CN110957255A - Material rack for diode packaging - Google Patents
Material rack for diode packaging Download PDFInfo
- Publication number
- CN110957255A CN110957255A CN201911385935.5A CN201911385935A CN110957255A CN 110957255 A CN110957255 A CN 110957255A CN 201911385935 A CN201911385935 A CN 201911385935A CN 110957255 A CN110957255 A CN 110957255A
- Authority
- CN
- China
- Prior art keywords
- rack
- push rod
- lead blocking
- lead
- slider
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 41
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 9
- 230000007246 mechanism Effects 0.000 claims abstract description 36
- 230000000903 blocking effect Effects 0.000 claims abstract description 35
- 238000009434 installation Methods 0.000 claims abstract description 5
- 238000005096 rolling process Methods 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 7
- 239000003292 glue Substances 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/6609—Diodes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention discloses a material rack for packaging diodes, which comprises a material loading rack and a material unloading rack, wherein the material unloading rack comprises a plurality of bilaterally symmetrical bearing supports, a plurality of V-shaped grooves for placing diodes are uniformly formed in the bearing supports, the material loading rack is buckled on the material unloading rack, the material loading rack also comprises an adjusting mechanism, and a mounting cavity for mounting the adjusting mechanism is concavely formed in the bearing supports; the adjusting mechanism comprises a lead blocking slider, an attraction mechanism and a guide push rod, the attraction mechanism is arranged in the middle of the installation cavity, the lead blocking sliders are arranged on two sides of the attraction mechanism, the guide push rod is vertically arranged on the fixed die, and a through hole allowing the guide push rod to pass through is formed in the corresponding position of the material loading frame. According to the invention, the guide push rod pushes the lead blocking slider to move towards two sides, so that the diode is pushed to move towards the middle, and the qualified rate of diode sealing glue is improved. The ingenious magnet that adopts keeps attracting in the use and keeps keeping off the lead wire slider, and after the die sinking, keep off lead wire slider automatic re-setting.
Description
Technical Field
The invention relates to the field of diode packaging, in particular to a material frame for diode packaging.
Background
In the process of packaging the diode, the diode needs to be externally sealed. Generally, the length of the lead wire extending from both ends of the diode is the same, and therefore, the diode needs to be secured in the middle of the mold. If the diode is not in the middle position during the encapsulation, the encapsulation at one end is thinner and the encapsulation at the other end is thicker, and during normal use, the thinner side may have a breakdown phenomenon, which may cause the diode not to be used normally.
The existing manufacturers usually adopt the matching of the distance between two ends of the material rack and the length of the diode, and when the diode is placed, the diode can be ensured to be positioned in the middle; in addition, the material rest is usually made of metal aluminum, so that the weight of the material rest is reduced, and the labor intensity of workers is reduced. However, when the led is sealed, the metal expands due to the high temperature environment, and the expansion coefficient of the aluminum is large, so that the leads at the two ends of the diode are squeezed by the two ends when the led is sealed, so that the diode is inclined and displaced.
Disclosure of Invention
Aiming at overcoming the defects in the prior art, the invention mainly aims to overcome the defects in the prior art, and discloses a material rack for packaging diodes, which comprises a material loading rack and a material unloading rack, wherein the material unloading rack comprises a plurality of bilaterally symmetrical bearing supports, a plurality of V-shaped grooves for placing the diodes are uniformly arranged on the bearing supports, the material loading rack is buckled on the material unloading rack, and the material loading rack also comprises an adjusting mechanism, and a mounting cavity for mounting the adjusting mechanism is concavely arranged on the bearing supports; the adjusting mechanism comprises a lead blocking slider, an attraction mechanism and a guide push rod, the attraction mechanism is arranged in the middle of the installation cavity, the lead blocking sliders are arranged on two sides of the attraction mechanism, the guide push rod is vertically arranged on the fixed die, and a through hole allowing the guide push rod to pass through is arranged at the corresponding position of the feeding frame.
Further, the attraction mechanism includes a magnet, and the lead blocking slider is made of a material that can be attracted by the magnet.
Further, attract mechanism includes fixed block and tension spring, the outside extension in fixed block both sides sets up the guide bar to the level setting is used for holding tension spring and the accommodation hole that runs through, tension spring sets up in the accommodation hole, and both ends and both sides keep off the lead wire slider and connect, it sets up to keep off the lead wire slider slip on the guide bar.
Furthermore, a rolling round shaft is arranged at the contact position of the lead blocking slider and the guide push rod.
Further, the guide push rod includes an expanding portion and a locking portion, the lead blocking slider is pushed by the expanding portion to move to both sides, and the expanded position of the lead blocking slider is held by the positioning portion.
The invention has the following beneficial effects:
according to the invention, the guide push rod pushes the lead blocking slider to move towards two sides, so that the diode is pushed to move towards the middle, and the qualified rate of diode sealing glue is improved. The ingenious magnet that adopts keeps attracting in the use and keeps keeping off the lead wire slider, and after the die sinking, keep off lead wire slider automatic re-setting. In addition, a tension spring is also provided as a power source for automatic reset of the lead blocking slider, and automatic reset of the lead blocking slider is also realized. And a round shaft is added, so that the abrasion between the guide push rod and the lead blocking sliding block is reduced.
Drawings
Fig. 1 is a schematic structural view of a blanking frame;
fig. 2 is a schematic structural view of a feeding frame;
fig. 3 is a schematic view of the usage state of the rack;
FIG. 4 is a schematic view of the adjustment mechanism in use;
FIG. 5 is a schematic view of an embodiment of a suction mechanism in use;
FIG. 6 is a top view of FIG. 5
FIG. 7 is a schematic structural view of a lead blocking slider;
FIG. 8 is a schematic structural view of an embodiment of the suction mechanism;
FIG. 9 is a schematic view showing a state before mold clamping;
FIG. 10 is a schematic view showing a state after mold clamping;
FIG. 11 is a schematic structural view of a guide push rod;
the reference numbers are as follows:
1. the device comprises a feeding frame, 2, a discharging frame, 3, a bearing support, 4, an adjusting mechanism, 5, a fixed die, 6, a movable die, 9, a diode, 11, a through hole, 31, a V-shaped groove, 32, an installation cavity, 41, a lead blocking slider, 42, an attraction mechanism, 43, a guide push rod, 411, a circumference, 412, a guide hole, 421, a fixed block, 422, a tension spring, 423, a guide rod, 424, an accommodating hole, 431, an expansion part, 432 and a locking part.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
A material rack for packaging diodes is shown in figures 1-4 and 9-10 and comprises an upper material rack 1 and a lower material rack 2, wherein the lower material rack 2 comprises a plurality of bilaterally symmetrical bearing supports 3, a plurality of V-shaped grooves 31 for placing diodes 9 are uniformly formed in the bearing supports 3, and wires at two ends of each diode 9 are placed in the V-shaped grooves 31 of two adjacent bearing supports 3. Go up work or material rest 1 lock on work or material rest 2 down, then place the work or material rest on the movable mould. The device also comprises an adjusting mechanism 4, wherein a mounting cavity 32 for mounting the adjusting mechanism 4 is concavely arranged on the bearing bracket 3; the adjusting mechanism 4 comprises a lead blocking slider 41, an attraction mechanism 42 and a guide push rod 43, wherein the attraction mechanism 42 is arranged in the middle of the installation cavity 32, the lead blocking sliders 41 are arranged on two sides of the attraction mechanism 42, the guide push rod 43 is vertically arranged on the fixed die 5, and a through hole 11 allowing the guide push rod 43 to pass through is arranged at a corresponding position of the upper material rack 1. When the diode fixing device is used, the lead blocking sliders 41 on the two sides are attracted by the attraction mechanism 42 to be tightly attached to the attraction mechanism 42, the diodes are placed in the V-shaped groove 31, the upper material rack 1 is buckled on the lower material rack 2, the material rack is placed into the movable mold 6, then the movable mold 6 and the fixed mold 5 are assembled, the guide push rods 43 are inserted into the through holes 11, the lead blocking sliders 41 on the two sides are pushed to move towards the two sides, and the diodes 9 are further pushed to move towards the middle. After the mold is opened, the lead blocking slider 41 is returned by the suction mechanism 42.
In one embodiment, the attraction mechanism 42 includes a magnet, and the lead blocking slider 41 is made of a material that can be attracted by the magnet; such as iron, cobalt, nickel. When the mold is opened, the lead blocking slider 41 is tightly attached to the magnet by the attraction of the magnet; when the guiding push rod 43 is inserted, the lead blocking slider 41 is pushed to slide towards two sides.
In one embodiment, as shown in fig. 5 to 8, the attraction mechanism 42 includes a fixed block 421 and a tension spring 422, guide rods 423 are extended outwards from two sides of the fixed block 421, and a guide hole 412 is provided at a corresponding position of the wire blocking slider 41, and the guide rods 423 are slidably disposed in the guide hole 412. The fixing block 421 is horizontally provided with a receiving hole 424 for receiving the tension spring 422 and penetrating through the fixing block, the tension spring 422 is arranged in the receiving hole 424, and two ends of the tension spring 422 are connected with the lead blocking sliders 41 on two sides.
In one embodiment, a rolling circular shaft 411 is provided at the contact position of the wire blocking slider 41 and the guide push rod 43. The sliding friction between the guide pusher 43 and the wire guide slider 41 is converted into rolling friction by the circular shaft 411.
In one embodiment, as shown in fig. 11, the guide push rod 43 is a columnar structure including an expanding portion 431 and a locking portion 432, the expanding portion 431 being disposed below the locking portion 432; the expansion part inclines inwards from top to bottom, and then the expansion part 431 pushes the lead blocking slide block 41 towards two sides when the die is closed; the locking portion 432 is a vertical plane, i.e., defines the lead stopper slider 41 push-out distance.
The above are merely preferred embodiments of the present invention, and are not intended to limit the scope of the invention; it is intended that the following claims be interpreted as including all such alterations, modifications, and equivalents as fall within the true spirit and scope of the invention.
Claims (5)
1. A material rack for packaging diodes comprises a material loading rack and a material unloading rack, wherein the material unloading rack comprises a plurality of bilaterally symmetrical bearing supports, a plurality of V-shaped grooves for placing diodes are uniformly formed in the bearing supports, and the material loading rack is buckled on the material unloading rack; the adjusting mechanism comprises a lead blocking slider, an attraction mechanism and a guide push rod, the attraction mechanism is arranged in the middle of the installation cavity, the lead blocking sliders are arranged on two sides of the attraction mechanism, the guide push rod is vertically arranged on the fixed die, and a through hole allowing the guide push rod to pass through is arranged at the corresponding position of the feeding frame.
2. The stack for diode packages of claim 1, wherein the attraction mechanism comprises a magnet, and the lead blocking slider is made of a material that can be attracted by the magnet.
3. The rack for diode packages as claimed in claim 1, wherein the suction mechanism comprises a fixed block and a tension spring, the fixed block has two sides extending outwards to form guide rods, and a horizontal receiving hole for receiving the tension spring and passing through the horizontal receiving hole, the tension spring is disposed in the receiving hole, and two ends of the tension spring are connected to the lead blocking sliders at two sides, and the lead blocking sliders are slidably disposed on the guide rods.
4. The stack for diode packages as claimed in claim 1, wherein a circular axis of rolling is provided at a position where the lead blocking slider contacts the guide push rod.
5. The stack for diode packages according to claim 1, wherein the guide push rod includes an expanding portion and a locking portion, the expanding portion pushes the lead blocking slider to move to both sides, and the positioning portion maintains the expanded position of the lead blocking slider.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911385935.5A CN110957255A (en) | 2019-12-29 | 2019-12-29 | Material rack for diode packaging |
| PCT/CN2020/095621 WO2021135081A1 (en) | 2019-12-29 | 2020-06-11 | Material rack for diode packaging |
| DE202020005633.2U DE202020005633U1 (en) | 2019-12-29 | 2020-06-11 | Fabric frame for diode encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911385935.5A CN110957255A (en) | 2019-12-29 | 2019-12-29 | Material rack for diode packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110957255A true CN110957255A (en) | 2020-04-03 |
Family
ID=69984702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911385935.5A Pending CN110957255A (en) | 2019-12-29 | 2019-12-29 | Material rack for diode packaging |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN110957255A (en) |
| DE (1) | DE202020005633U1 (en) |
| WO (1) | WO2021135081A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021135081A1 (en) * | 2019-12-29 | 2021-07-08 | 太仓佳锐精密模具有限公司 | Material rack for diode packaging |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3734309B2 (en) * | 1996-06-18 | 2006-01-11 | アピックヤマダ株式会社 | Wire rod feeder |
| CN201279887Y (en) * | 2008-10-30 | 2009-07-29 | 常州星海半导体器件有限公司 | Diode injection molding mould positioning device |
| CN107768289B (en) * | 2017-11-21 | 2024-07-12 | 太仓佳锐精密模具有限公司 | Semiconductor packaging mould work or material rest |
| CN110957255A (en) * | 2019-12-29 | 2020-04-03 | 太仓佳锐精密模具有限公司 | Material rack for diode packaging |
-
2019
- 2019-12-29 CN CN201911385935.5A patent/CN110957255A/en active Pending
-
2020
- 2020-06-11 DE DE202020005633.2U patent/DE202020005633U1/en not_active Expired - Lifetime
- 2020-06-11 WO PCT/CN2020/095621 patent/WO2021135081A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021135081A1 (en) * | 2019-12-29 | 2021-07-08 | 太仓佳锐精密模具有限公司 | Material rack for diode packaging |
Also Published As
| Publication number | Publication date |
|---|---|
| DE202020005633U1 (en) | 2021-11-23 |
| WO2021135081A1 (en) | 2021-07-08 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |