CN110913571A - Novel magnetically attractable circuit board and manufacturing method thereof - Google Patents
Novel magnetically attractable circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN110913571A CN110913571A CN201911233566.8A CN201911233566A CN110913571A CN 110913571 A CN110913571 A CN 110913571A CN 201911233566 A CN201911233566 A CN 201911233566A CN 110913571 A CN110913571 A CN 110913571A
- Authority
- CN
- China
- Prior art keywords
- insulating layer
- circuit board
- pad
- substrate
- hot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
Abstract
The invention discloses a novel magnetically-attractable circuit board, which comprises a substrate, wherein the substrate is made of a stainless iron material, an insulating layer is tightly hot-pressed and attached to the surface of the substrate, first bonding pads are embedded in the left side and the right side of the inside of the insulating layer, second bonding pads are arranged on the side edges of the first bonding pads, the second bonding pads are embedded in the insulating layer, copper sheets are tightly hot-pressed and attached to the surface of the insulating layer, and the copper sheets are respectively in contact with the first bonding pads and the second bonding pads; the manufacturing method of the novel magnetic circuit board comprises the following steps: s1, selecting a substrate material; s2, hot-pressing the insulating layer; s3, embedding a first pad and a second pad; s4, hot-pressing the copper sheet; compared with the existing circuit board, the novel magnetic circuit board increases the magnetic attraction property under the condition of not reducing the basic function of the existing circuit board, and transmits current signals through attracting magnetic products.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a novel magnetically attractable circuit board and a manufacturing method thereof.
Background
The name of the circuit board is: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, plays an important role in the batch production of fixed circuits and the optimization of the layout of electric appliances, but the existing circuit board has no characteristic of being attracted by a magnetic object and cannot meet the requirements of partial detachable use occasions.
Disclosure of Invention
The present invention aims to overcome the above-mentioned shortcomings and provide a technical solution to solve the above-mentioned problems.
Novel but circuit board is inhaled to magnetism, including the base plate, and the base plate is the nonrust iron material constitution, the inseparable hot pressing laminating in surface of base plate has the insulating layer, and the inside left and right sides of insulating layer inlays and is equipped with first pad, the side of first pad is equipped with the second pad, and inside the second pad inlays to be located the insulating layer, the inseparable hot pressing laminating in surface of insulating layer has the copper sheet, and the copper sheet contacts with first pad and second pad respectively.
The manufacturing method of the novel magnetically attractable circuit board is used for manufacturing the novel magnetically attractable circuit board and comprises the following steps:
s1, selecting a substrate material: selecting a stainless iron sheet as a component material of a substrate;
s2, hot-pressing the insulating layer: the substrate selected in S1 is placed in a hot press apparatus, and the surface of the substrate is covered with an insulating layer. The insulating layer is tightly attached to the surface of the substrate in a hot pressing mode through hot pressing equipment;
s3, embedding a first pad and a second pad: embedding a first bonding pad and a second bonding pad on the surface of the insulating layer thermally pressed and attached to the surface of the substrate in the S2 process;
s4, hot-pressing the copper sheet: and (4) performing hot-pressing and copper sheet laminating on the surface of the insulating layer embedded with the first bonding pad and the second bonding pad of S3 to form the novel magnetically attractable circuit board.
Compared with the prior art, the invention has the beneficial effects that: compared with the existing circuit board, the novel magnetically attractable circuit board increases the magnetic attraction property under the condition of not reducing the basic functions of the existing circuit board, and transmits current signals through attracting with a product with magnetism.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of a novel magnetically attractable circuit board.
Shown in the figure: 1. the circuit board comprises a substrate, 2, an insulating layer, 3, a copper sheet, 4, a first bonding pad, 5 and a second bonding pad.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, in the embodiment of the present invention, the novel magnetically attractable circuit board includes a substrate 1, and the substrate 1 is made of a stainless steel material, so that the circuit board manufactured by the substrate 1 has magnetic attractability, an insulating layer 2 is tightly attached to the surface of the substrate 1 by hot pressing, first pads 4 are embedded on the left and right sides inside the insulating layer 2, second pads 5 are disposed on the side edges of the first pads 4, the second pads 5 are embedded inside the insulating layer 2, copper sheets 3 are tightly attached to the surface of the insulating layer 2 by hot pressing, and the copper sheets 3 are respectively in contact with the first pads 4 and the second pads 5.
The manufacturing method of the novel magnetically attractable circuit board is used for manufacturing the novel magnetically attractable circuit board and comprises the following steps:
s1, selecting a substrate material: selecting a stainless iron sheet as a component material of a substrate;
s2, hot-pressing the insulating layer: the substrate selected in S1 is placed in a hot press apparatus, and the surface of the substrate is covered with an insulating layer. The insulating layer is tightly attached to the surface of the substrate in a hot pressing mode through hot pressing equipment;
s3, embedding a first pad and a second pad: embedding a first bonding pad and a second bonding pad on the surface of the insulating layer thermally pressed and attached to the surface of the substrate in the S2 process;
s4, hot-pressing the copper sheet: and (4) performing hot-pressing and copper sheet laminating on the surface of the insulating layer embedded with the first bonding pad and the second bonding pad of S3 to form the novel magnetically attractable circuit board.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (2)
1. Novel circuit board can be inhaled to magnetism, a serial communication port, including the base plate, and the base plate is the nonrust iron material constitution, the inseparable hot pressing laminating in surface of base plate has the insulating layer, and the inside left and right sides of insulating layer inlays and is equipped with first pad, the side of first pad is equipped with the second pad, and inside the second pad inlays and locates the insulating layer, the inseparable hot pressing laminating in surface of insulating layer has the copper sheet, and the copper sheet contacts with first pad and second pad respectively.
2. A manufacturing method of a novel magnetically attractable circuit board, which is used for manufacturing the novel magnetically attractable circuit board of claim 1, and is characterized by comprising the following steps:
s1, selecting a substrate material: selecting a stainless iron sheet as a component material of a substrate;
s2, hot-pressing the insulating layer: the substrate selected in S1 is placed in a hot press apparatus, and the surface of the substrate is covered with an insulating layer. The insulating layer is tightly attached to the surface of the substrate in a hot pressing mode through hot pressing equipment;
s3, embedding a first pad and a second pad: embedding a first bonding pad and a second bonding pad on the surface of the insulating layer thermally pressed and attached to the surface of the substrate in the S2 process;
s4, hot-pressing the copper sheet: and (4) performing hot-pressing and copper sheet laminating on the surface of the insulating layer embedded with the first bonding pad and the second bonding pad of S3 to form the novel magnetically attractable circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911233566.8A CN110913571A (en) | 2019-12-05 | 2019-12-05 | Novel magnetically attractable circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911233566.8A CN110913571A (en) | 2019-12-05 | 2019-12-05 | Novel magnetically attractable circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110913571A true CN110913571A (en) | 2020-03-24 |
Family
ID=69822624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911233566.8A Pending CN110913571A (en) | 2019-12-05 | 2019-12-05 | Novel magnetically attractable circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110913571A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101849448A (en) * | 2007-06-29 | 2010-09-29 | 上村工业株式会社 | Wiring substrate manufacturing method |
| CN101888748A (en) * | 2009-05-14 | 2010-11-17 | 欣兴电子股份有限公司 | Manufacturing method of circuit board |
| JP2017208372A (en) * | 2016-05-16 | 2017-11-24 | Dic株式会社 | Formation method of conductive pattern and manufacturing method of electronic device |
-
2019
- 2019-12-05 CN CN201911233566.8A patent/CN110913571A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101849448A (en) * | 2007-06-29 | 2010-09-29 | 上村工业株式会社 | Wiring substrate manufacturing method |
| CN101888748A (en) * | 2009-05-14 | 2010-11-17 | 欣兴电子股份有限公司 | Manufacturing method of circuit board |
| JP2017208372A (en) * | 2016-05-16 | 2017-11-24 | Dic株式会社 | Formation method of conductive pattern and manufacturing method of electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110418508B (en) | Manufacturing method of copper substrate circuit board | |
| CN105896010B (en) | A kind of circulator | |
| TWI587758B (en) | Multilayer wiring board | |
| HK1060399A1 (en) | Planarizing interposer | |
| KR900004722B1 (en) | Hybrid intergrated circuit | |
| CN110519910B (en) | PCB detection method by bonding heat dissipation medium through conductive medium and PCB | |
| MY137304A (en) | Jig for holding and conveyance, and holding and conveyance method | |
| CN110913571A (en) | Novel magnetically attractable circuit board and manufacturing method thereof | |
| CN102083272B (en) | Circuit board with grounding structure | |
| CN103841767A (en) | Transparent printed circuit board and manufacturing method thereof | |
| CN106852034A (en) | The processing method of the high-accuracy auto lamp printed board of high heat conduction embedded ceramic piece | |
| CN106028642A (en) | TR assembly multilayer circuit board and processing technology thereof | |
| CN109219257A (en) | A kind of copper-clad plate and its production technology of application reversion copper foil material | |
| CN108419359A (en) | A kind of single-sided circuit board of good heat dissipation effect | |
| CN207201075U (en) | Thermoelectricity separates Copper based electrical plate | |
| CN208490034U (en) | A kind of soft or hard combination core plate of projector | |
| CN208016103U (en) | A kind of goldfinger bevel circuit board | |
| JP7262183B2 (en) | Wiring circuit board and manufacturing method thereof | |
| CN108492976B (en) | Coil structure and preparation method of composite coil structure | |
| CN208210414U (en) | A kind of switching FPC structure of plug-in type | |
| CN111212521A (en) | Multilayer circuit board with embedded plane resistance ceramic powder filled with hydrocarbon resin | |
| CN204733462U (en) | A kind of circuit board based on ceramic material | |
| CN201252676Y (en) | Flexible circuit board for flat mini-size motor | |
| CN207947947U (en) | A kind of replacement welding resistance press mold structural circuit plate | |
| CN203015285U (en) | Selective local electroplating thick gold printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |