CN110913608A - Circuit board lamination welding method, device and storage medium - Google Patents
Circuit board lamination welding method, device and storage medium Download PDFInfo
- Publication number
- CN110913608A CN110913608A CN201911184301.3A CN201911184301A CN110913608A CN 110913608 A CN110913608 A CN 110913608A CN 201911184301 A CN201911184301 A CN 201911184301A CN 110913608 A CN110913608 A CN 110913608A
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- circuit board
- welding
- solder paste
- solder
- furnace
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
Abstract
The application discloses a circuit board lamination welding method and a circuit board lamination dismounting method, wherein the welding method comprises the following steps: providing a first circuit board and a second circuit board; welding the first circuit board and the second circuit board by adopting first solder paste; and providing a third circuit board, and welding the third circuit board and the second circuit board by adopting second solder paste, wherein the first solder paste and the second solder paste have different melting points. By arranging the solder pastes with different melting points when the circuit boards are welded, the temperature can be controlled in the subsequent disassembly process so as to achieve the purpose of disassembly, the welding between other circuit boards can not be influenced, and the disassembly difficulty is reduced.
Description
Technical Field
The application relates to the field of circuit board manufacturing process, in particular to a circuit board lamination welding method and a circuit board lamination dismounting method.
Background
In recent years, with the development of technology and the increase of work demand, electronic devices such as mobile terminals and personal digital assistants are becoming popular among users due to their multi-functions and portability, and many functions of electronic devices are supported by a Printed Circuit Board (PCB) integrated with a plurality of functional chips, which is soldered on the PCB.
In the related art, when a functional chip in the electronic device fails, the PCB corresponding to the failed chip needs to be detached, and since the circuit board in the electronic device is generally stacked, when the solder paste between the PCBs is melted at a high temperature, the solder paste between the other PCBs is also melted, thereby increasing the difficulty in detaching.
Disclosure of Invention
The embodiment of the application provides a laminated circuit board welding method which can reduce the disassembly difficulty.
The embodiment of the application provides a circuit board lamination welding method, which comprises the following steps:
providing a first circuit board and a second circuit board;
welding the first circuit board and the second circuit board by adopting first solder paste;
and providing a third circuit board, and welding the third circuit board and the second circuit board by adopting second solder paste, wherein the first solder paste and the second solder paste have different melting points.
The embodiment of the present application further provides a method for detaching a circuit board stack, which is applied to a circuit board stack formed by the circuit board stack soldering method described above, and includes:
feeding the circuit board lamination into a welding furnace with a first furnace temperature, and melting second solder paste between the third circuit board and the second circuit board;
disassembling the third circuit board;
feeding the circuit board lamination into a welding furnace with a second furnace temperature, and melting first solder paste between the first circuit board and the second circuit board;
and removing the second circuit board.
The circuit board lamination welding method provided by the embodiment of the application comprises the following steps: providing a first circuit board and a second circuit board; welding the first circuit board and the second circuit board by adopting first solder paste; and providing a third circuit board, and welding the third circuit board and the second circuit board by adopting second solder paste, wherein the first solder paste and the second solder paste have different melting points. By arranging the solder pastes with different melting points when the circuit boards are welded, the temperature can be controlled in the subsequent disassembly process so as to achieve the purpose of disassembly, the welding between other circuit boards can not be influenced, and the disassembly difficulty is reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic flow chart of a circuit board stack soldering method provided in an embodiment of the present application.
Fig. 2 is a schematic connection diagram of a first circuit board, a second circuit board and a third circuit board provided in the embodiment of the present application.
Fig. 3 is a schematic diagram of the second circuit board and the third circuit board provided in the embodiment of the present application, along the extending direction of the Y-axis positive half axis.
Fig. 4 is a schematic flow chart of a circuit board stack disassembly method according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic flow chart of a circuit board stack soldering method according to an embodiment of the present application. The embodiment of the application provides a circuit board lamination welding method, which comprises the following steps:
specifically, the first circuit board and the second circuit board are flexible circuit boards made of polyimide.
Step 102, welding the first circuit board and the second circuit board by adopting first solder paste;
specifically, the first solder paste is a high temperature solder paste composed of tin, silver and copper, and has a melting point of 250-300 °, preferably 280 °.
The first solder paste can be printed at the joint of the first circuit board and the second circuit board, for example, the first welding position of the first circuit board is welded with the second welding position of the second circuit board, the first solder paste is printed at the first welding position and/or the second welding position, then the first welding position is attached to the second welding position, and the first solder paste and the second solder paste are sent into a welding furnace, so that the first circuit board is welded with the second circuit board.
Thus, step 102 may comprise:
arranging first solder paste at the first welding position and/or the second welding position;
and the first welding position and the second welding position are jointed and sent into a welding furnace so as to weld the first circuit board and the second circuit board.
Wherein, because the melting point of the first solder paste is 250-300 degrees, the temperature for welding the first welding position and the second welding position should be 250-300 degrees, therefore, the first welding position and the second welding position are jointed and sent into the welding furnace, so that the welding of the first circuit board and the second circuit board comprises the following steps:
and (3) attaching the first welding position and the second welding position, and feeding the first welding position and the second welding position into a welding furnace with the furnace temperature of 250-300 ℃ so as to weld the first circuit board and the second circuit board.
Step 103, providing a third circuit board, and soldering the third circuit board and the second circuit board by using a second solder paste, wherein the first solder paste and the second solder paste have different melting points.
Specifically, the third wiring board is generally a flexible wiring board made of polyimide. The second solder paste is a low-temperature solder paste composed of any one of SnBi, SnBiAg and SnBiCu, and has a melting point of 150-200 degrees, preferably 180 degrees.
The second solder paste can be printed at the joint of the second circuit board and the third circuit board, for example, the third welding position of the third circuit board is welded with the fourth welding position of the second circuit board, the second solder paste is printed at the third welding position and/or the fourth welding position, then the third welding position and the fourth welding position are jointed, and the third circuit board and the second circuit board are welded in the welding furnace.
Thus, step 103 may comprise:
arranging second solder paste at the third welding position and/or the fourth welding position;
and attaching the third welding position and the fourth welding position, and sending the third welding position and the fourth welding position into a welding furnace so as to weld the third circuit board and the fourth circuit board.
The melting point of the second solder paste is 150-200 degrees, which is different from the melting point of the first solder paste, and the melting point of the first solder paste is larger than that of the second solder paste. Therefore, the temperature for welding the third welding position and the fourth welding position is 150-200 degrees, therefore, the third welding position and the fourth welding position are jointed and sent into the welding furnace, so that the third circuit board and the fourth circuit board are welded, comprising the following steps:
and (4) attaching the third welding position and the fourth welding position, and feeding the third welding position and the fourth welding position into a welding furnace with the furnace temperature of 150-200 ℃ so as to weld the third circuit board and the fourth circuit board.
The circuit board lamination welding method provided by the embodiment of the application comprises the following steps: providing a first circuit board and a second circuit board; welding the first circuit board and the second circuit board by adopting first solder paste; and providing a third circuit board, and welding the third circuit board and the second circuit board by adopting second solder paste, wherein the first solder paste and the second solder paste have different melting points. By arranging the solder pastes with different melting points when the circuit boards are welded, the temperature can be controlled in the subsequent disassembly process so as to achieve the purpose of disassembly, the welding between other circuit boards can not be influenced, and the disassembly difficulty is reduced.
Specifically, please refer to fig. 2 and fig. 3, fig. 2 is a schematic connection diagram of a first circuit board, a second circuit board and a third circuit board according to an embodiment of the present disclosure. Fig. 3 is a schematic diagram of the second circuit board and the third circuit board in fig. 2 along the extending direction of the positive Y-axis.
The X axis represents a vertical direction, the Y axis represents a horizontal direction, the first circuit board 10, the second circuit board 20 and the third circuit board 30 are sequentially arranged from bottom to top, a first welding point 101 is preset on the first circuit board 10, a second welding point 201 opposite to the first welding point 101 is arranged on the second circuit board 20, a third welding point 202 opposite to the second welding point 201 is further arranged on the second circuit board 20, and a fourth welding point opposite to the third welding point 202 is arranged on the third circuit board 30.
Printing first solder paste on the first welding position 101 and/or the second welding position 201, attaching the first welding position 101 and the second welding position 201, and feeding into a welding furnace with the furnace temperature of 250-300 degrees for welding.
After the first solder joints 101 and the second solder joints 201 are soldered and fixed, the third solder joints 202 of the second circuit board 20 and/or the fourth solder joints 301 of the third circuit board 30 are printed with a second solder paste, and the third solder joints 202 and the fourth solder joints 301 are bonded together and then are sent into a soldering furnace with a furnace temperature of 150-200 ℃ for soldering.
Correspondingly, please refer to fig. 4, and fig. 4 is a schematic flow chart of a circuit board stack disassembly method according to an embodiment of the present application. The embodiment of the application also provides a circuit board lamination dismounting method of the circuit board lamination formed by the circuit board lamination welding method, which comprises the following steps:
and step 410, conveying the circuit board lamination into a welding furnace with a first furnace temperature, and melting second solder paste between the third circuit board and the second circuit board.
Specifically, since the soldering relationship between the second circuit board and the third circuit board is to be removed, the second solder paste for connecting the second circuit board and the third circuit board is to be melted. And because the second solder paste has a melting point less than that of the first solder paste, the first furnace temperature needs to be ensured to be greater than or equal to the melting point of the second solder paste and less than that of the first solder paste in order to avoid melting the first solder paste.
And step 420, removing the third circuit board.
It is understood that the third wiring board may be removed from the second wiring board after the second solder paste is melted.
And 430, conveying the circuit board lamination into a welding furnace with a second furnace temperature, and melting the first solder paste between the first circuit board and the second circuit board.
Specifically, if the second circuit board is to be continuously removed, the first solder paste connecting the second circuit board and the first circuit board needs to be melted. And because the first solder paste is high-temperature solder paste, the melting point of the first solder paste is higher, so that the temperature of the second furnace is required to be more than or equal to the melting point of the first solder paste.
It is understood that the second circuit board may be removed from the first circuit board after the first solder paste is melted.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The circuit board laminate welding method and the circuit board laminate disassembling method provided by the embodiment of the application are described in detail above, a specific example is applied in the description to explain the principle and the implementation manner of the application, and the description of the embodiment is only used for helping to understand the technical scheme and the core idea of the application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (10)
1. A method of laminate welding for a circuit board, comprising:
providing a first circuit board and a second circuit board;
welding the first circuit board and the second circuit board by adopting first solder paste;
and providing a third circuit board, and welding the third circuit board and the second circuit board by adopting second solder paste, wherein the melting point of the first solder paste is greater than that of the second solder paste.
2. A circuit board stack soldering method according to claim 1, wherein a first solder joint is provided on said first circuit board, a second solder joint is provided on said second circuit board opposite to said first solder joint, and said soldering of said first circuit board and said second circuit board with said first solder paste comprises:
providing a first solder paste at the first solder joint and/or the second solder joint;
and attaching the first welding position and the second welding position, and sending the first welding position and the second welding position into a welding furnace to weld the first circuit board and the second circuit board.
3. A circuit board laminate soldering method according to claim 2, wherein said first solder paste has a melting point of 250 ° to 300 °, said first solder joint and said second solder joint are joined and fed into a soldering furnace to solder said first circuit board to said second circuit board, comprising:
and the first welding part and the second welding part are jointed and are sent into a welding furnace with the furnace temperature of 250-300 degrees, so that the first circuit board and the second circuit board are welded.
4. A circuit board lamination soldering method according to claim 3, wherein the first solder paste is composed of tin, silver and copper.
5. A circuit board lamination welding method according to claim 2, wherein a third welding point on the opposite side of the second welding point is further arranged on the second circuit board, a fourth welding point opposite to the third welding point is arranged on the third circuit board, and the third circuit board is welded to the second circuit board by using a second solder paste, comprising:
providing a second solder paste at the third solder joint and/or the fourth solder joint;
and attaching the third welding position and the fourth welding position, and sending the third welding position and the fourth welding position into a welding furnace to weld the third circuit board and the fourth circuit board.
6. A circuit board laminate soldering method according to claim 5, wherein said second solder paste has a melting point of 150 ° to 200 °, said third solder joint and said fourth solder joint are joined and fed into a soldering furnace to solder a third circuit board to said fourth circuit board, comprising:
and the third welding part and the fourth welding part are jointed and are sent into a welding furnace with the furnace temperature of 150-200 degrees, so that the third circuit board and the fourth circuit board are welded.
7. The method of claim 6, wherein the second solder paste is composed of any one of SnBi, SnBiAg and SnBiCu.
8. A circuit board laminate disassembly method applied to a circuit board laminate formed by the circuit board laminate soldering method according to claim 1, comprising:
feeding the circuit board lamination into a welding furnace with a first furnace temperature, and melting second solder paste between the third circuit board and the second circuit board;
disassembling the third circuit board;
feeding the circuit board lamination into a welding furnace with a second furnace temperature, and melting first solder paste between the first circuit board and the second circuit board;
and removing the second circuit board.
9. A circuit board laminate soldering method according to claim 8, wherein the first oven temperature is greater than or equal to the melting point of the second solder paste and less than the melting point of the first solder paste.
10. A circuit board laminate soldering method according to claim 8, wherein the second oven temperature is greater than or equal to the melting point of the first solder paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911184301.3A CN110913608A (en) | 2019-11-27 | 2019-11-27 | Circuit board lamination welding method, device and storage medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911184301.3A CN110913608A (en) | 2019-11-27 | 2019-11-27 | Circuit board lamination welding method, device and storage medium |
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| Publication Number | Publication Date |
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| CN110913608A true CN110913608A (en) | 2020-03-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911184301.3A Pending CN110913608A (en) | 2019-11-27 | 2019-11-27 | Circuit board lamination welding method, device and storage medium |
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| JP2019016595A (en) * | 2017-07-06 | 2019-01-31 | 積水化学工業株式会社 | Conductive material, connection structure and method for producing connection structure |
| CN109348646A (en) * | 2018-10-31 | 2019-02-15 | 深圳信息职业技术学院 | Perforation reflow soldering method |
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2019
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63310198A (en) * | 1987-06-12 | 1988-12-19 | Fujitsu Ltd | Bonding method for printed substrate |
| JPH03192796A (en) * | 1989-12-21 | 1991-08-22 | Matsushita Electric Ind Co Ltd | Manufacture of composite multilayered board |
| JPH0983128A (en) * | 1995-09-08 | 1997-03-28 | Toshiba Corp | Junction structure of semiconductor module |
| CN1600458A (en) * | 2003-09-23 | 2005-03-30 | 张�杰 | Method and equipment for breaking down and reclaiming electronic components and solder of discarded circuit board |
| CN103460815A (en) * | 2011-04-04 | 2013-12-18 | 松下电器产业株式会社 | Mounting structure and method for manufacturing same |
| CN103442524A (en) * | 2013-08-23 | 2013-12-11 | 深圳市创荣发电子有限公司 | Patch module disassembling and assembling method |
| CN204119670U (en) * | 2014-09-18 | 2015-01-21 | 深圳市四季春科技有限公司 | A kind of PLCC encapsulates mobile phone camera |
| JP2019016595A (en) * | 2017-07-06 | 2019-01-31 | 積水化学工業株式会社 | Conductive material, connection structure and method for producing connection structure |
| CN108990300A (en) * | 2018-08-24 | 2018-12-11 | 郑州云海信息技术有限公司 | PCH module method for dismounting |
| CN109348646A (en) * | 2018-10-31 | 2019-02-15 | 深圳信息职业技术学院 | Perforation reflow soldering method |
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