CN110989221A

CN110989221A - Display substrate, preparation method and repair method thereof and display device

Info

Publication number: CN110989221A
Application number: CN201911329011.3A
Authority: CN
Inventors: 刘群; 郭宏雁; 刘俊豪; 南武杰; 何辰光; 张晓东; 郭炼; 张荣聪
Original assignee: BOE Technology Group Co Ltd; Wuhan BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Wuhan BOE Optoelectronics Technology Co Ltd
Priority date: 2019-12-20
Filing date: 2019-12-20
Publication date: 2020-04-10
Anticipated expiration: 2039-12-20
Also published as: CN110989221B

Abstract

The invention provides a display substrate, a preparation method and a repair method thereof and a display device. The display substrate comprises a common electrode wire positioned in the fan-out area, a plurality of signal wires which are insulated and crossed with the common electrode wire and a breakpoint repairing unit; the common electrode wire comprises a first common electrode wire and a second common electrode wire which are arranged in parallel and a plurality of connecting strips for connecting the first common electrode wire and the second common electrode wire, the connecting strips are arranged between adjacent signal wires, the breakpoint repair unit is respectively connected with the signal wires and the first common electrode wire, and the breakpoint repair unit is used for communicating the signal wires on two sides of the breakpoint when the breakpoint occurs in the signal wires. According to the invention, the breakpoint repair unit and the public electrode wire of the double-wire structure are arranged in the fan-out region, so that bad repair of broken wires of the data wires in the fan-out region is realized, product scrapping is avoided, and the product yield is improved.

Description

Display substrate, preparation method and repair method thereof and display device

Technical Field

The invention relates to the technical field of display, in particular to a display substrate, a preparation method and a repair method thereof and a display device.

Background

A Liquid Crystal Display (LCD) is a flat panel Display device, and has features of small size, low power consumption, no radiation, and relatively low manufacturing cost, so that the LCD has been rapidly developed in recent years, and is increasingly applied to the field of high-performance Display.

Currently, a main structure of a liquid crystal display device includes an array (TFT) substrate and a Color Filter (CF) substrate which are oppositely disposed, and a Liquid Crystal (LC) layer disposed between the two substrates. The array substrate includes a display area, a Fan-out (Fan-out) area, and a circuit area, the Fan-out area being disposed between the display area and the circuit area. The display area is provided with grid lines and data lines, a plurality of grid lines and a plurality of data lines are perpendicularly crossed to form a plurality of pixels arranged in a matrix, a Thin Film Transistor (TFT) is arranged in each pixel, the circuit area is provided with a driving circuit and the like, and the fan-out area is provided with a data lead and the like.

In the preparation process of the array substrate, the disconnection defect of the data line is inevitably generated. At present, for the data line disconnection defect occurring in the display area, the prior art generally performs maintenance through the corresponding electrode in the pixel, but for the data line disconnection defect occurring in the fan-out area, there is no effective maintenance scheme in the prior art.

Disclosure of Invention

The technical problem to be solved by the embodiment of the invention is to provide a display substrate, a preparation method and a repair method thereof, and a display device, so as to solve the problem that the fan-out area data line can not be maintained and broken in the prior art.

In order to solve the above technical problem, an embodiment of the present invention provides a display substrate, including a common electrode line located in a fan-out region, a plurality of signal lines insulated and crossed with the common electrode line, and a breakpoint repair unit; the common electrode wire comprises a first common electrode wire and a second common electrode wire which are arranged in parallel and a plurality of connecting strips for connecting the first common electrode wire and the second common electrode wire, the connecting strips are arranged between adjacent signal wires, the breakpoint repair unit is respectively connected with the signal wires and the first common electrode wire, and the breakpoint repair unit is used for communicating the signal wires on two sides of the breakpoint when the breakpoint occurs in the signal wires.

Optionally, the first common electrode line, the second common electrode line and the plurality of connecting bars are disposed on the substrate; the signal line comprises a data lead and a data line which are connected through a first connecting electrode, and the data lead is arranged on the substrate and connected with the breakpoint repairing unit; a first insulating layer covers the data lead, the data line is arranged on the first insulating layer, and a first overlapping area and a second overlapping area are formed by the data line and the first common electrode line and the second common electrode line respectively; the second insulating layer covers the data line, and the first connecting electrode is arranged on the second insulating layer and connected with the data lead and the data line through a via hole.

Optionally, the breakpoint repairing unit includes a repairing electrode layer disposed on the substrate, a first insulating layer covering the repairing electrode layer, and a lap electrode layer disposed on the first insulating layer; the repair electrode layer comprises a first repair electrode, a second repair electrode and a third repair electrode which are arranged on the substrate, the first repair electrode is connected with the signal line, the second repair electrode is connected with the first public electrode line, the third repair electrode is arranged between the first repair electrode and the second repair electrode, and the third repair electrode is used for connecting the signal line on two sides of the breakpoint through the lap electrode layer and the first repair electrode and the second repair electrode when the breakpoint occurs on the signal line.

Optionally, the landing electrode layer includes a first landing electrode, a second landing electrode, a third landing electrode, and a fourth landing electrode disposed on the first insulating layer; the first lapping electrode and the first repairing electrode have an overlapping region, the second lapping electrode and the first repairing electrode and the third repairing electrode have an overlapping region, and a semiconductor layer is arranged between the first lapping electrode and the second lapping electrode; the third lapping electrode and the second repairing electrode have an overlapping region, the fourth lapping electrode and the second repairing electrode and the third repairing electrode have an overlapping region, and a semiconductor layer is arranged between the third lapping electrode and the fourth lapping electrode.

Optionally, the first overlapping electrode, the second overlapping electrode, the third overlapping electrode and the fourth overlapping electrode are all L-shaped electrodes formed by a rectangular portion and a strip portion, the rectangular portion of the first overlapping electrode and the strip portion of the second overlapping electrode have an overlapping region with the first repairing electrode, the rectangular portion of the third overlapping electrode and the strip portion of the fourth overlapping electrode have an overlapping region with the second repairing electrode, the strip portion of the first overlapping electrode, the rectangular portion of the second overlapping electrode, the strip portion of the third overlapping electrode and the rectangular portion of the fourth overlapping electrode have an overlapping region with the third repairing electrode.

Optionally, the breakpoint repair unit further includes a second insulating layer covering the overlapping electrode layer, and a second connection electrode, a third connection electrode, and a fourth connection electrode that are disposed on the second insulating layer, the second connection electrode is connected to the third repair electrode, the second overlapping electrode, and the fourth overlapping electrode through via holes, the third connection electrode is connected to the first repair electrode and the first overlapping electrode through via holes, and the fourth connection electrode is connected to the second repair electrode and the third overlapping electrode through via holes.

Optionally, the line width of the first common electrode line and the line width of the second common electrode line are both greater than or equal to 8 μm, and the distance between the first common electrode line and the second common electrode line, the distance between the signal line and the connecting bar on one side, and the distance between the signal line and the connecting bar on the other side are both greater than or equal to 5 μm.

An embodiment of the invention provides a display device, which includes the display substrate.

In order to solve the above technical problem, an embodiment of the present invention further provides a method for manufacturing a display substrate, including:

forming a common electrode line, a plurality of signal lines which are insulated and crossed with the common electrode line and a breakpoint repairing unit in a fan-out area; the common electrode wire comprises a first common electrode wire and a second common electrode wire which are arranged in parallel and a plurality of connecting strips for connecting the first common electrode wire and the second common electrode wire, the connecting strips are arranged between adjacent signal wires, the breakpoint repair unit is respectively connected with the signal wires and the common electrode wires, and the breakpoint repair unit is used for communicating the signal wires on two sides of the breakpoint when the signal wires have breakpoints.

Optionally, forming a common electrode line, a plurality of signal lines insulated and crossed with the common electrode line, and a breakpoint repair unit in a fan-out region, includes:

forming a data lead, a common electrode line and a repair electrode layer of a breakpoint repair unit on a substrate; the repair electrode layer comprises a first repair electrode, a second repair electrode and a third repair electrode, the first repair electrode is connected with the data lead, the second repair electrode is connected with the first common electrode wire, and the third repair electrode is arranged between the first repair electrode and the second repair electrode;

and forming a data line connected with the data lead and a lap electrode layer of the breakpoint repair unit, wherein the data line and the first and second common electrode lines respectively form a first overlapping area and a second overlapping area.

Optionally, forming a data line connected to the data lead and a lap electrode layer of the breakpoint repair unit includes:

forming a first insulating layer covering the data lead, the common electrode line and the repair electrode layer;

forming a semiconductor layer on the first insulating layer;

forming a lap electrode layer of the data line and the breakpoint repair unit; the lapping electrode layer comprises a first lapping electrode, a second lapping electrode, a third lapping electrode and a fourth lapping electrode; the first lapping electrode is respectively overlapped with the first repairing electrode and the third repairing electrode, the second lapping electrode is respectively overlapped with the first repairing electrode and the third repairing electrode, and the semiconductor layer is arranged between the first lapping electrode and the second lapping electrode; the third lapping electrode has an overlapping region with the second repairing electrode and the third repairing electrode respectively, the fourth lapping electrode has an overlapping region with the second repairing electrode and the third repairing electrode respectively, and the semiconductor layer is arranged between the third lapping electrode and the fourth lapping electrode;

forming a second insulating layer covering the data line and the overlap electrode layer;

forming a connection electrode layer on the second insulating layer; the connection electrode layer includes first connection electrode, second connection electrode, third connection electrode and fourth connection electrode, first connection electrode passes through via connection data lead wire and data line, the second connection electrode passes through via connection electrode, second overlap joint electrode and fourth overlap joint electrode are restoreed to the third, the third connection electrode passes through via connection electrode and first repair electrode and first overlap joint electrode, the fourth connection electrode passes through via connection electrode the second restore electrode and with third overlap joint electrode.

In order to solve the above technical problem, an embodiment of the present invention further provides a method for repairing a display substrate, where the display substrate includes a common electrode line located in a fan-out region, a plurality of signal lines insulated and crossed with the common electrode line, and a breakpoint repairing unit; the common electrode wires comprise a first common electrode wire, a second common electrode wire and a plurality of connecting strips, the first common electrode wire and the second common electrode wire are arranged in parallel, the connecting strips are arranged between adjacent signal wires, the signal wires and the first common electrode wire and the second common electrode wire respectively form a first overlapping area and a second overlapping area, the breakpoint repairing unit is respectively connected with the signal wires and the common electrode wires, and the repairing method comprises the following steps:

welding the first overlapping area to connect the signal line at one side of the breakpoint with the first common electrode line; cutting the first common electrode wire and the connecting strip outside the first overlapping area to isolate the first overlapping area from the second overlapping area;

and welding the breakpoint repairing unit to connect the signal line on the other side of the breakpoint with the first common electrode line.

Optionally, the breakpoint repairing unit includes a repairing electrode layer disposed on the substrate, a first insulating layer covering the repairing electrode layer, and a lap electrode layer disposed on the first insulating layer; the repair electrode layer comprises a first repair electrode, a second repair electrode and a third repair electrode, wherein the first repair electrode, the second repair electrode and the third repair electrode are arranged on the substrate, the first repair electrode is connected with the signal line, the second repair electrode is connected with the first common electrode line, and the third repair electrode is arranged between the first repair electrode and the second repair electrode; welding the breakpoint repair unit, including:

and welding the overlapping regions of the lapping electrode layer and the first repairing electrode, the second repairing electrode and the third repairing electrode, so that the third repairing electrode is respectively connected with the first repairing electrode and the second repairing electrode.

Optionally, the overlapping electrode layer includes a first overlapping electrode, a second overlapping electrode, a third overlapping electrode and a fourth overlapping electrode, which are disposed on the first insulating layer, the first overlapping electrode and the second overlapping electrode respectively have an overlapping region with the first repairing electrode and the third repairing electrode, the first repairing electrode is connected to the first overlapping electrode, the third overlapping electrode and the fourth overlapping electrode respectively have an overlapping region with the second repairing electrode and the third repairing electrode, the second repairing electrode is connected to the third overlapping electrode, and the third repairing electrode is connected to the second overlapping electrode and the fourth overlapping electrode; welding the overlap region of the lap electrode layer and the first repair electrode, the second repair electrode and the third repair electrode, including:

welding the overlapping area of the first lapping electrode and the third repairing electrode and the overlapping area of the fourth lapping electrode and the second repairing electrode, so that the third repairing electrode is respectively connected with the first repairing electrode and the second repairing electrode; alternatively, the first and second electrodes may be,

welding the overlapping region of the second lapping electrode and the first repairing electrode and the overlapping region of the third lapping electrode and the third repairing electrode, so that the third repairing electrode is respectively connected with the first repairing electrode and the second repairing electrode; alternatively, the first and second electrodes may be,

and welding the overlapping area of the second lapping electrode and the first repairing electrode and the overlapping area of the fourth lapping electrode and the second repairing electrode, so that the third repairing electrode is respectively connected with the first repairing electrode and the second repairing electrode.

The embodiment of the invention provides a display substrate, a manufacturing method and a repairing method thereof, and a display device. Meanwhile, the breakpoint repairing unit also has the function of eliminating the static electricity of the signal line.

Of course, not all of the advantages described above need to be achieved at the same time in the practice of any one product or method of the invention. Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the embodiments of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

Drawings

The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the example serve to explain the principles of the invention and not to limit the invention. The shapes and sizes of the various elements in the drawings are not to scale and are merely intended to illustrate the invention.

FIG. 1 is a schematic view of a display substrate according to an embodiment of the present invention;

FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;

FIG. 3 is a cross-sectional view taken along line B-B of FIG. 1;

FIG. 4 is a schematic diagram of a data line, a common electrode line and other patterns formed according to an embodiment of the present invention;

FIG. 5 is a cross-sectional view taken along line A-A of FIG. 4;

FIG. 6 is a cross-sectional view taken along line B-B of FIG. 4;

FIG. 7 is a schematic diagram illustrating an embodiment of the present invention after forming patterns such as data lines;

FIG. 8 is a cross-sectional view taken along line A-A of FIG. 7;

FIG. 9 is a cross-sectional view taken along line B-B of FIG. 7;

FIG. 10 is a schematic view showing a second insulating layer and other patterns formed in accordance with an embodiment of the present invention;

FIG. 11 is a cross-sectional view taken along line A-A of FIG. 10;

FIG. 12 is a cross-sectional view taken along line B-B of FIG. 10;

FIG. 13 is a diagram illustrating an embodiment of repairing a bad data line disconnection according to the present invention;

FIG. 14 is a diagram illustrating another embodiment of repairing a bad data line disconnection according to an embodiment of the present invention;

fig. 15 is a schematic structural diagram of a common electrode line according to an embodiment of the present invention.

Description of reference numerals:

10-a substrate; 11 — a first insulating layer; 12 — a second insulating layer;

20 — data leads; 21-a first repair electrode; 22 — a second repair electrode;

23-a third repair electrode; 30-common electrode lines; 31 — a first common electrode line;

32 — a second common electrode line; 33-connecting strips; 41 — first overlap region;

42 — second overlap region; 43 — a third overlap region; 44 — a fourth overlap region;

45-fifth overlap area; 46 — a sixth overlap region; 50-data line;

51 — a first strap electrode; 52 — a second strap electrode; 53-third overlap electrode;

54-a fourth strap electrode; 55-a semiconductor layer; 61 — a first connecting electrode;

62-a second connecting electrode; 63 — a third connecting electrode; 64-fourth connecting electrode.

Detailed Description

The following describes embodiments with reference to the drawings. Note that the embodiments may be implemented in a plurality of different forms. Those skilled in the art can easily understand the fact that the modes and contents can be changed into various forms without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the following embodiments.

In the drawings, the size of each component, the thickness of layers, or regions may be exaggerated for clarity. Therefore, the present invention is not necessarily limited to the dimensions, and the shapes and sizes of the respective members in the drawings do not reflect actual proportions. In addition, the drawings schematically show desirable examples, and one embodiment of the present invention is not limited to the shapes, numerical values, and the like shown in the drawings.

The ordinal numbers such as "first", "second", "third", and the like in the present specification are provided for avoiding confusion among the constituent elements, and are not limited in number.

In this specification, for convenience, terms indicating orientation or positional relationship such as "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like are used to explain positional relationship of constituent elements with reference to the drawings, only for convenience of description and simplification of description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. The positional relationship of the components is changed as appropriate in accordance with the direction in which each component is described. Therefore, the words described in the specification are not limited to the words described in the specification, and may be replaced as appropriate.

In this specification, the terms "mounted," "connected," and "connected" are to be construed broadly unless otherwise specifically indicated and limited. For example, the connection can be fixed, detachable or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening components, or may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In this specification, a transistor refers to an element including at least three terminals, i.e., a gate electrode, a drain electrode, and a source electrode. The transistor has a channel region between a drain electrode (drain electrode terminal, drain region, or drain electrode) and a source electrode (source electrode terminal, source region, or source electrode), and current can flow through the drain electrode, the channel region, and the source electrode. Note that in this specification, a channel region refers to a region where current mainly flows.

In this specification, functions of the "source electrode" and the "drain electrode" may be interchanged when a transistor having opposite polarities is used, when a current direction changes during circuit operation, or the like. Therefore, in this specification, "source electrode" and "drain electrode" may be exchanged with each other.

In this specification, "electrically connected" includes a case where constituent elements are connected together by an element having some kind of electrical action. The "element having a certain electric function" is not particularly limited as long as it can transmit and receive an electric signal between connected components. Examples of the "element having some kind of electric function" include not only an electrode and a wiring but also a switching element such as a transistor, a resistor, an inductor, a capacitor, other elements having various functions, and the like.

In the present specification, "parallel" means a state in which an angle formed by two straight lines is-10 ° or more and 10 ° or less, and therefore, includes a state in which the angle is-5 ° or more and 5 ° or less. The term "perpendicular" refers to a state in which the angle formed by two straight lines is 80 ° or more and 100 ° or less, and therefore includes a state in which the angle is 85 ° or more and 95 ° or less.

In the present specification, "film" and "layer" may be interchanged with each other. For example, the "conductive layer" may be sometimes replaced with a "conductive film". Similarly, the "insulating film" may be replaced with an "insulating layer".

At present, in the manufacturing process of the liquid crystal display device, when a Data Open failure is detected after the liquid crystal display device is boxed, if the Data Open failure occurs in the display area, the liquid crystal display device is generally shipped after being maintained by the corresponding electrodes in the pixels. If the broken line is detected to occur in the fan-out area, the product can only be scrapped due to no effective maintenance method, the yield of the product is reduced, and the production cost is increased.

In order to solve the problem that the prior art cannot maintain the broken line of the data line of the fan-out area, the embodiment of the invention provides a display substrate. The design idea of the embodiment of the invention is that the common electrode wire with the double-line structure and the breakpoint repair unit with the double-layer structure are arranged in the fan-out area of the display substrate, and when the data wire is badly broken, the data wires at two sides of the breakpoint are connected by utilizing one common electrode wire and the breakpoint repair unit, so that the bad repair of the broken data wire in the fan-out area is realized.

The display substrate comprises a common electrode wire positioned in a fan-out area, a plurality of signal wires which are in insulation intersection with the common electrode wire and a breakpoint repair unit; the common electrode wire comprises a first common electrode wire and a second common electrode wire which are arranged in parallel and a plurality of connecting strips for connecting the first common electrode wire and the second common electrode wire, the connecting strips are arranged between adjacent signal wires, the breakpoint repair unit is respectively connected with the signal wires and the first common electrode wire, and the breakpoint repair unit is used for communicating the signal wires on two sides of the breakpoint when the breakpoint occurs in the signal wires. Meanwhile, the breakpoint repairing unit is also used for eliminating static electricity of the signal line.

The first common electrode line, the second common electrode line and the plurality of connecting strips are arranged on the substrate, and the second end of the breakpoint repair unit is connected with the first common electrode line. The signal line comprises a data lead and a data line which are connected through a first connecting electrode, and the data lead is arranged on the substrate and is connected with the first end of the breakpoint repairing unit; a first insulating layer covers the data lead, the data line is arranged on the first insulating layer, and a first overlapping area and a second overlapping area are formed by the data line and the first common electrode line and the second common electrode line respectively; the second insulating layer covers the data line, and the first connecting electrode is arranged on the second insulating layer and connected with the data lead and the data line through a via hole.

The breakpoint repairing unit comprises a repairing electrode layer arranged on a substrate, a first insulating layer covering the repairing electrode layer, and a lap electrode layer arranged on the first insulating layer; the repair electrode layer comprises a first repair electrode, a second repair electrode and a third repair electrode which are arranged on the substrate, the first repair electrode serving as a first end of the breakpoint repair unit is connected with the data lead, the second repair electrode serving as a second end of the breakpoint repair unit is connected with the first common electrode wire, the third repair electrode is arranged between the first repair electrode and the second repair electrode at an interval, and the third repair electrode is used for connecting the first repair electrode and the second repair electrode through the lapping electrode layer when a breakpoint occurs on the signal wire, namely the first repair electrode, the second repair electrode and the third repair electrode are connected together to enable the signal wires on two sides of the breakpoint to be communicated.

The breakpoint repairing unit further comprises a second insulating layer covering the lapping electrode layer and a connecting electrode layer arranged on the second insulating layer, wherein the lapping electrode layer is used for being connected with the repairing electrode layer through the connecting electrode layer; the lapping electrode layer comprises a first lapping electrode, a second lapping electrode, a third lapping electrode and a fourth lapping electrode which are arranged on the first insulating layer at intervals, the first lapping electrode, the first repairing electrode and the third repairing electrode are provided with overlapping areas, the second lapping electrode, the first repairing electrode and the third repairing electrode are provided with overlapping areas, the third lapping electrode, the second repairing electrode and the third repairing electrode are provided with overlapping areas, and the fourth lapping electrode, the second repairing electrode and the third repairing electrode are provided with overlapping areas; the connection electrode layer is including setting up first connection electrode, second connection electrode, third connection electrode and fourth connection electrode on the second insulating layer, first connection electrode pass through the via hole with data lead and data line are connected, the second connection electrode pass through the via hole with electrode, second overlap joint electrode and fourth overlap joint electrode connection are restoreed to the third, the third connection electrode pass through the via hole with first restoration electrode and first overlap joint electrode connection, the fourth connection electrode pass through the via hole with electrode and third overlap joint electrode connection are restoreed to the second.

The data lead, the common electrode wire and the repair electrode layer are arranged on the same layer and are formed through the same composition process. The data line and the lap electrode layer are arranged on the same layer and are formed through the same composition process. The first connecting electrode, the second connecting electrode, the third connecting electrode and the fourth connecting electrode are arranged on the same layer and are formed through the same composition process.

Fig. 1, 2 and 3 are schematic structural views of a display substrate according to an embodiment of the present invention, in which fig. 1 is a plan view, fig. 2 is a sectional view taken along a-a direction in fig. 1, and fig. 3 is a sectional view taken along a-B direction in fig. 1. As shown in fig. 1, 2 and 3, the display substrate according to the embodiment of the present invention includes:

a substrate 10;

a data lead 20, a common electrode line 30, and a repair electrode layer of a breakpoint repair unit disposed on the substrate 10; the common electrode line 30 includes a first common electrode line 31, a second common electrode line 32 and a plurality of connecting bars 33 arranged in parallel, the plurality of connecting bars 33 are arranged between the first common electrode line 31 and the second common electrode line 32 and are respectively connected with the first common electrode line 31 and the second common electrode line 32, and each connecting bar 33 is arranged between adjacent data lines 50; the repair electrode layer of the breakpoint repair unit comprises a first repair electrode 21, a second repair electrode 22 and a third repair electrode 23, the first repair electrode 21 is connected with the data lead 20, the second repair electrode 22 is connected with the first common electrode line 31, and the third repair electrode 23 is arranged between the first repair electrode 21 and the second repair electrode 22;

a first insulating layer 11 covering the data leads 20, the common electrode lines 30, and the repair electrode layer;

a data line 50 disposed on the first insulating layer 11 and a landing electrode layer of the breakpoint repair unit; wherein, the data line 50 is insulated and crossed with the common electrode line 30 to form a first overlapping area 41 and a second overlapping area 42; the lap electrode layer comprises a first lap electrode 51, a second lap electrode 52, a third lap electrode 53 and a fourth lap electrode 54 which are arranged at intervals, the first lap electrode 51 is respectively provided with an overlapping region with the first repair electrode 21 and the third repair electrode 23, the second lap electrode 52 is also respectively provided with an overlapping region with the first repair electrode 21 and the third repair electrode 23, a semiconductor layer 55 is arranged between the first lap electrode 51 and the second lap electrode 52, the third lap electrode 53 is respectively provided with an overlapping region with the second repair electrode 22 and the third repair electrode 23, the fourth lap electrode 54 is also respectively provided with an overlapping region with the second repair electrode 22 and the third repair electrode 23, and a semiconductor layer 55 is arranged between the third lap electrode 53 and the fourth lap electrode 54;

a second insulating layer 12 covering the data line 50 and the overlap electrode layer, the second insulating layer 12 having a plurality of via holes formed thereon;

a connection electrode layer provided on the second insulating layer 12; the connection electrode layer comprises a first connection electrode 61, a second connection electrode 62, a third connection electrode 63 and a fourth connection electrode 64, the first connection electrode 61 connects the data lead 20 with the data line 50 through a via hole, the second connection electrode 62 connects the third repair electrode 23, the second overlapping electrode 52 and the fourth overlapping electrode 54 through via holes, the third connection electrode 63 connects the first repair electrode 21 with the first overlapping electrode 51 through a via hole, and the fourth connection electrode 64 connects the second repair electrode 22 with the third overlapping electrode 53 through a via hole.

In summary, the display substrate according to the embodiment of the invention includes three conductive layers, a first conductive layer, a second conductive layer and a third conductive layer, wherein a first insulating layer is disposed between the first conductive layer and the second conductive layer, and a second insulating layer is disposed between the second conductive layer and the third conductive layer. The first conductive layer includes a horizontally disposed common electrode line 30, a vertically disposed data lead 20, a first repair electrode 21, a second repair electrode 22, and a third repair electrode 23, and the above patterns are disposed in the same layer and formed by the same patterning process. The common electrode line 30 includes a first common electrode line 31 and a second common electrode line 32 arranged in parallel, and the first common electrode line 31 and the second common electrode line 32 are connected by a plurality of connecting bars 33 arranged at intervals. The first repair electrode 21 is connected to the data lead 20, the second repair electrode 22 is connected to the first common electrode line 31, and the third repair electrode 23 is disposed between the first repair electrode 21 and the second repair electrode 22. The second conductive layer includes a vertically disposed data line 50, a first landing electrode 51, a second landing electrode 52, a third landing electrode 53, and a fourth landing electrode 54, which are disposed in the same layer and formed through the same patterning process. The data line 50 perpendicularly crosses the common electrode line 30, the data line 50 forms a first overlapping area 41 with the first common electrode line 31, and the data line 50 forms a second overlapping area 42 with the second common electrode line 32. The first and

second landing electrodes

51 and 52 are respectively disposed over the first and

third repair electrodes

21 and 23, and the third and

fourth landing electrodes

53 and 54 are respectively disposed over the second and

third repair electrodes

22 and 23. The third conductive layer includes a first connection electrode 61, a second connection electrode 62, a third connection electrode 63, and a fourth connection electrode 64, and the above-described patterns are disposed at the same layer and formed through the same patterning process. The first connection electrode 61 connects the data lead 20 and the data line 50 through a via hole, the second connection electrode 62 connects the third repair electrode 23, the second lap electrode 52, and the fourth lap electrode 54 through a via hole, the third connection electrode 63 connects the first lap electrode 51 and the first repair electrode 21 through a via hole, and the fourth connection electrode 64 connects the third lap electrode 53 and the second repair electrode 22 through a via hole.

The embodiment of the invention provides a display substrate, wherein a breakpoint repairing unit and a public electrode wire with a double-wire structure are arranged in a fan-out region, and the breakpoint repairing unit is used for communicating signal wires on two sides of a breakpoint when the signal wires have breakpoints, so that bad repair of broken data wires in the fan-out region is realized, product scrapping is avoided, and the product yield is improved. Meanwhile, the breakpoint repairing unit also has the function of eliminating the static electricity of the signal line.

The technical solution of the present embodiment is further described below by the manufacturing process of the display substrate. The "patterning process" in this embodiment includes processes of depositing a film, coating a photoresist, exposing a mask, developing, etching, and stripping the photoresist, and is a well-established manufacturing process in the related art. The deposition may be performed by a known process such as sputtering, evaporation, chemical vapor deposition, etc., the coating may be performed by a known coating process, and the etching may be performed by a known method, which is not particularly limited herein. In the description of the present embodiment, it is to be understood that "thin film" refers to a layer of a material deposited or coated on a substrate. The "thin film" may also be referred to as a "layer" if it does not require a patterning process or a photolithography process throughout the fabrication process. If a patterning process or a photolithography process is required for the "thin film" in the entire manufacturing process, the "thin film" is referred to as a "thin film" before the patterning process, and the "layer" after the patterning process. The "layer" after the patterning process or the photolithography process includes at least one "pattern".

(1) A data lead, a common electrode line and a repair electrode layer pattern are formed on a substrate. Forming the data lead line, the common electrode line and the repair electrode layer pattern includes: a first metal thin film is deposited on a substrate, and the first metal thin film is patterned through a patterning process to form a data lead 20, a common electrode line 30, and a repair electrode layer pattern of a breakpoint repair unit on the substrate 10, as shown in fig. 4, 5, and 6, fig. 5 is a cross-sectional view taken along a-a direction in fig. 4, and fig. 6 is a cross-sectional view taken along a-B direction in fig. 4. The vertically arranged data leads 20 are located in the upper region of the fan-out region, are adjacent to the circuit region, and the distance between the adjacent data leads 20 is gradually reduced along the direction from the display region to the circuit region. The horizontally arranged common electrode line 30 is located in a lower region of the fan-out region, and is adjacent to the display region, the common electrode line 30 includes a first common electrode line 31, a second common electrode line 32 and a plurality of connecting bars 33, the plurality of connecting bars 33 are arranged between the first common electrode line 31 and the second common electrode line 32, each connecting bar 33 is arranged between adjacent data leads 20, and each connecting bar 33 is respectively connected with the first common electrode line 31 and the second common electrode line 32. The structure of the common electrode line 30 according to the embodiment of the present invention may also be understood as that a plurality of slits (Slit) or openings extending in the length direction are formed in the common electrode line, and the subsequently formed data line is disposed across the slits or openings, so that the data line and the common electrode line form a double overlap. The repair electrode layer comprises a first repair electrode 21, a second repair electrode 22 and a third repair electrode 23, the first repair electrode 21 is connected with the data lead 20 and extends towards the direction of the common electrode line 30, the second repair electrode 22 is connected with the first common electrode line 31 and extends towards the direction of the data lead 20, the third repair electrode 23 is arranged between the first repair electrode 21 and the second repair electrode 22, and the third repair electrode 23 is rectangular. The first metal film may be made of a metal material, such as silver Ag, copper Cu, aluminum Al, molybdenum Mo, or an alloy material of the above metals, and may be a single-layer metal or a multi-layer metal.

(2) And forming a data line and a lap electrode layer pattern. Forming the data line and the landing electrode layer pattern includes: on the substrate formed with the aforementioned patterns, a first insulating film and a semiconductor film are sequentially deposited, and the semiconductor film is patterned through a patterning process to form a first insulating layer 11 pattern covering the data wire 20, the common electrode line 30, and the repair electrode layer pattern, and a plurality of semiconductor layer 55 patterns disposed on the first insulating layer 11. Subsequently, a second metal film is deposited, and the second metal film is patterned through a patterning process to form a landing electrode layer pattern of the data line 50 and the breakpoint repair unit, where the landing electrode layer pattern includes a first landing electrode 51, a second landing electrode 52, a third landing electrode 53, and a fourth landing electrode 54 that are disposed at intervals, and a semiconductor layer 55 is located between the first landing electrode 51 and the second landing electrode 52, and between the third landing electrode 53 and the fourth landing electrode 54, as shown in fig. 7, 8, and 9, fig. 8 is a cross-sectional view taken along a-a direction in fig. 7, and fig. 9 is a cross-sectional view taken along B-B direction in fig. 7.

The data lines 50 are arranged in a vertical direction, the upper end portions of the data lines are adjacent to the data leads 20, the lower end portions of the data lines extend from the fan-out area to the display area, and the data lines 50 are insulated and crossed with the common electrode lines 30 to form two overlapping areas: a first overlap area 41 where the data line 50 crosses the first common electrode line 31 and a second overlap area 42 where the data line 50 crosses the second common electrode line 32. The first lap electrode 51 is arranged over the first repair electrode 21 and the third repair electrode 23 in a straddling manner, and has an overlapping region with the first repair electrode 21 and the third repair electrode 23; the second lap electrode 52 is also arranged over the first repair electrode 21 and the third repair electrode 23 in a straddling manner, and has an overlapping region with the first repair electrode 21 and the third repair electrode 23; the third overlapping electrode 53 is arranged above the second repair electrode 22 and the third repair electrode 23 in a straddling manner, and has an overlapping region with the second repair electrode 22 and the third repair electrode 23; the fourth overlapping electrode 54 also straddles over the second repair electrode 22 and the third repair electrode 23, and has an overlapping region with the second repair electrode 22 and the third repair electrode 23.

In the embodiment of the present invention, each of the first landing electrode 51, the second landing electrode 52, the third landing electrode 53, and the fourth landing electrode 54 is L-shaped, and is formed of a rectangular portion and a strip portion. Wherein the rectangular portion of the first landing electrode 51 is disposed above the side of the first repair electrode 21 adjacent to the data lead 20, and the stripe portion of the first landing electrode 51 is disposed above the side of the third repair electrode 23 adjacent to the data lead 20. The rectangular portion of the second landing electrode 52 is disposed above the side of the third repair electrode 23 away from the data lead 20, and the bar-shaped portion of the second landing electrode 52 is disposed above the side of the first repair electrode 21 away from the data lead 20. One semiconductor layer 55 is located between the rectangular portion of the first landing electrode 51 and the bar portion of the second landing electrode 52, and the other semiconductor layer 55 is located between the bar portion of the first landing electrode 51 and the rectangular portion of the second landing electrode 52. The rectangular portion of the third landing electrode 53 is disposed above the side of the second repair electrode 22 adjacent to the data line 50, and the stripe portion of the third landing electrode 53 is disposed above the side of the third repair electrode 23 adjacent to the data line 50. The rectangular portion of the fourth landing electrode 54 is disposed above the side of the third repair electrode 23 away from the data line 50, and the stripe portion of the fourth landing electrode 54 is disposed above the side of the second repair electrode 22 away from the data line 50. One semiconductor layer 55 is located between the rectangular portion of the third overlapping electrode 53 and the bar portion of the fourth overlapping electrode 54, and the other semiconductor layer 55 is located between the bar portion of the third overlapping electrode 53 and the rectangular portion of the fourth overlapping electrode 54. That is, the rectangular portion of the first landing electrode 51 and the stripe portion of the second landing electrode 52 overlap the first repair electrode 21, the rectangular portion of the third landing electrode 53 and the stripe portion of the fourth landing electrode 54 overlap the second repair electrode 22, and the stripe portion of the first landing electrode 51, the rectangular portion of the second landing electrode 52, the stripe portion of the third landing electrode 53 and the rectangular portion of the fourth landing electrode 54 overlap the third repair electrode 53. With the above arrangement, it is formed that the first and

second landing electrodes

51 and 52 are oppositely disposed in a mirror-symmetrical manner, and the third and

fourth landing electrodes

53 and 54 are oppositely disposed in a mirror-symmetrical manner. The mirror symmetry means that the two are symmetrical relative to a vertical axis and a horizontal axis, and the relative arrangement means that L-shaped inward-folding angles of the two are opposite.

In the patterning process, the rectangular portion of the first landing electrode 51 is further provided with a first through hole T1 exposing the first insulating layer 11, an orthographic projection of the first through hole T1 on the substrate 10 is located within an orthographic projection range of the first repair electrode 21 on the substrate 10, the rectangular portion of the third landing electrode 53 is further provided with a second through hole T2 exposing the first insulating layer 11, and an orthographic projection of the second through hole T2 on the substrate 10 is located within an orthographic projection range of the second repair electrode 22 on the substrate 10.

(3) A second insulating layer 12 pattern provided with vias is formed. Forming the pattern of the second insulating layer 12 provided with the via holes includes: a second insulating film is deposited on the substrate formed with the aforementioned pattern, and the second insulating film is patterned through a patterning process to form a pattern of a second insulating layer 12 provided with a plurality of via holes, as shown in fig. 10, 11 and 12, fig. 11 is a sectional view taken along a-a direction in fig. 10, and fig. 12 is a sectional view taken along B-B direction in fig. 10. Wherein, a plurality of via holes include:

the first via hole K1 at one end of the data lead 20 adjacent to the data line 50, the first insulating layer 11 and the second insulating layer 12 in the first via hole K1 being etched away to expose the surface of the data lead 20; the second via hole K2 at an end of the data line 50 adjacent to the data lead 20, the second insulating layer 12 in the second via hole K2 is etched away to expose a surface of the data line 50.

The third via hole K3 between the second landing electrode 52 and the fourth landing electrode 54, the first insulating layer 11 and the second insulating layer 12 in the third via hole K3 are etched away, exposing the surface of the third repair electrode 23; the fourth via hole K4 is located at one end of the second landing electrode 52 adjacent to the third landing electrode 53, and the second insulating layer 12 in the fourth via hole K4 is etched away to expose the surface of the second landing electrode 52; the fifth via hole K5 is located at an end of the fourth landing electrode 54 adjacent to the second landing electrode 52, and the second insulating layer 12 in the fifth via hole K5 is etched away to expose a surface of the fourth landing electrode 54.

The sixth via hole K6 located at the position of the first through hole, the first insulating layer 11 and the second insulating layer 12 in the sixth via hole K6 are etched away, and the surface of the first repair electrode 21 is exposed; the seventh via hole K7 located at the position of the first landing electrode 51 and adjacent to the sixth via hole K6, the second insulating layer 12 in the seventh via hole K7 is etched away to expose the surface of the first landing electrode 51.

The eighth via hole K8 located at the second via hole, the first insulating layer 11 and the second insulating layer 12 in the eighth via hole K8 are etched away, exposing the surface of the second repair electrode 22; the ninth via hole K9 located at the position of the third landing electrode 53 and adjacent to the eighth via hole K8, the second insulating layer 12 in the ninth via hole K9 is etched away to expose the surface of the third landing electrode 53.

(4) And forming a connection electrode layer pattern. Forming the connection electrode layer pattern includes: on the substrate formed with the aforementioned pattern, a transparent conductive film is deposited, and the transparent conductive film is patterned through a patterning process to form a connection electrode layer pattern, the connection electrode layer including a first connection electrode 61, a second connection electrode 62, a third connection electrode 63, and a fourth connection electrode 64, as shown in fig. 1, 2, and 3. Wherein the content of the first and second substances,

the first connection electrode 61 is disposed at an end region where the data lead 20 and the data line 50 are adjacent to each other, and the first connection electrode 61 is connected to the data lead 20 through a first via K1 and is connected to the data line 50 through a second via K2. The second connection electrode 62 is disposed at an end region where the second and

fourth landing electrodes

52 and 54 are adjacent to each other, and the second connection electrode 62 is connected to the third repair electrode 23 through a third via hole K3, connected to the second landing electrode 52 through a fourth via hole K4, and connected to the fourth landing electrode 54 through a fifth via hole K5. The third connection electrode 63 is disposed at the position of the first landing electrode 51, connected to the first repair electrode 21 through a sixth via K6, and connected to the first landing electrode 51 through a seventh via K7. The fourth connection electrode 64 is disposed at the position of the third landing electrode 53, connected to the second repair electrode 22 through the eighth via K8, and connected to the third landing electrode 53 through the ninth via K9.

Thus, the data lead 20 and the data line 50 are electrically connected through the first connection electrode 61, and a data signal transmitted from the data driving circuit in the circuit region is transmitted to the data line 50 through the data lead 20 and transmitted from the data line 50 to the display region. The third repair electrode 23, the second lap electrode 52, and the fourth lap electrode 54 are electrically connected through the second connection electrode 62. The first repair electrode 21 and the first landing electrode 51 are electrically connected through the third connection electrode 63. The second repair electrode 22 and the third lap electrode 53 are electrically connected by a fourth connection electrode 64.

In the embodiment of the present invention, the substrate may be a glass substrate, a quartz substrate, a plastic substrate, or a flexible substrate. The first metal film and the second metal film may be made of a metal material, such as silver Ag, copper Cu, aluminum Al, molybdenum Mo, or an alloy material of the above metals, and may be a single-layer metal or a multi-layer metal. The first insulating film and the second insulating film may be formed using silicon oxide SiOx, silicon nitride SiNx, silicon oxynitride SiON, or the like, or may be formed using aluminum oxide AlOx, hafnium oxide HfOx, tantalum oxide TaOx, or the like, and may be a single layer, a multilayer, or a composite layer. Generally, the first insulating layer 11 is referred to as a Gate Insulating (GI) layer, and the second insulating layer 12 is referred to as a Passivation (PVX) layer. The transparent conductive film may be made of Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), or the like.

Because the distance between the data leads of the fan-out area of the display substrate is gradually reduced, the data leads are easy to generate static accumulation in the preparation process. If static electricity is not effectively eliminated, the display substrate is seriously damaged. The breakpoint repairing unit provided by the embodiment of the invention can effectively eliminate static electricity of the data lead of the fan-out area. Specifically, when the data lead 20 generates charges, the charges move to the first repair electrode 21 electrically connected to the data lead 20, and since the first landing electrode 51 is electrically connected to the first repair electrode 21, the charges are also accumulated on the first landing electrode 51, thereby effectively improving the dispersion degree of the accumulated static electricity. Since the first overlapping electrode 51, the semiconductor layer 55 and the second overlapping electrode 52 are similar to the semiconductor discharge tube for overvoltage protection in structure, when the charges on the first overlapping electrode 51 are accumulated to a certain degree, static electricity can be discharged by breaking down the semiconductor layer 55 between the first overlapping electrode 51 and the second overlapping electrode 52, and static electricity of the data lead can be effectively eliminated. Meanwhile, for surge current or pulse current which may appear on the data lead, the breakpoint repair unit may also conduct discharge by breaking down the semiconductor layer 55, so as to protect the data lead. After the first and

second landing electrodes

51 and 52 complete the electrostatic discharge, the third and

fourth landing electrodes

53 and 54 perform the function of eliminating the static electricity.

Fig. 13 is a schematic diagram illustrating an embodiment of repairing a bad data line disconnection according to an embodiment of the present invention. As shown in fig. 13, the third repair electrode 23, the data wire 20, and the common electrode line 30 are disposed in the same layer and are formed through the same patterning process. The first landing electrode 51, the second landing electrode 52, the third landing electrode 53, the fourth landing electrode 54, and the data line 50 are disposed in the same layer and formed through the same patterning process. The data line 50 is spaced apart from the common electrode line 30 by a first insulating layer 11 having a first overlapping region 41 and a second overlapping region 42, the first overlapping electrode 51 is spaced apart from the third repair electrode 23 by the first insulating layer 11 having a third overlapping region 43, and the fourth overlapping electrode 54 is spaced apart from the second repair electrode 22 by the first insulating layer 11 having a fourth overlapping region 44. The third repair electrode 23 is used for communicating the first repair electrode 21 with the second repair electrode 22 through the third repair electrode 23 when the data line is repaired to be broken badly, and the common electrode line 30 with a double-line structure is used for communicating the data line 50 with the first common electrode line 31 when the data line is repaired to be broken badly, so that the data lead 20 (or the data line 50) on one side of the breakpoint D is connected with the data line 50 on the other side of the breakpoint D.

Specifically, when a data line breakpoint D of a certain data lead 20 (or data line 50) in the fan-out region needs to be repaired, first, the first overlapping region 41 formed by crossing the data line 50 and the first common electrode line 31 is laser-welded, the laser welding melts the first insulating layer 11 of the first overlapping region 41, forms a first welding point H1 in the first overlapping region 41, and connects the data line 50 and the first common electrode line 31.

Subsequently, the first common electrode line 31 on both sides of the first welding point H1 is laser-cut to form a first cutting point Q1 and a second cutting point Q2 for cutting off the first common electrode line 31, and the connecting bar 33 between the first cutting point Q1 and the second cutting point Q2 is laser-cut to form a third cutting point Q3 for cutting off the connection between the first common electrode line 31 and the second common electrode line 32. In this way, in the two common electrode lines 30, the first common electrode line 31 is cut by the first cutting point Q1 and the second cutting point Q2, but the second common electrode line 32 is still normally connected, the first common electrode line 31 on the side of the first cutting point Q1 away from the first welding point H1 is still connected with the second common electrode line 32 through the other connecting strips 33, and the first common electrode line 31 on the side of the second cutting point Q2 away from the first welding point H1 is still connected with the second common electrode line 32 through the other connecting strips 33, so that the normal operation of the common electrode lines is not affected by cutting off the first common electrode line 31. In practice, the first cutting point Q1, the second cutting point Q2 and the third cutting point Q3 are to isolate the first welding point H1 and the second common electrode line 32 from each other.

Subsequently, the third overlap region 43 and the fourth overlap region 44 are laser-welded, which melts the first insulating layer 11 of the third overlap region 43 and the fourth overlap region 44, forms a second welding point H2 in the third overlap region 43, communicates the first landing electrode 51 with the third repair electrode 23, forms a third welding point H3 in the fourth overlap region 44, and communicates the fourth landing electrode 54 with the second repair electrode 22.

In this way, the first solder H1 makes the connection of the data line 50 with the first common electrode line 31, but the first common electrode line 31 including the first solder H1 is isolated by the first cutting point Q1, the second cutting point Q2, and the third cutting point Q3. Since the first landing electrode 51 is connected to the first repair electrode 21 through the third connection electrode 63, and the first repair electrode 21 is connected to the data lead 20, the second pad H2 enables the third repair electrode 23 to be connected to the data lead 20 (or the data line 50) on the break point D side. Since the fourth overlapping electrode 54 is connected to the third repair electrode 23 through the second connection electrode 62, the second repair electrode 22 is connected to the isolated common electrode line 30, and the isolated first common electrode line 31 is connected to the data line 50, the third welding point H3 realizes the connection of the third repair electrode 23 to the data line 50 on the other side of the break point D. That is to say, the first welding point H1, the second welding point H2, the third welding point H3 and the isolated first common electrode line 31 connect the data lead 20 (or the data line 50) on one side of the breakpoint D with the data line 50 on the other side of the breakpoint D, thereby realizing the repair of bad disconnection of the data line, and the data signal on one side of the breakpoint D can be transmitted to the other side of the breakpoint D through the breakpoint repair unit and the first common electrode line 31, thereby ensuring that the display area can receive the data signal. Meanwhile, after the bad disconnection of the data line is repaired, the normal work of the second common electrode line cannot be influenced, and the uniformity of the common voltage on the common electrode line can be ensured. Furthermore, after the bad data line breakage is repaired, only the breakpoint repairing unit of the data line with bad breakage is affected, and the breakpoint repairing units of other data lines are not affected. The sequence of welding and cutting in the repair described above is merely an example. In practice, other sequences may be adopted, and the embodiment is not limited in detail herein.

As can be seen from the above description, in the embodiment of the present invention, the common electrode line of the double-line structure and the breakpoint repair unit of the double-layer structure are disposed in the fan-out region, two overlapping regions are formed between the common electrode line of the double-line structure and the data line, the first end of the breakpoint repair unit is connected to the data lead, and the second end of the breakpoint repair unit is connected to the first common electrode line. Specifically, for two overlapping areas formed by the common electrode line and the data line in a double-line structure, the data line and the first common electrode line may be connected by laser welding the first overlapping area, and the welded first common electrode line and the second common electrode line may be isolated by laser cutting. For the breakpoint repair unit of the double-layer structure, the first end and the second end of the breakpoint repair unit can be communicated through laser welding. Because the first end of the breakpoint repair unit is connected with the data lead on one side of the breakpoint, the second end of the breakpoint repair unit is connected with the welded second common electrode wire, and the welded second common electrode wire is connected with the data line, the second end of the breakpoint repair unit is connected with the data line on the other side of the breakpoint, and the bad repair of the broken line of the data line in the fan-out area is realized. The embodiment of the invention effectively solves the problem that the broken line of the data line of the fan-out area can not be maintained in the prior art, not only realizes the effective repair of the broken line of the data line of the fan-out area, avoids product abandonment and greatly improves the product yield, but also can not influence the public voltage provided by the public electrode line, has high repair success rate, can be applied to actual production, has great application value and has good application prospect. Meanwhile, the breakpoint repairing unit provided by the embodiment of the invention can play a role in static electricity prevention, and effectively improves the working reliability of the display substrate. Furthermore, the preparation process of the display substrate in the embodiment of the invention is the same as the existing process flow, the existing process flow and process equipment do not need to be changed, a new process does not need to be added, a new material does not need to be introduced, the process compatibility is good, and the process realizability is high.

Among them, the second welding point H2 and the third welding point H3 shown in fig. 13 are only an exemplary illustration. Fig. 14 is a schematic diagram illustrating another embodiment of repairing a bad data line disconnection according to an embodiment of the present invention. Since the second landing electrode 52 and the first repair electrode 21 have the fifth overlap region 45, and the third landing electrode 53 and the third repair electrode 23 have the sixth overlap region 46, by laser welding the fifth overlap region 45 and the sixth overlap region 46, the fifth welding point H5 is formed in the fifth overlap region 45, and the sixth welding point H6 is formed in the sixth overlap region 46, so that the first repair electrode 21 and the second repair electrode 22 can be communicated with each other through the third repair electrode 23, as shown in fig. 14. In practical implementation, the connection of the first repair electrode 21, the third repair electrode 23 and the second repair electrode 22 may be realized through the third welding point H3 and the fifth welding point H5.

Fig. 15 is a schematic structural diagram of a common electrode line according to an embodiment of the present invention. As shown in fig. 15, since the line width a of the first common electrode line 31 and the line width b of the second common electrode line 32 relate to laser welding, in order to ensure the reliability of welding, the line width a of the first common electrode line 31 is set to be greater than or equal to 8 μm, the line width b of the second common electrode line 32 is set to be greater than or equal to 8 μm, and both the line width a of the first common electrode line 31 and the line width b of the second common electrode line 32 are greater than or equal to the line width of the data line 50. Preferably, the line width a is 8 μm to 16 μm and the line width b is 8 μm to 16 μm. In addition, since the distance c between the first common electrode line 31 and the second common electrode line 32, the distance d between the data line 50 and the one-side connecting bar 33, and the distance e between the data line 50 and the other-side connecting bar 33 relate to laser cutting, in order to ensure the cutting reliability, the distance c between the first common electrode line 31 and the second common electrode line 32 is set to be greater than or equal to 5 μm, the distance d between the data line 50 and the one-side connecting bar 33 is greater than or equal to 5 μm, the distance e between the data line 50 and the other-side connecting bar 33 is set to be greater than or equal to 5 μm, and the distance c between the first common electrode line 31 and the second common electrode line 32, the distance d between the data line 50 and the one-side connecting bar 33, and the distance e between the data line 50 and the other-side connecting bar 33 are all greater than or equal to the laser. Preferably, the pitch c is 5 μm to 10 μm, the pitch d is 5 μm to 10 μm, and the pitch e is 5 μm to 10 μm. Although the embodiment of the present invention has been described by taking two common electrode lines as an example, it can be seen from the technical idea of the embodiment of the present invention that there may be a plurality of common electrode lines.

Based on the inventive concept of the foregoing embodiments, the present embodiment provides a method for manufacturing a display substrate. The preparation method of the display substrate comprises the following steps:

Wherein, form public electrode line, with a plurality of signal lines and breakpoint repair unit of public electrode line insulation crossing in fan-out region, include:

Wherein, form with the overlap electrode layer of data line and breakpoint repair unit that the data pin wire is connected includes:

forming a data line and a lap electrode layer of a breakpoint repair unit on the first insulating layer; the lapping electrode layer comprises a first lapping electrode, a second lapping electrode, a third lapping electrode and a fourth lapping electrode, the first lapping electrode and the second lapping electrode respectively have overlapping areas with the first repairing electrode and the third repairing electrode, and the third lapping electrode and the fourth lapping electrode respectively have overlapping areas with the second repairing electrode and the third repairing electrode;

The detailed manufacturing process of the display substrate has been described in the foregoing embodiments, and is not repeated herein.

The embodiment of the invention provides a preparation method of a display substrate, wherein a breakpoint repair unit and a public electrode wire with a double-wire structure are arranged in a fan-out region, and the breakpoint repair unit is used for communicating signal wires on two sides of a breakpoint when the signal wire has the breakpoint, so that bad repair of broken wires of data wires in the fan-out region is realized, product scrapping is avoided, and the product yield is improved. Meanwhile, the breakpoint repairing unit also has the function of eliminating the static electricity of the signal line. Furthermore, the preparation process of the display substrate in the embodiment of the invention is the same as the existing process flow, the existing process flow and process equipment do not need to be changed, a new process does not need to be added, a new material does not need to be introduced, the process compatibility is good, and the process realizability is high.

Based on the inventive concept of the foregoing embodiments, the embodiments of the present invention further provide a method for repairing a display substrate. In the repair method of the display substrate in the embodiment of the invention, the display substrate comprises a common electrode wire positioned in a fan-out area, a plurality of signal wires which are insulated and crossed with the common electrode wire and a breakpoint repair unit; the common electrode wires comprise a first common electrode wire, a second common electrode wire and a plurality of connecting strips, the first common electrode wire and the second common electrode wire are arranged in parallel, the connecting strips are arranged between adjacent signal wires, the signal wires and the first common electrode wire and the second common electrode wire respectively form a first overlapping area and a second overlapping area, and the breakpoint repair unit is respectively connected with the signal wires and the common electrode wires; when the data line is broken badly, the repairing method comprises the following steps:

The breakpoint repairing unit comprises a repairing electrode layer arranged on a substrate, a first insulating layer covering the repairing electrode layer, and a lap electrode layer arranged on the first insulating layer; the repair electrode layer comprises a first repair electrode, a second repair electrode and a third repair electrode, wherein the first repair electrode, the second repair electrode and the third repair electrode are arranged on the substrate, the first repair electrode is connected with the signal line, the second repair electrode is connected with the first common electrode line, and the third repair electrode is arranged between the first repair electrode and the second repair electrode; welding the breakpoint repair unit, including:

The lapping electrode layer comprises a first lapping electrode, a second lapping electrode, a third lapping electrode and a fourth lapping electrode which are arranged on the first insulating layer, the first lapping electrode and the second lapping electrode respectively have overlapping areas with the first repairing electrode and the third repairing electrode, the first repairing electrode is connected with the first lapping electrode, the third lapping electrode and the fourth lapping electrode respectively have overlapping areas with the second repairing electrode and the third repairing electrode, the second repairing electrode is connected with the third lapping electrode, and the third repairing electrode is connected with the second lapping electrode and the fourth lapping electrode; welding the overlap region of the lap electrode layer and the first repair electrode, the second repair electrode and the third repair electrode, including:

The specific repairing process of the display substrate has been described in detail in the foregoing embodiments, and is not repeated herein.

The embodiment of the invention provides a method for repairing a display substrate, wherein a breakpoint repairing unit and a public electrode wire with a double-wire structure are arranged in a fan-out region, and the breakpoint repairing unit is used for communicating signal wires on two sides of a breakpoint when the signal wires have the breakpoint, so that bad repairing of broken data wires in the fan-out region is realized, product scrapping is avoided, the product yield is improved, the method can be applied to actual production, and the method has a good application prospect.

Based on the inventive concept of the foregoing embodiments, an embodiment of the present invention further provides a display device, which includes the display substrate employing the foregoing embodiments. The display device may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.

Although the embodiments of the present invention have been described above, the above description is only for the convenience of understanding the present invention, and is not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. The display substrate is characterized by comprising a common electrode wire positioned in a fan-out area, a plurality of signal wires which are insulated and crossed with the common electrode wire and a breakpoint repairing unit; the common electrode wire comprises a first common electrode wire and a second common electrode wire which are arranged in parallel and a plurality of connecting strips for connecting the first common electrode wire and the second common electrode wire, the connecting strips are arranged between adjacent signal wires, the breakpoint repair unit is respectively connected with the signal wires and the first common electrode wire, and the breakpoint repair unit is used for communicating the signal wires on two sides of the breakpoint when the breakpoint occurs in the signal wires.

2. The display substrate according to claim 1, wherein the first common electrode line, the second common electrode line and the plurality of connection bars are disposed on a base; the signal line comprises a data lead and a data line which are connected through a first connecting electrode, and the data lead is arranged on the substrate and connected with the breakpoint repairing unit; a first insulating layer covers the data lead, the data line is arranged on the first insulating layer, and a first overlapping area and a second overlapping area are formed by the data line and the first common electrode line and the second common electrode line respectively; the second insulating layer covers the data line, and the first connecting electrode is arranged on the second insulating layer and connected with the data lead and the data line through a via hole.

3. The display substrate according to claim 1, wherein the breakpoint repair unit comprises a repair electrode layer disposed on a base, a first insulating layer covering the repair electrode layer, a landing electrode layer disposed on the first insulating layer; the repair electrode layer comprises a first repair electrode, a second repair electrode and a third repair electrode which are arranged on the substrate, the first repair electrode is connected with the signal line, the second repair electrode is connected with the first public electrode line, the third repair electrode is arranged between the first repair electrode and the second repair electrode, and the third repair electrode is used for connecting the signal line on two sides of the breakpoint through the lap electrode layer and the first repair electrode and the second repair electrode when the breakpoint occurs on the signal line.

4. The display substrate according to claim 3, wherein the landing electrode layer comprises a first landing electrode, a second landing electrode, a third landing electrode, and a fourth landing electrode disposed on the first insulating layer; the first lapping electrode and the first repairing electrode have an overlapping region, the second lapping electrode and the first repairing electrode and the third repairing electrode have an overlapping region, and a semiconductor layer is arranged between the first lapping electrode and the second lapping electrode; the third lapping electrode and the second repairing electrode have an overlapping region, the fourth lapping electrode and the second repairing electrode and the third repairing electrode have an overlapping region, and a semiconductor layer is arranged between the third lapping electrode and the fourth lapping electrode.

5. The display substrate according to claim 4, wherein each of the first overlapping electrode, the second overlapping electrode, the third overlapping electrode, and the fourth overlapping electrode is L-shaped and includes a rectangular portion and a strip portion, the rectangular portion of the first overlapping electrode and the strip portion of the second overlapping electrode overlap with the first repairing electrode, the rectangular portion of the third overlapping electrode and the strip portion of the fourth overlapping electrode overlap with the second repairing electrode, and the strip portion of the first overlapping electrode, the rectangular portion of the second overlapping electrode, the strip portion of the third overlapping electrode, and the rectangular portion of the fourth overlapping electrode overlap with the third repairing electrode.

6. The display substrate according to claim 4, wherein the breakpoint repair unit further comprises a second insulating layer covering the overlapping electrode layer, and a second connection electrode, a third connection electrode, and a fourth connection electrode disposed on the second insulating layer, the second connection electrode is connected to the third repair electrode, the second overlapping electrode, and the fourth overlapping electrode through via holes, the third connection electrode is connected to the first repair electrode and the first overlapping electrode through via holes, and the fourth connection electrode is connected to the second repair electrode and the third overlapping electrode through via holes.

7. The display substrate according to any one of claims 1 to 7, wherein a line width of the first common electrode line and a line width of the second common electrode line are both greater than or equal to 8 μm, and a distance between the first common electrode line and the second common electrode line, a distance between the signal line and the connecting bar on one side, and a distance between the signal line and the connecting bar on the other side are both greater than or equal to 5 μm.

8. A display device comprising the display substrate according to any one of claims 1 to 7.

9. A method for preparing a display substrate is characterized by comprising the following steps:

10. The manufacturing method of claim 9, wherein forming a common electrode line, a plurality of signal lines crossing the common electrode line in an insulating manner, and a breakpoint repair unit in a fan-out region comprises:

11. The method of manufacturing according to claim 10, wherein forming a lap electrode layer of a data line and a breakpoint repair unit connected to the data lead includes:

forming a semiconductor layer on the first insulating layer;

12. The method for repairing the display substrate is characterized in that the display substrate comprises a common electrode wire positioned in a fan-out area, a plurality of signal wires which are insulated and crossed with the common electrode wire and a breakpoint repairing unit; the common electrode wires comprise a first common electrode wire, a second common electrode wire and a plurality of connecting strips, the first common electrode wire and the second common electrode wire are arranged in parallel, the connecting strips are arranged between adjacent signal wires, the signal wires and the first common electrode wire and the second common electrode wire respectively form a first overlapping area and a second overlapping area, the breakpoint repairing unit is respectively connected with the signal wires and the common electrode wires, and the repairing method comprises the following steps:

13. The repair method according to claim 12, wherein the breakpoint repair unit includes a repair electrode layer disposed on a substrate, a first insulating layer covering the repair electrode layer, a lap electrode layer disposed on the first insulating layer; the repair electrode layer comprises a first repair electrode, a second repair electrode and a third repair electrode, wherein the first repair electrode, the second repair electrode and the third repair electrode are arranged on the substrate, the first repair electrode is connected with the signal line, the second repair electrode is connected with the first common electrode line, and the third repair electrode is arranged between the first repair electrode and the second repair electrode; welding the breakpoint repair unit, including:

14. The repair method according to claim 13, wherein the overlapping electrode layer includes a first overlapping electrode, a second overlapping electrode, a third overlapping electrode, and a fourth overlapping electrode disposed on the first insulating layer, the first overlapping electrode and the second overlapping electrode have overlapping regions with the first repair electrode and the third repair electrode, respectively, the first repair electrode is connected to the first overlapping electrode, the third overlapping electrode and the fourth overlapping electrode have overlapping regions with the second repair electrode and the third repair electrode, respectively, the second repair electrode is connected to the third overlapping electrode, and the third repair electrode is connected to the second overlapping electrode and the fourth overlapping electrode; welding the overlap region of the lap electrode layer and the first repair electrode, the second repair electrode and the third repair electrode, including: