is arranged on the upper surface of the protective layer on the outer side of the groove and used for protecting the protective layer on the outer side of the groove, the protective layer is positioned on the upper surface of the printed circuit board, the silk-screen layer is arranged on the upper surfaces of the protective layers on the two sides of the groove, and the silk-screen layer is made of white ink;
the shell comprises a shielding cover, the shielding cover is fixedly connected with the printed circuit board through a connecting device in the mounting hole, the shielding cover is covered over the circuit module, and elastic conductive adhesive is arranged between the side wall of the shielding cover and the groove and is used for being connected with the grounding end of the printed circuit board;
the size deviation of the shielding cover is not larger than a deviation preset value, and the width of the silk-screen layer is not smaller than the alignment deviation of the shielding cover during installation.
2. The emc shield of claim 1, wherein the width of the screen layer is not less than a first predetermined width and not greater than a second predetermined width;
wherein the first preset width is smaller than the second preset width.
3. The emc shield of claim 1, wherein the width of the trench is not less than a third predetermined width and not greater than a fourth predetermined width;
wherein the third preset width is smaller than the fourth preset width.
4. The emc shield of any one of claims 1-3, wherein an orthographic projection of the sidewalls of the shield on the upper surface of the pcb at least partially coincides with the groove.
5. The EMI shielding apparatus of claim 4, wherein a difference between a width of said trench and a thickness of a sidewall of said shield case is not less than zero and not greater than a first predetermined difference;
wherein the first preset difference is a value greater than zero.
6. The emc shield of claim 5, wherein a difference between a width of the trench and a thickness of the sidewalls of the shield is no less than a second predetermined difference;
the second preset difference is a value which is larger than zero and smaller than the first preset difference.
7. The emc shield of claim 1, wherein the shield material comprises an aluminum alloy.
8. An electronic device, characterized in that the electronic device comprises an electromagnetic compatibility shielding apparatus according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110814787.5A CN113543617B (en) | 2021-07-19 | 2021-07-19 | Electromagnetic compatibility shielding device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110814787.5A CN113543617B (en) | 2021-07-19 | 2021-07-19 | Electromagnetic compatibility shielding device and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113543617A CN113543617A (en) | 2021-10-22 |
| CN113543617B true CN113543617B (en) | 2023-03-24 |
Family
ID=78128824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110814787.5A Active CN113543617B (en) | 2021-07-19 | 2021-07-19 | Electromagnetic compatibility shielding device and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113543617B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1774959A (en) * | 2003-04-15 | 2006-05-17 | 波零公司 | Electomagnetic interference shielding for a printed circuit board |
| CN202663713U (en) * | 2012-06-04 | 2013-01-09 | 环达电脑(上海)有限公司 | Electromagnetic shielding cover structure |
| CN202738318U (en) * | 2012-08-27 | 2013-02-13 | 杭州华三通信技术有限公司 | Plug-in card protective cover and electronic device |
| CN104157618A (en) * | 2014-08-07 | 2014-11-19 | 华进半导体封装先导技术研发中心有限公司 | Packaging structure and packaging technology for radio-frequency module |
| CN110993508A (en) * | 2019-11-22 | 2020-04-10 | 青岛歌尔智能传感器有限公司 | Packaging structure, manufacturing method thereof and electronic equipment |
| CN112888283A (en) * | 2019-11-30 | 2021-06-01 | 华为技术有限公司 | Shielding cover, shielding cover, equipment printed circuit board and electronic equipment |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5724234A (en) * | 1996-05-02 | 1998-03-03 | Ericsson Inc. | Slotted shield can |
| KR100592768B1 (en) * | 1999-03-12 | 2006-06-26 | 삼성전자주식회사 | Electro magnetic interference shield apparatus |
| CN101499459B (en) * | 2008-01-28 | 2010-09-08 | 日月光半导体制造股份有限公司 | Packaging structure |
| CN202364529U (en) * | 2011-12-08 | 2012-08-01 | 北京北大千方科技有限公司 | Vehicle-mounted equipment |
| CN104144598B (en) * | 2013-05-08 | 2018-02-02 | 鸿富锦精密工业（深圳）有限公司 | Radome and circuit board fixation structure |
| CN103491753B (en) * | 2013-08-26 | 2016-10-05 | 苏州佳世达电通有限公司 | Radome |
| CN204350441U (en) * | 2015-02-05 | 2015-05-20 | 苍南县伯特利电子有限公司 | A kind of two plane type wiring board with heat radiation |
| CN205847843U (en) * | 2016-06-03 | 2016-12-28 | 上海与德通讯技术有限公司 | Mainboard structure and mobile terminal with radome |
| CN107734947A (en) * | 2016-08-10 | 2018-02-23 | 莱尔德电子材料（上海）有限公司 | Electro-magnetic shielding cover and electronic equipment |
| CN206181715U (en) * | 2016-11-30 | 2017-05-17 | 深圳天珑无线科技有限公司 | Mobile terminal shield assembly |
| CN207305054U (en) * | 2017-09-27 | 2018-05-01 | 梅州华盛电路板有限公司 | A kind of LED display wiring board for preventing short circuit |
| CN208095042U (en) * | 2018-03-06 | 2018-11-13 | 红河学院 | A kind of high-voltage electrical apparatus screening arrangement |
| CN209497668U (en) * | 2018-08-24 | 2019-10-15 | 东莞联桥电子有限公司 | A kind of slim pcb board with shielding construction |
| CN210093661U (en) * | 2019-04-28 | 2020-02-18 | 湖南中车时代电动汽车股份有限公司 | PCB board, circuit arrangement for automotive electronics with test point |
| CN110493949A (en) * | 2019-08-08 | 2019-11-22 | 上海创功通讯技术有限公司 | Flexible circuit board and preparation method thereof, electronic equipment |
| CN211406420U (en) * | 2019-09-16 | 2020-09-01 | 叶志行 | Anti-static printed circuit board |
| EP3817043A1 (en) * | 2019-10-31 | 2021-05-05 | Heraeus Deutschland GmbH & Co KG | Electromagnetic interference shielding in recesses of electronic modules |
| CN113056148A (en) * | 2019-12-26 | 2021-06-29 | 鸿富锦精密工业(武汉)有限公司 | Stack type mainboard and electronic equipment |
| CN212628570U (en) * | 2020-08-03 | 2021-02-26 | 成都市一博科技有限公司 | Sink-embedded shielding cover |
| CN212783443U (en) * | 2020-09-04 | 2021-03-23 | 北京金百泽科技有限公司 | Chip packaging structure of PCB board with quick layout characteristic |
-
2021
- 2021-07-19 CN CN202110814787.5A patent/CN113543617B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1774959A (en) * | 2003-04-15 | 2006-05-17 | 波零公司 | Electomagnetic interference shielding for a printed circuit board |
| CN202663713U (en) * | 2012-06-04 | 2013-01-09 | 环达电脑(上海)有限公司 | Electromagnetic shielding cover structure |
| CN202738318U (en) * | 2012-08-27 | 2013-02-13 | 杭州华三通信技术有限公司 | Plug-in card protective cover and electronic device |
| CN104157618A (en) * | 2014-08-07 | 2014-11-19 | 华进半导体封装先导技术研发中心有限公司 | Packaging structure and packaging technology for radio-frequency module |
| CN110993508A (en) * | 2019-11-22 | 2020-04-10 | 青岛歌尔智能传感器有限公司 | Packaging structure, manufacturing method thereof and electronic equipment |
| CN112888283A (en) * | 2019-11-30 | 2021-06-01 | 华为技术有限公司 | Shielding cover, shielding cover, equipment printed circuit board and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113543617A (en) | 2021-10-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI558309B (en) | Electronic device with heat dissipating electromagnetic interference shielding structures | |
| US4829432A (en) | Apparatus for shielding an electrical circuit from electromagnetic interference | |
| US20060189183A1 (en) | Camera module connector | |
| US6456504B1 (en) | Surface mounted grounding clip for shielded enclosures | |
| EP2018046B1 (en) | Mounting Structure For Compact Camera Module | |
| CN210008007U (en) | Electronic device | |
| EP1930995A2 (en) | Electrical connector | |
| CN101902022B (en) | Junction box for a vehicle | |
| US7609530B2 (en) | Conductive elastomeric shielding device and method of forming same | |
| CN210835357U (en) | Optical module | |
| US6985366B2 (en) | EMC shield and housing for electronic components | |
| KR100959577B1 (en) | Enclosure of information technology equipment | |
| EP3125069B1 (en) | Structure and method for reducing electromagnetic interference | |
| CN113543617B (en) | Electromagnetic compatibility shielding device and electronic equipment | |
| CN112187970B (en) | Camera module and electronic device thereof | |
| KR100585938B1 (en) | Connector having a shell which can readily be fixed to a connector housing | |
| CN111491439A (en) | Circuit board assembly and electronic equipment | |
| KR20210004774A (en) | Receptacle connector | |
| KR100612574B1 (en) | Noise removal structure of FPCB for mobile communication terminal | |
| TWI769682B (en) | Electrical connector with electromagnetic shielding function | |
| KR20230074409A (en) | Antenna equipment and electronics | |
| US20090266602A1 (en) | Electromagnetic interference shield | |
| KR101133630B1 (en) | Receptacle connector improved in mounting structure | |
| CN220253675U (en) | Connector shielding conducting structure and vehicle-mounted camera | |
| CN219164811U (en) | Circuit board assembly and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: Floor 25, Block A, Zhongzhou Binhai Commercial Center Phase II, No. 9285, Binhe Boulevard, Shangsha Community, Shatou Street, Futian District, Shenzhen, Guangdong 518000 Patentee after: Shenzhen Youjia Innovation Technology Co.,Ltd. Address before: 518051 1101, west block, Skyworth semiconductor design building, 18 Gaoxin South 4th Road, Gaoxin community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN MINIEYE INNOVATION TECHNOLOGY Co.,Ltd. |
|
| CP03 | Change of name, title or address |