CN107726904A - A kind of Micropump secondary ring heat pipe for multi-heat source radiating - Google Patents
A kind of Micropump secondary ring heat pipe for multi-heat source radiating Download PDFInfo
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- CN107726904A CN107726904A CN201711044628.1A CN201711044628A CN107726904A CN 107726904 A CN107726904 A CN 107726904A CN 201711044628 A CN201711044628 A CN 201711044628A CN 107726904 A CN107726904 A CN 107726904A
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- evaporator
- micropump
- heat pipe
- secondary ring
- outlet
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Jet Pumps And Other Pumps (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention belongs to heat exchange correlative technology field, it discloses a kind of Micropump secondary ring heat pipe for multi-heat source radiating, it includes reservoir, and the Micropump secondary ring heat pipe also includes evaporator assemblies, the first radiator loop, the second radiator loop and injector；The evaporator assemblies include at least two evaporators in series or in parallel；The injector and the evaporator assemblies are connected behind the first radiator loop and the second radiator loop parallel connection, the reservoir connects the injector and the evaporator assemblies.The Micropump secondary ring heat pipe of the present invention starts rapidly, and transmission range is longer, and operation stability is preferable, and thermal resistance is relatively low.
Description
Technical field
It is auxiliary more particularly, to a kind of Micropump for multi-heat source radiating the invention belongs to heat exchange correlative technology field
Help loop circuit heat pipe.
Background technology
With the quick raising of electronic device performance, each functional module is highly integrated, and component size is gradually to microminiaturization
Direction is developed, and the heat flow density of unit area constantly increases, and the thermal control to electronic device proposes extremely harsh requirement.It is right
In spaceborne cooling electronic component, due to the dispersiveness of each radiating module unit, for the cooling system of type compact to design, meet
The demand of multi-heat source radiating is, it is necessary to consider various factors to design cooling system.In addition, in the field of spacecraft load radiating
Close, transmission range and stability to cooling system have higher requirement.
In electronic device cooling heat dissipation technology, whether exterior power is needed according to cooling system, system is divided into actively
Two kinds of formula and passive type.Active cooling system mainly includes microchannel, microjet etc., has simple in construction, Heat transmission distance
The advantages that long, but be constrained to the exchange capability of heat of monophasic fluid, system radiating is limited in one's ability, and the uniform temperature of wall also compared with
Difference.Passive heat radiation system mainly includes heat pipe, loop circuit heat pipe etc., and loop circuit heat pipe fills as a kind of typical passive heat radiation
Put, it is mainly made up of evaporator, condenser and gas-liquid pipeline etc., and the mesh of heat transportation is reached by the evaporation-condensation of working medium
, wherein the capillary suction force of capillary wick provides power for the circulation of whole system；Due in system operation without extraneous
Power, therefore loop circuit heat pipe has the advantages of safety and stability, is the study hotspot in current dissipation from electronic devices field.But by
It is limited to the capillary suction force of loop heat pipe capillary core, the Heat transmission in loop can not meet space long range heat row apart from limited
The demand of dissipating, for the loop circuit heat pipe using multi-evaporator structure type, occur again because the feed flow failure of evaporator causes system
The problem of operation failure.Further, since the special construction of flat type loop heat pipe evaporator so that the heat conduction of evaporator side wall and the back of the body
It is serious to heat conduction, the boiling of evaporator compensating liquid intracavity liquid is easily caused, so that the temperature fluctuation of system operation even unstability,
It is unfavorable for the radiating of electronic device.
The content of the invention
For the disadvantages described above or Improvement requirement of prior art, the invention provides a kind of Micropump for multi-heat source radiating
Secondary ring heat pipe, its work characteristics based on existing loop circuit heat pipe, study and devise a kind of longer use of Heat transmission distance
In the Micropump secondary ring heat pipe of multi-heat source radiating.The Micropump secondary ring heat pipe includes Micropump, described in the Micropump connection
Reservoir and the evaporator assemblies, the Micropump are used to drive liquid working substance, accelerate the cycle rate of liquid working substance, improve
Response sensitivity, start more rapid.In addition, working medium pipeline effectively walks the leakage torrid zone of compensating liquid chamber, liquid is eliminated
The temperature fluctuation that compensated cavity internal cause boiling heat transfer is brought, has fundamentally contained the temperature fluctuation of evaporator surface, enhances fortune
Capable stability.
To achieve the above object, the invention provides a kind of Micropump secondary ring heat pipe for multi-heat source radiating, it is wrapped
Include reservoir, it is characterised in that：
The Micropump secondary ring heat pipe also includes evaporator assemblies, the first radiator loop, the second heat loss through radiation
Device loop, injector, working medium pipeline and steam pipework；The evaporator assemblies include at least two evaporations in series or in parallel
Device；
One end of the steam pipework is connected to one end of the evaporator assemblies, and the other end is connected to first radiation
One end of radiator loop, the other end of first radiator are connected to one end of the injector, the injector
The other end be connected to the entrance of the reservoir, the outlet of the reservoir is connected to the other end of the evaporator assemblies；
The evaporator assemblies, the working medium pipeline, the second radiator loop and the injector are sequentially connected and connect, described
Working medium pipeline is connected to same one end of the evaporator assemblies, the first radiator loop with the steam pipework
And the second radiator loop is connected to same one end of the injector.
Further, the Micropump secondary ring heat pipe also includes Micropump, and the Micropump connects the reservoir and described
Evaporator assemblies.
Further, the quantity of the evaporator is two, and two evaporators are respectively the first evaporator and second
Evaporator, one end of first evaporator are provided with the first evaporator liquid inlet, and the other end is respectively arranged with the first evaporation
Device liquid outlet and the first evaporator steam (vapor) outlet；One end of second evaporator is provided with the second evaporator liquid inlet,
The other end is respectively arranged with the second evaporator liquid outlet and the second evaporator steam (vapor) outlet.
Further, first evaporator and second evaporator series, the first evaporator liquid inlet connect
It is connected to the outlet of the Micropump, the first evaporator liquid outlet is connected to the second evaporator liquid inlet, and described
Two evaporator liquid outlets are connected to the working medium pipeline；The first evaporator steam (vapor) outlet and the second evaporator steam
Outlet is connected to the first radiator loop by the steam pipework.
Further, first evaporator is in parallel with second evaporator, the first evaporator liquid inlet and
The second evaporator liquid inlet is all connected to the entrance of the Micropump；The first evaporator liquid outlet and described second
Evaporator liquid outlet is connected to the second radiator loop after converging by the working medium pipeline；First evaporation
Device steam (vapor) outlet and the second evaporator steam (vapor) outlet are connected to first radiation and dissipated after converging by the steam pipework
Hot device loop.
Further, the Micropump is gear pump driven by magnetic force or centrifugal pump.
Further, the evaporator is planar configuration, and it is used to contact with additional thermic load, with to the external heat
Load is radiated.
Further, the reservoir is cylindrical structure, and it is used to store liquid working substance.
Further, the Micropump secondary ring heat pipe also includes reservoir capillary wick, and the reservoir capillary wick is set
In the reservoir.
In general, by the contemplated above technical scheme of the present invention compared with prior art, use provided by the invention
Mainly had the advantages that in the Micropump secondary ring heat pipe of multi-heat source radiating：
1. the Micropump secondary ring heat pipe includes Micropump, the Micropump connects the reservoir and the evaporator group
Part, the Micropump are used to drive liquid working substance, accelerate the cycle rate of liquid working substance, improve response sensitivity, start more
To be rapid；
2. the Micropump drives liquid working substance, transmittability is substantially increased, and in the presence of injector, steam
Transmittability also significantly improved；
3. working medium pipeline effectively walks the leakage torrid zone of compensating liquid intracavitary, compensating liquid intracavitary is eliminated because of boiling heat transfer band
The temperature fluctuation come, has fundamentally contained the temperature fluctuation of evaporator surface, has enhanced the stability of operation；
4. due to the evaporator using planar configuration, overcoming traditional cylindrical loop circuit heat pipe needs by between saddle
Switch through the deficiency that commutation evaporator transmits heat, greatly reduce the thermal contact resistance between thermal source and evaporator, reduce entirety
Quality；
5. Micropump process auxiliary drive fluid loop working medium circulation, the circulation ability of working medium significantly increase, solves multi-evaporator
Between working medium distribution and supply problem, so as to using the series-parallel loop of multi-evaporator can be with stable operation.
Brief description of the drawings
Fig. 1 is that the plane for the Micropump secondary ring heat pipe for being used for multi-heat source radiating that first embodiment of the invention provides is shown
It is intended to；
Fig. 2 is the schematic perspective view of the Micropump secondary ring heat pipe for being used for multi-heat source radiating in Fig. 1；
Fig. 3 is that the plane for the Micropump secondary ring heat pipe for being used for multi-heat source radiating that second embodiment of the invention provides is shown
It is intended to；
Fig. 4 is the schematic perspective view of the Micropump secondary ring heat pipe for being used for multi-heat source radiating in Fig. 3.
In all of the figs, identical reference is used for representing identical element or structure, wherein：1- first evaporates
Device, the first evaporators of 1-1- liquid inlet, 1-2- the first evaporator liquid outlets, 1-3- the first evaporator steam (vapor) outlets, 2-
Two evaporators, the second evaporators of 2-1- liquid inlet, 2-2- the second evaporator liquid outlets, 2-3- the second evaporator steam go out
Mouthful, the first radiators of 3- loop, 3-1- the first radiator circuit entrances, the first radiators of 3-2- loop goes out
Mouthful, the second radiators of 4- loop, 4-1- the second radiator circuit entrances, the second radiators of 4-2- loop goes out
Mouthful, 5- injectors, 5-1- driving fluid entrances, 5-2- driven fluid entrances, the outlet of 5-3- fluid-mixings, 6- reservoirs, 6-
1- reservoir capillary wicks, 7- Micropumps, the additional thermic loads of 8-, 9- evaporator capillary wicks, 10- steam pipeworks.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.As long as in addition, technical characteristic involved in each embodiment of invention described below
Conflict can is not formed each other to be mutually combined.
Provided by the present invention for multi-heat source radiating Micropump secondary ring heat pipe by active and passive heat radiation mode
It is combined, using Micropump auxiliary liquid loop, is added significantly to the Heat transmission distance of system；Followed using the liquid refrigerant of system
Ring, improve startup ability of the system under different load；Using liquid refrigerant cooling liquid compensated cavity to take away evaporator
Leakage heat, eliminate the temperature fluctuation that compensating liquid intracavitary is brought by boiling heat transfer, it is ensured that capillary wick abundance and stable feed flow, enhance
The stability of system operation；Liquid circulation is driven using Micropump, it is ensured that feed flow equalization stable between multi-evaporator.
Fig. 1 and Fig. 2 is referred to, what first embodiment of the invention provided is used for the Micropump secondary ring heat of multi-heat source radiating
Pipe, the Micropump secondary ring heat pipe include the first evaporator 1, the second evaporator 2, the first radiator loop 3, the second spoke
Penetrate radiator loop 4, injector 5, reservoir 6, Micropump 7, evaporator capillary wick 9 and steam pipework 10.
First evaporator 1 is connected into evaporator assemblies, one end of the evaporator assemblies with second evaporator 2
The Micropump 7 is connected, the other end connects one end of the steam pipework 10 and one end of working medium pipeline respectively.First radiation
One end of radiator loop 3 is connected to the other end of the steam pipework 10, and the other end is connected to one end of the injector 5.
The one end in the second radiator loop 4 is connected to the other end of the working medium pipeline, and the other end is connected to the injection
One end of device 5, the second radiator loop 4 and the first radiator loop 3 are connected to the injection
Same one end of device 5.The reservoir 6 connects the other end and the Micropump 7 of the injector 5.
The evaporator capillary wick 9 is provided with first evaporator 1, its one end is provided with the first evaporator liquid and entered
Mouth 1-1, the other end are respectively arranged with the first evaporator liquid outlet 1-2 and the first evaporator steam (vapor) outlet 1-3.Present embodiment
In, the center overlapping of axles of the central shaft of the first evaporator liquid inlet 1-1 and the first evaporator liquid outlet 1-2,
The central shaft of the first evaporator liquid outlet 1-2 is parallel with the central shaft of the first evaporator steam (vapor) outlet 1-3.
The evaporator capillary wick 9 is also equipped with second evaporator 2, its one end is provided with the second evaporator inlet
2-1, the other end are respectively arranged with the second evaporator liquid outlet 2-2 and the second evaporator steam (vapor) outlet 2-3.
The first evaporator liquid inlet 1-1 is connected to the Micropump 7, the first evaporator liquid by liquid line
Body outlet 1-2 is connected to the second evaporator liquid inlet 2-1 by liquid line.The first evaporator steam (vapor) outlet 1-
3 and the second evaporator steam (vapor) outlet 2-3 is connected to the of the first radiator loop 3 through the steam pipework 10
One radiator circuit entrance 3-1.The second evaporator liquid outlet 2-2 is connected to described by the working medium pipeline
The second radiator circuit entrance 4-1 in two radiator loops 4.
The first radiator circuit outlet 3-2 and second heat loss through radiation in the first radiator loop 3
The second radiator circuit outlet 4-2 in device loop 4 be connected to the injector 5 driven fluid entrance 5-2 and
Driving fluid entrance 5-1.The injector 5 is additionally provided with fluid-mixing outlet 5-3, and the fluid-mixing outlet 5-3 is connected to
The reservoir 6.Reservoir capillary wick 6-1 is provided with the reservoir 6, to ensure that the entrance of the Micropump 7 is filled by liquid
It is full.The outlet of the reservoir 6 is connected to the entrance of the Micropump 7, and the outlet of the Micropump 7 is connected to first evaporator
Liquid inlet 1-1.In present embodiment, first evaporator 1 and second evaporator 2 are planar configuration, plane
The evaporator of formula structure may insure to be bonded with the direct of radiating surface, reduce the thermal contact resistance between thermal source, improve heat exchange effect
Rate；First evaporator 1 and second evaporator 2 are bonded setting with additional thermic load 8 respectively, with respectively to corresponding institute
Additional thermic load 8 is stated to be radiated.
The Micropump 7 drives liquid working substance to pass in and out first evaporator 1 and second evaporator 2 successively, on the one hand
The side wall heat conduction of first evaporator 1 and second evaporator 2 is effectively taken away and backwards to heat conduction amount, with described in elimination
The issuable liquid boiling phenomenon of the compensating liquid intracavitary of first evaporator 1 and second evaporator 2, it is ensured that the evaporation
The feed flow of device capillary wick 9 is sufficient stable；On the other hand, under higher thermal load condition, the burning of the evaporator capillary wick 9 is avoided
It is dry, it ensure that Micropump secondary ring heat pipe stable operation under wider operating mode.
In present embodiment, the first radiator loop 3 and the second radiator loop 4 are arranged on pre-
First hold successfully on the aluminium sheet of groove, utilize the first radiator loop 3 and the second radiator loop 4 and the aluminium
Heat is dispersed into outer space by the temperature difference between plate by the aluminium sheet, with ensure the first radiator loop 3 and
The cycle fluid of the outlet in the second radiator loop 4 is supercooled state.
In present embodiment, the reservoir 6 is cylindrical structure；The Micropump 7 is gear pump driven by magnetic force or centrifugation
Pump；The cycle fluid that the Micropump secondary ring heat pipe uses can be the working medium of positive pressure-type, or negative pressure type
Working medium.The working medium of positive pressure-type is from ammonia, R245fa etc.；The working medium of negative pressure type is from methanol, acetone etc..In present embodiment
Evaporator quantity be two；It is appreciated that in other embodiments, the quantity of evaporator can increase according to being actually needed
Add or reduce.
During the Micropump secondary ring heat pipe work, under the driving of the Micropump 7, the liquid work in the reservoir 6
Matter enters first evaporator 1 by the first evaporator liquid inlet 1-1, in the presence of the additional thermic load 8,
A part of liquid working substance in first evaporator 1, which is heated, to be vaporized and forms steam and enter the steam pipework 10, same with this
When, the partially liq working medium in first evaporator 1 enters the described second evaporation through the first evaporator liquid outlet 1-2
Device 2, and in the presence of the corresponding additional thermic load 8, the liquid working substance vaporization in second evaporator 2 forms steam
Into the steam pipework 10, steam is in the steam pipework 10 caused by first evaporator 1 and second evaporator 2
Enter the first radiator loop 3 after converging, and be converted to liquid working substance by condensation and enter the injector 5.Together
When, a part of liquid working substance in second evaporator 2, which absorbs, to be entered the described second radiation after the leakage heat of the evaporator 2 and dissipates
Hot device loop 4, and enter the injector 5 after supercooling.Two-way liquid working substance is back to after converging in the injector 5
The reservoir 6, the injector 5 are additionally operable to play suction to the liquid working substance in the first radiator loop 3
Effect, to accelerate the steam pressure in first evaporator 1 and second evaporator 2, and then reduce the steaming of liquid working substance
Send out temperature and the running temperature in loop.
Fig. 3 and Fig. 4 is referred to, what second embodiment of the invention provided is used for the Micropump secondary ring heat of multi-heat source radiating
Pipe and the Micropump secondary ring heat pipe for being used for multi-heat source radiating that first embodiment of the invention provides are essentially identical, and difference exists
In, first evaporator 1 and second evaporator 2 and it is unified into the evaporator assemblies.
Wherein, the first evaporator liquid inlet 1-1 and the second evaporator liquid inlet 2-1 points pass through same liquid
Body pipeline is connected to the outlet of the Micropump 7.The first evaporator liquid outlet 1-2 and the second evaporator liquid outlet
2-2 is connected to the second radiator circuit entrance 4-1 by the working medium pipeline.The first evaporator steam goes out
Mouth 1-3 and the second evaporator steam (vapor) outlet 2-3 is connected to first radiator by the steam pipework 10
Circuit entrance 3-1.
First evaporator 1 and described second are respectively enterd after the liquid working substance of the Micropump 7 driving is divided into two
Evaporator 2, and convergeed in the liquid outlet of first evaporator 1 and second evaporator 2 through the working medium pipeline
The second radiator loop 4.
Provided by the present invention for the Micropump secondary ring heat pipe of multi-heat source radiating, the Micropump secondary ring heat pipe includes
Micropump, the Micropump connect the reservoir and the evaporator assemblies, and the Micropump is used to drive liquid working substance, accelerates liquid
The cycle rate of body working medium, response sensitivity is improved, started more rapid.In addition, working medium pipeline is effectively by compensating liquid
The leakage torrid zone of chamber is walked, and is eliminated the temperature fluctuation that compensating liquid intracavitary is brought by boiling heat transfer, has fundamentally been contained evaporator
The temperature fluctuation on surface, enhance the stability of operation.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, all any modification, equivalent and improvement made within the spirit and principles of the invention etc., all should be included
Within protection scope of the present invention.
Claims (9)
1. a kind of Micropump secondary ring heat pipe for multi-heat source radiating, it includes reservoir, it is characterised in that：
The Micropump secondary ring heat pipe also includes evaporator assemblies, the first radiator loop, the second radiator time
Road, injector, working medium pipeline and steam pipework；The evaporator assemblies include at least two evaporators in series or in parallel；
One end of the steam pipework is connected to one end of the evaporator assemblies, and the other end is connected to first heat loss through radiation
The one end in device loop, the other end of first radiator are connected to one end of the injector, the injector it is another
One end is connected to the entrance of the reservoir, and the outlet of the reservoir is connected to the other end of the evaporator assemblies；It is described
Evaporator assemblies, the working medium pipeline, the second radiator loop and the injector are sequentially connected and connect, the working medium
Pipeline is connected to same one end of the evaporator assemblies, the first radiator loop and institute with the steam pipework
State same one end that the second radiator loop is connected to the injector.
2. the Micropump secondary ring heat pipe for multi-heat source radiating as claimed in claim 1, it is characterised in that：The Micropump is auxiliary
Loop circuit heat pipe is helped also to include Micropump, the Micropump connects the reservoir and the evaporator assemblies.
3. the Micropump secondary ring heat pipe for multi-heat source radiating as claimed in claim 2, it is characterised in that：The evaporator
Quantity be two, two evaporators are respectively the first evaporator and the second evaporator, one end of first evaporator
The first evaporator liquid inlet is provided with, the other end is respectively arranged with the first evaporator liquid outlet and the first evaporator steam goes out
Mouthful；One end of second evaporator is provided with the second evaporator liquid inlet, and the other end is respectively arranged with the second evaporator liquid
Body exports and the second evaporator steam (vapor) outlet.
4. the Micropump secondary ring heat pipe for multi-heat source radiating as claimed in claim 3, it is characterised in that：Described first steams
Send out device and second evaporator series, the first evaporator liquid inlet is connected to the outlet of the Micropump, and described first
Evaporator liquid outlet is connected to the second evaporator liquid inlet, and the second evaporator liquid outlet is connected to the work
Matter pipeline；The first evaporator steam (vapor) outlet and the second evaporator steam (vapor) outlet are connected to by the steam pipework
The first radiator loop.
5. the Micropump secondary ring heat pipe for multi-heat source radiating as claimed in claim 3, it is characterised in that：Described first steams
Hair device is in parallel with second evaporator, and the first evaporator liquid inlet and the second evaporator liquid inlet are all connected with
In the entrance of the Micropump；The first evaporator liquid outlet and the second evaporator liquid outlet pass through the working medium tube
Road is connected to the second radiator loop after converging；The first evaporator steam (vapor) outlet and second evaporator steam
Vapor outlet is connected to the first radiator loop after converging by the steam pipework.
6. the Micropump secondary ring heat pipe for multi-heat source radiating as claimed in claim 2, it is characterised in that：The Micropump is
Gear pump driven by magnetic force or centrifugal pump.
7. the Micropump secondary ring heat pipe for being used for multi-heat source radiating as described in claim any one of 1-6, it is characterised in that：Institute
It is planar configuration to state evaporator, and it is used to contact with additional thermic load, to be radiated to the additional thermic load.
8. the Micropump secondary ring heat pipe for being used for multi-heat source radiating as described in claim any one of 1-6, it is characterised in that：Institute
It is cylindrical structure to state reservoir, and it is used to store liquid working substance.
9. the Micropump secondary ring heat pipe for being used for multi-heat source radiating as described in claim any one of 1-6, it is characterised in that：Institute
Stating Micropump secondary ring heat pipe also includes reservoir capillary wick, and the reservoir capillary wick is arranged in the reservoir.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711044628.1A CN107726904A (en) | 2017-10-31 | 2017-10-31 | A kind of Micropump secondary ring heat pipe for multi-heat source radiating |
| PCT/CN2017/112764 WO2019085090A1 (en) | 2017-10-31 | 2017-11-24 | Micropump-assisted loop heat pipe for heat dissipation from multiple heat sources |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711044628.1A CN107726904A (en) | 2017-10-31 | 2017-10-31 | A kind of Micropump secondary ring heat pipe for multi-heat source radiating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107726904A true CN107726904A (en) | 2018-02-23 |
Family
ID=61202474
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711044628.1A Pending CN107726904A (en) | 2017-10-31 | 2017-10-31 | A kind of Micropump secondary ring heat pipe for multi-heat source radiating |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107726904A (en) |
| WO (1) | WO2019085090A1 (en) |
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| CN109661156A (en) * | 2019-01-29 | 2019-04-19 | 上海微小卫星工程中心 | A kind of double entrance evaporators and loop circuit heat pipe |
| CN110926245A (en) * | 2019-12-06 | 2020-03-27 | 南方科技大学 | Liquid metal heat exchange device |
| CN111006529A (en) * | 2019-12-27 | 2020-04-14 | 华中科技大学 | Double-evaporator loop heat pipe |
| CN112000206A (en) * | 2020-08-28 | 2020-11-27 | 包文隆 | Heat radiation system based on pump-driven capillary phase change loop |
| CN112179190A (en) * | 2020-09-29 | 2021-01-05 | 西安交通大学 | Ultrathin flat-plate loop heat pipe of coupling ejector |
| CN112179191A (en) * | 2020-09-29 | 2021-01-05 | 西安交通大学 | Flat-plate loop heat pipe suitable for two vertical heat sources |
| WO2021109937A1 (en) * | 2019-12-06 | 2021-06-10 | 南方科技大学 | Magnetic fluid heat exchange device |
| CN114745936A (en) * | 2022-05-12 | 2022-07-12 | 南京航空航天大学 | Cold accumulation type airborne two-phase flow system |
| CN116280282A (en) * | 2023-05-10 | 2023-06-23 | 株洲太空星际卫星科技有限公司 | Integrated thermal control device based on phase-change energy storage temperature-equalizing plate and expandable radiator |
| US12004320B2 (en) | 2019-06-18 | 2024-06-04 | Huawei Technologies Co., Ltd. | Thermal component and electronic device |
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| CN116280282A (en) * | 2023-05-10 | 2023-06-23 | 株洲太空星际卫星科技有限公司 | Integrated thermal control device based on phase-change energy storage temperature-equalizing plate and expandable radiator |
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