CN110972391A - High-precision circuit board and manufacturing method thereof - Google Patents
High-precision circuit board and manufacturing method thereof Download PDFInfo
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- CN110972391A CN110972391A CN201911096406.3A CN201911096406A CN110972391A CN 110972391 A CN110972391 A CN 110972391A CN 201911096406 A CN201911096406 A CN 201911096406A CN 110972391 A CN110972391 A CN 110972391A
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- layer
- metal layer
- polyimide film
- conductive
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A high-precision circuit board comprises a supporting base plate and a conducting circuit arranged on the supporting base plate, wherein the supporting base plate is a polyimide film formed on a flat glass mother board, the conducting circuit is a metal layer, the metal layer is provided with a pattern corresponding to the conducting circuit, the forming conditions of the metal layer comprise that the supporting base plate is positioned on the flat glass mother board, the metal layer is deposited on the supporting base plate in a magnetron sputtering mode, and the metal layer forms the pattern corresponding to the conducting circuit through a photoetching process. The polyimide film is formed on the flat glass mother board to be used as the supporting bottom board, so that the flat glass mother board is flatter and smoother, and further, when the supporting bottom board is positioned on the flat glass mother board, a metal layer with very high uniformity is plated on the supporting bottom board in a magnetron sputtering mode and is patterned through a photoetching process, so that the circuit precision can reach the level of more than 10 mu m, and the circuit density can also be obviously improved.
Description
Technical Field
The invention relates to the field of printed circuit boards, in particular to a high-precision circuit board and a manufacturing method thereof.
Background
Printed circuit boards generally include a supporting substrate body and patterned conductive traces disposed thereon. In recent years, as the integration of electronic devices such as mobile phones is higher, the requirement for the circuit density of the printed circuit board is higher, and thus the requirement for the pattern precision of the printed circuit board is higher.
In the prior art, the printed circuit board generally uses an epoxy board as a supporting substrate, and then a copper conductive layer is adhered thereon, and then a pattern of a circuit is etched on the copper conductive layer by using an etching method. In this method, since the flatness of the epoxy board is insufficient, the thickness of the copper conductive layer is too thick, and the etching protection layer during etching is mostly disposed by printing, it is difficult to achieve high pattern precision (>50 μm), which severely limits the circuit density of the printed circuit board.
For the above reasons, it is necessary to develop a high-precision circuit board and a manufacturing process thereof to meet the increasingly high line density and pattern precision required for electronic devices.
Disclosure of Invention
The invention aims to provide a high-precision circuit board which has higher pattern precision and line density. The technical scheme is as follows:
the utility model provides a high accuracy circuit board, includes supporting baseplate and the conducting wire of setting on supporting baseplate, characterized by: the support base plate is a polyimide film formed on a flat glass mother plate, the conductive circuit is a metal layer, the metal layer is provided with a pattern corresponding to the conductive circuit, and the forming conditions of the metal layer comprise that the support base plate is positioned on the flat glass mother plate, the metal layer is deposited on the support base plate in a magnetron sputtering mode, and the metal layer forms the pattern corresponding to the conductive circuit through a photoetching process.
The high-precision circuit board breaks through the conventional practice of the traditional epoxy board, firstly, a polyimide film is formed on a flat glass mother board to be used as a supporting bottom board, so that the supporting bottom board is far flatter and smoother than the epoxy board in the prior art, further, when the supporting bottom board is positioned on the flat glass mother board, a metal layer (such as molybdenum niobium-aluminum niobium-molybdenum niobium three-layer alloy) with very high uniformity is plated on the supporting bottom board in a magnetron sputtering mode, the metal layer is patterned into a corresponding pattern of a high-precision conducting circuit through a photoetching process, finally, the finished circuit board is stripped from the flat glass mother board, and the flat glass mother board can be repeatedly utilized. Therefore, the circuit precision of the high-precision circuit board can reach the level of more than 10 μm, which is far higher than the pattern precision of a common printed circuit board, and the circuit density can also be obviously improved. The high-precision circuit board can be directly used as a flexible circuit board, can be further adhered to a hard board to form a hard circuit board, and can even be stacked to form a multilayer circuit board.
Preferably, the outer side surface of the circuit board may further be provided with a protective layer (e.g., an insulating ink for covering the circuit), a marking layer (e.g., a text or a graphic mark of the ink), and a reinforcing plate (e.g., a polyimide reinforcing plate, a metal reinforcing plate, and a fiber reinforcing plate adhered by a glue layer). Preferably, the protective layer, the identification layer or the reinforcing plate is arranged when the supporting bottom plate is positioned on the glass mother plate, so that good alignment of the supporting bottom plate can be ensured.
In a preferred embodiment of the present invention, the conductive traces include at least a first trace layer and a second trace layer, and an insulating isolation layer is disposed between the first trace layer and the second trace layer, and the isolation layer is a patterned photosensitive resin coating.
As a further preferable aspect of the present invention, the isolation layer is provided with a through hole, and the first and second conductive layers are connected to each other through the through hole. Through the arrangement of the through holes in the isolation layer, jumper wires and the like between the first lead layer and the second lead layer can be connected.
In a specific embodiment, the conductive line is further covered with an oxide conductive layer for preventing the metal layer from being oxidized. The oxide conductive layer is a conductive film layer such as indium tin oxide, zinc aluminum oxide and the like, can be formed on the metal layer through magnetron sputtering, can be simultaneously patterned with the metal layer to form a consistent superposed pattern, and can also be respectively patterned with the metal layer to form a pattern (a circuit can be formed independently) inconsistent with the metal layer. The oxide conducting layer is covered on the metal layer, so that the metal layer can be prevented from being oxidized, and the environmental reliability of the circuit board is improved.
In a specific embodiment, the circuit board is further provided with a bonding member, the inner side of the bonding member is provided with a first conductive end, the first conductive end is bonded on the polyimide film through anisotropic conductive glue, the first conductive end is connected with the conductive circuit through conductive particles (such as conductive gold balls) on the anisotropic conductive glue, the first conductive end can be a metal pin, and the bonding member is used for expanding the functions of the circuit board. The mount may be a chip (typically an unpackaged die); the bonding member may also be an interposer including a first conductive end and a second conductive end, and the second conductive end is a metal pin, so that the circuit board can electrically connect other circuits (such as soldering or connecting through a connector) through the second conductive end.
A manufacturing method of a high-precision circuit board is characterized by comprising the following steps:
step (1), coating a polyimide precursor solution on a glass mother board, and curing to form a polyimide film;
step (2), keeping the polyimide film on the glass template, and manufacturing a metal layer with a corresponding pattern of the conductive circuit on the polyimide film, wherein the metal layer specifically comprises the following steps: depositing a metal layer on the polyimide film by adopting a magnetron sputtering mode, and forming a corresponding pattern of the conducting circuit on the metal layer by adopting a photoetching mode;
and (3) stripping the polyimide film from the glass mother board to obtain the circuit board.
In one embodiment, between the step (2) and the step (3), a protective layer is attached on the polyimide film, and then the polyimide film is peeled off to avoid pulling the circuit board.
The glass master is preferably float glass.
As a preferred embodiment of the present invention, in the step (2), a silicon oxide film is deposited on the polyimide film as an insulating buffer layer by a magnetron sputtering method, and then a metal layer having a pattern corresponding to a conductive circuit is formed on the polyimide film.
As a preferred embodiment of the present invention, the step (2) of forming the metal layer at least includes forming a first conductive line layer and a second conductive line layer, and forming an isolation layer between the first conductive line layer and the second conductive line layer, where the isolation layer is formed by coating a photosensitive resin and patterning, and specifically includes: coating photosensitive resin, pre-curing, exposing, developing and post-curing.
In a specific scheme, between the step (2) and the step (3), a pasting piece is arranged on the polyimide film, a first conductive end is arranged on the inner side of the pasting piece, when the pasting piece is arranged, the pasting piece is adhered to the polyimide film through anisotropic conductive adhesive, and the first conductive end is connected with the conductive circuit through conductive particles (such as conductive gold balls) on the anisotropic conductive adhesive.
Drawings
FIG. 1 is a schematic structural diagram of a first embodiment of the present invention;
FIGS. 2-7 are schematic diagrams of a manufacturing method according to one embodiment of the present invention;
FIG. 8 is a schematic structural diagram of a second embodiment of the present invention;
fig. 9 is a schematic structural view of the interposer.
Detailed Description
The following further describes the preferred embodiments of the present invention with reference to the accompanying drawings.
Example one
As shown in fig. 1, the high-precision circuit board includes a supporting base plate 1 and a conductive trace 2 disposed on the supporting base plate 1, the supporting base plate 1 is a polyimide film 200 formed on a flat glass mother plate 100, the conductive trace 2 is a metal layer 300, the metal layer 300 has a pattern corresponding to the conductive trace 2, and the forming condition of the metal layer 300 includes that the supporting base plate 1 is on the flat glass mother plate 100, the metal layer 300 is deposited on the supporting base plate 1 by a magnetron sputtering method, and the metal layer 300 forms the pattern corresponding to the conductive trace 2 by a photolithography process.
The thickness of the polyimide film 200 may be 10 μm-100 μm. The flat glass mother substrate 100 is preferably float glass having a very high flatness, which ensures that the polyimide film 200 formed has a high flatness (thickness uniformity) and a high smoothness.
In this embodiment, the circuit board is further provided with a first attaching member and a second attaching member. As shown in fig. 9, the first bonding member is an interposer 3 including a first conductive end 301 and a second conductive end 302, the interposer 3 is attached to the polyimide film 200 through an anisotropic conductive adhesive 7, the first conductive end 301 is connected to the conductive trace 2 through a conductive ball 8, and the second conductive end 302 is a metal pin, so that the circuit board can electrically connect other circuits (such as soldering or connecting through a connector) through the second conductive end; the second attachment is a bare-mounted chip 4 (typically an unpackaged die).
In a specific embodiment, the conductive line 2 is further covered with an oxide conductive layer for preventing the metal layer 300 from being oxidized. The oxide conductive layer is a conductive film layer such as indium tin oxide, zinc aluminum oxide, etc., which can be formed on the metal layer 300 by magnetron sputtering, and can be patterned simultaneously with the metal layer 300 to form a uniform superimposed pattern, or can be patterned separately from the metal layer 300 to form a pattern (which can be a circuit separately) different from the metal layer 300. The oxide conductive layer is covered on the metal layer 300 to prevent the metal layer 300 from being oxidized, thereby improving the environmental reliability of the circuit board.
In a specific embodiment, the outer side of the circuit board may further be provided with a protective layer (e.g., an insulating ink for covering the circuit), a marking layer (e.g., a text or graphic mark of ink), and a reinforcing plate (e.g., a polyimide reinforcing plate, a metal reinforcing plate, and a fiber reinforcing plate adhered by a glue layer). It is further preferable that the protective layer, the mark layer, or the reinforcing plate is provided when the support base plate 1 is placed on the flat glass mother plate 100, so that it can be ensured that it has good alignment.
The high-precision circuit board breaks through the conventional practice of the traditional epoxy board, firstly, a polyimide film 200 is formed on a flat glass mother board 100 to serve as a supporting bottom board 1, so that the supporting bottom board 1 is far flatter and smoother than the epoxy board in the prior art, further, when the supporting bottom board 1 is positioned on the flat glass mother board 100, a metal layer 300 (such as a molybdenum niobium-aluminum niobium-molybdenum niobium alloy) with very high uniformity is plated on the supporting bottom board 1 in a magnetron sputtering mode, the metal layer 300 is patterned into a corresponding high-precision conducting circuit 2 by a photoetching process, and finally, the finished circuit board is peeled off from the flat glass mother board 100, and the flat glass mother board 100 can be repeatedly utilized. Therefore, the circuit precision of the high-precision circuit board can reach the level of more than 10 μm, which is far higher than the pattern precision of a common printed circuit board, and the circuit density can also be obviously improved. The high-precision circuit board can be directly used as a flexible circuit board, can be further adhered to a hard board to form a hard circuit board, and can even be stacked to form a multilayer circuit board.
The manufacturing method of the high-precision circuit board is characterized by comprising the following steps:
step (1), as shown in fig. 2 and 3, coating a polyimide precursor solution on a flat glass mother substrate 100, and curing to form a polyimide film 200;
step (2), as shown in fig. 4, the polyimide film 200 is still on the flat glass template 100, and the metal layer 300 having the corresponding pattern of the conductive trace 2 is fabricated on the polyimide film 200, which specifically includes: firstly, depositing a silicon oxide film on the polyimide film 200 as an insulating buffer layer in a magnetron sputtering mode, then depositing a metal layer 300 on the polyimide film 200 in the magnetron sputtering mode, and forming a corresponding pattern of the conductive circuit 2 on the metal layer 300 in a photoetching mode;
step (2.1), as shown in fig. 5, a first bonding member and a second bonding member are arranged on the polyimide film 2, the first bonding member is an adapter plate 3, the adapter plate 3 is provided with a first conductive end and a second conductive end, the second conductive end is a metal pin, the adapter plate 3 bonds the bonding member on the polyimide film 200 through anisotropic conductive adhesive, and the first conductive end is connected with the conductive circuit 2 through conductive particles (such as conductive gold balls) on the anisotropic conductive adhesive; the second bonding member is a bare chip 4, and the bare chip 4 bonds the bonding member to the polyimide film 200 through the anisotropic conductive adhesive;
step (2.2), attaching a protective layer on the polyimide film 200 to avoid scratching the circuit board when the polyimide film 200 is peeled off;
step (2.3), as shown in fig. 6, the outline of the circuit board is cut in advance on the polyimide film 200 (laser cutting, cutting with a knife die, etc. can be adopted);
step (3), as shown in fig. 7, the polyimide film 200 is peeled off from the flat glass mother substrate 100, and a circuit board is obtained.
The precursor solution may be a polyamic acid solution, and the coating method is preferably spin coating or extrusion coating to ensure the thickness uniformity.
The curing process comprises the following steps: 1) drying to remove the solvent; 2) and cross-linking and curing at a high temperature of 250-400 ℃ to form a polyimide film.
The amount of the precursor solution is controlled to be 10 μm-100 μm thick, thereby forming a final polyimide film.
The metal layer 300 is preferably a "molybdenum niobium-aluminum neodymium-molybdenum niobium" three-layer alloy.
The photolithography generally includes a series of processes including coating photoresist, pre-curing, exposing, developing, hardening, etching, and stripping.
The circuit board can be directly peeled off from the flat glass mother board 100 after being made, or can be peeled off by means of solution soaking, laser irradiation and the like, in order to ensure that the polyimide film 200 is not pulled in the peeling process, a protective film can be attached to the polyimide film 200 to assist the peeling process, for example, an ultraviolet reduction adhesive film (which has larger adhesive force with the circuit board during peeling and reduces the adhesive force after ultraviolet irradiation) is attached for peeling, and finally, the ultraviolet light is irradiated to remove the reduction adhesive film, so that the independent circuit board is obtained.
Example two
As shown in fig. 8, in the case where the other parts are the same as those of the first embodiment, the differences are: the conductive circuit 2 comprises a first conductive wire layer 201 and a second conductive wire layer 202, an insulating isolation layer 5 is arranged between the first conductive wire layer 201 and the second conductive wire layer 202, and the isolation layer 5 is a patterned photosensitive resin coating; the isolation layer 5 is provided with a through hole 6, and the first conductive line layer 201 and the second conductive line layer 202 are connected with each other through the through hole 6. .
Specifically, the isolation layer 5 is preferably a photosensitive resin layer formed by spin coating or flat coating (or extrusion coating), which has good thickness uniformity and smoothness, and has a thickness of between 0.5 μm-5 μm. The isolation layer 5 is preferably patterned by a yellow light process (i.e., exposure and development), and the pattern precision can reach a level of more than 10 μm, so that the isolation layer can be matched with a high-precision circuit to realize a high-precision double-layer or multi-layer circuit (the existing circuit board needs to realize the double-layer or multi-layer circuit, generally needs to realize a double-sided board or multi-layer board punching mode, and the pattern precision is difficult to improve).
By providing the isolation layer 5 with the through hole 6, a jumper or the like connection between the first wire layer 201 and the second wire layer 202 can be realized.
Referring to fig. 2-7 and 8, in the manufacturing method of this embodiment, when the metal layer 300 is manufactured in step (2) of the first embodiment, the manufacturing method includes manufacturing a first wire layer 201 and a second wire layer 202, and disposing an isolation layer 5 between the first wire layer 201 and the second wire layer 202, where the isolation layer 5 is disposed by coating a photosensitive resin and patterning, and specifically includes: coating photosensitive resin, pre-curing, exposing, developing and post-curing.
In addition, it should be noted that the names of the parts and the like of the embodiments described in the present specification may be different, and the equivalent or simple change of the structure, the characteristics and the principle described in the present patent idea is included in the protection scope of the present patent. Various modifications, additions and substitutions for the specific embodiments described may be made by those skilled in the art without departing from the scope of the invention as defined in the accompanying claims.
Claims (6)
1. The utility model provides a high accuracy circuit board, includes supporting baseplate and the conducting wire of setting on supporting baseplate, characterized by: the support base plate is a polyimide film formed on a flat glass mother plate, the conductive circuit is a metal layer, the metal layer is provided with a pattern corresponding to the conductive circuit, and the forming conditions of the metal layer comprise that the support base plate is positioned on the flat glass mother plate, the metal layer is deposited on the support base plate in a magnetron sputtering mode, and the metal layer forms the pattern corresponding to the conductive circuit through a photoetching process.
2. The high-precision circuit board as claimed in claim 1, wherein: the conductive circuit at least comprises a first conductive wire layer and a second conductive wire layer, wherein an insulating isolation layer is arranged between the first conductive wire layer and the second conductive wire layer, and the isolation layer is a graphical photosensitive resin coating.
3. The high-precision circuit board as claimed in claim 2, wherein: the isolation layer is provided with a through hole, and the first lead layer and the second lead layer are connected with each other through the through hole.
4. A manufacturing method of a high-precision circuit board is characterized by comprising the following steps:
step (1), coating a polyimide precursor solution on a flat glass mother board, and curing to form a polyimide film;
step (2), keeping the polyimide film on the flat glass template, and manufacturing a metal layer with a corresponding pattern of the conductive circuit on the polyimide film, wherein the metal layer specifically comprises the following steps: depositing a metal layer on the polyimide film by adopting a magnetron sputtering mode, and forming a corresponding pattern of the conducting circuit on the metal layer by adopting a photoetching mode;
step (3), stripping the polyimide film from the flat glass mother board to obtain a circuit board; in the step (2), a silicon oxide film is deposited on the polyimide film as an insulating buffer layer by means of magnetron sputtering, and then a metal layer with a pattern corresponding to the conductive circuit is manufactured on the polyimide film.
5. The manufacturing method of a high-precision circuit board according to claim 4, characterized in that: in the step (2), a silicon oxide film is deposited on the polyimide film as an insulating buffer layer by means of magnetron sputtering, and then a metal layer with a pattern corresponding to the conductive circuit is manufactured on the polyimide film.
6. The manufacturing method of a high-precision circuit board according to claim 4, characterized in that: the step (2) of manufacturing the metal layer at least comprises manufacturing a first wire layer and a second wire layer, and arranging an isolation layer between the first wire layer and the second wire layer, wherein the isolation layer is arranged in a mode of coating photosensitive resin and is patterned, and the method specifically comprises the following steps: coating photosensitive resin, pre-curing, exposing, developing and post-curing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911096406.3A CN110972391A (en) | 2019-11-11 | 2019-11-11 | High-precision circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911096406.3A CN110972391A (en) | 2019-11-11 | 2019-11-11 | High-precision circuit board and manufacturing method thereof |
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| CN110972391A true CN110972391A (en) | 2020-04-07 |
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| CN201911096406.3A Pending CN110972391A (en) | 2019-11-11 | 2019-11-11 | High-precision circuit board and manufacturing method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105988647A (en) * | 2015-02-05 | 2016-10-05 | 汕头超声显示器技术有限公司 | Capacitive touch screen manufacturing method with less procedure |
| CN207851849U (en) * | 2018-02-27 | 2018-09-11 | 汕头超声显示器技术有限公司 | A kind of capacitance type fingerprint sensing device |
| CN208044576U (en) * | 2018-02-14 | 2018-11-02 | 汕头超声显示器技术有限公司 | A kind of hole connection and capacitance touch screen and display using hole connection |
| CN109271068A (en) * | 2018-09-20 | 2019-01-25 | 汕头超声显示器技术有限公司 | A kind of manufacturing method of flexibility capacitance touch screen |
| CN209267856U (en) * | 2018-10-09 | 2019-08-16 | 汕头超声显示器技术有限公司 | A kind of connection structure of flexible circuit board and glass substrate |
-
2019
- 2019-11-11 CN CN201911096406.3A patent/CN110972391A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105988647A (en) * | 2015-02-05 | 2016-10-05 | 汕头超声显示器技术有限公司 | Capacitive touch screen manufacturing method with less procedure |
| CN208044576U (en) * | 2018-02-14 | 2018-11-02 | 汕头超声显示器技术有限公司 | A kind of hole connection and capacitance touch screen and display using hole connection |
| CN207851849U (en) * | 2018-02-27 | 2018-09-11 | 汕头超声显示器技术有限公司 | A kind of capacitance type fingerprint sensing device |
| CN109271068A (en) * | 2018-09-20 | 2019-01-25 | 汕头超声显示器技术有限公司 | A kind of manufacturing method of flexibility capacitance touch screen |
| CN209267856U (en) * | 2018-10-09 | 2019-08-16 | 汕头超声显示器技术有限公司 | A kind of connection structure of flexible circuit board and glass substrate |
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