CN110957288A - Heat dissipation device and method for high-power device - Google Patents
Heat dissipation device and method for high-power device Download PDFInfo
- Publication number
- CN110957288A CN110957288A CN201911166975.0A CN201911166975A CN110957288A CN 110957288 A CN110957288 A CN 110957288A CN 201911166975 A CN201911166975 A CN 201911166975A CN 110957288 A CN110957288 A CN 110957288A
- Authority
- CN
- China
- Prior art keywords
- heat
- power device
- spreading plate
- printed board
- graphite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
Abstract
The invention relates to a heat dissipation device and a heat dissipation method for a high-power device, belongs to the technical field of aerospace, and particularly relates to the technical field of heat dissipation of high-power devices on aerospace vehicles. The invention processes the graphite heat spreading plate by matching with the layout of the printed board, and a boss is made on the heat spreading plate at the position corresponding to the high-power device on the printed board; fixing the printed board welded with components on a frame, measuring the distance between the top surface of the high-power device and the mounting surface of the heat-spreading plate, matching the height of the heat-radiating boss of the graphite heat-spreading plate according to the measured distance, coating heat-conducting grease additionally according to the distribution condition of the heat-conducting grease on the high-power device when mounting the heat-conducting pad, and increasing the heat-conducting path for the heat-radiating device with a bonding pad on the belly.
Description
Technical Field
The invention relates to a heat dissipation device and a heat dissipation method for a high-power device, belongs to the technical field of aerospace, and particularly relates to the technical field of heat dissipation of the high-power device on an aerospace vehicle, wherein the high-power device means that the power of the device is not less than 5W.
Background
The problem that the temperature rise of a high-power device is too high is often met in the technical field of engineering. With the smaller and smaller overall dimensions of electronic equipment inside an aerospace plane, the power of devices is higher and higher, and the heat dissipation of high-power devices becomes a difficult point in product design. The prior art only depends on the contact heat dissipation mode of the printed board and the aluminum frame, which cannot meet the heat dissipation requirement of the high-power device.
Disclosure of Invention
The technology of the invention solves the problems that: the defects of the prior art are overcome, and the heat dissipation device and the method for the high-power device are provided.
The technical solution of the invention is as follows:
a heat dissipating double-fuselage of the high-power device, the apparatus includes the printed board, heat-conducting cushion, graphite spreads the hot plate, frame, heat-conducting grease and cold plate; the frame is provided with a heat conduction boss which is positioned at the connecting position with the graphite heat spreading plate;
the bottom of the high-power device is welded on the printed board through the welding leg;
the top of the high-power device is connected with the graphite heat spreading plate through the heat conducting pad;
the graphite heat spreading plate is fixedly connected with the frame, and a boss is arranged at the connecting position of the frame and the graphite heat spreading plate, and the height of the boss is 8-10 mm;
the graphite heat spreading plate is fixedly connected with a heat conducting boss of the frame through heat conducting grease;
the frame is fixedly connected with the cold plate;
the thickness of the heat conducting pad is 0.4-0.5 mm;
and a boss is processed at the position where the graphite heat-spreading plate is connected with the heat-conducting pad, and GD-414 glue is coated between the boss on the graphite heat-spreading plate and the heat-conducting pad.
A heat dissipation method for a high-power device comprises the following steps:
(1) firstly, one side of a heat conducting pad is adhered to a boss of a graphite heat spreading plate by GD-414 glue, a layer of heat conducting grease is coated on the other side of the heat conducting pad, and a printed board welded with a high-power device is fixedly connected with a frame;
(2) the graphite heat spreading plate is lightly placed on the frame without installing a fixing screw, at the moment, a heat conducting pad adhered to the graphite heat spreading plate is in contact with the upper surface of the high-power device, the graphite heat spreading plate is lightly pressed by a hand, the graphite heat spreading plate is taken down after t seconds, for example, 10 seconds of pressing, the upper surface of the high-power device is observed, and if the heat conducting grease is uniform, the heat conducting pad is in good contact with the high-power device; if the surface of the high-power device is uneven in heat conduction grease, a tiny gap is formed between the heat conduction pad and the high-power device, and at the moment, the heat conduction grease is required to be additionally coated on the part, with less heat conduction grease, of the high-power device, so that good contact between the heat conduction pad and the high-power device during final installation is guaranteed.
A heat sink for high-power device comprises a printed board and a frame;
the upper surface of the printed board is connected with the bottom of the high-power device through an abdomen bonding pad in a welding manner;
the lower surface of the printed board is connected with the frame, and the upper surface of the printed board and the connecting part of the high-power device are coated with copper layers;
the connecting part of the printed board and the high-power device is provided with a plurality of through holes, the inner surfaces of the through holes are coated with copper layers, the thickness of each copper layer is 0.025mm, the diameter of each through hole is 0.2-0.3mm, and the number of the through holes is 20-30.
A heat dissipation method for a high-power device comprises the following steps:
(1) processing a plurality of through holes on the printed board;
(2) coating copper layers on the inner surfaces of the plurality of through holes processed in the step (1), and coating copper layers on the periphery of the top ends and the periphery of the bottom ends of the plurality of through holes;
(3) and the bottom of the high-power device is connected to the upper surface of the printed board through an abdomen welding plate in a welding mode.
Advantageous effects
(1) The high-heat-conductivity graphite heat spreading plate is adopted, the contact heat dissipation area between the printed board and the frame is enlarged in a matching mode, the heat dissipation path of the high-power device is increased, the timely conduction of heat of the high-power device is guaranteed, and the high-temperature failure of the device is prevented.
(2) The invention discloses a heat dissipation method of a high-power device, which mainly comprises ①, wherein the heat conductivity of a high-heat-conduction graphite heat-dissipation plate is 3 times that of aluminum alloy, ② uses a heat-conduction pad with the thickness of 0.5mm to reduce the temperature difference on two sides of the heat-conduction pad, ③ is used for matching and processing a boss of the graphite heat-dissipation plate according to the height of the device to ensure that the compression amount of the heat-conduction pad is in the optimal heat conduction range, when the ④ heat-dissipation plate is trial-assembled, the contact effect of the heat-conduction pad and the device is determined through the distribution of heat-conduction grease on the high-power device, ⑤ increases the contact area of the graphite heat-dissipation plate and a frame, ⑥ increases the heat conduction path of the high-power device for heat dissipation at the belly, and.
(3) The invention processes the graphite heat spreading plate by matching with the layout of the printed board, and a boss is made on the heat spreading plate at the position corresponding to the high-power device on the printed board; fixing the printed board welded with components on a frame, measuring the distance between the top surface of the high-power device and the mounting surface of the heat-spreading plate, matching the height of the heat-radiating boss of the graphite heat-spreading plate according to the measured distance, coating heat-conducting grease additionally according to the distribution condition of the heat-conducting grease on the high-power device when mounting the heat-conducting pad, and increasing the heat-conducting path for the heat-radiating device with a bonding pad on the belly.
Drawings
Fig. 1 is a schematic view of a heat dissipation structure in embodiment 1;
fig. 2 is a schematic view of a heat dissipation structure in embodiment 2.
Detailed Description
A high-power device heat dissipation method, the bottom of the high-power device is welded on the printed board through the welding leg, the top of the high-power device is connected with graphite heat-spreading plate through the heat-conducting pad, the graphite heat-spreading plate is fixedly connected with the frame, and the connecting position of the frame and the graphite heat-spreading plate is provided with a heat-conducting boss, the height of the heat-conducting boss is 8-10mm, the graphite heat-spreading plate is fixedly connected with the heat-conducting boss of the frame through heat-conducting grease, and the frame is fixedly connected with the cold plate; the thickness of the heat conducting pad is 0.4-0.5 mm; the connecting position of the graphite heat spreading plate and the heat conducting pad is provided with a boss, and GD-414 glue is coated between the boss on the graphite heat spreading plate and the heat conducting pad.
Firstly, one side of a heat conducting pad is adhered to a boss of a graphite heat spreading plate by GD-414 glue, a layer of heat conducting grease is coated on the other side of the heat conducting pad, a printed board welded with a high-power device is fixedly connected with a frame, then the graphite heat spreading plate is lightly placed on the frame without installing a fixing screw, at the moment, the heat conducting pad adhered to the graphite heat spreading plate is contacted with the upper surface of the high-power device, the graphite heat spreading plate is lightly pressed by hands, the graphite heat spreading plate is taken down after being pressed for 10 seconds, the upper surface of the high-power device is observed, and if the heat conducting grease is uniform, the heat conducting pad is well contacted with the high-power; if the surface of the high-power device is uneven in heat conduction grease, a tiny gap is formed between the heat conduction pad and the high-power device, and at the moment, the heat conduction grease is required to be additionally coated on the part, with less heat conduction grease, of the high-power device, so that good contact between the heat conduction pad and the high-power device during final installation is guaranteed.
A high-power device heat dissipation method, the upper surface of the printed board is connected with high-power device, the lower surface of the printed board is connected with frame, and the upper surface of the printed board and the connection part of the high-power device are coated with copper layer, the connection part of the printed board and the high-power device is provided with a plurality of through holes, the inner surfaces of the through holes are coated with copper layer, the thickness of the copper layer is 0.025mm, the bottom of the high-power device is welded on the printed board through belly pad; the diameter of the through holes is 0.2-0.3mm, and the number of the through holes is 20-30.
The aerospace craft matching equipment is mostly modular structure, is stacked by a plurality of modules and forms a whole with apron, connecting screw, and every module has relatively independent function, has that rigidity is high, inside cable junction reliability is high, the manufacturability is good, maintain characteristics such as more convenient.
Next, heat dissipation measures are implemented for the module assembly 1 with many high-power devices.
In order to ensure the heat conduction efficiency and reduce the temperature difference at the two sides of the heat conduction pad, the heat conduction pad cannot be too thick, and generally the thickness is selected to be 0.5 mm. Meanwhile, in order to ensure that the compression of the heat conducting pad is 10-20%, the processing height of the boss of the heat spreading plate needs to be strictly controlled. When the distance between the printed board and the heat-spreading board is fixed, in order to ensure reasonable compression of the heat-conducting pad, the welding height of the device and the boss height of the heat-spreading board are two main influencing factors. For a device, the height tolerance of the device is 0.5mm, the welding tolerance of the device is 0.2mm, and in order to improve the precision, a matching processing method is required.
The high-power device on the printed board is firstly welded, the printed board is fixed on the frame after welding, and the height H1 between the upper surface of the device and the mounting surface of the heat-spreading plate is measured. To ensure the measurement accuracy, four points are measured at four corners of the upper surface of the high-power device, and the average value is calculated.
The thickness of the heat conducting pad is 0.5mm, the thickness of the heat conducting pad after compression is 0.4mm when the heat conducting pad is compressed by 20%. GD-414 glue is coated between the heat diffusion plate boss and the heat conducting pad, heat conducting grease is coated between the heat conducting pad and the device, the total thickness of the GD-414 glue and the heat conducting grease is about 0.1mm, so that H3 is 0.5mm, and the machining height H2 of the heat diffusion plate boss is calculated to be H1-0.5 mm.
The heat of the high-power device is conducted to the graphite heat-spreading plate through the heat-conducting pad, and the heat of the frame is conducted to the equipment installation cold plate, so that the heat is quickly conducted to the frame from the graphite heat-spreading plate, and the key of heat conduction of the high-power device is one ring. In order to quickly conduct heat from the heat-diffusing plate to the frame, it is necessary to maximize the contact area between the heat-diffusing plate and the frame. Therefore, a structural boss with the height of 10mm is designed at the bottom of the frame and is in contact with the heat diffusion plate, and rapid heat conduction is guaranteed.
When the module combination 1 is assembled, in order to ensure that the heat conducting pad is well contacted with the heat diffusion plate and the device, heat conducting grease needs to be additionally coated. Firstly, a heat conducting pad is adhered to a boss of a heat spreading plate by GD-414 glue, and a thin layer of heat conducting grease is coated on the other side of the heat conducting pad. The printed board welded with the high-power device is fixed with the frame, then the heat-spreading plate is lightly placed on the frame without installing a fixing screw, and at the moment, the heat-conducting pad adhered on the heat-spreading plate is contacted with the upper surface of the high-power device. Lightly pressing the heat spreading plate by hand for 10 seconds, then taking down the heat spreading plate, observing the upper surface of the device, and if the heat conducting grease is uniform, indicating that the heat conducting pad is in good contact with the device; if the heat conduction grease on the surface of the device is uneven, a fine gap is formed between the heat conduction pad and the device, and at the moment, the heat conduction grease is required to be additionally coated on the part with less heat conduction grease on the device, so that good contact between the heat conduction pad and the device is ensured during final installation.
Besides the method of heat dissipation by the graphite heat dissipation plate, the high-power device can also assist other heat dissipation modes. For a belly-land high power device, heat dissipation from the belly is considered because the belly heat is greater. The belly of the device is welded on the copper-clad layer of the printed board by soldering tin.
30 small holes with the diameter of 0.3mm are formed below the high-power device with the pad on the belly, a copper-clad layer with the thickness of 0.025mm is arranged on the hole wall, and the heat of the high-power device is conducted to a frame below the printed board through the copper rings with the thickness of 0.025 mm.
In conclusion, by adopting materials with high thermal conductivity, increasing the heat dissipation path and increasing the contact area, the heat of the high-power device can be smoothly led out, and the high-temperature failure of the device is prevented.
Example 1
As shown in fig. 1, a heat dissipation method for a high power device, the bottom of the high power device is welded on a printed board through a welding leg, the top of the high power device is connected with a graphite heat spreading plate through a heat conducting pad, the graphite heat spreading plate is fixedly connected with a frame, a heat conducting boss is arranged at the connecting position of the frame and the graphite heat spreading plate, the height of the heat conducting boss is 8-10mm, the graphite heat spreading plate is fixedly connected with the heat conducting boss of the frame through heat conducting grease, and the frame is fixedly connected with a cold plate; the thickness of the heat conducting pad is 0.4-0.5 mm; the connecting position of the graphite heat spreading plate and the heat conducting pad is provided with a boss, and GD-414 glue is coated between the boss on the graphite heat spreading plate and the heat conducting pad.
Firstly, one side of a heat conducting pad is adhered to a boss of a graphite heat spreading plate by GD-414 glue, a layer of heat conducting grease is coated on the other side of the heat conducting pad, a printed board welded with a high-power device is fixedly connected with a frame, then the graphite heat spreading plate is lightly placed on the frame without installing a fixing screw, at the moment, the heat conducting pad adhered to the graphite heat spreading plate is contacted with the upper surface of the high-power device, the graphite heat spreading plate is lightly pressed by hands, the graphite heat spreading plate is taken down after being pressed for 10 seconds, the upper surface of the high-power device is observed, and if the heat conducting grease is uniform, the heat conducting pad is well contacted with the high-power; if the surface of the high-power device is uneven in heat conduction grease, a tiny gap is formed between the heat conduction pad and the high-power device, and at the moment, the heat conduction grease is required to be additionally coated on the part, with less heat conduction grease, of the high-power device, so that good contact between the heat conduction pad and the high-power device during final installation is guaranteed.
Example 2
As shown in fig. 2, in the heat dissipation method for the high-power device, the upper surface of a printed board is connected with the high-power device, the lower surface of the printed board is connected with a frame, a copper layer is coated on the connecting part of the upper surface of the printed board and the high-power device, a plurality of through holes are formed in the connecting part of the printed board and the high-power device, the inner surfaces of the through holes are coated with the copper layer, the thickness of the copper layer is 0.025mm, and the bottom of the high-power device is welded on the printed board through an abdominal pad; the diameter of the through holes is 0.2-0.3mm, and the number of the through holes is 20-30.
A heat dissipation method for a high-power device comprises the following steps:
(1) processing a plurality of through holes on the printed board;
(2) coating copper layers on the inner surfaces of the plurality of through holes processed in the step (1), and coating copper layers on the periphery of the top ends and the periphery of the bottom ends of the plurality of through holes;
(3) and the bottom of the high-power device is connected to the upper surface of the printed board through an abdomen welding plate in a welding mode.
Claims (10)
1. A heat dissipating double-fuselage of the high-power device, characterized by that: the device comprises a printed board, a heat conducting pad, a graphite heat spreading plate, a frame, heat conducting grease and a cold board;
the bottom of the high-power device is welded on the printed board through the welding leg;
the top of the high-power device is connected with the graphite heat spreading plate through the heat conducting pad;
the graphite heat spreading plate is fixedly connected with the frame, and a heat conduction boss is arranged at the connecting position of the frame and the graphite heat spreading plate;
the graphite heat spreading plate is fixedly connected with a heat conducting boss of the frame through heat conducting grease;
the frame is fixedly connected with the cold plate;
the position where the graphite heat spreading plate is connected with the heat conducting pad is provided with a boss, and glue is coated between the boss on the graphite heat spreading plate and the heat conducting pad.
2. The heat dissipating device for high power device as claimed in claim 1, wherein: the height of the heat conduction boss on the frame is 8-10 mm.
3. The heat dissipating device for high power device as claimed in claim 1, wherein: the thickness of the heat conducting pad is 0.4-0.5 mm.
4. The heat dissipating device for high power device as claimed in claim 1, wherein: GD-414 glue is coated between the boss on the graphite heat spreading plate and the heat conducting pad.
5. A heat dissipation method for a high-power device is characterized by comprising the following steps:
(1) firstly, one side of a heat conducting pad is adhered to a boss of a graphite heat spreading plate by GD-414 glue, a layer of heat conducting grease is coated on the other side of the heat conducting pad, and a printed board welded with a high-power device is fixedly connected with a frame;
(2) the graphite heat spreading plate is lightly placed on the frame without installing a fixing screw, at the moment, a heat conducting pad adhered to the graphite heat spreading plate is in contact with the upper surface of the high-power device, the graphite heat spreading plate is lightly pressed by a hand, the graphite heat spreading plate is taken down after the graphite heat spreading plate is pressed for a set time, the upper surface of the high-power device is observed, and if the heat conducting grease is uniform, the heat conducting pad is in good contact with the high-power device; if the surface of the high-power device is uneven in heat conduction grease, the part with less heat conduction grease on the high-power device is additionally coated with the heat conduction grease, so that the heat conduction pad is in good contact with the high-power device during final installation.
6. The method for dissipating heat from a high power device as claimed in claim 1, wherein: in the step (2), the pressing time is set to 10 seconds.
7. A heat dissipating double-fuselage of the high-power device, characterized by that: the device comprises a printed board and a frame;
the upper surface of the printed board is connected with the bottom of the high-power device through an abdomen bonding pad in a welding manner;
the lower surface of the printed board is connected with the frame, and the upper surface of the printed board and the connecting part of the high-power device are coated with copper layers;
the connecting part of the printed board and the high-power device is provided with a plurality of through holes, the inner surfaces of the through holes are coated with copper layers, and the thickness of each copper layer is 0.025 mm.
8. The heat dissipating device for high power device as claimed in claim 7, wherein: the diameter of the through hole is 0.2-0.3 mm.
9. The heat dissipating device for high power device as claimed in claim 7, wherein: the number of the through holes is 20-30.
10. A heat dissipation method for a high-power device is characterized by comprising the following steps:
(1) processing a plurality of through holes on the printed board;
(2) coating copper layers on the inner surfaces of the plurality of through holes processed in the step (1), and coating copper layers on the periphery of the top ends and the periphery of the bottom ends of the plurality of through holes;
(3) and the bottom of the high-power device is connected to the upper surface of the printed board through an abdomen welding plate in a welding mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911166975.0A CN110957288B (en) | 2019-11-25 | 2019-11-25 | Heat dissipation device and method for high-power device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911166975.0A CN110957288B (en) | 2019-11-25 | 2019-11-25 | Heat dissipation device and method for high-power device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110957288A true CN110957288A (en) | 2020-04-03 |
| CN110957288B CN110957288B (en) | 2021-07-13 |
Family
ID=69976715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911166975.0A Active CN110957288B (en) | 2019-11-25 | 2019-11-25 | Heat dissipation device and method for high-power device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110957288B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112822899A (en) * | 2020-12-29 | 2021-05-18 | 中国航天时代电子有限公司 | Dual-redundancy 270V high-voltage high-power load monitoring device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2838038Y (en) * | 2004-09-22 | 2006-11-15 | 台湾积体电路制造股份有限公司 | Semiconductor encapsulant |
| CN102281740A (en) * | 2011-06-08 | 2011-12-14 | 中兴通讯股份有限公司 | Heat dissipation unit and method |
| CN103383983A (en) * | 2012-05-02 | 2013-11-06 | 茂邦电子有限公司 | Light emitting diode encapsulation, PCB type radiating substrate used for light emitting diode encapsulation and manufacturing method of PCB type radiating substrate |
| CN104134633A (en) * | 2014-08-07 | 2014-11-05 | 华进半导体封装先导技术研发中心有限公司 | High-power chip flexible substrate packaging structure and packaging process |
| WO2018081783A1 (en) * | 2016-10-31 | 2018-05-03 | Phononic, Inc. | Metal core thermoelectric device |
| CN109860131A (en) * | 2019-03-22 | 2019-06-07 | 西安微电子技术研究所 | A kind of system-in-package structure with interior radiator |
-
2019
- 2019-11-25 CN CN201911166975.0A patent/CN110957288B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2838038Y (en) * | 2004-09-22 | 2006-11-15 | 台湾积体电路制造股份有限公司 | Semiconductor encapsulant |
| CN102281740A (en) * | 2011-06-08 | 2011-12-14 | 中兴通讯股份有限公司 | Heat dissipation unit and method |
| CN103383983A (en) * | 2012-05-02 | 2013-11-06 | 茂邦电子有限公司 | Light emitting diode encapsulation, PCB type radiating substrate used for light emitting diode encapsulation and manufacturing method of PCB type radiating substrate |
| CN104134633A (en) * | 2014-08-07 | 2014-11-05 | 华进半导体封装先导技术研发中心有限公司 | High-power chip flexible substrate packaging structure and packaging process |
| WO2018081783A1 (en) * | 2016-10-31 | 2018-05-03 | Phononic, Inc. | Metal core thermoelectric device |
| CN109860131A (en) * | 2019-03-22 | 2019-06-07 | 西安微电子技术研究所 | A kind of system-in-package structure with interior radiator |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112822899A (en) * | 2020-12-29 | 2021-05-18 | 中国航天时代电子有限公司 | Dual-redundancy 270V high-voltage high-power load monitoring device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110957288B (en) | 2021-07-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2146374B1 (en) | Printed circuit boards assembly comprising a heat sink | |
| US20100302734A1 (en) | Heatsink and method of fabricating same | |
| CN107078111B (en) | Cooling device, method for producing a cooling device and power circuit | |
| TWI612861B (en) | Circuit board structure with chip embedded therein and manufacturing method thereof | |
| CN110957288B (en) | Heat dissipation device and method for high-power device | |
| JP2013516776A (en) | Thermal plug used in heat sink and its assembly method | |
| JP2021174847A (en) | Electronic device | |
| TWM590780U (en) | Heat dissipation structure of IGBT modules with different copper thickness | |
| TWM592106U (en) | Power module | |
| JP2020174116A (en) | Heat sink fixing member and electronic device | |
| JP2021111776A (en) | Electronic facility and assembling method for electronic facility | |
| CN108922873B (en) | Radiating assembly for spacecraft electronic product CQFP device and mounting process | |
| CN214228544U (en) | Copper-based heat dissipation circuit board | |
| CN217035622U (en) | Heat radiation structure of bridge rectifier chip | |
| US20100251536A1 (en) | Heat-dissipating structure on case of industrial computer and manufacturing method thereof | |
| CN211210027U (en) | Integrated structure of radiator and circuit board | |
| CN220326092U (en) | Hardware heat radiation structure | |
| CN216600206U (en) | Thermoelectric separation copper substrate | |
| US11439039B2 (en) | Thermal management of electronic devices on a cold plate | |
| CN216600615U (en) | Heat sink and electrical apparatus | |
| CN111146096B (en) | Double-sided heat dissipation semiconductor device and single-reflow soldering method thereof | |
| CN219644407U (en) | Circuit board heat abstractor and computer server | |
| US11343942B2 (en) | Power conversion device including cooling components | |
| JP6403741B2 (en) | Surface mount semiconductor package equipment | |
| RU2667360C1 (en) | Method for providing passive heat receptor of mobile device processing unit or laptop computer based on diamond-copper composite material and device for its implementation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |