CN110932050A - Investment pattern device and using method - Google Patents
Investment pattern device and using method Download PDFInfo
- Publication number
- CN110932050A CN110932050A CN201911119646.0A CN201911119646A CN110932050A CN 110932050 A CN110932050 A CN 110932050A CN 201911119646 A CN201911119646 A CN 201911119646A CN 110932050 A CN110932050 A CN 110932050A
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- Prior art keywords
- module
- solder
- cable
- containing cavity
- cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/03—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the relationship between the connecting locations
- H01R11/09—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the relationship between the connecting locations the connecting locations being identical
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0249—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for simultaneous welding or soldering of a plurality of wires to contact elements
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
The invention relates to the technical field of cable connecting devices, and particularly discloses a melting mold device and a using method thereof, wherein the melting mold device comprises a first module and a second module matched with the first module for use, and the first module and the second module are surrounded to form a material containing cavity; the first module or/and the second module are/is provided with a first wire accommodating hole and a second wire accommodating hole which are used for accommodating a first cable and a second cable respectively; the first module or/and the second module is/are provided with an ignition assembly; during the use, pack into first appearance line hole, second appearance line hole with first cable, second cable respectively, to holding the material intracavity and adding the solder, the conducting connection department of first cable, second cable is arranged in the solder, ignites the subassembly and ignites the solder that holds the material intracavity, and the solder after the burning forms the soldering liquid, and the conducting connection department of two cables of cladding promotes the encapsulation connection efficiency of two cables after the soldering liquid cools off.
Description
Technical Field
The invention relates to the technical field of cable connecting devices, and particularly discloses a melting mold device and a using method thereof.
Background
Electric power is one of indispensable energy in the life at present, and in the construction process of power equipment, often need to lead the wire conductively of two cables and connect together, then cover the conductive connection department of two cables, prevent that the conductive connection department of two cables from breaking away from each other and separating. In the prior art, a protective layer is manually coated at the conduction connection part of the two cables by an operator, and then the protective layer is manually and fixedly connected to the outer sides of the two cables, so that the efficiency is extremely low.
Disclosure of Invention
In order to overcome the defects and shortcomings in the prior art, the invention aims to provide the investment device and the using method thereof.
In order to achieve the purpose, the investment pattern device comprises a first module and a second module matched with the first module, wherein the first module and the second module are surrounded to form a material containing cavity, and the material containing cavity is used for containing external welding flux; the first module or/and the second module are/is provided with a first wire accommodating hole and a second wire accommodating hole which are respectively communicated with the material accommodating cavity, the first wire accommodating hole and the second wire accommodating hole are used for accommodating a first cable and a second cable respectively, and the conduction connection position of the first cable and the second cable is positioned in the material accommodating cavity; the first module or/and the second module is/are provided with an ignition assembly for igniting the solder in the volume chamber.
Preferably, the ignition assembly is a spark plug, the spark plug is conducted with an external power supply, and the head of the spark plug protrudes into the material containing cavity.
Preferably, the melting mold device further comprises a first driving member, the spark plug is movably arranged on the first module or/and the second module, and the first driving member is used for driving the spark plug to enter or exit the material containing cavity.
Preferably, the first module or/and the second module is/are provided with two cooling assemblies, the two cooling assemblies are respectively used for cooling the first cable and the second cable, and the cooling assemblies are used for absorbing heat generated by solder combustion and transferred along the length direction of the cables.
Preferably, the ignition assembly comprises a first discharge needle and a second discharge needle which are arranged on the first module or/and the second module, the first discharge needle and the second discharge needle are respectively communicated with an anode of an external power supply and a cathode of the power supply, and electric sparks generated by discharge of the first discharge needle and the second discharge needle are used for igniting the solder in the material containing cavity.
Preferably, the melting mold device further comprises a second driving piece, the first discharge needles and the second discharge needles are movably arranged in the first module or/and the second module, and the second driving piece is used for driving the first discharge needles and the second discharge needles to enter and exit the material containing cavity.
In order to achieve the purpose, the use method of the investment device of the invention,
providing a melting mold device;
arranging two cables on a melting mold device, wherein the conduction connection position of the two cables is positioned in a material containing cavity of the melting mold device;
powder-shaped solder is filled into a material containing cavity of the investment device, and the conduction connection part of the two cables is positioned in the solder;
and igniting the solder in the material containing cavity of the investment device, forming soldering liquid by the burnt solder, and coating the conducting connection part of the two cables after the soldering liquid is cooled.
The invention has the beneficial effects that: during the use, pack into first appearance line hole, second appearance line hole with first cable, second cable respectively, to holding the material intracavity and adding the solder, the conducting connection department of first cable, second cable is arranged in the solder, ignites the subassembly and ignites the solder that holds the material intracavity, and the solder after the burning forms the soldering liquid, and the conducting connection department of two cables of cladding promotes the encapsulation connection efficiency of two cables after the soldering liquid cools off.
Drawings
Fig. 1 is a schematic perspective view of a first embodiment of the present invention;
fig. 2 is a schematic perspective view of a second embodiment of the present invention.
The reference numerals include:
1-first module 2-second module 3-holding cavity
4-first wire holding hole 5-second wire holding hole 6-spark plug
7-cooling component 8-first discharge needle 9-second discharge needle.
Detailed Description
For the understanding of those skilled in the art, the present invention will be further described with reference to the following examples and drawings, which are not intended to limit the present invention.
Example one
Referring to fig. 1, the investment pattern device of the present invention includes a first module 1 and a second module 2 used in cooperation with the first module 1, the first module 1 and the first module 1 are detachably connected together, the first module 1 and the second module 2 are both made of copper alloy, preferably, gripping rings (not shown in the figure) are disposed on the left and right sides of the first module 1 and the left and right sides of the second module 2, and a user can grip the gripping rings with hands to move the first module 1 or the second module 2 as required, the first module 1 and the second module 2 are enclosed to form a material containing cavity 3, the material containing cavity 3 is used for containing external solder, the first module 1 or/and the second module 2 are provided with a feeding hole (not shown in the figure) communicated with the material containing cavity 3, the solder is added into the material containing cavity 3 through the feeding hole, and the solder is in a powder shape; the first module 1 or/and the second module 2 are/is provided with a first wire accommodating hole 4 and a second wire accommodating hole 5, the first wire accommodating hole 4 and the second wire accommodating hole 5 are respectively communicated with the material accommodating cavity 3, the first wire accommodating hole 4 and the second wire accommodating hole 5 are used for accommodating a first wire and a second wire respectively, the conduction connection part of the first wire and the second wire is positioned in the material accommodating cavity 3, and after powdered solder is loaded into the material accommodating cavity 3, the conduction connection part of the first wire and the second wire is positioned in the solder in the material accommodating cavity 3; and an ignition assembly is arranged on the first module 1 or/and the second module 2 and is used for igniting the solder in the material containing cavity 3, so that the solder is combusted and melted into the soldering liquid.
When the cable is actually used, the first cable and the second cable are respectively arranged in the first accommodating hole 4 and the second accommodating hole 5, then the first cable and the second cable are connected in a conduction mode, the first module 1 and the second module 2 are packaged together, powdery solder is added into the accommodating cavity 3, the solder is formed by mixing gunpowder and solder powder, the conduction connection position of the first cable and the second cable is located in the solder, the solder in the accommodating cavity 3 is ignited by the ignition assembly, the heat is released when the gunpowder is combusted, the solder powder is melted by the heat released when the gunpowder is combusted, the combusted solder forms solder liquid, the combusted solder liquid forms solder liquid, the conductive connection position of the two cables is coated after the solder liquid is cooled, automatic coating packaging of the conduction connection position of the first cable and the second cable is realized, and manual coating of an operator is not needed for packaging the conduction connection position of the two cables, the packaging connection efficiency of the two cables is improved.
The ignition component is a spark plug 6, the spark plug 6 is conducted with an external power supply, the head of the spark plug 6 protrudes into the material containing cavity 3, after the material containing cavity 3 is filled with solder, the power supply is started, and the solder in the material containing cavity 3 is ignited by utilizing sparks released by the head of the spark plug 6, so that the solder is burnt.
The melting mold device further comprises a first driving member (not shown in the figure), the spark plug 6 is movably arranged on the first module 1 or/and the second module 2, according to actual needs, the spark plug 6 can be slidably arranged on the first module 1 or/and the second module 2 or can be rotatably arranged on the first module 1 or/and the second module 2, the first driving member is used for driving the spark plug 6 to enter and exit the material containing cavity 3, and the first driving member can be an air cylinder, an electric cylinder or an oil cylinder and the like. After the spark plug 6 ignites the solder in the container cavity 3, the first driving piece drives the spark plug 6 to exit the container cavity 3, so that the influence of the burnt solder on the spark plug 6 is reduced, and the service life of the spark plug 6 is prolonged in an auxiliary mode.
Preferably, the cooling module 7 is further provided with a plurality of heat dissipation fins (not shown), which are formed by protruding from the outer surface of the cooling module 7, and the heat dissipation fins are used for increasing the contact area between the cooling module 12 and the outside air, and assisting in increasing the heat dissipation efficiency of the cooling module 7.
The invention relates to a method for using a fusible pattern device,
providing a melting mold device;
arranging two cables on a melting mold device, wherein the conduction connection position of the two cables is positioned in a material containing cavity 3 of the melting mold device;
powder-shaped solder is filled into a material containing cavity 3 of the investment device, and the conduction connection position of the two cables is positioned in the solder;
the welding flux in the material containing cavity 3 of the investment device is ignited, the welding flux after combustion forms welding liquid, the welding liquid is cooled to coat the conduction connection parts of the two cables, automatic coating packaging of the conduction connection parts of the two cables is achieved, the conduction connection parts of the two cables are packaged without manual coating of an operator, and packaging connection efficiency of the two cables is improved.
The solder comprises 65-75 mass percent: 1, the welding powder comprises the following components in parts by weight: 210 portions of lead 180-plus material, 90-100 portions of tin, 4-8 portions of silver, 2-5 portions of nickel, 2-4 portions of copper, 0.1-0.8 portion of indium, 0.01-0.02 portion of scandium, 0.3-0.9 portion of germanium, 0.2-0.8 portion of lanthanum, 0.05-0.1 portion of chromium and 1-4 portions of zinc; the gunpowder comprises the following components in parts by weight: 30-40 parts of copper oxide powder, 2-4 parts of copper powder, 10-20 parts of calcium sulfate, 15-20 parts of aluminum powder, 6-12 parts of magnesium powder, 6-10 parts of red phosphorus powder and 4-8 parts of potassium permanganate powder.
Preferably, the welding powder comprises the following components in parts by weight: 190 parts of lead, 95 parts of tin, 6 parts of silver, 4 parts of nickel, 3 parts of copper, 0.5 part of indium, 0.015 part of scandium, 0.6 part of germanium, 0.2-0.8 part of lanthanum, 0.06 part of chromium and 2 parts of zinc.
Preferably, the gunpowder comprises the following components in parts by weight: 36 parts of copper oxide powder, 2.5 parts of copper powder, 13 parts of calcium sulfate, 15 parts of aluminum powder, 7 parts of magnesium powder, 8 parts of red phosphorus powder and 5 parts of potassium permanganate powder.
Example two
Referring to fig. 2, the ignition assembly includes a first discharge needle 8 and a second discharge needle 9 disposed on the first module 1 or/and the second module 2, the first discharge needle 8 and the second discharge needle 9 are respectively connected to an anode of an external power source and a cathode of the power source, and electric sparks generated by discharge of the first discharge needle 8 and the second discharge needle 9 are used for igniting solder in the material accommodating cavity 3. After the solder is filled in the material containing cavity 3, the power supply is started, the spark is generated by the point discharge between the first discharge needle 8 and the second discharge needle 9, and the solder in the material containing cavity 3 is ignited by the spark, so that the solder is burnt.
The melting mold device further comprises a second driving piece (not shown in the figure), the first discharge needle 8 and the second discharge needle 9 are movably arranged on the first module 1 or/and the second module 2, according to actual needs, the first discharge needle 8 and the second discharge needle 9 can be slidably arranged on the first module 1 or/and the second module 2 or can be rotatably arranged on the first module 1 or/and the second module 2, the second driving piece is used for driving the first discharge needle 8 and the second discharge needle 9 to enter and exit the material containing cavity 3, and the second driving piece can be an air cylinder, an electric cylinder or an oil cylinder; preferably, the number of the second driving members is two, and the two second driving members are used for respectively driving the first discharge needles 8 and the second discharge needles 9 to move.
The rest of this embodiment is the same as the first embodiment, and the unexplained features in this embodiment are explained by the first embodiment, which is not described herein again.
The above description is only a preferred embodiment of the present invention, and for those skilled in the art, the present invention should not be limited by the description of the present invention, which should be interpreted as a limitation.
Claims (7)
1. An investment device, which is characterized in that: the solder-containing device comprises a first module and a second module matched with the first module, wherein the first module and the second module are surrounded to form a material-containing cavity, and the material-containing cavity is used for containing external solder; the first module or/and the second module are/is provided with a first wire accommodating hole and a second wire accommodating hole which are respectively communicated with the material accommodating cavity, the first wire accommodating hole and the second wire accommodating hole are used for accommodating a first cable and a second cable respectively, and the conduction connection position of the first cable and the second cable is positioned in the material accommodating cavity; the first module or/and the second module is/are provided with an ignition assembly for igniting the solder in the volume chamber.
2. The investment device of claim 1, wherein: the ignition assembly is a spark plug, the spark plug is communicated with an external power supply, and the head of the spark plug protrudes into the material containing cavity.
3. The investment device of claim 2, wherein: the melting mold device further comprises a first driving piece, the spark plug is movably arranged on the first module or/and the second module, and the first driving piece is used for driving the spark plug to enter and exit the material containing cavity.
4. The investment device of claim 1, wherein: the first module or/and the second module are/is provided with two cooling assemblies, the two cooling assemblies are respectively used for cooling the first cable and the second cable, and the cooling assemblies are used for absorbing heat generated by solder combustion and transmitted along the length direction of the cables.
5. The investment device of claim 1, wherein: the ignition assembly comprises a first discharge needle and a second discharge needle which are arranged on the first module or/and the second module, the first discharge needle and the second discharge needle are respectively communicated with an anode of an external power supply and a cathode of the power supply, and electric sparks generated by the discharge of the first discharge needle and the second discharge needle are used for igniting the solder in the material containing cavity.
6. The investment device of claim 5, wherein: the melting mold device further comprises a second driving piece, the first discharge needles and the second discharge needles are movably arranged in the first module or/and the second module, and the second driving piece is used for driving the first discharge needles and the second discharge needles to enter and exit the material containing cavity.
7. The use method of the investment device is characterized in that:
providing a melting mold device;
arranging two cables on a melting mold device, wherein the conduction connection position of the two cables is positioned in a material containing cavity of the melting mold device;
powder-shaped solder is filled into a material containing cavity of the investment device, and the conduction connection part of the two cables is positioned in the solder;
and igniting the solder in the material containing cavity of the investment device, forming soldering liquid by the burnt solder, and coating the conducting connection part of the two cables after the soldering liquid is cooled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911119646.0A CN110932050A (en) | 2019-11-15 | 2019-11-15 | Investment pattern device and using method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911119646.0A CN110932050A (en) | 2019-11-15 | 2019-11-15 | Investment pattern device and using method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110932050A true CN110932050A (en) | 2020-03-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911119646.0A Pending CN110932050A (en) | 2019-11-15 | 2019-11-15 | Investment pattern device and using method |
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| CN (1) | CN110932050A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111864499A (en) * | 2020-07-28 | 2020-10-30 | 国网山东省电力公司寿光市供电公司 | Cable butt welding device and method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1379504A (en) * | 2001-03-30 | 2002-11-13 | 日本压着端子制造株式会社 | Electric connector of twisted cable using resin welding flux and electric wire connecting method |
| JP2013214734A (en) * | 2012-03-08 | 2013-10-17 | Sumitomo Electric Ind Ltd | Method of manufacturing multiconductor cable equipped with substrate |
| CN106848990A (en) * | 2017-01-13 | 2017-06-13 | 刘国晓 | A kind of docking calculation of 10kV twisted polyethylene cables |
| CN107104293A (en) * | 2017-04-26 | 2017-08-29 | 中国科学院合肥物质科学研究院 | Two low temperature superconducting cable terminal jointing components and preparation method thereof |
| CN209045235U (en) * | 2018-12-14 | 2019-06-28 | 上海三原电缆附件有限公司 | It is a kind of for weld big section aluminum conductor cable band Cooling fixture |
-
2019
- 2019-11-15 CN CN201911119646.0A patent/CN110932050A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1379504A (en) * | 2001-03-30 | 2002-11-13 | 日本压着端子制造株式会社 | Electric connector of twisted cable using resin welding flux and electric wire connecting method |
| JP2013214734A (en) * | 2012-03-08 | 2013-10-17 | Sumitomo Electric Ind Ltd | Method of manufacturing multiconductor cable equipped with substrate |
| CN106848990A (en) * | 2017-01-13 | 2017-06-13 | 刘国晓 | A kind of docking calculation of 10kV twisted polyethylene cables |
| CN107104293A (en) * | 2017-04-26 | 2017-08-29 | 中国科学院合肥物质科学研究院 | Two low temperature superconducting cable terminal jointing components and preparation method thereof |
| CN209045235U (en) * | 2018-12-14 | 2019-06-28 | 上海三原电缆附件有限公司 | It is a kind of for weld big section aluminum conductor cable band Cooling fixture |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111864499A (en) * | 2020-07-28 | 2020-10-30 | 国网山东省电力公司寿光市供电公司 | Cable butt welding device and method |
| CN111864499B (en) * | 2020-07-28 | 2022-01-25 | 国网山东省电力公司寿光市供电公司 | Cable butt welding device and method |
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Application publication date: 20200327 |
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