CN101051645A - Pixel array substrate - Google Patents
Pixel array substrate Download PDFInfo
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- CN101051645A CN101051645A CN 200710102136 CN200710102136A CN101051645A CN 101051645 A CN101051645 A CN 101051645A CN 200710102136 CN200710102136 CN 200710102136 CN 200710102136 A CN200710102136 A CN 200710102136A CN 101051645 A CN101051645 A CN 101051645A
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Abstract
The pixel array base plate includes base plate and following parts configured on the base plate: scanning wires, data wires, active elements, pixel electrodes, multiple first patternized floating placed metals, and multiple first patternized connection conducting wires. Being in crisscross mode, data wires and scanning wires form multiple pixel areas. Each active element connects corresponding scanning wire, data wire and pixel electrode electrically. Moreover, each first patternized floating placed metal and any data wire are overlapped partially. Crossing over any one scanning wire, each first patternized connection conducting wire and first patternized floating placed metal on two sides of scanning wire are overlapped partially.
Description
Technical field
The present invention relates to a kind of semiconductor element substrate, and be particularly related to a kind of image element array substrates.
Background technology
Along with modern video signal development of technology, various display has been used on the display screen of consumption electronic products such as mobile phone, notebook computer, digital camera and PDA(Personal Digital Assistant) in large quantities.In these displays, because advantage such as that LCD (LCD) and display of organic electroluminescence (OLED) have is in light weight, volume is little and power consumption is low makes it become the main flow on the market.No matter be LCD or organic electro-luminescent display, its manufacturing process includes with semiconductor technology and forms image element array substrates.The shown color of each pixel in the corresponding adjustment image element array substrates, display can produce image.
Fig. 1 is the partial top view of known a kind of image element array substrates.Please refer to Fig. 1, known image element array substrates 100 comprises substrate (not illustrating) and is disposed at the multi-strip scanning line 110 on the substrate, many data wires 120, a plurality of thin-film transistor 130, a plurality of pixel electrode 140 and patch cords 150 (Repairline), wherein scan line 110 is to be staggered with ranks with data wire 120, and define a plurality of pixel regions (indicate) of array, and patch cord 150 is the peripheries that are surrounded on these pixel regions.Particularly, scan line 110 is to arrange with column direction, and data wire 120 is to arrange with line direction, and all has thin-film transistor 130 and pixel electrode 140 in each pixel region.
Accept above-mentionedly, thin-film transistor 130 is the confluces that are adjacent to scan line 110 and data wire 120, and electrically connects with pixel electrode 140 with scan line 110, data wire 120 respectively.In addition, thin-film transistor 130 transmits the sweep signal of coming and determines it is to be in to open or closing state according to scan line 110.When thin-film transistor 130 was in the state of unlatching, pixel electrode 140 can receive via thin-film transistor 130 by data wire 120 and transmit the data-signal of coming, so that the color that corresponding pixel adjustment shows.
In the process of making image element array substrates 100, when the situation of broken string 122 takes place in a certain data wire 120, can be with data wire 120 two ends and patch cord 150 laser weldings (Welding) of broken string 122, to form 2 welding points 124.So signal can transmit from the patch cord 150 of periphery, to reach the effect of repairing.Yet,, make this can cause the problem of capacitance-resistance sluggishness (RC delay) because the length of patch cord 150 is longer.In addition, a patch cord 150 only can be repaired the data wire 120 of a broken string 122, and when data wire 120 quantity of broken string 122 surpassed the quantity of patch cord 150, image element array substrates 100 also can't be repaired.
Fig. 2 A is the partial top view of known another kind of image element array substrates, and Fig. 2 B is the profile of the image element array substrates of Fig. 2 A, and its section line is the AA ' line of Fig. 2 A.Please refer to Fig. 2 A and Fig. 2 B, known image element array substrates 200 comprises substrate 210 and the multi-strip scanning line 220 that is disposed on the substrate 210, many data wires 230, a plurality of thin-film transistors 240, a plurality of pixel electrodes 250 and a plurality of patternings metal (Floating Metal) 260 of floating, wherein the patterning metal 260 of floating is to be positioned at data wire 230 belows, and overlap with data wire 230, in addition, patterning is floated and is formed with first insulating barrier 10 between metal 260 and the data wire 230, data wire 230 tops are formed with second insulating barrier 20, are formed with semiconductor layer 50 above the scan line 220 of thin-film transistor 240.
Partial top view and profile when broken string takes place the data wire that Fig. 2 C and Fig. 2 D are respectively the image element array substrates of Fig. 2 A.Please refer to Fig. 2 C and Fig. 2 D, when the situation of broken string 232 takes place in data wire 230, can with data wire 230 in broken string two ends, 232 place with metal 260 laser weldings of floating of the patterning below it, to form 2 welding points 234.So, data wire 230 can be repaired the effect open circuit to reach by the float conducting of metal 260 of patterning.
Yet metal 260 is the structure with layer with scan line 220 because patterning is floated, and so the patterning metal 260 of floating just can't be disposed at the staggered place of data wire 230 and scan line 220.The situation that broken string takes place when data wire 230 is that this image element array substrates 200 just can't be repaired when being positioned at the staggered place of itself and scan line 220.
Partial top view when Fig. 2 E is damaged for the thin-film transistor of the image element array substrates of Fig. 2 A; Fig. 2 F is the profile of the image element array substrates of Fig. 2 E, and its section line is the ZZ ' line of Fig. 2 E.Please refer to Fig. 2 E and Fig. 2 F, when thin-film transistor 240a is damaged, for example the grid 242a of thin-film transistor 240a, source electrode 244a and drain electrode are short-circuited between the 246a, generally all are to utilize laser cutting (Laser Cut) that the drain electrode 246a of thin-film transistor 240a is cut off to form the 248a that opens a way with the lead between the pixel electrode 250.So, transmit the data of coming, so just this pixel can be repaired into dark state owing to pixel electrode 250 can't receive data wire 230.
Generally speaking, the shown color of image element array substrates 200 adjacent two pixel regions can be very close, when the pixel region of thin-film transistor 240a correspondence was repaired into dark state, it can produce bigger drop with adjacent pixel region (for example pairing pixel region of thin-film transistor 240b) on showing.So will make human eye can find bad some zone easily, and cause the quality of display unit to reduce.
Fig. 2 G is the partial top view of the data wire of known another image element array substrates when broken string takes place.Please refer to Fig. 2 G, the image element array substrates 200a of Fig. 2 G is similar to the image element array substrates 200 of Fig. 2 C, its difference is that image element array substrates 200a comprises two light shield layers (light-shieldinglayers) 260a, lay respectively at the both sides of data wire 230, and data wire 230 has more protuberance 236, and protuberance 236 can overlap with corresponding light shield layer 260a.
Accept above-mentioned, when the situation of broken string 232 takes place in data wire 230, can be with data wire 230 at the protuberance 236 at broken string two ends, the 232 place light shield layer 260a laser welding below with it, to form a plurality of welding point 234a.So, data wire 230 can be repaired the effect that opens circuit to reach by the conducting of light shield layer 260a.Yet, similar aforementioned, because light shield layer 260a and scan line 220 be the structure with layer, if the situation that data wire 230 generations are broken is that this image element array substrates 200a just can't repair when being positioned at the staggered place of itself and scan line 220.
Fig. 2 H is the partial top view of the data wire of known another image element array substrates when broken string takes place.Please refer to Fig. 2 H, the image element array substrates 200b of Fig. 2 H is similar to the image element array substrates 200 of Fig. 2 C, and its difference is that the pixel electrode 250b of image element array substrates 200b and data wire 230 overlap.When the situation of broken string 232 takes place in data wire 230, can be with data wire 230 at broken string two ends, 232 place and the pixel electrode 250b laser welding above it, to form two welding point 234b.So, data wire 230 can be repaired the effect that opens circuit to reach by the conducting of pixel electrode 250b.
Yet when passing through pixel electrode 250b with conducting data wire 230, the while also can be sacrificed this pixel and be caused point defect (point defect), so this also is not good settling mode.
Summary of the invention
In view of this, main purpose of the present invention is providing a kind of image element array substrates, and it can solve the problem of broken data wire.
Another object of the present invention is providing a kind of image element array substrates, and it can solve the excessive problem of its demonstration drop of pixel region of damage.
For reaching above-mentioned or other purposes, the present invention proposes a kind of image element array substrates, comprises substrate and be disposed at float metal and a plurality of first patterning of multi-strip scanning line on the substrate, many data wires, a plurality of active element, a plurality of pixel electrode, a plurality of first patternings connecting lead.These data wires and scan line are to form a plurality of pixel regions in crisscross mode, and each active element can electrically connect with corresponding scan line, data wire and pixel electrode.In addition, each first patterning metal of floating can overlap with a data wire wherein, and each first patterning connects lead and can cross over a wherein scanning linear, and respectively therewith first patterning of the scanning linear both sides metal of floating overlap.
In one embodiment of this invention, image element array substrates also can comprise a plurality of contact holes (contact window) that are disposed on the substrate, makes corresponding first patterning metal of floating be connected lead with corresponding first patterning through contact hole thus and electrically connect.
In one embodiment of this invention, above-mentioned active element can have drain electrode, metal has first protuberance and second protuberance and each first patterning is floated, wherein each first protuberance can overlap with arbitrary drain electrode, and each second protuberance can overlap with arbitrary pixel electrode.
In one embodiment of this invention, image element array substrates also can comprise a plurality of second patternings that are disposed on this substrate metal of floating, and metal can overlap with arbitrary scanning linear and each second patterning is floated.In addition, each first patterning connects lead can cross over arbitrary data wire, and overlaps with second patterning of the data wire both sides metal of floating respectively.In addition, image element array substrates also comprises a plurality of contact holes that are disposed on the substrate, each contact hole is electrically connected at arbitrary second patterning metal of floating and is connected between the lead with arbitrary first patterning, and wherein this second patterning metal of floating first connects lead and overlaps therewith.
In one embodiment of this invention, image element array substrates more can comprise a plurality of second patternings that are disposed on this substrate metal of floating, and metal can overlap with arbitrary scanning linear and each second patterning is floated.In addition, image element array substrates, comprise that also a plurality of second patternings that are disposed on the substrate connect lead and contact hole, wherein each second patterning connection lead can be crossed over arbitrary data wire, and respectively therewith second patterning of the data wire both sides metal electrode of floating overlap, and each contact hole is electrically connected at arbitrary second patterning metal of floating and is connected between the lead with arbitrary second patterning, wherein this second patterning float metal therewith first patterning connect lead and overlap.
In one embodiment of this invention, image element array substrates can comprise that more the bridging lines (common line) that are disposed on the substrate are connected lead with the 3rd patterning.These bridging lines are parallel to scan line, and vertical with data wire.Each the 3rd patterning connects lead and crosses over arbitrary bridging line, and respectively therewith first patterning of the bridging line both sides metal electrode of floating overlap.In addition, image element array substrates also comprises a plurality of contact holes that are disposed on the substrate, each contact hole is electrically connected at arbitrary first patterning metal of floating and is connected between the lead with arbitrary the 3rd patterning, and wherein first patterning metal of floating is connected lead with first patterning and overlaps.
For reaching above-mentioned or other purposes, the present invention proposes a kind of image element array substrates in addition, and float metal and a plurality of second patterning of the multi-strip scanning line on comprising substrate and being disposed at substrate, many data wires, a plurality of active element, a plurality of pixel electrode, a plurality of second patternings is connected lead.These data wires and scan line are to form a plurality of pixel regions in crisscross mode, and each active element can electrically connect with corresponding scan line, data wire and pixel electrode.In addition, each second patterning metal of floating can overlap with arbitrary scanning linear, and each second patterning connects lead and can cross over arbitrary data wire, and respectively therewith second patterning of the data wire both sides metal of floating overlap.
In one embodiment of this invention, image element array substrates more can comprise a plurality of contact holes that are disposed on the substrate, each contact hole is electrically connected at arbitrary second patterning metal of floating and is connected between the lead with arbitrary second patterning, wherein this second patterning float metal therewith second patterning connect lead and overlap.
In one embodiment of this invention, the above-mentioned scan line or the material of data wire can comprise aluminium (Al), molybdenum (Mo), molybdenum nitride (MoN), titanium (Ti), titanium nitride (TiN), chromium (Cr), chromium nitride (CrN) or its combination.
In one embodiment of this invention, the material of above-mentioned pixel electrode can comprise tin indium oxide (IndiumTin Oxide, ITO) or indium zinc oxide (Indium Zinc Oxide, IZO).
Comprehensively above-mentioned, in image element array substrates of the present invention, when broken string takes place in data wire, particularly the zone of broken string takes place is when being positioned at itself and scan line confluce to data wire, can utilize first first patterning connection lead of floating metal pattern and crossing over scanning linear, and the data wire of broken string is connected to reach the effect of repairing.In addition, when active element damaged, corresponding pixel electrode can utilize first protuberance and second protuberance to transmit signal, so that this pixel region can reach identical display effect (but not repairing into dark state) with the neighborhood pixels zone.So, the pixel region of this damage promptly is difficult for being identified easily by human eye, and then is maintained the quality of display unit.
State with other purposes, feature and advantage and can become apparent on the present invention for allowing, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Fig. 1 is the partial top view of known a kind of image element array substrates.
Fig. 2 A is the partial top view of known another kind of image element array substrates.
Fig. 2 B is the profile of the image element array substrates of Fig. 2 A.
Partial top view and profile when broken string takes place the data wire that Fig. 2 C and Fig. 2 D are respectively the image element array substrates of Fig. 2 A.
Partial top view and profile when the thin-film transistor that Fig. 2 E and Fig. 2 F are respectively the image element array substrates of Fig. 2 A is damaged.
Fig. 2 G is the partial top view of the data wire of known another image element array substrates when broken string takes place.
Fig. 2 H is the partial top view of the data wire of known another image element array substrates when broken string takes place.
Fig. 3 A is the partial top view according to the image element array substrates of first embodiment of the invention.
Fig. 3 B is the profile of the image element array substrates of Fig. 3 A.
Fig. 3 C is the profile of the data wire of the image element array substrates of Fig. 3 A when broken string takes place.
Fig. 4 is the partial top view according to the image element array substrates of second embodiment of the invention.
Fig. 5 A is the partial top view according to a kind of image element array substrates of third embodiment of the invention.
Partial top view when Fig. 5 B is damaged for the active element of the image element array substrates of Fig. 5 A.
Fig. 5 C is the partial top view according to the another kind of image element array substrates of third embodiment of the invention.
Fig. 6 is the partial top view according to the image element array substrates of fourth embodiment of the invention.
Fig. 7 is the partial top view according to the image element array substrates of fifth embodiment of the invention.
Fig. 8 A and Fig. 8 B are the partial top view according to the image element array substrates of sixth embodiment of the invention.
Description of reference numerals
10,391: the first insulating barriers 20,392: the second insulating barriers
50,393: semiconductor layer 100,200: image element array substrates
110,220: scan line 120,230: data wire
122,232: broken string
124,234,234a, 234b: welding point
130,240,240a, 240b: thin-film transistor
140,250,250a: pixel electrode 150: patch cord
210: substrate 242a: grid
244a: source electrode 246a: drain electrode
248a: open circuit 260: the patterning metal of floating
260a: light shield layer
300a, 300b, 300c, 300d, 300e, 300f, 300g: image element array substrates
310: substrate 320: scan line
322: bridging line 330: data wire
340,340a, 340b: active element 342: grid
344: source electrode 346: drain electrode
348: open circuit 350,350a, 350b: pixel electrode
351,352: auxiliary capacitor
360: the first patternings metal of floating
362a, 362b, 364a, 364b: welding point
368: the second protuberances of 366: the first protuberances
Patterning connected lead 372,372a in 370: the first: contact hole
374: the three patternings connect 380: the second patternings of lead metal of floating
Patterning connected lead in 390: the second
AA ', BB ', ZZ ': hatching S1, S2: pixel region
Embodiment
First embodiment
Fig. 3 A is the partial top view according to the image element array substrates of first embodiment of the invention, and Fig. 3 B is the profile of the image element array substrates of Fig. 3 A, and its section line is the BB ' line of Fig. 3 A.Please refer to Fig. 3 A and Fig. 3 B, image element array substrates 300a of the present invention comprises substrate 310 and is disposed at float metal 360 and a plurality of first patterning of multi-strip scanning line 320 on the substrate 310, many data wires 330, a plurality of active element 340, a plurality of pixel electrode 350, a plurality of first patternings and connects lead 370.Wherein, first patterning is floated and is formed with first insulating barrier 391 between metal 360 and the data wire 330, and data wire 330 tops are formed with second insulating barrier 392, above the scan line 220 of active element 340, forms semiconductor layer 393 on this first insulating barrier 391.These data wires 330 are a plurality of pixel regions (for example pixel region S1, S2) that form array in crisscross mode with scan line 320, and have corresponding active element 340 and pixel electrode 350 in each pixel region, wherein each active element 340 can electrically connect with pixel electrode 350 with corresponding scan line 320, data wire 330.In the present embodiment, some and scan line 320 overlaids in the pixel electrode 350, and form auxiliary capacitor 351.
Accept above-mentionedly, active element 340 can transmit the sweep signal of coming and determine according to scan line 320 is to be in to open or closing state.When active element 340 was in the state of unlatching, pixel electrode 340 can receive via active element 340 by data wire 330 and transmit the data-signal of coming, so that the color that corresponding pixel adjustment shows.Generally speaking, neighborhood pixels zone (for example pixel region S1, S2) shown color is close mostly.
In addition, float metal 360 of each first patterning can overlap with arbitrary data wire 330, and each first patterning connects lead 370 and can cross over arbitrary scanning linear 320, and respectively therewith first patterning of the scanning linear 320 both sides metal 360 of floating overlap.Particularly, first patterning metal 360 of floating is to be the structure with layer with scanning linear 320, and first patterning connect lead 370 and pixel electrode 350 be with layer structure.Connect the mode that lead 370 is crossed over scanning linears 320 by first patterning, can with each independently (isolated) first patterning metal 360 of floating utilize laser welding and conducting, so promptly can be used as the repairing circuit of data wire 330.
Fig. 3 C is the profile of the data wire of the image element array substrates of Fig. 3 A when broken string takes place.Please refer to Fig. 3 A and Fig. 3 C, especially when the zone that broken string takes place for data wire 330 be the position at data wire 330 during with scan line 320 confluces, just can be with independently first patterning metal 360 conductings of floating of scan line 320 both sides, to repair the data wire 330 that broken string takes place.Specifically, the data wire 330 of the regional both sides of broken string can be floated metal 360 laser weldings to form two welding point 362a with first patterning respectively, and with first patterning connect lead 370 simultaneously with aforesaid be positioned at scan line 320 both sides independently first patterning float metal 360 laser weldings to form two welding point 364a, so the data wire 330 of broken string can be utilized float metal 360 and first patterning of first patterning to connect lead 370 and be connected in series to finish repairing.
Accept above-mentionedly, it is shorter that metal 360 and first patterning connect the length of lead 370 because first patterning is floated, and therefore can avoid the problem of capacitance-resistance sluggishness.In addition, no matter data wire 330 breaks wherein, and image element array substrates 300a of the present invention all can repair, thus to promote the making rate of finished products of image element array substrates 300a.
In addition, scan line 320 can comprise the alloy of aluminium, molybdenum, molybdenum nitride, titanium, titanium nitride, chromium, chromium nitride, above-mentioned metal or the sandwich construction that it combines with the material of data wire 330, and the material transparent conductive material of pixel electrode 350 can comprise tin indium oxide or indium zinc oxide.But the present invention is not limited with pixel electrode 350 for scan line 320, data wire 330.
Second embodiment
Fig. 4 is the partial top view according to the image element array substrates of second embodiment of the invention.Please refer to Fig. 4, the image element array substrates 300b of present embodiment is similar to the image element array substrates 300a (as shown in Figure 3A) of first embodiment, and convenient for asking explanation, the member of same names is still continued to use identical label.In the present embodiment, some and scan line 320 overlaids in the pixel electrode 350, and form auxiliary capacitor 351.Wherein, image element array substrates 300a also comprises a plurality of contact holes 372 that are disposed on the substrate 310, and contact hole 372 is to be electrically connected at first patterning that overlaps to float between metal 360 and first patterning connection lead 370.In other words, connect lead 370 when making, just form the lead of similar panel data line 330 by contact hole 372 at float with first patterning in the delegation metal 360 and first patterning.
Accept above-mentioned, the zone that broken string takes place when data wire 330 is when occurring in data wire 330 with scan line 320 confluces, only needs the data wire 330 of the regional both sides of broken string is promptly finished repairing with first patterning metal 360 laser weldings of floating to form two welding point 362b respectively.Certainly, for the problem of avoiding the capacitance-resistance sluggishness takes place, can further contact hole 372a be utilized laser cutting to cut off.
What emphasize once more is, spirit of the present invention be to utilize first patterning of crossing over scanning linear 320 connect lead 370 with each independently first patterning float metal 360 to electrically connecting, to reach the purpose of repairing data wire 330.In the present embodiment, be to utilize contact hole 372 that first patterning is connected metal 360 electric connections of floating of lead 370 and first patterning in advance, and first embodiment is when broken string takes place data wire 330, just utilizes the mode of laser welding that first patterning connection lead 370 and first patterning are floated metal 360 electric connections to repair.
The 3rd embodiment
Fig. 5 A is the partial top view according to a kind of image element array substrates of third embodiment of the invention.Please refer to Fig. 5 A, the image element array substrates 300c of present embodiment is similar to the image element array substrates 300a (as shown in Figure 3A) of first embodiment, and its difference is that first patterning of the present embodiment metal 360 of floating has more first protuberance 366.In addition, active element 340 for example is a thin-film transistor, wherein the grid 342 of active element 340 is to electrically connect (in the present embodiment with scan line 320, the grid 342 of active element 340 is formed by part of scanning line 320), and the source electrode 344 of active element 340 is to electrically connect with data wire 330, and the drain electrode 346 of active element 340 is to electrically connect with pixel electrode 350.In addition, first protuberance 366 overlaps with the drain electrode 346 of active element 340.
Partial top view when Fig. 5 B is damaged for the active element of the image element array substrates of Fig. 5 A.Please refer to Fig. 5 A and Fig. 5 B, generally speaking, the displaying contents of adjacent pixel region S1, S2 is close.When active element 340a can't operate because of damage, the displaying contents that can make pixel region S1 display pixel area S2 was in the mode as repairing.Particularly, earlier the drain electrode 346 of active element 340a is cut off and formed and open a way 348, transmit wrong signal to pixel electrode 350a with the active element 340a that avoids damaging.Then, the mode of utilizing laser welding with first protuberance 366 respectively with drain electrode 346 weldings of the drain electrode 346 of active element 340a and active element 340b and form two welding point 366a.Afterwards, mode with aforementioned similar repairing data wire 330, with first patterning connect lead 370 simultaneously with aforesaid be positioned at scan line 320 both sides independently first patterning float metal 360 laser weldings to form two welding point 364b, so promptly finish inpainted pixels region S 1.
When data-signal was passed to pixel electrode 350b through the drain electrode 346 of active element 340b, data-signal also can be passed to first protuberance 366 via the drain electrode 346 of active element 340b.The conducting of floating metal 360 by first patterning connection lead 370 and first patterning again, data-signal promptly can be passed to pixel electrode 350a.Above-mentioned repairing method is no matter be that drain electrode 346 is short-circuited with source electrode 344 or active element 340a breaks down and all can repair.Basically be drain electrode 346 disconnections of elder generation with active element 340a, make the uncontrollable pixel region S1 of active element 340a, again the pixel electrode 350a of pixel region S1 is electrically connected to the active element 340b of pixel region S2, thus be by pixel region S2 active element 340b control the signal that enters pixel region S1.So, the i.e. displaying contents of display pixel area S2 synchronously of pixel region S1.Because the displaying contents of pixel region S1 and pixel region S2 is originally just close, therefore the pixel region S1 that damages promptly is difficult for being identified easily by human eye, so be maintained the quality of display unit.
Subsidiary one what carry is that although present embodiment is to be the mode that the example explanation is repaired with adjacent two pixel regions, right the present invention does not limit and non-ly repairs with adjacent two pixel regions.For example, the present invention can also repair by two pixel regions at interval, and end is seen actual product and decided.In addition, present embodiment also can be imitated the image element array substrates 300b with second embodiment, electrically connects first patterning in the mode of making contact hole and connects lead 370 and first patterning metal 360 of floating, and just repeats no more at this.
Fig. 5 C is the partial top view according to the another kind of image element array substrates of third embodiment of the invention.Please refer to Fig. 5 A and Fig. 5 C, the image element array substrates 300d of present embodiment is similar to aforesaid image element array substrates 300c (shown in Fig. 5 A), its difference is that first patterning of the present embodiment metal 360 of floating is to have second protuberance 368, and second protuberance 368 overlaps with pixel electrode 350.Because the repairing method of identical aforementioned first protuberance 366 of the repairing method of second protuberance 368 is familiar with this skill person when releasing easily, just repeats no more herein.
It should be noted that, image element array substrates of the present invention does not limit can only be separately with first protuberance 366 or the mode inpainted pixels of second protuberance 368, and it also can have first protuberance 366 and second protuberance 368 simultaneously to reach better repair efficiency.
In addition, only pipe is to be example to repair broken data wire in the foregoing embodiments, and right the present invention can also repair the situation of scan line broken string simultaneously.Below will illustrate for embodiment and cooperation in addition again.
The 4th embodiment
Fig. 6 is the partial top view according to the image element array substrates of fourth embodiment of the invention.Please refer to Fig. 6, the image element array substrates 300e of present embodiment is similar to the image element array substrates 300a (as shown in Figure 3A) of first embodiment, and its difference is that the image element array substrates 300e of present embodiment comprises that also float metal 380 and second patterning of a plurality of second patternings that are disposed on the substrate 310 connects lead 390.Be connected lead 370 with respect to aforementioned first patterning metal 360 of floating with first patterning, float metal 380 of each second patterning can overlap with arbitrary scanning linear 320, and each second patterning connects lead 390 and can cross over arbitrary data wire 330, and respectively therewith second patterning of the data wire 320 both sides metal 380 of floating overlap.
Particularly, second patterning metal 380 of floating is to be the structure with layer with data wire 330, and second patterning connect lead 390 and pixel electrode 350 be with layer structure.Connect the mode that lead 390 is crossed over data wires 330 by second patterning, can with each independently second patterning metal 380 of floating utilize laser welding and conducting, so promptly can be used as the repairing circuit of scan line 320.Because the spirit of repairing scan line 320 broken strings is spiritual identical with aforementioned repairing data wire 330 broken strings, those skilled in the art just repeats no more at this when weighing voluntarily.
It should be noted that, although present embodiment image element array substrates 300e comprise simultaneously first patterning float metal 360, second patterning float metal 380, first patterning connects lead 370 and second patterning connects lead 390, has the function of repairing scan line 320 and data wire 330 simultaneously with convenient.Right image element array substrates 300e of the present invention also can include only float metal 380 and second patterning of second patterning and connect lead 390, with the function as repairing scan line 320.
Subsidiary one carry be, similar aforesaid image element array substrates 300b (as shown in Figure 4), image element array substrates 300e also can comprise a plurality of contact holes (not illustrating) that are disposed on the substrate 310, and wherein contact hole is to be electrically connected at second patterning that overlaps to float between metal 380 and second patterning connection lead 390.In other words, connect lead 390 when making, just form the lead of similar parallel scan lines 320 by contact hole at float metal 380 and second patterning of same second patterning that lists.
In addition, first patterning connects lead 370 is connected lead 390 with second patterning function and is to provide metal 360 and the second patterning metal 380 energy cross-over connections of floating of floating of first patterning cross data wire 330 and scan line 320.Because it is close with the function that second patterning is connected lead 390 that first patterning connects lead 370, and it is same layer structure with pixel electrode 350 all, so can be again with its integration.Below will illustrate for embodiment and cooperation in addition again.
The 5th embodiment
Fig. 7 is the partial top view according to the image element array substrates of fifth embodiment of the invention.Please refer to Fig. 7, the image element array substrates 300f of present embodiment is similar to the image element array substrates 300e (as shown in Figure 6) of the 4th embodiment, its difference is that first patterning of present embodiment connects lead 370 and can cross over staggered scanning linear 320 and data wire 330 simultaneously, and respectively therewith first patterning of the scan line 320 both sides metal 360 of floating overlap, and simultaneously respectively therewith second patterning of the data wire 330 both sides metal 380 of floating overlap.
Similar aforementioned, when scan line 320 broken strings, can utilize second patterning metal 380 collocation first patterning of floating to connect lead 370 and repair, and when data wire 330 broken strings, can utilize first patterning metal 360 collocation first patterning connection lead 370 of floating to repair.
Subsidiary one carry be, first patterning of image element array substrates 300e, the 300e of the 4th embodiment and the 5th embodiment metal 360 of floating also can also comprise aforesaid first protuberance 366 and second protuberance 368 (shown in Fig. 5 A and Fig. 5 C), to enable the pixel region of further repair damaged.
The 6th embodiment
Fig. 8 A is the partial top view according to the image element array substrates of sixth embodiment of the invention.Please refer to Fig. 8 A, the image element array substrates 300g of present embodiment is similar to the image element array substrates 300a (as shown in Figure 3A) of first embodiment, and its difference is that the image element array substrates 300g of present embodiment comprises that also many bridging lines 322 that are disposed on the substrate 310 are connected lead 374 with the 3rd patterning.Bridging line 322 is and scan line 320 is the structure with layer, and bridging line 322 is parallel to scan line 320, and with data wire 330 vertical interlaceds.In the present embodiment, bridging line 322 and pixel electrode 350 overlapping parts are formed with an auxiliary capacitor 352.Similar aforesaid first patterning connects lead 370, and each the 3rd patterning connects lead 374 can cross over bridging lines 322, and respectively therewith first patterning of the bridging line 322 both sides metal electrode 360 of floating overlap.
When the zone that broken string takes place for data wire 330 is the position at data wire 330 during with bridging line 322 confluces, just can utilize first patterning metal 360 collocation the 3rd patterning of floating to connect lead 374 and repair data wire 330.In addition, similar aforesaid image element array substrates 300b (as shown in Figure 4), image element array substrates 300g also can comprise a plurality of contact holes that are disposed on the substrate 310, shown in Fig. 8 B, wherein some contact hole is to be electrically connected at first patterning that the overlaps metal 360 of floating to be connected between the lead 370 with first patterning, and some contact hole is to be electrically connected at first patterning that the overlaps metal 360 of floating to be connected between the lead 374 with the 3rd patterning.In other words, connect lead 374 when making, just form the lead of similar panel data line 330 by contact hole at the metal 360 of floating with first patterning in the delegation, first patterning connection lead 370 and the 3rd patterning.
Certainly, though the aforesaid a plurality of embodiment situation of lay special stress on when image element array substrates comprises bridging line not, those skilled in the art is when joining the explanation of making present embodiment and releasing easily.
Comprehensively above-mentioned, image element array substrates of the present invention has following advantage at least:
One, when broken string takes place in data wire, particularly the zone of broken string takes place is when being positioned at itself and scan line confluce to data wire, can utilize first first patterning connection lead of floating metal pattern and crossing over scanning linear, and the data wire of broken string is connected to reach the effect of repairing.The length of the metal and first patterning connection lead is shorter because first patterning is floated, and therefore can avoid the problem of capacitance-resistance sluggishness.In addition, no matter data wire breaks wherein, and image element array substrates of the present invention all can be repaired, and makes rate of finished products so can promote image element array substrates.
Two, when active element damages, corresponding pixel electrode can utilize first protuberance and second protuberance to transmit signal, so that this pixel region can reach identical display effect (but not repairing into dark state) with the neighborhood pixels zone.So, the pixel region of this damage promptly is difficult for being identified easily by human eye, and then is maintained the quality of display unit.
Three, when broken string takes place in scan line, particularly the zone of broken string takes place is when being positioned at itself and data wire confluce to scan line, can utilize second second patterning connection lead of floating metal pattern and crossing over data wire, and the scan line of broken string is connected to reach the effect of repairing.That is any lead of image element array substrates of the present invention all can be repaired, and makes rate of finished products to promote image element array substrates thus.
The foregoing description is only given an example for convenience of description, and the interest field that the present invention advocated should be as the criterion so that the claim scope is described certainly, but not only limits to the foregoing description.
Claims (14)
1, a kind of image element array substrates comprises:
Substrate;
The multi-strip scanning line, parallel to each other being disposed on this substrate;
A plurality of first patternings metal of floating is disposed on this substrate, and between these scan lines;
Insulating barrier is disposed on this substrate, and covers these scan lines and these the first patternings metal of floating;
Many data wires, parallel to each other being disposed on this insulating barrier, wherein each data wire and these scan lines intersect, and with these first patternings overlapping one of at least of metal of floating, but do not electrically connect;
A plurality of active elements are formed on this substrate, and electrically connect with corresponding scan line and data wire;
A plurality of pixel electrodes are formed on this substrate, and each pixel electrode and corresponding active element electrically connect; And
A plurality of first patternings connect leads, and each these first patterning connects leads and crosses over a wherein scanning linear, and these first patternings connect leads and overlap with this first patterning of these scanning linear both sides metal of floating respectively.
2, image element array substrates as claimed in claim 1 also comprises a plurality of contact holes, is disposed on this substrate, and wherein, these first patternings metal of floating is connected lead via these contact holes and electrically connects with these first patternings.
3, image element array substrates as claimed in claim 1, wherein each active element has drain electrode, and per first patterning metal of floating has first protuberance, and per first protuberance can overlap with a drain electrode wherein.
4, image element array substrates as claimed in claim 1, the wherein per first patterning metal of floating has second protuberance, and per second protuberance can overlap with a pixel electrode wherein.
5, image element array substrates as claimed in claim 1 also comprises a plurality of second patternings metal of floating, and is disposed on this substrate, and per second patterning metal of floating can overlap with a scanning linear wherein.
6, image element array substrates as claimed in claim 5, wherein per first patterning connects lead can cross over a wherein data wire, and overlaps with this second patterning of these data wire both sides metal of floating respectively.
7, image element array substrates as claimed in claim 6 also comprises a plurality of contact holes that are disposed on this substrate, and wherein, these second patternings metal of floating is connected lead via these contact holes and electrically connects with these first patternings.
8, image element array substrates as claimed in claim 5, comprise that also a plurality of second patternings that are disposed on this substrate connect lead, per second patterning connects lead and crosses over a wherein data wire, and overlaps with this second patterning of these data wire both sides metal electrode of floating respectively.
9, image element array substrates as claimed in claim 8 also comprises a plurality of contact holes that are disposed on this substrate, and wherein, these second patternings metal of floating is connected lead via these contact holes and electrically connects with these second patternings.
10, image element array substrates as claimed in claim 1 also comprise many bridging lines that are disposed on this substrate, and these bridging lines is parallel to these scan lines, and intersects with these data wires.
11, image element array substrates as claimed in claim 10, comprise that also a plurality of the 3rd patternings that are disposed on this substrate connect lead, per the 3rd patterning connects lead and crosses over a wherein bridging line, and overlaps with this first patterning of these bridging line both sides metal electrode of floating respectively.
12, image element array substrates as claimed in claim 11 also comprises a plurality of contact holes that are disposed on this substrate, and wherein these first patternings metal of floating is connected lead via these contact holes and electrically connects with these the 3rd patternings.
13, a kind of image element array substrates comprises:
Substrate;
The multi-strip scanning line is disposed on this substrate;
Insulating barrier is disposed on this substrate and these scan lines;
Many data wires are disposed on this insulating barrier, and intersect with these scan lines;
A plurality of second patternings metal of floating is disposed on this insulating barrier, and these second patternings metal of floating overlaps with a scanning linear wherein;
A plurality of active elements electrically connect with corresponding scan line and data wire;
A plurality of pixel electrodes electrically connect with corresponding active element; And
A plurality of second patternings connect leads, and per second patterning connects lead can cross over a wherein data wire, and overlap with this second patterning of these data wire both sides metal of floating respectively.
14, image element array substrates as claimed in claim 13, also comprise a plurality of contact holes that are disposed on this substrate, each contact hole is electrically connected at wherein, and these second patternings metal of floating is connected lead via these contact holes and electrically connects with these second patternings.
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| CNB2007101021363A CN100466268C (en) | 2007-04-29 | 2007-04-29 | Pixel array substrate |
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| CNB2007101021363A CN100466268C (en) | 2007-04-29 | 2007-04-29 | Pixel array substrate |
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| CN100466268C CN100466268C (en) | 2009-03-04 |
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