CN110947434A - Electronic package and manufacturing method thereof - Google Patents
Electronic package and manufacturing method thereof Download PDFInfo
- Publication number
- CN110947434A CN110947434A CN201811229518.7A CN201811229518A CN110947434A CN 110947434 A CN110947434 A CN 110947434A CN 201811229518 A CN201811229518 A CN 201811229518A CN 110947434 A CN110947434 A CN 110947434A
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- Prior art keywords
- insulator
- electronic
- electronic package
- board
- conductive structure
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000012212 insulator Substances 0.000 claims abstract description 54
- 238000000034 method Methods 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 10
- 238000005260 corrosion Methods 0.000 claims description 9
- 230000007797 corrosion Effects 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 7
- 238000000018 DNA microarray Methods 0.000 description 14
- 239000012472 biological sample Substances 0.000 description 8
- 239000013060 biological fluid Substances 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000008280 blood Substances 0.000 description 3
- 210000004369 blood Anatomy 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/12—Specific details about manufacturing devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
Abstract
An electronic package and its manufacturing method, bury the electronic element with sensing area and conductive structure in the insulator, and make the sensing area expose the insulator, and electrically connect the electronic element and the conductive structure by the circuit structure, and then dispose the groove of a plate body on the sensing area of the electronic element.
Description
Technical Field
The present invention relates to an electronic package, and more particularly, to an electronic package with a sensing function and a method for fabricating the same.
Background
The definition of biochip applies the principles of molecular biology, biochemistry, etc., uses glass or high molecular as substrate, combines with micro-electromechanical technology, designs and manufactures the biological and medical detecting elements with microminiaturization, rapid and parallel processing capability, so it can carry out large amount of biochemical detection on a tiny area.
The micro flow channel structure on the biochip can be used to perform the procedures of mixing, transmitting or separating the sample, so the use of the micro flow channel biochip can reduce the error of manual operation experiment, reduce the energy consumption and the sample consumption, and save the labor and time.
As shown in fig. 1, it is known that a cover plate 15 having a groove 150 is made of a polymer material, the cover plate 15 is attached to a biochip 11 having a sensing area a via an adhesive 10, so as to form a flow channel on the biochip 11, and the flow channel flows through the sensing area a, and then a package 13 is formed on the biochip 11 to cover the cover plate 15, and a wire structure 12 is formed in the package 13 to electrically connect to an electrode pad 110 of the biochip 11, and the wire structure 12 is exposed on the surface of the package 13 to be combined with a solder ball 16, in order to provide a sensing package 1 applied to a biochip.
However, in the conventional sensing package 1, the surface of the biochip 11 is combined with the cover plate 15, and a space is required to form the package 13, so that the usable area of the sensing region a of the biochip 11 is greatly reduced, thereby reducing the overall operating efficiency of the biochip 11.
In addition, since the groove 150 is fabricated to dispose the cover plate 15 on the biochip 11, the volume of the cover plate 15 is limited by the size of the biochip 11, so that the flow channel can accommodate a limited amount of biological samples, which may lead to erroneous detection results due to insufficient amount of biological samples.
Therefore, how to overcome the above problems of the prior art has become an issue to be solved.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present invention provides an electronic package and a method for fabricating the same
The electronic package of the present invention includes: an insulator having opposing first and second surfaces; an electronic element with a sensing region, which is embedded in the insulator and exposes the sensing region to the first surface of the insulator; a conductive structure embedded in the insulator; the circuit structure is formed on the first surface of the insulator and electrically connects the electronic element and the conductive structure; and a plate body having a groove and disposed on the sensing region.
The invention also provides a manufacturing method of the electronic packaging piece, which comprises the following steps: providing an electronic component, which comprises an insulator, an electronic element and a conductive structure embedded in the insulator, and a circuit structure formed on the insulator and electrically connecting the electronic element and the conductive structure, wherein the electronic element is provided with a sensing region so that the sensing region is exposed out of the insulator and the circuit structure; and arranging a plate body with a groove on the sensing area of the electronic element.
In the electronic package and the method for fabricating the same, the conductive structure is in the form of a pillar.
In the electronic package and the method for manufacturing the same, the board body has a plurality of openings communicating with the grooves.
In the electronic package and the manufacturing method thereof, the board body is made of glass.
In the electronic package and the method for manufacturing the same, the arrangement position of the trench partially corresponds to the position of the sensing region.
In the electronic package and the method for manufacturing the same, the board is disposed on the insulator through the supporting portion. For example, the supporting portion is made of corrosion-resistant material, or the supporting portion includes a metal layer and a metal bump formed on the metal layer.
In the electronic package and the method for manufacturing the same, a bonding portion is formed on the insulator to bond the board.
In the electronic package and the method for manufacturing the same, a plurality of conductive elements are formed on the insulator and electrically connected to the conductive structure.
Therefore, the electronic package and the manufacturing method thereof of the invention mainly form an insulator on one side of the sensing region through the electronic device without reserving a space, so that compared with the prior art, the electronic device of the invention can manufacture the sensing region according to the requirement to improve the overall operation efficiency of the electronic device.
In addition, the manufacturing method of the invention firstly manufactures the electronic component comprising the insulator, the electronic element and the circuit structure, and then arranges the plate body on the electronic component, so compared with the prior art, the volume of the plate body of the invention does not need to be matched with the size of the electronic element, and the space specification of the groove can be designed according to the requirement, so that the groove can accommodate the required biological sample volume, thereby avoiding the problem of generating wrong detection results due to insufficient biological sample volume.
Drawings
Fig. 1 is a schematic cross-sectional view of a conventional sensing package.
Fig. 2A to fig. 2G are schematic cross-sectional views illustrating a method for manufacturing an electronic package according to the present invention.
Fig. 2F' is a schematic top view of fig. 2F.
Fig. 3 is a schematic cross-sectional view of a board body of an electronic package according to another embodiment of the present invention.
Description of the symbols
1 sensing package
10 glue
11 biochip
110,210 electrode pad
12-line structure
13 Package
15 cover plate
150,250 groove
16 solder ball
2 electronic package
2a electronic component
21 electronic component
21a sensing surface
21b non-sensing surface
22 conductive structure
22a,22b end faces
23 insulator
23a first surface
23b second surface
24-circuit structure
24a joint
25 plate body
251 opening
26 conductive element
35a,35b support
350 metal layer
351 metal bump
9 bearing part
A sensing area.
Detailed Description
The following description of the embodiments of the present invention is provided by way of specific examples, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein.
It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for understanding and reading the contents disclosed in the specification, and are not used for limiting the conditions under which the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, ratio relationship changes or size adjustments should still fall within the scope of the technical contents disclosed in the present invention without affecting the efficacy and the achievable purpose of the present invention. In addition, the terms "above", "first", "second" and "a" as used in the present specification are for clarity of description only, and are not intended to limit the scope of the present invention, and the relative relationship between the terms and the terms is not to be construed as a substantial technical change or modification.
Fig. 2A to fig. 2G are schematic cross-sectional views illustrating a manufacturing method of the electronic package 2 according to the present invention.
As shown in fig. 2A, a plurality of conductive structures 22 and at least one electronic component 21 are disposed on a carrier 9.
In the present embodiment, the electronic device 21 is a sensor chip, for example, a sensor chip for detecting a characteristic change of a biological fluid, a temperature difference, a pressure, and the like. For example, the electronic device 21 has a sensing surface 21a and a non-sensing surface 21b opposite to each other, wherein the sensing surface 21a has a plurality of electrode pads 210 and a sensing area a for detecting biological fluid (e.g., blood), and the electronic device 21 is bonded to the carrier 9 through the sensing surface 21a thereof.
In addition, the conductive structure 22 is, for example, in the form of a column, which is formed by, for example, electroplating, sputtering, pasting, or other methods.
The carrier 9 is a disposable plate for wafer level packaging, such as a glass plate, a silicon plate, or other plates.
As shown in fig. 2B, the conductive structure 22 and the electronic element 21 are covered by an insulator 23.
In the present embodiment, the insulator 23 is used as a package layer, which is formed by pressing, molding or other methods, and the material thereof can be a dielectric material or a package material, such as Polyimide (PI), dry film (dry film), epoxy resin (epoxy) or a package compound (molding compound), but is not limited thereto.
In addition, the insulator 23 has a first surface 23a and a second surface 23b opposite to each other, and the first surface 23a is bonded to the carrier 9.
As shown in fig. 2C, the carrier 9 is removed to expose the sensing surface 21a of the electronic component 21, the end surface 22a of the conductive structure 22 and the first surface 23a of the insulator 23, and the sensing surface 21a of the electronic component 21 is flush with the first surface 23a of the insulator 23.
As shown in fig. 2D, a circuit structure 24 is formed on the first surface 23a of the insulator 23 and the sensing surface 21a of the electronic element 21, such that the circuit structure 24 electrically connects the conductive structure 22 and the electrode pad 210 of the electronic element 21 and exposes the sensing region a and the electrode pad 210, and the insulator 23, the electronic element 21, the conductive structure 22 and the circuit structure 24 are used as an electronic component 2a, wherein the circuit structure 24 is made of a corrosion-resistant material (e.g., gold (Au)).
In the present embodiment, the circuit structure 24 is fabricated by a redistribution layer (RDL) process, such as gold wire, copper wire or other suitable material capable of resisting corrosion of biological liquid, so that the circuit structure 24 is electrically connected to the electrode pads 210 of the electronic component 21 and the conductive structures 22, and the number of layers is designed according to requirements, thereby forming a dielectric layer (not shown) for bonding circuits according to requirements.
In addition, the electronic component 2a may also have at least one bonding portion 24a formed on the first surface 23a of the insulator 23, wherein the bonding portion 24a is a metal layer made of a gold layer and has no electrical function, i.e., the bonding portion 24a is not electrically connected to the conductive structure 22.
As shown in fig. 2E to fig. 2F, a board 25 having a groove 250 is disposed on the circuit structure 24 and covers the sensing region a of the electronic device 21.
In the present embodiment, the plate 25 is a semiconductor plate such as glass, and the layout position of the trench 250 partially corresponds to the position of the sensing region a, i.e. the trench 250 covers the sensing region a. When the biological fluid flows into the groove 250, the biological fluid passes through the sensing region a to be detected.
In addition, the plate 25 has a plurality of openings 251 communicating with the grooves 250, as shown in fig. 2F', for allowing biological fluid (such as blood) to enter and exit the grooves 250 from the openings 251 or flow out of the grooves 250 from the openings 251.
The board body 25 is correspondingly coupled to the connection portion 24a via the support portion 35a, so that the board body 25 is disposed on the circuit structure 24. Specifically, as shown in fig. 2E, the supporting portion 35a is formed by sputtering or other methods to form a metal layer made of gold, and a portion of the supporting portion 35a contacts the circuit structure 24 and another portion contacts the connecting portion 24a, wherein the supporting portion 35a is not formed in the trench 250, and the circuit structure 24 and the connecting portion 24a are not electrically connected; alternatively, as shown in fig. 3, the supporting portion 35b is manufactured by forming a metal layer 350 by sputtering or other methods, and then forming a plurality of metal bumps 351 made of gold on the metal layer 350 by electroplating or other methods, wherein a portion of the metal bumps 351 of the supporting portion 35b contact the circuit structure 24 and another portion of the metal bumps 351 contact the bonding portion 24a, and the circuit structure 24 and the bonding portion 24a are not electrically connected.
Therefore, the supporting portions 35a,35b and the connecting portion 24a are used as a Dummy (Dummy) and do not transmit signals, and the circuit structure 24 is used for transmitting signals.
As shown in fig. 2G, a portion of the material of the second surface 23b of the insulator 23 is removed to expose the other end surface 22b of the conductive structure 22, so that a conductive element 26, such as a solder ball or a metal bump, is bonded to the end surface 22b of the conductive structure 22.
The electronic package 2 of the present invention can be used for detecting biological fluid (such as blood), so the structure of the electronic package needs to be acid and alkali resistant, so the joint between the plate 25 and the insulator 23 needs to use a material (such as the joint 24a and/or the support 35a,35b made of gold) that can resist corrosion (or acid and alkali), and the metal support 35a,35b formed on the surface of the plate 25 for joining the joint 24a can effectively avoid the corrosion of the joint, thereby enhancing the structural reliability of the electronic package 2.
In addition, the sensing surface 21a of the electronic device 21 does not need to be formed with the insulator 23, so that the usable area of the sensing surface 21a of the electronic device 21 is increased compared to the prior art, and the sensing region a can be manufactured as required to improve the overall operating efficiency of the electronic device 21.
Moreover, the manufacturing method of the electronic package of the present invention first manufactures the electronic component 2a and then arranges the board 25, so compared with the prior art, the volume of the board 25 of the present invention does not need to match the size of the electronic component 21, and thus the space specification of the groove 250 can be designed according to the requirement, so that the groove 250 can accommodate the required biological sample amount, thereby avoiding the problem of generating an erroneous detection result due to insufficient biological sample amount.
The present invention also provides an electronic package 2 comprising: an insulator 23, at least one electronic component 21, a plurality of conductive structures 22, a circuit structure 24, and a board 25 having a groove 250.
The insulator 23 has a first surface 23a and a second surface 23b opposite to each other.
The electronic device 21 is embedded in the insulator 23, and the electronic device 21 has at least one sensing region a, such that the sensing region a is exposed from the first surface 23a of the insulator 23.
The conductive structure 22 is embedded in the insulator 23.
The circuit structure 24 is combined with the first surface 23a of the insulator 23 to electrically connect the electronic component 21 and the conductive structure 22.
The plate 25 is disposed on the sensing region a.
In one embodiment, the conductive structure 22 is in the form of a pillar.
In one embodiment, the layout position of the trench 250 partially corresponds to the position of the sensing region a.
In one embodiment, the plate 25 has a plurality of openings 251 that communicate with the grooves 250.
In one embodiment, the plate 25 is glass.
In one embodiment, the supporting portions 35a and 35b are formed on the board 25, so that the board 25 is disposed on the circuit structure 24 through the supporting portions 35a and 35 b. For example, the support portion 35a is in the form of a metal layer; alternatively, the supporting portion 35b includes a metal layer 350 and a metal bump 351 formed on the metal layer 350.
In one embodiment, the electronic package 2 further includes a bonding portion 24a formed on the first surface 23a of the insulator 23 for disposing the board 25 and not electrically connected to the conductive structure 22.
In one embodiment, the electronic package 2 further includes a plurality of conductive elements 26 formed on the second surface 23b of the insulator 23 and electrically connected to the conductive structure 22.
In summary, in the electronic package and the method for fabricating the same of the present invention, the joint portion and/or the supporting portion is made of corrosion-resistant material to prevent corrosion at the joint of the board and the insulator, so as to enhance the structural reliability of the electronic package.
In addition, the sensing surface of the electronic element does not need to reserve a space to form an insulator, so that the electronic element can manufacture the sensing area according to the requirement, and the whole operation efficiency of the electronic element can be improved.
In addition, the manufacturing method of the invention firstly manufactures the electronic component comprising the insulator, the electronic element and the circuit structure, and then arranges the plate body on the electronic component, so the volume of the plate body of the invention does not need to be matched with the size of the electronic element, and the space specification of the groove of the plate body can be designed according to the requirement, so that the groove can accommodate the required biological sample volume, thereby avoiding the problem of generating wrong detection results due to insufficient biological sample volume.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify the above-described embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of the invention should be determined from the following claims.
Claims (20)
1. An electronic package, comprising:
an insulator having opposing first and second surfaces;
an electronic element with a sensing region, which is embedded in the insulator and exposes the sensing region to the first surface of the insulator;
a conductive structure embedded in the insulator;
the circuit structure is formed on the first surface of the insulator and electrically connects the electronic element and the conductive structure; and
the plate body is provided with a groove and is configured on the sensing area.
2. The electronic package of claim 1, wherein the conductive structure is in the form of a pillar.
3. The electronic package of claim 1, wherein the board body has a plurality of openings communicating with the grooves.
4. The electronic package of claim 1, wherein the board body is glass.
5. The electronic package of claim 1, wherein the trench is disposed at a position partially corresponding to the position of the sensing region.
6. The electronic package according to claim 1, wherein a support portion is formed on the board body, such that the board body is disposed on the first surface of the insulator through the support portion.
7. The electronic package of claim 6, wherein the support portion is formed of a corrosion resistant material.
8. The electronic package according to claim 6, wherein the support comprises a metal layer and a metal bump formed on the metal layer.
9. The electronic package according to claim 1, further comprising a bonding portion formed on the first surface of the insulator for bonding to the board.
10. The electronic package according to claim 1, further comprising a plurality of conductive elements formed on the second surface of the insulator and electrically connected to the conductive structure.
11. A method of fabricating an electronic package, the method comprising:
providing an electronic component, which comprises an insulator, an electronic element and a conductive structure embedded in the insulator, and a circuit structure formed on the insulator and electrically connecting the electronic element and the conductive structure, wherein the electronic element is provided with a sensing region so that the sensing region is exposed out of the insulator and the circuit structure; and
a plate body with a groove is arranged on the sensing area of the electronic element.
12. The method of claim 11, wherein the conductive structure is in the form of a pillar.
13. The method of claim 11, wherein the board has a plurality of openings communicating with the grooves.
14. The method of claim 11, wherein the board is glass.
15. The method of claim 11, wherein the trench is disposed at a position partially corresponding to the sensing region.
16. The method of claim 11, wherein the board is disposed on the insulator via a support portion.
17. The method of claim 16, wherein the support portion is made of a corrosion-resistant material.
18. The method of claim 16, wherein the support portion comprises a metal layer and a metal bump formed on the metal layer.
19. The method of claim 11, further comprising forming a bonding portion on the insulator to bond the board.
20. The method of claim 11, further comprising forming a plurality of conductive elements on the insulator such that the conductive elements are electrically connected to the conductive structures.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107133854 | 2018-09-26 | ||
| TW107133854A TWI673834B (en) | 2018-09-26 | 2018-09-26 | Electronic package and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110947434A true CN110947434A (en) | 2020-04-03 |
| CN110947434B CN110947434B (en) | 2022-03-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811229518.7A Active CN110947434B (en) | 2018-09-26 | 2018-10-22 | Electronic package and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110947434B (en) |
| TW (1) | TWI673834B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI742469B (en) * | 2019-11-22 | 2021-10-11 | 虹晶科技股份有限公司 | Biochip package structure |
| TWI826337B (en) * | 2023-07-05 | 2023-12-11 | 力成科技股份有限公司 | Image sensor package that keeps the glue from overflowing |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030041735A (en) * | 2001-11-21 | 2003-05-27 | 주식회사 씨큐브디지탈 | Fabrication and assembly method of image sensor using by flip chip packaging process |
| US20040161909A1 (en) * | 2002-11-29 | 2004-08-19 | Andreas Meckes | Electronic component and method for its production |
| CN1542963A (en) * | 2003-05-02 | 2004-11-03 | 精工爱普生株式会社 | Semiconductor device and method of manufacturing the same, electronic device, electronic instrument |
| TW201041053A (en) * | 2009-05-07 | 2010-11-16 | Unisense Technology Co Ltd | Sensor components packaging structure and method of manufacturing the same |
| EP2096667B1 (en) * | 2008-02-29 | 2013-05-08 | Sumco Corporation | Silicon substrate and manufacturing method thereof |
| CN103915402A (en) * | 2013-01-04 | 2014-07-09 | 矽品精密工业股份有限公司 | Photoelectric module structure |
| CN104867906A (en) * | 2014-02-20 | 2015-08-26 | 矽品精密工业股份有限公司 | Semiconductor package and fabrication method thereof |
| CN105845635A (en) * | 2015-01-16 | 2016-08-10 | 恒劲科技股份有限公司 | Electronic encapsulation structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG152086A1 (en) * | 2007-10-23 | 2009-05-29 | Micron Technology Inc | Packaged semiconductor assemblies and associated systems and methods |
| TWM538153U (en) * | 2016-09-21 | 2017-03-11 | Chip Win Technology Co Ltd | Integrated multi-substrate structure of electronic biosensor and microfluidic device |
-
2018
- 2018-09-26 TW TW107133854A patent/TWI673834B/en active
- 2018-10-22 CN CN201811229518.7A patent/CN110947434B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030041735A (en) * | 2001-11-21 | 2003-05-27 | 주식회사 씨큐브디지탈 | Fabrication and assembly method of image sensor using by flip chip packaging process |
| US20040161909A1 (en) * | 2002-11-29 | 2004-08-19 | Andreas Meckes | Electronic component and method for its production |
| CN1542963A (en) * | 2003-05-02 | 2004-11-03 | 精工爱普生株式会社 | Semiconductor device and method of manufacturing the same, electronic device, electronic instrument |
| EP2096667B1 (en) * | 2008-02-29 | 2013-05-08 | Sumco Corporation | Silicon substrate and manufacturing method thereof |
| TW201041053A (en) * | 2009-05-07 | 2010-11-16 | Unisense Technology Co Ltd | Sensor components packaging structure and method of manufacturing the same |
| CN103915402A (en) * | 2013-01-04 | 2014-07-09 | 矽品精密工业股份有限公司 | Photoelectric module structure |
| CN104867906A (en) * | 2014-02-20 | 2015-08-26 | 矽品精密工业股份有限公司 | Semiconductor package and fabrication method thereof |
| CN105845635A (en) * | 2015-01-16 | 2016-08-10 | 恒劲科技股份有限公司 | Electronic encapsulation structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI673834B (en) | 2019-10-01 |
| CN110947434B (en) | 2022-03-22 |
| TW202013624A (en) | 2020-04-01 |
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