CN110913581B - Hole filling method for thin film circuit board of wide circuit - Google Patents
Hole filling method for thin film circuit board of wide circuit Download PDFInfo
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- CN110913581B CN110913581B CN201811086287.9A CN201811086287A CN110913581B CN 110913581 B CN110913581 B CN 110913581B CN 201811086287 A CN201811086287 A CN 201811086287A CN 110913581 B CN110913581 B CN 110913581B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
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Abstract
The invention relates to a hole filling method of a film circuit board of a wide circuit, which comprises the following steps: presetting overprinting areas at the connecting parts of the conductive circuits on the two sides of the insulating base material; printing a plurality of communication holes in the overprinting area; mounting a bottom supporting layer on the surface of one side of the insulating base material; printing conductive ink in an overprinting area on the surface of one side, away from the bottom supporting layer, of the insulating base material, and drying to form a first overprinting ink layer; tearing off the bottom supporting layer; and printing conductive ink in an overprinting area on the surface of one side of the torn support bottom layer of the insulating base material, drying to form a second overprinting ink layer, and mutually attaching and connecting the second overprinting ink layer and the first overprinting ink layer at the communicating hole. The hole filling method of the wide-circuit thin film circuit board is simple in production process, the overprinting area is preset at the joint of the positive circuit and the negative circuit, and the plurality of communicating holes are printed and reasonably arranged in the overprinting area, so that effective communication of double-layer wide circuits is realized, and the communication effectiveness is improved.
Description
Technical Field
The invention relates to the technical field of printing, in particular to a hole filling method for a thin film circuit board of a wide circuit.
Background
At present, the hole of irritating of film circuit board, when insulating substrate's positive and negative printing conductive ink, make conductive ink pour into the intercommunication of realizing positive and negative circuit in the conducting hole by oneself, but this mode is mainly to the hole of irritating of accurate thin conducting wire, and the junction of positive and negative circuit is irritated the hole intercommunication through a conducting hole, and adopts this mode to wide conducting wire, and the conducting hole is great, and the conductive ink of positive and negative printing breaks because of gravity easily in conducting hole department, unable more stable intercommunication, the phenomenon of circuit breaking often appears.
Disclosure of Invention
The invention aims to provide a hole filling method for a wide-circuit thin film circuit board, which solves the problem that a thin conductive circuit hole filling communication mode in the prior art is not suitable for communication of positive and negative circuits of the wide-circuit thin film circuit board.
The technical scheme adopted by the invention for solving the technical problem is as follows: a hole filling method for a film circuit board of a wide circuit comprises the following steps:
A. presetting overprinting areas at the connecting parts of the conductive circuits on the two sides of the insulating base material;
B. printing a plurality of communication holes in the overprinting area;
C. mounting a bottom supporting layer on the surface of one side of the insulating base material;
D. printing conductive ink in an overprinting area on the surface of one side, away from the bottom supporting layer, of the insulating base material, and drying to form a first overprinting ink layer;
E. tearing off the bottom supporting layer;
F. and printing conductive ink in an overprinting area on the surface of one side of the torn support bottom layer of the insulating base material, drying to form a second overprinting ink layer, and mutually attaching and connecting the second overprinting ink layer and the first overprinting ink layer at the communicating hole.
In the hole filling method, in the step D, the conductive ink is printed in the overprinting area of the second side surface, meanwhile, the conductive ink is used for synchronously printing the conductive circuit of the second side surface on the second side surface, and the conductive ink is synchronously dried; and step F, printing conductive ink in the overprint area of the first side surface, simultaneously printing a conductive circuit of the first side surface on the first side surface by using the conductive ink, and synchronously drying.
In the hole filling method, the overprinting area is circular, and the diameter of the overprinting area is 0-3 mm larger than the width of the conductive circuit.
In the hole filling method, the width of the conductive circuit is 2-4 mm.
In the hole filling method, the diameter of the communicating hole is 0.5-1.5 mm; the number of the communicating holes is 3-15.
In the hole filling method, in the steps D and F, the conductive ink is conductive pure silver paste, and the mesh number of the printed screen plate is 90-380 meshes.
In the hole filling method, in the steps D and F, screen printing is adopted for printing the conductive ink, and the printing speed is 300-450 PCS/h; the printing pressure is 15N-30N.
In the hole filling method, in the steps D and F, the drying temperature is 90-160 ℃; the drying time is 30min-60 min.
In the hole filling method, in the step B, a plurality of positioning holes for positioning the insulating base material are formed in the insulating base material; the thickness of the insulating base material is 0.01mm-1 mm.
In the hole filling method of the present invention, the insulating base material is PET, PI, or PDMS; the bottom supporting layer is formed by release paper or release film.
The implementation of the hole filling method of the wide-circuit film circuit board has the following beneficial effects: the hole filling method of the wide-circuit thin film circuit board is simple in production process, the overprinting area is preset at the joint of the positive circuit and the negative circuit, and the plurality of communicating holes are printed and reasonably arranged in the overprinting area, so that effective communication of double-layer wide circuits is realized, and the communication effectiveness is improved; meanwhile, the bottom layer is arranged, so that ink leakage during printing and hole filling is prevented, and communication failure, scratching and pollution to a printing table top are avoided.
Drawings
Fig. 1 is a schematic structural diagram of a wide-circuit thin-film circuit board prepared by the hole filling method of the wide-circuit thin-film circuit board of the present invention.
Detailed Description
The hole filling method of the wide-circuit thin-film circuit board of the present invention is further described with reference to the accompanying drawings and embodiments:
the invention relates to a hole filling method of a film circuit board of a wide circuit, which comprises the following steps: as shown in figure 1 of the drawings, in which,
A. presetting overprint regions 2 at the connecting positions of the conductive circuits on the two sides of the insulating base material 1; the overprinting area 2 is preferably circular, and the diameter of the overprinting area 2 is 0-3 mm larger than the width of the conductive circuit; the overprint region 2 can also be in other shapes, such as a square shape and the like, and the side length of the overprint region is 0-3 mm larger than the width of the conducting circuit; wherein, the general wide line means that the preset width of the conductive circuit is 2-4mm, and can be wider as required; the insulating substrate 1 is PET, PI, or PDMS, but is not limited thereto; the thickness of the insulating substrate 1 is preferably 0.01mm to 1 mm;
B. a plurality of communicating holes 3 are punched in the overprinting area 2; the diameter of the communicating hole 3 is preferably 0.5-1.5 mm; the number of the communication holes 3 is preferably 3 to 15; and the intercommunicating pores 3 are uniformly and symmetrically arranged; a plurality of positioning holes (not marked in the figure) for positioning the insulating base material 1 are further formed in the insulating base material 1;
C. mounting a bottom supporting layer (not marked in the figure) on one side surface of the insulating substrate 1; the bottom layer is formed by release paper or release film, but not limited to; the bottom layer is used for preventing ink in the holes from leaking out during hole filling in printing, so that communication failure, scratching, pollution to a printing table top and the like are prevented;
D. printing conductive ink in an overprint area 2 on the surface of one side of the insulating base material 1, which is far away from the bottom supporting layer, to form a first overprint ink layer; printing conductive ink in the overprint area 2 of the second side surface, and simultaneously printing a conductive circuit on the second side surface by using the conductive ink, so as to realize one-time single-sided printing; and baking at 90-160 deg.C for 30-60 min;
E. tearing off the bottom supporting layer;
F. printing conductive ink in an overprint area 2 on one side surface of the torn support bottom layer of the insulating substrate 1 to form a second overprint ink layer, wherein the second overprint ink layer and the first overprint ink layer are mutually attached and connected at a communication hole 3; printing conductive ink in the overprinting area 2 of the first side surface, and simultaneously printing a conductive circuit on the first side surface by using the conductive ink, so as to realize single-sided one-time printing; and baking at 90-160 deg.C for 30-60 min.
In the steps D and F, screen printing is adopted for printing conductive ink, the conductive ink is conductive pure silver paste, a scraper is a circular knife which is 80 degrees to the screen printing plate, the mesh number of the printed screen printing plate is 90-380 meshes, and the printing speed is 300-450 PCS/h; the printing pressure is 15N-30N.
When conducting through adopting a plurality of intercommunicating pores 3 of aperture, the printing ink spreads comparatively evenly in the intercommunicating pores 3 of aperture, and because the cohesion of conductive printing ink after the drying is removed for printing ink in the pores does not drop because of gravity, thereby realizes the intercommunication of the upper and lower surface circuit of film circuit board.
The following is a detailed description of specific examples.
Example 1
The printing method comprises the following steps: screen printing; model: an east-far printer; insulating base material: PET, thickness 0.1 mm; conductive ink: 910A conductive pure silver paste of Changxing; scraping: the scraper is yellow 80 degrees, and the angle is a round sharp knife; mesh number of screen printing plate: 200 meshes; printing speed: 350 PCS/h; printing pressure: 20N, and (3).
Presetting a circular overprinting area 2 at the connecting position of the conductive circuits on the two sides of the insulating base material 1, wherein the diameter of the circular overprinting area 2 is 4 mm; 9 communicating holes 3 are uniformly and symmetrically arranged in the overprinting area 2, and the diameter of each communicating hole 3 is 0.5 mm; a plurality of positioning holes for positioning the insulating base material 1 are further formed in the insulating base material 1; mounting a release film as a bottom supporting layer on one side surface of the insulating substrate 1; printing conductive ink in an overprint area 2 on the surface of one side of the insulating base material 1, which is far away from the bottom supporting layer, to form a first overprint ink layer; printing conductive ink in the overprint area 2 of the second side surface, simultaneously printing a conductive circuit of the second side surface on the second side surface by using the conductive ink, wherein the width of the conductive circuit is 3mm, and baking for 40min at 125 ℃; tearing off the bottom supporting layer; printing conductive ink in an overprint area 2 on one side surface of the torn support bottom layer of the insulating base material 1 to form a second overprint ink layer, simultaneously printing the conductive ink in the overprint area 2 on the first side surface, synchronously printing a conductive circuit on the first side surface by using the conductive ink, and baking for 40min at 125 ℃.
And measuring whether the lines of the two points of the MN are conducted or not by using a multifunctional multimeter. The result shows that the conductive circuits on the front and back sides of the insulating substrate are conducted. For the wide circuit on the film circuit board, when a plurality of communicating holes 3 with small apertures are adopted for conducting, the ink in the communicating holes 3 with small apertures is spread uniformly, and after drying and removing, the ink in the holes does not drop due to gravity, so that the communication of the upper surface circuit and the lower surface circuit of the film is realized.
Example 2
The printing method comprises the following steps: screen printing; model: an east-far printer; insulating base material: PET, thickness 0.1 mm; conductive ink: 910A conductive pure silver paste of Changxing; scraping: the scraper is yellow 80 degrees, and the angle is a round sharp knife; mesh number of screen printing plate: 200 meshes; printing speed: 350 PCS/h; printing pressure: 20N, and (3).
Presetting a circular overprinting area 2 at the connecting position of the conductive circuits on the two sides of the insulating base material 1, wherein the diameter of the circular overprinting area 2 is 4 mm; 5 communication holes 3 are uniformly and symmetrically arranged in the overprinting area 2, and the diameter of each communication hole 3 is 1 mm; a plurality of positioning holes for positioning the insulating base material 1 are further formed in the insulating base material 1; mounting a release film as a bottom supporting layer on one side surface of the insulating substrate 1; printing conductive ink in an overprint area 2 on the surface of one side of the insulating base material 1, which is far away from the bottom supporting layer, to form a first overprint ink layer; printing conductive ink in the overprint area 2 of the second side surface, simultaneously printing a conductive circuit of the second side surface on the second side surface by using the conductive ink, wherein the width of the conductive circuit is 3mm, and baking for 40min at 125 ℃; tearing off the bottom supporting layer; printing conductive ink in an overprint area 2 on one side surface of the torn support bottom layer of the insulating base material 1 to form a second overprint ink layer, simultaneously printing the conductive ink in the overprint area 2 on the first side surface, synchronously printing a conductive circuit on the first side surface by using the conductive ink, and baking for 40min at 125 ℃.
And measuring whether the lines of the two points of the MN are conducted or not by using a multifunctional multimeter. The result shows that the conductive circuits on the front and back sides of the insulating substrate are conducted. For the wide circuit on the film circuit board, when a plurality of communicating holes 3 with small apertures are adopted for conducting, the ink in the communicating holes 3 with small apertures is spread uniformly, and after drying and removing, the ink in the holes does not drop due to gravity, so that the communication of the upper surface circuit and the lower surface circuit of the film is realized.
Example 3
The printing method comprises the following steps: screen printing; model: an east-far printer; insulating base material: PI with the thickness of 1 mm; conductive ink: 910A conductive pure silver paste of Changxing; scraping: the scraper is yellow 80 degrees, and the angle is a round sharp knife; mesh number of screen printing plate: 380 meshes; printing speed: 450 PCS/h; printing pressure: 15N, and (3).
Presetting a circular overprinting area 2 at the connecting position of the conductive circuits on the two sides of the insulating base material 1, wherein the diameter of the circular overprinting area 2 is 5 mm; 15 communication holes 3 are uniformly and symmetrically arranged in the overprinting area 2, and the diameter of each communication hole 3 is 0.5 mm; 2 positioning holes for positioning the insulating base material 1 are further formed in the insulating base material 1; mounting a release film as a bottom supporting layer on one side surface of the insulating substrate 1; printing conductive ink in an overprint area 2 on the surface of one side of the insulating base material 1, which is far away from the bottom supporting layer, to form a first overprint ink layer; printing conductive ink in the overprint area 2 of the second side surface, simultaneously printing a conductive circuit on the second side surface by using the conductive ink, wherein the width of the conductive circuit is 2mm, and baking for 60min at 90 ℃; tearing off the bottom supporting layer; printing conductive ink in an overprint area 2 on the surface of one side of the torn support bottom layer of the insulating base material 1 to form a second overprint ink layer, simultaneously printing the conductive ink in the overprint area 2 on the surface of the first side, synchronously printing a conductive circuit on the surface of the first side by using the conductive ink, and baking for 60min at the temperature of 90 ℃.
And measuring whether the lines of the two points of the MN are conducted or not by using a multifunctional multimeter. The result shows that the conductive circuits on the front and back sides of the insulating substrate are conducted. For the wide circuit on the film circuit board, when a plurality of communicating holes 3 with small apertures are adopted for conducting, the ink in the communicating holes 3 with small apertures is spread uniformly, and after drying and removing, the ink in the holes does not drop due to gravity, so that the communication of the upper surface circuit and the lower surface circuit of the film is realized.
Example 4
The printing method comprises the following steps: screen printing; model: an east-far printer; insulating base material: PDMS with a thickness of 0.01 mm; conductive ink: 910A conductive pure silver paste of Changxing; scraping: the scraper is yellow 80 degrees, and the angle is a round sharp knife; mesh number of screen printing plate: 90 meshes; printing speed: 300 PCS/h; printing pressure: 30N.
Presetting a circular overprinting area 2 at the connecting position of the conductive circuits on the two sides of the insulating base material 1, wherein the diameter of the circular overprinting area 2 is 3 mm; 3 communication holes 3 are uniformly and symmetrically arranged in the overprinting area 2, and the diameter of each communication hole 3 is 1.5 mm; 2 positioning holes for positioning the insulating base material 1 are further formed in the insulating base material 1; mounting a release film as a bottom supporting layer on one side surface of the insulating substrate 1; printing conductive ink in an overprint area 2 on the surface of one side of the insulating base material 1, which is far away from the bottom supporting layer, to form a first overprint ink layer; printing conductive ink in the overprint area 2 of the second side surface, simultaneously printing a conductive circuit on the second side surface synchronously by using the conductive ink, wherein the width of the conductive circuit is 3mm, and baking for 30min at 160 ℃; tearing off the bottom supporting layer; printing conductive ink in an overprint area 2 on the surface of one side of the torn support bottom layer of the insulating base material 1 to form a second overprint ink layer, simultaneously printing the conductive ink in the overprint area 2 on the surface of the first side, synchronously printing a conductive circuit on the surface of the first side by using the conductive ink, and baking for 30min at the temperature of 160 ℃.
And measuring whether the lines of the two points of the MN are conducted or not by using a multifunctional multimeter. The result shows that the conductive circuits on the front and back sides of the insulating substrate are conducted. For the wide circuit on the film circuit board, when a plurality of communicating holes 3 with small apertures are adopted for conducting, the ink in the communicating holes 3 with small apertures is spread uniformly, and after drying and removing, the ink in the holes does not drop due to gravity, so that the communication of the upper surface circuit and the lower surface circuit of the film is realized.
Comparative example
The printing method comprises the following steps: screen printing; model: an east-far printer; insulating base material: PET, thickness 0.1 mm; conductive ink: 910A conductive pure silver paste of Changxing; scraping: the scraper is yellow 80 degrees, and the angle is a round sharp knife; mesh number of screen printing plate: 200 meshes; printing speed: 350 PCS/h; printing pressure: 20N, and (3).
Presetting a circular overprinting area 2 at the connecting position of the conductive circuits on the two sides of the insulating base material 1, wherein the diameter of the circular overprinting area 2 is 4 mm; 1 communicating hole 3 is drilled in the overprinting area 2, and the diameter of the communicating hole 3 is 2 mm; 2 positioning holes for positioning the insulating base material 1 are further formed in the insulating base material 1; mounting a release film as a bottom supporting layer on one side surface of the insulating substrate 1; printing conductive ink in an overprint area 2 on the surface of one side of the insulating base material 1, which is far away from the bottom supporting layer, to form a first overprint ink layer; printing conductive ink in the overprint area 2 of the second side surface, simultaneously printing a conductive circuit of the second side surface on the second side surface by using the conductive ink, wherein the width of the conductive circuit is 2mm, and baking for 40min at 125 ℃; tearing off the bottom supporting layer; printing conductive ink in an overprint area 2 on one side surface of the torn support bottom layer of the insulating base material 1 to form a second overprint ink layer, simultaneously printing the conductive ink in the overprint area 2 on the first side surface, synchronously printing a conductive circuit on the first side surface by using the conductive ink, and baking for 40min at 125 ℃.
And measuring whether the lines of the two points of the MN are conducted or not by using a multifunctional multimeter. The result shows that the conducting circuits on the front and back sides of the insulating substrate are broken and fail to conduct. For a wide circuit on a film circuit board, when 1 communication hole 3 with a large diameter is adopted for conducting, ink in the hole is not flatly spread due to the fact that the ink is easily accumulated at the center of the hole during hole filling, and when a bottom supporting layer is removed, the ink in the hole can fall off due to gravity.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (10)
1. A hole filling method for a film circuit board of a wide circuit is characterized by comprising the following steps:
A. presetting overprinting areas at the connecting parts of the conductive circuits on the two sides of the insulating base material; the thickness of the insulating base material is 0.01mm-1 mm;
B. printing a plurality of communication holes in the overprinting area; the diameter of the communicating hole is 0.5-1.5 mm;
C. mounting a bottom supporting layer on the surface of one side of the insulating base material;
D. printing conductive ink in an overprinting area on the surface of one side, away from the bottom supporting layer, of the insulating base material, and drying to form a first overprinting ink layer;
E. tearing off the bottom supporting layer;
F. and printing conductive ink in an overprinting area on the surface of one side of the torn support bottom layer of the insulating base material, drying to form a second overprinting ink layer, and mutually attaching and connecting the second overprinting ink layer and the first overprinting ink layer at the communicating hole.
2. The hole filling method according to claim 1, wherein in step D, the conductive ink is printed in the overprint area of the second side surface, and simultaneously the conductive lines of the second side surface are printed on the second side surface by the conductive ink and simultaneously dried; and step F, printing conductive ink in the overprint area of the first side surface, simultaneously printing a conductive circuit of the first side surface on the first side surface by using the conductive ink, and synchronously drying.
3. The hole filling method according to claim 1, wherein the overprint region is circular, and a diameter of the overprint region is 0-3 mm larger than a width of the conductive line.
4. A method according to claim 3, wherein the width of the conductive track is 2-4 mm.
5. The method of claim 4, wherein the number of the communication holes is 3 to 15.
6. A hole filling method according to claim 2, wherein in steps D and F, the conductive ink is conductive pure silver paste, and the mesh number of the printed screen is 90-380 mesh.
7. A hole filling method according to claim 2, wherein in steps D and F, the printing of the conductive ink is performed by screen printing at a printing speed of 300-450 PCS/h; the printing pressure is 15N-30N.
8. The method of claim 2, wherein in steps D and F, the drying temperature is 90-160 ℃; the drying time is 30min-60 min.
9. The hole filling method according to claim 1, wherein in step B, a plurality of positioning holes for positioning the insulating substrate are formed in the insulating substrate.
10. The method of claim 1, wherein the insulating substrate is PET, PI or PDMS; the bottom supporting layer is formed by release paper or release film.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811086287.9A CN110913581B (en) | 2018-09-18 | 2018-09-18 | Hole filling method for thin film circuit board of wide circuit |
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| CN201811086287.9A CN110913581B (en) | 2018-09-18 | 2018-09-18 | Hole filling method for thin film circuit board of wide circuit |
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| TWI389611B (en) * | 2010-05-26 | 2013-03-11 | Zhen Ding Technology Co Ltd | Device and method for stuffing printing ink into holes in printed circuit board |
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| JP6199084B2 (en) * | 2013-06-12 | 2017-09-20 | 富士機械製造株式会社 | Printing device |
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| CN104661434A (en) * | 2013-11-20 | 2015-05-27 | 昆山苏杭电路板有限公司 | Double-faced aluminum substrate manufacturing process |
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| CN103874327A (en) * | 2014-03-26 | 2014-06-18 | 中国科学院微电子研究所 | Copper-clad plate and manufacturing method thereof |
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