CN110926245A - Liquid metal heat exchange device - Google Patents
Liquid metal heat exchange device Download PDFInfo
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- CN110926245A CN110926245A CN201911244212.3A CN201911244212A CN110926245A CN 110926245 A CN110926245 A CN 110926245A CN 201911244212 A CN201911244212 A CN 201911244212A CN 110926245 A CN110926245 A CN 110926245A
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- liquid metal
- heat exchange
- cooling
- exchange device
- heat
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- 229910001338 liquidmetal Inorganic materials 0.000 title claims abstract description 131
- 238000001816 cooling Methods 0.000 claims abstract description 78
- 230000005684 electric field Effects 0.000 claims abstract description 10
- 239000002826 coolant Substances 0.000 claims description 32
- 238000012546 transfer Methods 0.000 claims description 28
- 239000007788 liquid Substances 0.000 claims description 15
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 7
- 229910000846 In alloy Inorganic materials 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 6
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052733 gallium Inorganic materials 0.000 claims description 4
- 229910000807 Ga alloy Inorganic materials 0.000 claims description 3
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 3
- 239000011553 magnetic fluid Substances 0.000 claims description 3
- 230000002572 peristaltic effect Effects 0.000 claims description 3
- 239000012266 salt solution Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 239000000110 cooling liquid Substances 0.000 abstract description 31
- 238000013461 design Methods 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000002699 waste material Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005685 electric field effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
- F28F19/01—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using means for separating solid materials from heat-exchange fluids, e.g. filters
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a liquid metal heat exchange device which comprises two heat exchange pipelines, wherein one end of the two heat exchange pipelines at the same side is communicated with a cooling pipeline, the other end of the two heat exchange pipelines at the same side is communicated with a heat exchange chip, at least one heat exchange pipeline in the two heat exchange pipelines is provided with a storage device for storing liquid metal cooling liquid, a current generator for generating an electric field is further arranged on the heat exchange pipeline provided with the storage device, a heat source is arranged on the heat exchange chip, and a cooling structure is arranged on the cooling pipeline. The liquid metal heat exchange device provided by the invention has the advantages of simple structure, compact design and relative independence of all components, and is convenient to maintain and overhaul; the liquid metal heat exchange device has good interchangeability, and can realize modularization, serialization and rapid design; the liquid metal heat exchange device has no special requirements on working environment, can adapt to various special environments, and has high heat exchange efficiency.
Description
Technical Field
The invention relates to the field of heat exchange devices, in particular to a liquid metal heat exchange device.
Background
Conventional high efficiency heat exchange apparatus comprises: plate heat exchanger, shell and tube heat exchanger, above-mentioned heat exchanger generally is liquid-liquid heat transfer equipment.
However, most of the existing liquid-liquid heat exchange equipment has the defects of large volume, complex processing and manufacturing process, difficult maintenance, low heat exchange efficiency and the like. Therefore, the heat exchange device which is simple to process and manufacture, small in size, easy to maintain and high in heat exchange efficiency is developed, and the heat exchange device has positive significance for the development of a cooling process of an easily-heating chip or equipment with large heating capacity.
Disclosure of Invention
The invention aims to provide a liquid metal heat exchange device, and aims to solve the problems of large volume, complex structure, difficult maintenance and low heat exchange efficiency of the conventional heat exchange equipment.
The technical scheme of the invention is as follows:
the utility model provides a liquid metal heat transfer device, wherein, includes two heat transfer pipelines, the homonymy one end and the cooling line intercommunication of two heat transfer pipelines, the homonymy other end and the heat transfer chip intercommunication of two heat transfer pipelines, it all is provided with the accumulator that is used for storing liquid metal coolant liquid to have at least one heat transfer pipeline in two heat transfer pipelines, still be provided with the current generator that is used for producing the electric field on the heat transfer pipeline that is provided with the accumulator, be provided with the heat source on the heat transfer chip, be provided with cooling structure on the cooling line.
The magnetofluid heat exchange device is characterized in that at least one of the two heat exchange pipelines is provided with a micropump.
The liquid metal micropump heat exchange device is characterized in that the micropump is one of a micro peristaltic pump, a micro plunger pump, a micro pressure pump or a micro gear pump.
The magnetic fluid heat exchange device is characterized in that the two heat exchange pipelines are respectively provided with the storage.
The liquid metal heat exchange device is characterized in that the liquid metal cooling liquid is pure liquid metal or a mixed liquid composed of the pure liquid metal and a conductive medium.
The liquid metal heat exchange device is characterized in that the pure liquid metal is one or more of gallium alloy, indium alloy, gallium-indium alloy and gallium-indium-tin alloy.
The liquid metal heat exchange device is characterized in that the conductive medium is one or more of conductive oil, salt solution and sodium hydroxide.
The liquid metal heat exchange device is characterized in that the cooling pipeline comprises a plurality of cooling sub-pipelines which are sequentially communicated and arranged in an S shape, and the cooling sub-pipelines are provided with the cooling structures.
The liquid metal heat exchange device is characterized in that the upper end and the lower end of the cooling sub-pipeline are respectively provided with the cooling structure.
The liquid metal heat exchange device comprises a cooling structure and a cooling sub-pipeline, wherein the cooling structure comprises an energy conduction block which is in direct contact with the cooling sub-pipeline, and a radiating fin arranged on the surface of the energy conduction block.
The liquid metal heat exchange device is characterized in that the cooling structure further comprises a semiconductor cooling chip arranged between the energy conduction block and the radiating fin.
The liquid metal heat exchange device, wherein, the accumulator is in including the chamber that holds that is used for storing the liquid metal coolant liquid, the setting is in hold the filter screen of intracavity, set up and be in hold the sealed lid on chamber top, and set up and be in hold liquid metal coolant liquid entry and the liquid metal coolant liquid export at chamber left and right sides both ends.
The liquid metal heat exchange device is characterized in that micro-nano internal flow channels which are arranged in an S shape are arranged in the heat exchange chip.
Has the advantages that: compared with the existing heat exchange equipment, the liquid metal heat exchange device provided by the invention has the advantages of simple structure, compact design and relative independence of all components, and is convenient to maintain and overhaul; the liquid metal heat exchange device has good interchangeability, and can realize modularization, serialization and rapid design; the liquid metal heat exchange device has no special requirements on working environment, can adapt to various special environments, and has high heat exchange efficiency.
Drawings
Fig. 1 is a schematic structural diagram of a liquid metal heat exchange device according to a first embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a liquid metal changing device according to a second embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a liquid metal heat exchange device according to a third embodiment of the present invention.
Fig. 4 is an exploded view of the cooling structure of the present invention.
Fig. 5 is a schematic structural diagram of a liquid metal heat exchange device according to a fourth embodiment of the present invention.
Fig. 6 is a schematic cross-sectional view of the reservoir of the present invention.
Fig. 7 is a schematic diagram of a quarter sectional structure of the heat exchange chip of the present invention.
FIG. 8 is an exploded view of the heat source, heat exchange chip and chip holder of the present invention.
Detailed Description
The invention provides a liquid metal heat exchange device, and the invention is further described in detail below in order to make the purpose, technical scheme and effect of the invention clearer and clearer. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a preferred embodiment of a liquid metal heat exchanging device provided in the present invention, as shown in the figure, the device includes two heat exchanging pipelines 10, one end of each of the two heat exchanging pipelines 10 at the same side is communicated with a cooling pipeline 20, the other end of each of the two heat exchanging pipelines 10 at the same side is communicated with a heat exchanging chip 30, one of the two heat exchanging pipelines 10 is provided with a reservoir 40 for storing liquid metal coolant, the heat exchanging pipeline 10 provided with the reservoir 40 is further provided with a current generator 11 for generating an electric field, the heat exchanging chip 30 is provided with a heat source 50, and the cooling pipeline 20 is provided with a cooling structure 60.
This embodiment regards liquid metal coolant as the heat exchange medium among the heat transfer process, through the electric field effect that current generator 11 produced can drive liquid metal coolant in the accumulator 40 flows for liquid metal coolant flows through heat transfer chip 30 and cooling line 20 and reciprocating cycle, liquid metal coolant absorbs when flowing through heat transfer chip 30 the heat that heat source 50 produced becomes high temperature liquid metal coolant, high temperature liquid metal coolant is when flowing through during the cooling line, the setting is in cooling structure on the cooling line can be right high temperature liquid metal coolant cools off to realize the convection heat transfer.
In this embodiment, the current direction generated by the current generator 11 is the same as the flowing direction of the liquid metal cooling liquid, and the current generated by the current generator 11 not only can effectively drive the liquid metal cooling liquid to flow in the channel, but also can effectively reduce the surface tension of the liquid metal cooling liquid and enhance the wetting characteristic thereof, thereby reducing the flowing resistance of the liquid metal cooling liquid.
The liquid metal heat exchange device provided by the embodiment has the advantages of simple structure, compact design and relative independence of all components, and is convenient to maintain and overhaul; the liquid metal heat exchange device has the characteristic of good interchangeability, and can realize modularization, serialization and rapid design; the liquid metal heat exchange device has no special requirements on working environment, can adapt to various special environments, and has high heat exchange efficiency.
In some embodiments, a liquid metal heat exchanging device is further provided, as shown in fig. 2, the liquid metal heat exchanging device includes two heat exchanging pipelines 10, one end of each of the two heat exchanging pipelines 10 on the same side is communicated with a cooling pipeline 20, the other end of each of the two heat exchanging pipelines 10 on the same side is communicated with a heat exchanging chip 30, a reservoir 40 for storing liquid metal coolant and a current generator 11 for generating an electric field are disposed on each of the two heat exchanging pipelines 10, a heat source 50 is disposed on the heat exchanging chip 30, and a cooling structure 60 is disposed on the cooling pipeline 20.
In this embodiment, each of the two heat exchange pipelines 10 is provided with a reservoir 40 for storing liquid metal coolant, and each of the two heat exchange pipelines 10 is correspondingly provided with a current generator 11 for generating an electric field. The liquid metal heat exchange device provided by the embodiment comprises two reservoirs 40 and two current generators 11, wherein the electric fields generated by the two current generators 11 can increase the flow speed of the liquid metal cooling liquid in the reservoirs, so that the heat exchange efficiency of the liquid metal cooling liquid is increased.
In some embodiments, a liquid metal heat exchanging device is further provided, as shown in fig. 3, the liquid metal heat exchanging device includes two heat exchanging pipelines 10, one end of each of the two heat exchanging pipelines 10 at the same side is communicated with a cooling pipeline 20, the other end of each of the two heat exchanging pipelines 10 at the same side is communicated with a heat exchanging chip 30, one of the two heat exchanging pipelines 10 is provided with a reservoir 40 for storing liquid metal coolant and a current generator 11 for generating an electric field, the other heat exchanging pipeline is provided with a micro pump 12, the heat exchanging chip 30 is provided with a heat source 50, and the cooling pipeline 20 is provided with a cooling structure 60.
A micropump 12 is arranged on one heat exchange pipeline of the embodiment, the micropump 12 can be used as a flowing power source of the liquid metal micropump heat exchange device, and when the liquid metal cooling liquid flows slowly or does not flow under the action of an electric field generated by the current generator 11, the micropump 12 needs to be started to force the liquid metal cooling liquid to flow in the channel, so that the convection heat exchange efficiency is improved.
In some embodiments, the micropump is one of a micro peristaltic pump, a micro plunger pump, a micro pressure pump, or a micro gear pump, but is not limited thereto. In this embodiment, a suitable micro pump can be designed and selected according to the heat exchange requirement.
In some embodiments, different liquid metal cooling liquids can be selected according to cooling requirements, common temperature states and environmental requirements, when the working temperature of the heat source is higher, a liquid metal with a higher melting point can be selected, and the composition of different liquid metal cooling liquids can be designed and selected according to heat dissipation requirements.
In some embodiments, the liquid metal coolant is a pure liquid metal or a mixed liquid composed of a pure liquid metal and a conductive medium. By way of example, the pure liquid metal is one or more of gallium alloy, indium alloy, gallium indium alloy, and gallium indium tin alloy, but is not limited thereto; the conductive medium is one or more of conductive oil, salt solution and sodium hydroxide, but is not limited thereto.
In some embodiments, in order to improve the heat exchange efficiency, the cooling pipeline includes a plurality of cooling sub-pipelines which are sequentially communicated and arranged in an S shape, and the plurality of cooling sub-pipelines are all provided with cooling structures. For example, as shown in fig. 1, the cooling pipeline 20 may include 3 cooling sub-pipelines 21 arranged in an S-shape and sequentially connected, and the cooling structure 60 is disposed on each of the 3 cooling sub-pipelines 21. In this embodiment, the liquid metal cooling liquid can flow through in proper order after absorbing the heat of heat source the cooling sub-pipeline, through setting up a plurality of the cooling sub-pipeline 21 and with the cooling sub-pipeline sets up to the S type can effectively increase the heat transfer area of liquid metal cooling liquid to effectively promote liquid metal heat transfer device' S heat exchange efficiency.
In some embodiments, as shown in fig. 1 and 4, the cooling structure 60 includes an energy conduction block 61 in direct contact with the cooling sub-circuit 21, and a heat dissipation fin 62 disposed on a surface of the energy conduction block. In this embodiment, the energy conduction block 61 is equivalent to a heat conduction block, and when the high-temperature liquid metal coolant absorbing heat of the heat source flows through the cooling sub-pipeline 21, the energy conduction block 61 can conduct the heat of the high-temperature liquid metal coolant to the heat dissipation fins 62, so that the temperature of the high-temperature liquid metal coolant gradually decreases, thereby implementing convective heat transfer.
In some embodiments, the heat dissipation fins 62 alone are used to cool the high temperature liquid metal coolant, which is less efficient in convective heat transfer. Based on this, as shown in fig. 4, a semiconductor cooling chip 63 may be further disposed between the energy conduction block 61 and the heat dissipation fins 62, and a chip power supply 64 is connected to the semiconductor cooling chip 63. In this embodiment, the semiconductor cooling chip 63 can rapidly cool after being connected to the chip power supply 64, and at this time, the energy conduction block 61 is equivalent to a cold conduction block, and when the high-temperature liquid metal coolant absorbing heat from the heat source flows through the cooling sub-pipeline 21, the energy conduction block 61 can rapidly conduct the cold air generated by the semiconductor cooling chip 63 into the high-temperature liquid metal coolant, so that the temperature of the high-temperature liquid metal coolant is rapidly reduced, thereby achieving efficient convective heat transfer. In this embodiment, the energy conduction block 61 can also effectively prevent the semiconductor cooling chip 63 from directly contacting the cooling sub-pipe 21, so as to prevent the liquid metal cooling liquid inside the cooling sub-pipe 21 from solidifying and blocking the flow of the liquid metal cooling liquid in the cooling sub-pipe 21.
In some embodiments, as shown in fig. 5, in order to improve the heat convection efficiency of the liquid metal heat exchanger, the cooling structures 60 are disposed at both the upper and lower ends of the cooling sub-pipe 21, so as to double the heat exchange efficiency of the liquid metal heat exchanger.
In some embodiments, as shown in fig. 6, the reservoir 40 includes a receiving chamber 41 for storing the liquid metal coolant, a filter screen 42 disposed in the receiving chamber 41, a sealing cover 43 disposed at a top end of the receiving chamber 41, and a liquid metal coolant inlet 44 and a liquid metal coolant outlet 45 disposed at left and right ends of the receiving chamber 41. In this embodiment, the sealing cover 43 can be effectively used to prevent the liquid metal coolant inside the containing cavity from leaking; the filter screen 42 can be used for filtering solidified liquid metal formed in the flowing process of the liquid metal cooling liquid to agglomerate and deposit dust in the flow channel, so that the liquid metal cooling liquid is effectively prevented from being blocked in the flowing process; the filter screen 42 can also be used as a liquid drop generator, when the liquid metal cooling liquid passes through the filter screen, the liquid metal cooling liquid can be divided into smaller liquid drops by the filter screen, so that the liquid metal cooling liquid has a larger specific surface area, and the heat exchange efficiency is effectively improved.
In some specific embodiments, as shown in fig. 6, the filter screen 42 includes a plurality of filter sheets 421 arranged in a matrix, and the filter sheets 421 are provided with a plurality of filter holes 422. The size of the filter holes 422 can be set according to requirements.
In some embodiments, the bottom of the accommodating chamber 41 is further provided with a waste liquid outlet 46. In use of the reservoir, the waste outlet 46 is sealed; after the use of the storage is finished, the waste liquid outlet can be opened to discharge or replace the liquid metal cooling liquid in the accommodating cavity 41, or the accommodating cavity 41 can be cleaned.
In some embodiments, as shown in fig. 7, micro-nano internal flow channels 31 arranged in an S-shape are disposed inside the heat exchange chip 30. In this embodiment, the heat exchange chip 30 is provided with the micro-nano inner flow channels 31 arranged in an S-shape, so that the heat convection area of the liquid metal cooling liquid can be increased, and the heat exchange efficiency of the liquid metal heat exchange device can be effectively improved.
In some embodiments, as shown in fig. 1 and 7, a heat exchange chip liquid metal cooling liquid inlet 32 and a heat exchange chip liquid metal cooling liquid outlet 33 which are communicated with the micro-nano internal flow channel 31 are further disposed on the heat exchange chip 30, and the heat exchange chip 30 is communicated with the other end of the two heat exchange pipelines 10 on the same side through the heat exchange chip liquid metal cooling liquid inlet 32 and the heat exchange chip liquid metal cooling liquid outlet 33.
In some embodiments, as shown in fig. 1 and 8, the heat source 50 is disposed on the lower surface of the heat exchange chip 30, the chip holder 80 is disposed on the upper surface of the heat exchange chip 30, and the heat source 50 and the chip holder 80 are fixed by screws. In this embodiment, the upper surface of the heat exchange chip 30 is further provided with a protrusion positioning block 34, the chip clamp 80 is provided with an installation positioning groove 81 adapted to the protrusion positioning block 34, four corners of the chip clamp 80 are provided with first threaded holes 82, the bottom of the heat source 50 is provided with a support base 51, and four corners of the support base 51 are provided with second threaded holes 52 corresponding to the first threaded holes. In this embodiment, the protrusion positioning block 24 of the heat exchanging chip 30 is mounted on the mounting positioning groove 81 of the chip clamp 80, the heat source disposed on the supporting base 51 is disposed under the heat exchanging chip 30, the second screw hole 52 of the supporting base 51 is aligned with the first screw hole 82 of the chip clamp 80, and the heat source 50, the heat exchanging chip 30 and the chip clamp 80 are fixed together by passing a screw through the first screw hole 82 and the second screw hole 52.
In summary, in the invention, the liquid metal cooling liquid is used as a heat exchange medium in the heat exchange process, and the electric field generated by the current generator can drive the liquid metal cooling liquid in the storage to flow, so that the liquid metal cooling liquid flows through the heat exchange chip and the cooling pipeline and circulates back and forth, the liquid metal cooling liquid absorbs the heat generated by the heat source when flowing through the heat exchange chip and is changed into the high-temperature liquid metal cooling liquid, and the cooling structure arranged on the cooling pipeline can cool the high-temperature liquid metal cooling liquid when flowing through the cooling pipeline, thereby realizing the convective heat exchange. The liquid metal heat exchange device provided by the invention has the advantages of simple structure, compact design and relative independence of all components, and is convenient to maintain and overhaul; the liquid metal heat exchange device has the characteristic of good interchangeability, and can realize modularization, serialization and rapid design; the liquid metal heat exchange device has no special requirements on working environment, can adapt to various special environments, and has high heat exchange efficiency.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.
Claims (13)
1. The utility model provides a liquid metal heat transfer device, its characterized in that, includes two heat transfer pipelines, the homonymy one end and the cooling line intercommunication of two heat transfer pipelines, the homonymy other end and the heat transfer chip intercommunication of two heat transfer pipelines, it all is provided with the accumulator that is used for storing liquid metal coolant liquid to have at least a heat transfer pipeline in two heat transfer pipelines, still be provided with the current generator who is used for producing the electric field on the heat transfer pipeline that is provided with the accumulator, be provided with the heat source on the heat transfer chip, be provided with cooling structure on the cooling line.
2. The magnetic fluid heat exchange device according to claim 1, wherein at least one of the two heat exchange lines is provided with a micro pump.
3. The liquid metal micropump heat exchanging device of claim 2, wherein the micropump is one of a micro peristaltic pump, a micro plunger pump, a micro pressure pump, or a micro gear pump.
4. A magnetic fluid heat exchange device according to claim 1 wherein the reservoir is provided on both of the two heat exchange circuits.
5. The liquid metal heat exchange device of claim 1, wherein the liquid metal coolant is pure liquid metal or a mixture of pure liquid metal and a conductive medium.
6. A liquid metal heat exchange device according to claim 5, wherein the pure liquid metal is one or more of a gallium alloy, an indium alloy, a gallium indium alloy and a gallium indium tin alloy.
7. A liquid metal heat exchange device according to claim 5, wherein the electrically conductive medium is one or more of an electrically conductive oil, a salt solution and sodium hydroxide.
8. The liquid metal heat exchange device of claim 1, wherein the cooling pipeline comprises a plurality of cooling sub-pipelines which are sequentially communicated and arranged in an S shape, and the cooling sub-pipelines are provided with the cooling structures.
9. A liquid metal heat exchange device according to claim 8, wherein the cooling structure is provided at both the upper and lower ends of the cooling sub-pipe.
10. A liquid metal heat exchange device according to any one of claims 8 to 9, wherein the cooling structure comprises an energy conduction block in direct contact with the cooling sub-pipe, and heat dissipation fins provided on a surface of the energy conduction block.
11. The liquid metal heat exchange device of claim 10, wherein the cooling structure further comprises a semiconductor cooling chip disposed between the energy conducting block and the heat sink fin.
12. The liquid metal heat exchange device according to claim 1, wherein the reservoir comprises a containing cavity for storing liquid metal coolant, a filter screen arranged in the containing cavity, a sealing cover arranged at the top end of the containing cavity, and a liquid metal coolant inlet and a liquid metal coolant outlet arranged at the left end and the right end of the containing cavity.
13. The liquid metal heat exchange device according to claim 1, wherein micro-nano inner flow channels arranged in an S shape are arranged inside the heat exchange chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911244212.3A CN110926245A (en) | 2019-12-06 | 2019-12-06 | Liquid metal heat exchange device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911244212.3A CN110926245A (en) | 2019-12-06 | 2019-12-06 | Liquid metal heat exchange device |
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| CN110926245A true CN110926245A (en) | 2020-03-27 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116033701A (en) * | 2021-10-26 | 2023-04-28 | 荣耀终端有限公司 | Manufacturing method of electronic element heat dissipation structure, heat dissipation structure and electronic equipment |
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| CN109287100A (en) * | 2018-10-08 | 2019-01-29 | 云南靖创液态金属热控技术研发有限公司 | A kind of liquid metal heat radiation device and electronic equipment |
| CN212253777U (en) * | 2019-12-06 | 2020-12-29 | 南方科技大学 | Liquid metal heat exchange device |
Cited By (1)
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| CN116033701A (en) * | 2021-10-26 | 2023-04-28 | 荣耀终端有限公司 | Manufacturing method of electronic element heat dissipation structure, heat dissipation structure and electronic equipment |
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