CN110945605B - Method for manufacturing laminated electronic component - Google Patents

Method for manufacturing laminated electronic component Download PDF

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CN110945605B
CN110945605B CN201880048740.9A CN201880048740A CN110945605B CN 110945605 B CN110945605 B CN 110945605B CN 201880048740 A CN201880048740 A CN 201880048740A CN 110945605 B CN110945605 B CN 110945605B
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external electrode
electronic component
forming
sintered body
laminated electronic
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CN110945605A (en
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矢内剑
山口朋一
山岸裕司
武藤直树
松本沙也佳
臼井良辅
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Panasonic Intellectual Property Management Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/30Apparatus or processes specially adapted for manufacturing resistors adapted for baking
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/148Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
    • H01C17/283Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/285Precursor compositions therefor, e.g. pastes, inks, glass frits applied to zinc or cadmium oxide resistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/1006Thick film varistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/43Electric condenser making

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Thermistors And Varistors (AREA)
  • Details Of Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

A sintered body in which ceramic layers and internal electrodes were alternately laminated was obtained. A1 st external electrode connected to the internal electrode is formed on a side surface of the sintered body. The sintered body having the 1 st external electrode formed thereon was entirely coated with glass. The 2 nd external electrode was formed on the side surface of the glass-coated sintered body. With this method, in the laminated electronic component, the electrical connection between the internal electrode and the external electrode can be stabilized.

Description

层叠电子部件的制造方法Method for manufacturing laminated electronic components

技术领域technical field

本发明涉及各种电子设备中使用的层叠电子部件的制造方法。The present invention relates to a method of manufacturing laminated electronic components used in various electronic devices.

背景技术Background technique

近年来,表面安装用的电子部件中除了层叠陶瓷电容器、层叠陶瓷压敏电阻,还有各种电子部件。在这些电子部件的尺寸较小的情况下不会特别产生问题,但是若由于应对大容量或者大电流等导致电子部件的尺寸变大,则可能由于电路基板材料与陶瓷的线膨胀率之差导致产生机械应力,电子部件达到损坏。因此,在现有的电子部件中,在电子部件的两端面的外部电极安装将金属板加工而成的导线端子,经由该导线端子来安装于电路基板。In recent years, electronic components for surface mounting include various types of electronic components in addition to multilayer ceramic capacitors and multilayer ceramic varistors. There is no particular problem when the size of these electronic parts is small, but if the size of the electronic parts becomes large due to handling large capacity or high current, etc., it may be caused by the difference in linear expansion coefficient between the circuit board material and ceramics. Mechanical stress is generated and electronic components are damaged. Therefore, in a conventional electronic component, a lead terminal processed from a metal plate is attached to external electrodes on both end surfaces of the electronic component, and the lead terminal is mounted on a circuit board via the lead terminal.

例如,专利文献1中公开了与上述电子部件类似的现有的电子部件。For example, Patent Document 1 discloses a conventional electronic component similar to the above-mentioned electronic component.

在先技术文献prior art literature

专利文献patent documents

专利文献1:JP特开2000-306764号公报Patent Document 1: JP-A-2000-306764

发明内容Contents of the invention

获得将陶瓷层与内部电极交替层叠的烧结体。在烧结体的侧面形成与内部电极连接的第1外部电极。对形成有第1外部电极的烧结体整体进行玻璃涂层。在进行了玻璃涂层的烧结体的侧面形成第2外部电极。通过该方法,在层叠电子部件,能够使内部电极与外部电极的电连接稳定。A sintered body in which ceramic layers and internal electrodes were alternately laminated was obtained. A first external electrode connected to the internal electrode is formed on the side surface of the sintered body. Glass coating is performed on the entire sintered body on which the first external electrodes are formed. A second external electrode was formed on the side surface of the glass-coated sintered body. According to this method, the electrical connection between the internal electrodes and the external electrodes can be stabilized when the electronic component is laminated.

附图说明Description of drawings

图1A是实施方式中的层叠电子部件的立体图。FIG. 1A is a perspective view of a laminated electronic component in the embodiment.

图1B是图1A所示的层叠电子部件的线1B-1B处的剖视图。FIG. 1B is a cross-sectional view at line 1B-1B of the laminated electronic component shown in FIG. 1A .

图2是表示实施方式中的层叠电子部件的制造方法的剖视图。2 is a cross-sectional view illustrating a method of manufacturing a laminated electronic component in the embodiment.

图3是表示实施方式中的层叠电子部件的制造方法的剖视图。3 is a cross-sectional view illustrating a method of manufacturing a laminated electronic component in the embodiment.

图4是表示实施方式中的层叠电子部件的制造方法的剖视图。4 is a cross-sectional view illustrating a method of manufacturing a laminated electronic component in the embodiment.

图5是表示实施方式中的层叠电子部件的制造方法的剖视图。5 is a cross-sectional view illustrating a method of manufacturing a laminated electronic component in the embodiment.

图6是表示实施方式中的层叠电子部件的制造方法的剖视图。6 is a cross-sectional view showing a method of manufacturing a laminated electronic component in the embodiment.

图7是表示实施方式中的层叠电子部件的制造方法的剖视图。7 is a cross-sectional view showing a method of manufacturing a laminated electronic component in the embodiment.

图8是表示实施方式中的层叠电子部件的制造方法的剖视图。8 is a cross-sectional view illustrating a method of manufacturing a laminated electronic component in the embodiment.

具体实施方式detailed description

图1A是实施方式中的层叠电子部件1000的立体图。图1B是图1A所示的层叠电子部件1000的线1B-1B处的剖视图。在实施方式中,层叠电子部件1000是层叠陶瓷压敏电阻。FIG. 1A is a perspective view of a laminated electronic component 1000 in the embodiment. FIG. 1B is a cross-sectional view at line 1B-1B of the laminated electronic component 1000 shown in FIG. 1A . In the embodiment, the multilayer electronic component 1000 is a multilayer ceramic varistor.

层叠电子部件1000具备:烧结体11、被设置在烧结体11上的绝缘层15、被设置在烧结体11上的外部电极13A、13B、被设置在外部电极13A上的外部电极14A、被设置在外部电极13B上的外部电极14B、被设置在外部电极14A上的镀敷层16A、被设置在外部电极14B上的镀敷层16B、被设置在镀敷层16A上的接合材料18A、被设置在镀敷层16B上的接合材料18B、通过接合材料18A而与镀敷层16A即外部电极14A接合的导线端子17A、通过接合材料18B而与镀敷层16B即外部电极14B接合的导线端子17B。烧结体11具备相互被交替层叠的多个绝缘层22和内部电极12A、12B。烧结体11具有:内部电极12A露出的侧面11A;内部电极12B露出的侧面11B;与侧面11A、11B连结的安装面11C;与侧面11A、11B连结并且是安装面11C的相反侧的对面11D;连结于侧面11A、11B、安装面11C和对面11D的表面11E;连结于侧面11A、11B、安装面11C和对面11D并且是表面11E的相反侧的表面11F。绝缘层15被设置在烧结体11的安装面11C、对面11D和表面11E、11F上。层叠电子部件1000构成为通过在电路基板等的安装物2001连接导线端子17A、17B而被安装于安装物2001。The laminated electronic component 1000 includes: a sintered body 11, an insulating layer 15 provided on the sintered body 11, external electrodes 13A and 13B provided on the sintered body 11, an external electrode 14A provided on the external electrode 13A, and an external electrode 14A provided on the external electrode 13A. External electrode 14B on external electrode 13B, plating layer 16A provided on external electrode 14A, plating layer 16B provided on external electrode 14B, bonding material 18A provided on plating layer 16A, The bonding material 18B provided on the plating layer 16B, the lead terminal 17A bonded to the plating layer 16A, that is, the external electrode 14A through the bonding material 18A, and the lead terminal 17A bonded to the plating layer 16B, that is, the external electrode 14B through the bonding material 18B 17B. Sintered body 11 includes a plurality of insulating layers 22 and internal electrodes 12A and 12B that are alternately stacked. The sintered body 11 has: a side surface 11A where the internal electrode 12A is exposed; a side surface 11B where the internal electrode 12B is exposed; a mounting surface 11C connected to the side surfaces 11A and 11B; an opposite surface 11D connected to the side surfaces 11A and 11B and opposite to the mounting surface 11C; Surface 11E connected to side surfaces 11A, 11B, mounting surface 11C, and facing surface 11D; surface 11F connected to side surfaces 11A, 11B, mounting surface 11C, and facing surface 11D and opposite to surface 11E. The insulating layer 15 is provided on the mounting surface 11C, the opposite surface 11D, and the surfaces 11E, 11F of the sintered body 11 . Multilayer electronic component 1000 is configured to be mounted on mounted object 2001 by connecting lead terminals 17A, 17B to mounted object 2001 such as a circuit board.

以下说明层叠电子部件1000的制造方法。图2至图8是用于对层叠电子部件1000的制造方法进行说明的剖视图。A method for manufacturing the laminated electronic component 1000 will be described below. 2 to 8 are cross-sectional views illustrating a method of manufacturing the laminated electronic component 1000 .

将向氧化锌添加氧化铋等并将增塑剂、粘合剂等混合而得到的混合材料成形为片状,从而形成多个生片122。向银粉混合粘合剂等从而形成内部电极用糊膏112。在多个生片122印刷内部电极用糊膏112并层叠为生片122与内部电极用糊膏112交替排列后,通过单片化来形成图2所示的多个层叠体111。通过以约900℃烧制多个层叠体111从而得到多个烧结体11。此时,生片122与内部电极用糊膏112同时被烧制并分别成为绝缘层22和内部电极12A、12B。通过使多个烧结体11与研磨剂混合并搅拌来进行倒角,从而进行烧结体11的角部的倒角,并且使内部电极12A、12B分别在烧结体11的相互相反侧的侧面11A、11B露出。由此,可得到图2所示的烧结体11。内部电极12A在侧面11B不露出,内部电极12B在侧面11A不露出。烧结体11的大小为宽度约7mm、长度约9mm、高度约3mm。A mixed material obtained by adding bismuth oxide or the like to zinc oxide and mixing a plasticizer, a binder, and the like is formed into a sheet to form a plurality of green sheets 122 . A binder or the like is mixed with the silver powder to form the paste 112 for internal electrodes. After printing the internal electrode paste 112 on the plurality of green sheets 122 and stacking the green sheets 122 and the internal electrode paste 112 alternately, the plurality of laminated bodies 111 shown in FIG. 2 are formed by singulation. A plurality of sintered bodies 11 are obtained by firing a plurality of laminated bodies 111 at about 900°C. At this time, green sheet 122 is fired simultaneously with internal electrode paste 112 to form insulating layer 22 and internal electrodes 12A and 12B, respectively. The chamfering of the corners of the sintered bodies 11 is performed by mixing and stirring a plurality of sintered bodies 11 with abrasives, and the internal electrodes 12A, 12B are formed on the opposite sides of the sintered body 11 , respectively. 11B is exposed. Thereby, the sintered compact 11 shown in FIG. 2 can be obtained. The internal electrode 12A is not exposed on the side surface 11B, and the internal electrode 12B is not exposed on the side surface 11A. The size of the sintered body 11 is about 7 mm in width, about 9 mm in length, and about 3 mm in height.

准备在银粉混合粘合剂等而得到的导体糊膏。接下来,使多个烧结体11排列以使得内部电极12A露出的侧面11A对齐并且内部电极12B露出的侧面11B对齐,在烧结体11的侧面11A、11B印刷导体糊膏以使得分别覆盖露出的内部电极12A、12B,通过以约800℃进行烧制来形成外部电极13A、13B从而得到中间部件1001。此时,由于在从侧面11A、11B露出的内部电极12A、12B将外部电极13A、13B形成为直接接触,因此能够使内部电极12A、12B与外部电极13A、13B的电连接稳定。外部电极13A、13B的厚度约为20μm。被内部电极12A、12B彼此夹着的绝缘层22的区域决定层叠电子部件1000的电特性。由于外部电极13A、13B使用使银粉与粘合剂等混合的导体糊膏,能够防止作为导体的银粉以外的电介质等影响层叠电子部件1000的电特性的额外的物质向该区域扩散,能够使电特性稳定化。A conductor paste obtained by mixing a binder or the like with silver powder is prepared. Next, a plurality of sintered bodies 11 are arranged so that the exposed side surfaces 11A of the internal electrodes 12A are aligned and the exposed side surfaces 11B of the internal electrodes 12B are aligned, and conductor paste is printed on the side surfaces 11A, 11B of the sintered bodies 11 so as to cover the exposed insides, respectively. The electrodes 12A and 12B are fired at about 800° C. to form the external electrodes 13A and 13B to obtain the intermediate member 1001 . At this time, since external electrodes 13A, 13B are formed in direct contact with internal electrodes 12A, 12B exposed from side surfaces 11A, 11B, electrical connection between internal electrodes 12A, 12B and external electrodes 13A, 13B can be stabilized. The thickness of the external electrodes 13A, 13B is about 20 μm. The region of insulating layer 22 sandwiched between internal electrodes 12A and 12B determines the electrical characteristics of laminated electronic component 1000 . Since the external electrodes 13A and 13B use a conductor paste in which silver powder is mixed with a binder, etc., it is possible to prevent extra substances that affect the electrical characteristics of the laminated electronic component 1000 from diffusing to the area, such as dielectrics other than the silver powder that are conductors, and to make the electrical Characteristic stabilization.

如图4所示,准备例如由亚微米尺寸的二氧化硅粉末502和二氧化硅粉末502分散的介质液503构成的二氧化硅粉末502的悬浊液即玻璃涂层用的涂层液501。接下来,如图4所示,将形成有外部电极13A、13B的烧结体11即中间部件1001浸渍于涂层液501,对中间部件1001整体进行玻璃涂层。此时,在外部电极13A、13B的表面和烧结体11的表面11C~11F(参照图1A和图1B)附着有二氧化硅粉末502。之后,通过以约900℃对整体被玻璃涂层的中间部件1001进行热处理,从而形成图5所示的中间部件1002。在烧结体11的氧化锌的坯体即表面11C~11F附着的二氧化硅粉末502与绝缘层22的氧化锌的锌进行反应,在烧结体11的表面11C~11F的整体形成稳定的绝缘层15。通过将这样的稳定的绝缘层15形成于外部电极13A、13B以外的从外部电极13A、13B露出的表面11C~11F的整体,能够得到可靠性优良的层叠电子部件1000。在图5所示的中间部件1002中,在外部电极13A、13B的表面附着二氧化硅并分别形成二氧化硅层51A、51B。As shown in FIG. 4 , for example, a suspension of silica powder 502 composed of submicron-sized silica powder 502 and a medium solution 503 in which the silica powder 502 is dispersed is prepared, that is, a coating liquid 501 for glass coating. . Next, as shown in FIG. 4 , intermediate member 1001 , which is sintered body 11 on which external electrodes 13A, 13B were formed, is immersed in coating liquid 501 to perform glass coating on the entire intermediate member 1001 . At this time, silica powder 502 adheres to the surfaces of external electrodes 13A, 13B and surfaces 11C to 11F of sintered body 11 (see FIGS. 1A and 1B ). Thereafter, the intermediate member 1002 shown in FIG. 5 is formed by heat-treating the entirety of the glass-coated intermediate member 1001 at about 900°C. The silicon dioxide powder 502 attached to the surfaces 11C to 11F of the green body of zinc oxide of the sintered body 11 reacts with the zinc of the zinc oxide of the insulating layer 22 to form a stable insulating layer on the entire surfaces 11C to 11F of the sintered body 11 15. By forming such a stable insulating layer 15 on the entire surfaces 11C to 11F exposed from the external electrodes 13A and 13B other than the external electrodes 13A and 13B, a highly reliable laminated electronic component 1000 can be obtained. In intermediate member 1002 shown in FIG. 5 , silicon dioxide is attached to the surfaces of external electrodes 13A and 13B to form silicon dioxide layers 51A and 51B, respectively.

准备在银粉和玻璃料中混合粘合剂等而得到的混合糊膏。接下来,使多个烧结体11即中间部件1002排列以使得形成有外部电极13A的侧面对齐并且形成有外部电极13B的侧面对齐,在外部电极13A、13B涂敷混合糊膏以使得按照外部电极13A、13B不露出的方式完全覆盖外部电极13A、13B,通过以约700℃进行烧制从而形成图6所示的外部电极14A、14B。外部电极14A、14B具有比外部电极13A、13B大的面积,分别包围外部电极13A、13B的周围。此时,在外部电极13A、13B的表面附着的二氧化硅层51A、51B的二氧化硅的一部分向混合糊膏即外部电极14A、14B中的玻璃料扩散。由此,外部电极13A、13B与外部电极14A、14B可靠地电连接。作为涂敷混合糊膏的方法,优选使用印刷工艺,但也可以使用浸入工艺。但是,即使在该情况下也优选仅涂敷于中间部件1002的几乎侧面。由于为了形成外部电极14A、14B而使用加入有玻璃料的银糊膏,因此外部电极14A、14B能够以充分的强度固定于外部电极13A、13B以及烧结体11。A mixed paste obtained by mixing a binder and the like with silver powder and glass frit is prepared. Next, a plurality of sintered bodies 11, that is, the intermediate member 1002 is arranged so that the sides on which the external electrodes 13A are formed are aligned and the sides on which the external electrodes 13B are formed are aligned, and a mixed paste is applied to the external electrodes 13A and 13B so that External electrodes 13A and 13B are completely covered so that 13A and 13B are not exposed, and fired at about 700° C. to form external electrodes 14A and 14B shown in FIG. 6 . External electrodes 14A, 14B have larger areas than external electrodes 13A, 13B, and surround external electrodes 13A, 13B, respectively. At this time, part of the silicon dioxide in the silicon dioxide layers 51A and 51B attached to the surfaces of the external electrodes 13A and 13B diffuses into the mixed paste, that is, the glass frit in the external electrodes 14A and 14B. Thereby, external electrodes 13A, 13B and external electrodes 14A, 14B are reliably electrically connected. As a method of applying the mixed paste, a printing process is preferably used, but a dipping process may also be used. However, even in this case, it is preferable to apply only to almost the sides of the intermediate member 1002 . Since the silver paste containing glass frit is used to form external electrodes 14A, 14B, external electrodes 14A, 14B can be fixed to external electrodes 13A, 13B and sintered body 11 with sufficient strength.

接下来,通过电镀,在外部电极14A、14B上分别形成镀敷层16A、16B从而形成图7所示的单独部件1003。镀敷层16A(16B)具有:包含形成在外部电极14A(14B)上的镀镍层和形成在镀镍层上的镀锡层的双层构造。在实施方式中,镀镍层的厚度约为3μm,镀锡层的厚度约为5μm。Next, by electroplating, plating layers 16A, 16B are respectively formed on the external electrodes 14A, 14B to form the individual member 1003 shown in FIG. 7 . The plating layer 16A ( 16B) has a two-layer structure including a nickel plating layer formed on the external electrode 14A ( 14B) and a tin plating layer formed on the nickel plating layer. In an embodiment, the thickness of the nickel plating layer is about 3 μm, and the thickness of the tin plating layer is about 5 μm.

将铁或者磷青铜的板穿孔为规定的形状后,折弯为L字状从而准备导线端子17A、17B。在导线端子17A、17B形成镍以及锡的镀敷层,在与外部电极14A、14B抵接的区域,通过焊料等的接合材料来分别设置接合层18A、18B。接下来,如图8所示,在镀敷层16A、16B即外部电极14A、14B分别连接导线端子17A、17B。使导线端子17A、17B抵接于外部电极14A、14B和接合层18A、18B,通过激光等进行加热来将接合层18A、18B的焊料熔融,在外部电极14A、14B连接导线端子17A、17B,从而能够得到附带导线端子的层叠电子部件1000。通过印刷来形成外部电极13A、13B和外部电极14A、14B,从而能够使与导线端子17A、17B相接的外部电极14A、14B(镀敷层16A、16B)的表面平坦,能够将接合层18A、18B沿着导线端子17A、17B从烧结体11的侧面11A、11B超过安装面11C并向安装物2001扩展。通过这样构成,能够分散从导线端子17A、17B侧的应力,能够进一步提高层叠电子部件1000的可靠性。Lead terminals 17A and 17B are prepared by punching an iron or phosphor bronze plate into a predetermined shape and bending it into an L-shape. Plated layers of nickel and tin are formed on the lead terminals 17A, 17B, and bonding layers 18A, 18B are respectively provided with a bonding material such as solder in areas that are in contact with the external electrodes 14A, 14B. Next, as shown in FIG. 8 , lead terminals 17A, 17B are connected to plating layers 16A, 16B, that is, external electrodes 14A, 14B, respectively. The lead terminals 17A, 17B are brought into contact with the external electrodes 14A, 14B and the bonding layers 18A, 18B, heated by laser or the like to melt the solder of the bonding layers 18A, 18B, and the lead terminals 17A, 17B are connected to the external electrodes 14A, 14B. Thereby, the laminated electronic component 1000 with a lead terminal can be obtained. External electrodes 13A, 13B and external electrodes 14A, 14B are formed by printing, so that the surfaces of external electrodes 14A, 14B (plating layers 16A, 16B) in contact with lead terminals 17A, 17B can be flattened, and bonding layer 18A can be formed. , 18B extend from the side surfaces 11A, 11B of the sintered body 11 beyond the mounting surface 11C along the lead terminals 17A, 17B to the mounting object 2001 . With such a configuration, the stress from the lead terminals 17A, 17B side can be dispersed, and the reliability of the multilayer electronic component 1000 can be further improved.

图7和图8所示的单独部件1003具有:在层叠电子部件1000被安装于电路基板等的安装物2001(参照图1B)时与安装物2001对置的安装面53C、和与安装面53C相反的一侧的对面53D。在将导线端子17A、17B与外部电极14A、14B连接的情况下,配置为将单独部件1003的对面53D设为下方并与基准面54抵接,使导线端子17A、17B的端部117A、117B与基准面54抵接并与对面53D对位的状态下将导线端子17A、17B与外部电极14A、14B连接。通过上述方法而形成的外部电极14A、14B能够几乎不附于单独部件1003的对面53D。因此通过上述的对位,能够使导线端子17A、17B的安装位置稳定,能够容易将层叠电子部件1000高精度地安装于安装物2001,能够提高安装性。Individual component 1003 shown in FIGS. 7 and 8 has mounting surface 53C facing mounting object 2001 when laminated electronic component 1000 is mounted on mounting object 2001 (see FIG. 1B ) such as a circuit board, and mounting surface 53C. The opposite side is across from 53D. When the lead terminals 17A, 17B are connected to the external electrodes 14A, 14B, they are arranged so that the opposite surface 53D of the separate member 1003 is set downward and abuts against the reference surface 54, so that the ends 117A, 117B of the lead terminals 17A, 17B The lead terminals 17A, 17B are connected to the external electrodes 14A, 14B in a state of being in contact with the reference surface 54 and aligned with the opposing surface 53D. The external electrodes 14A, 14B formed by the method described above can hardly be attached to the opposite surface 53D of the individual member 1003 . Therefore, the mounting positions of the lead terminals 17A and 17B can be stabilized by the alignment described above, and the multilayer electronic component 1000 can be easily mounted on the mounted object 2001 with high precision, thereby improving mountability.

在上述的现有的电子部件中,若在安装导线端子时产生位置偏移,则在安装于电路基板时产生以下的问题。现有的附带导线端子的面安装的电子部件在通常的面安装用的部件安装导线端子,在这些电子部件中为了安装于电路基板,通过浸入(dip)等的方法来在电子部件的安装面形成电极。因此,在安装面以外,在上表面、侧面等的电子部件的其他面也形成电极。若以该电子部件的外形为基准来安装导线端子,则根据电极的厚度差别,可能产生位置偏移。In the above-mentioned conventional electronic component, if a positional displacement occurs when the lead terminal is mounted, the following problems arise when it is mounted on a circuit board. The existing surface-mounted electronic components with lead terminals are mounted with lead terminals on the components used for surface mounting. In these electronic components, in order to be mounted on the circuit board, the mounting surface of the electronic components is dipped by dipping or the like. Form the electrodes. Therefore, electrodes are also formed on other surfaces of the electronic component, such as the upper surface and the side surface, in addition to the mounting surface. If the lead terminal is mounted based on the outer shape of the electronic component, a positional shift may occur due to a difference in thickness of the electrodes.

实施方式中的层叠电子部件1000如上述那样,能够高精度地容易地安装于安装物2001,能够提高安装性。As described above, the multilayer electronic component 1000 in the embodiment can be easily mounted on the mounting object 2001 with high precision, and the mountability can be improved.

在对导线端子17A、17B进行定位时,单独部件1003之中在安装面53C的相反侧使距安装面53C最远的部分与基准面54抵接。在图8所示的单独部件1003中,镀敷层16A、16B与基准面54抵接。在实施方式中,为了可靠地抑制烧结体11的差别所导致的导线端子17A、17B的位置的差别,优选相比于外部电极14A、14B,绝缘层15在安装面53C的相反侧远离于安装面53C。When positioning the lead terminals 17A and 17B, the part of the individual member 1003 that is farthest from the mounting surface 53C on the opposite side to the mounting surface 53C comes into contact with the reference surface 54 . In the individual component 1003 shown in FIG. 8 , the plating layers 16A, 16B are in contact with the reference plane 54 . In the embodiment, in order to reliably suppress the difference in the position of the lead terminals 17A, 17B caused by the difference in the sintered body 11, it is preferable that the insulating layer 15 is farther away from the mounting surface 53C than the external electrodes 14A, 14B. Surface 53C.

-符号说明--Symbol Description-

11 烧结体11 Sintered body

12A、12B 内部电极12A, 12B Internal electrodes

13A、13B 外部电极(第1外部电极)13A, 13B External electrodes (1st external electrodes)

14A、14B 外部电极(第2外部电极)14A, 14B External electrode (2nd external electrode)

15 绝缘层15 insulation

16A、16B 镀敷层16A, 16B plating layer

17A、17B 导线端子17A, 17B wire terminals

18A、18B 接合层18A, 18B bonding layer

Claims (9)

1.一种层叠电子部件的制造方法,包含:1. A method of manufacturing a laminated electronic component, comprising: 准备具备被交替层叠的陶瓷层和内部电极并且具有所述内部电极露出的侧面的层叠体的步骤;A step of preparing a laminate having alternately stacked ceramic layers and internal electrodes and having a side surface where the internal electrodes are exposed; 对所述层叠体进行烧制,得到具有所述内部电极露出的侧面的烧结体的步骤;The step of firing the laminated body to obtain a sintered body having a side surface where the internal electrodes are exposed; 在所述烧结体的所述侧面形成与所述内部电极连接的第1外部电极的步骤;a step of forming a first external electrode connected to the internal electrode on the side surface of the sintered body; 通过对具有所形成的所述第1外部电极的所述烧结体整体进行玻璃涂层,从而将绝缘层形成于所述烧结体的所述第1外部电极以外的表面的整体的步骤;A step of forming an insulating layer on the entire surface of the sintered body other than the first external electrode by glass-coating the entirety of the sintered body having the formed first external electrode; 在所述第1外部电极上形成第2外部电极,从而获得具备所述烧结体、所述绝缘层、所述第1外部电极和所述第2外部电极的单独部件的步骤;和forming a second external electrode on the first external electrode to obtain a single component including the sintered body, the insulating layer, the first external electrode, and the second external electrode; and 在所述第2外部电极经由接合层而连接板状的导线端子的步骤,In the step of connecting the second external electrode to a plate-shaped lead terminal via a bonding layer, 所述单独部件具有在所述层叠电子部件被安装于安装物的状态下与所述安装物对置的安装面,The individual component has a mounting surface facing the mounting object in a state where the laminated electronic component is mounted on the mounting object, 在所述层叠电子部件被安装于安装物的状态下,所述接合层从所述第2外部电极沿着所述导线端子超过所述安装面来扩展。In a state where the multilayer electronic component is mounted on an object, the bonding layer extends from the second external electrode along the lead terminal beyond the mounting surface. 2.根据权利要求1所述的层叠电子部件的制造方法,其中,2. The method of manufacturing a laminated electronic component according to claim 1, wherein: 形成所述第1外部电极的所述步骤包含:通过印刷工艺在所述烧结体的所述侧面形成所述第1外部电极的步骤。The step of forming the first external electrode includes the step of forming the first external electrode on the side surface of the sintered body by a printing process. 3.根据权利要求2所述的层叠电子部件的制造方法,其中,3. The method of manufacturing a laminated electronic component according to claim 2, wherein: 形成所述第2外部电极的所述步骤包含:通过印刷工艺在所述第1外部电极上形成所述第2外部电极的步骤。The step of forming the second external electrode includes the step of forming the second external electrode on the first external electrode by a printing process. 4.根据权利要求1所述的层叠电子部件的制造方法,其中,4. The method of manufacturing a laminated electronic component according to claim 1, wherein: 形成所述第1外部电极的所述步骤包含:在所述烧结体的所述侧面涂敷含有银的导体糊膏的步骤,The step of forming the first external electrode includes the step of applying a conductor paste containing silver to the side surface of the sintered body, 形成所述第2外部电极的所述步骤包含:将含有银和玻璃料的混合糊膏涂敷于所述第1外部电极的步骤。The step of forming the second external electrode includes the step of applying a mixed paste containing silver and glass frit to the first external electrode. 5.根据权利要求4所述的层叠电子部件的制造方法,其中,5. The method of manufacturing a laminated electronic component according to claim 4, wherein: 形成所述第2外部电极的所述步骤还包含:对涂敷于所述第1外部电极的所述混合糊膏进行烧制的步骤。The step of forming the second external electrode further includes the step of firing the mixed paste applied to the first external electrode. 6.根据权利要求4所述的层叠电子部件的制造方法,其中,6. The method of manufacturing a laminated electronic component according to claim 4, wherein: 形成所述绝缘层的所述步骤包含:将具有所形成的所述第1外部电极的所述烧结体浸渍于二氧化硅粉末的悬浊液来进行所述玻璃涂层,从而形成所述绝缘层以使得二氧化硅残留于所述第1外部电极的表面的步骤,The step of forming the insulating layer includes immersing the sintered body having the formed first external electrode in a suspension of silica powder to coat the glass, thereby forming the insulating layer. layer such that silicon dioxide remains on the surface of the first external electrode, 形成所述第2外部电极的所述步骤包含:在所述第1外部电极的残留二氧化硅的所述表面涂敷所述混合糊膏的步骤。The step of forming the second external electrode includes the step of applying the mixed paste on the surface of the remaining silicon dioxide of the first external electrode. 7.根据权利要求4所述的层叠电子部件的制造方法,其中,7. The method of manufacturing a laminated electronic component according to claim 4, wherein: 形成所述第1外部电极的所述步骤还包含:对所涂敷的所述导体糊膏进行烧制的步骤。The step of forming the first external electrodes further includes the step of firing the applied conductive paste. 8.根据权利要求1所述的层叠电子部件的制造方法,其中,8. The method of manufacturing a laminated electronic component according to claim 1, wherein: 还包含在所述第2外部电极连接导线端子的步骤。It also includes the step of connecting a lead terminal to the second external electrode. 9.根据权利要求8所述的层叠电子部件的制造方法,其中,9. The method of manufacturing a laminated electronic component according to claim 8, wherein: 形成所述第2外部电极的所述步骤包含:获得具备所述烧结体、所述绝缘层、所述第1外部电极和所述第2外部电极的单独部件的步骤,The step of forming the second external electrode includes the step of obtaining a single member including the sintered body, the insulating layer, the first external electrode, and the second external electrode, 所述单独部件具有:在所述层叠电子部件被安装于安装物时与所述安装物对置的安装面、和所述安装面的相反侧的对面,The individual component has a mounting surface that faces the mounting object when the laminated electronic component is mounted on the mounting object, and a surface opposite to the mounting surface, 在所述第2外部电极连接所述导线端子的步骤包含:The step of connecting the lead terminal to the second external electrode includes: 通过将所述单独部件的所述对面与所述导线端子的端部对位来将所述导线端子定位的步骤;和the step of positioning said wire terminal by aligning said opposite face of said separate component with an end of said wire terminal; and 将所定位的所述导线端子与所述第2外部电极连接的步骤。A step of connecting the positioned lead terminal to the second external electrode.
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