CN110911286A - Preparation method of waterproof power supply based on base coating process - Google Patents
Preparation method of waterproof power supply based on base coating process Download PDFInfo
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- CN110911286A CN110911286A CN201911216523.9A CN201911216523A CN110911286A CN 110911286 A CN110911286 A CN 110911286A CN 201911216523 A CN201911216523 A CN 201911216523A CN 110911286 A CN110911286 A CN 110911286A
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- 238000000576 coating method Methods 0.000 title claims abstract description 26
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 239000003292 glue Substances 0.000 claims abstract description 60
- 238000005507 spraying Methods 0.000 claims abstract description 30
- 238000010438 heat treatment Methods 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 8
- 230000007547 defect Effects 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000011049 filling Methods 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 3
- 239000002585 base Substances 0.000 abstract description 13
- 230000006378 damage Effects 0.000 abstract description 6
- 239000012458 free base Substances 0.000 abstract description 3
- 230000036541 health Effects 0.000 abstract description 3
- 239000000565 sealant Substances 0.000 description 29
- 230000000694 effects Effects 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000004078 waterproofing Methods 0.000 description 4
- 230000001680 brushing effect Effects 0.000 description 3
- 230000037452 priming Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 239000012855 volatile organic compound Substances 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 polysiloxane Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001932 seasonal effect Effects 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention discloses a preparation method of a waterproof power supply based on a base coating process, which comprises the following steps: assembling, namely assembling all the prepared functional components, the circuit board and the power supply shell; testing, namely testing each assembled functional component, circuit board and power supply shell; spraying, namely spraying the surfaces of the tested functional components and circuit boards and the inner side of the power supply shell; airing, namely placing all the sprayed functional components, the circuit board and the power supply shell on a ventilated operation line for natural airing; and (3) glue pouring, namely performing quantitative glue pouring on the dried product by using a glue pouring machine. Has the advantages that: the base coat adopted by the invention belongs to a solvent-free base coat, so that the harm to the environment is reduced, the problem of potential safety hazard is also reduced, and meanwhile, the harm to the health of workers is not brought.
Description
Technical Field
The invention relates to the field of preparation of waterproof power supplies of a base coating process, in particular to a preparation method of a waterproof power supply based on a base coating process.
Background
Society develops rapidly, and energy resources consume a large amount, and greenhouse effect causes climate deterioration. In order to respond to the national requirements of energy conservation, emission reduction and other environmental protection, the LED power supply has high efficiency, long service life, small volume and light weight, meets the requirements of times, gradually occupies a main position in the market, simultaneously the market has gradually improved waterproof requirements on the power supply so as to prolong the service life of the power supply, and manufacturers need to develop towards automation, improve the production efficiency, save energy and reduce emission. Due to the wide range of LED power applications and long term reliability requirements for harsh environments, LED power supplies must have excellent moisture and water resistance.
In the waterproof design of the power supply, besides the necessary structural waterproofing (for example, using a rubber gasket/O-ring, joint sealant, etc.), it is most common to adopt an organic silicon pouring sealant to achieve the long-term waterproofing of the power supply, and according to the type of the organic silicon pouring sealant, the waterproof pouring sealant process includes the following types:
1. condensed pouring sealant (the A/B sealant is usually mixed in a ratio of 10: 1 or 5: 1, etc.), as shown in FIG. 2, the A sealant and the B sealant are defoamed, mixed uniformly in a mixer, poured into a power supply box, and then cured at room temperature. The pouring sealant has good bonding performance, and can form good bonding with a power supply device and a shell at normal temperature so as to achieve excellent waterproof effect, but the process has the following defects:
(1) the condensed pouring sealant is composed of hydroxyl-terminated polysiloxane, alkoxy cross-linking agent, adhesive and catalyst, wherein reversion and degradation are easy to occur in a high-temperature sealing environment, so that a liquid or gel form after reversion is generated near a heating component, the physical sealing waterproof effect is lost, and a power supply fails;
(2) the mixing proportion of the A/B components is strict, the production control requirement is high, the situation that the glue is not dry is easy to occur, the correlation between the curing speed and the seasonal temperature is strong, and the quality control is complex;
(3) the glue has strong polarity and may cause corrosion negative effects on sensitive parts;
(4) the condensed pouring sealant releases small molecules in the curing process, can form larger shrinkage stress, and generates strain and other abnormalities on sensitive components, thereby generating power supply performance output abnormity.
2. The pouring of the addition type pouring sealant (the A/B sealant is usually mixed in a ratio of 1: 1) and the base coating is generally divided into 2 steps, as shown in FIG. 3: the first step is that the power supply device is coated with a base coat by brushing, spraying or dipping, and then naturally dried; the second step is glue filling: and (3) defoaming the glue A and the glue B, uniformly mixing the glue A and the glue B in a mixer, pouring the mixture into a power supply box, and curing at room temperature or by heating (an oven or a drying tunnel can be adopted). The water resistance of the pouring sealant is realized through the primary coating, because the addition type pouring sealant has no adhesiveness.
An effective solution to the problems in the related art has not been proposed yet.
Disclosure of Invention
Aiming at the problems in the related art, the invention provides a preparation method of a waterproof power supply based on a base coating process, so as to overcome the technical problems in the prior related art.
Therefore, the invention adopts the following specific technical scheme:
a preparation method of a waterproof power supply based on a base coating process comprises the following steps:
assembling, namely assembling all the prepared functional components, the circuit board and the power supply shell;
testing, namely testing each assembled functional component, circuit board and power supply shell;
spraying, namely spraying the surfaces of the tested functional components and circuit boards and the inner side of the power supply shell;
airing, namely placing all the sprayed functional components, the circuit board and the power supply shell on a ventilated operation line for natural airing;
glue pouring, namely performing quantitative glue pouring on the dried product by using a glue pouring machine;
curing, namely placing the product subjected to glue pouring in a room for natural curing or placing the product in a tunnel furnace for heating and curing;
and (5) finishing the product, and outputting the finished product of the waterproof power supply after the manufacturing process is finished.
Further, spraying, in the process of spraying the surfaces of the tested functional components and circuit boards and the inner side of the power supply shell: the surface of each tested functional component and circuit board and the inner side of the power supply shell can be brushed or dipped.
Further, spraying, namely spraying the surfaces of the tested functional components and circuit boards and the inner side of the power supply shell; before the surfaces of the functional components and the circuit board and the inner side of the power supply shell are sprayed, the surfaces of the functional components and the circuit board and the inner side of the power supply shell need to be kept clean and dry.
Further, spraying, namely spraying the surfaces of the tested functional components and circuit boards and the inner side of the power supply shell; and spraying the surfaces of the functional components and the circuit board and the inner side of the power supply shell for 1-2 times. The thickness of the spray is generally between 10 and 100 microns.
Further, airing, namely placing the sprayed functional components, the circuit board and the power supply shell on a ventilated operation line, and naturally airing; the natural drying time is 10-60 minutes.
Further, glue pouring, namely performing quantitative glue pouring on the dried product by using a glue pouring machine; need use the management and control stirring, avoid introducing the bubble and influence waterproof performance.
Further, glue pouring, namely performing quantitative glue pouring on the dried product by using a glue pouring machine; after the glue filling operation is finished, in order to ensure that the glue is wetted and flows to a specified position, the defect of no glue cavity is avoided, the water resistance is poor, and online vacuumizing is needed.
Further, curing, namely placing the product subjected to glue pouring indoors for natural curing or placing the product in a tunnel furnace for heating and curing; the time for indoor natural curing is 4-24 hours.
Further, curing, namely placing the product subjected to glue pouring indoors for natural curing or placing the product in a tunnel furnace for heating and curing; the time for heating and curing in the tunnel furnace is 5-20 minutes.
Further, curing, namely placing the product subjected to glue pouring indoors for natural curing or placing the product in a tunnel furnace for heating and curing; the temperature for heating and curing in the tunnel furnace is 60-80 ℃.
The invention has the beneficial effects that:
1. the base coat adopted by the invention belongs to a solvent-free base coat, so that the release of volatile organic compounds and the volatilization of a large amount of solvents are effectively reduced, the harm to the environment is reduced, further, safety measures such as ventilation and static electricity prevention are not required to be prepared in use, the problem of potential safety hazard is reduced, and meanwhile, the harm to the health of workers is avoided; in addition, the production process is simplified, and the working efficiency is improved.
2. The primary coating process can complete the curing process at indoor temperature without heating and drying; meanwhile, the embedding glue curing process is used for heating and curing in a tunnel furnace, and the bonding and water proofing can be realized only at 60-80 ℃.
3. The addition type pouring sealant disclosed by the invention is resistant to high and low temperatures, good in high-temperature and high-humidity performance, and free of reversion under the high-temperature sealing condition, the power device, the shell and the addition type pouring sealant are connected together by the primary coating in a bridging manner, so that the waterproof, stable and reliable effects can be realized, and the defect of reversion of the condensation pouring sealant can be avoided; meanwhile, the mixing ratio of the addition type pouring sealant is 1:1, so that the requirement on the ratio control precision is not high, the mixing construction requirement of the pouring sealant is simple, the pouring sealant can be heated and cured, and the automatic and efficient production is easy to realize.
4. The base coating process can adopt various construction modes such as spraying, brushing, dip-coating and the like, and can carry out waterproof operation on various types of LED power supplies.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a flow chart of a method of making a waterproof power supply based on a priming process according to an embodiment of the present invention;
FIG. 2 is a flow chart of the condensed pouring sealant;
FIG. 3 is a flow chart of the additive pouring sealant.
Detailed Description
For further explanation of the various embodiments, the drawings which form a part of the disclosure and which are incorporated in and constitute a part of this specification, illustrate embodiments and, together with the description, serve to explain the principles of operation of the embodiments, and to enable others of ordinary skill in the art to understand the various embodiments and advantages of the invention, and, by reference to these figures, reference is made to the accompanying drawings, which are not to scale and wherein like reference numerals generally refer to like elements.
According to the embodiment of the invention, a preparation method of a waterproof power supply based on a priming coating process is provided.
Referring to the drawings and the detailed description, the invention will be further described, as shown in fig. 1, according to an embodiment of the invention, a preparation method of a waterproof power supply based on a priming process comprises the following steps:
step S101, assembling, namely assembling all prepared functional components, circuit boards and power supply shells;
step S102, testing, namely testing each assembled functional component, circuit board and power supply shell;
step S103, spraying, namely spraying the surfaces of the tested functional components and circuit boards and the inner side of the power supply shell;
step S104, airing, namely placing the sprayed functional components, the circuit board and the power supply shell on a ventilated operation line for natural airing;
s105, glue pouring, namely performing quantitative glue pouring on the dried product by using a glue pouring machine;
s106, curing, namely placing the product subjected to glue pouring indoors for natural curing or placing the product in a tunnel furnace for heating and curing;
and S107, outputting a finished waterproof power supply after finishing the manufacturing process of the finished product.
In one embodiment, in the process of spraying, the surfaces of the tested functional components and circuit boards and the inner side of the power supply shell are: the surface of each tested functional component and circuit board and the inner side of the power supply shell can be brushed or dipped.
In one embodiment, spraying, the surfaces of the tested functional components and circuit boards and the inner side of the power supply shell are sprayed; before the surfaces of the functional components and the circuit board and the inner side of the power supply shell are sprayed, the surfaces of the functional components and the circuit board and the inner side of the power supply shell need to be kept clean and dry.
In one embodiment, spraying, the surfaces of the tested functional components and circuit boards and the inner side of the power supply shell are sprayed; and spraying the surfaces of the functional components and the circuit board and the inner side of the power supply shell for 1-2 times. The thickness of the spray is generally between 10 and 100 microns.
In one embodiment, drying, namely placing all the sprayed functional components, the circuit board and the power supply shell on a ventilated operation line, and naturally drying; the natural drying time is 10-60 minutes.
In one embodiment, the glue is poured, and the dried product is subjected to quantitative glue pouring by using a glue pouring machine; need use the management and control stirring, avoid introducing the bubble and influence waterproof performance.
In one embodiment, the glue is poured, and the dried product is subjected to quantitative glue pouring by using a glue pouring machine; after the glue filling operation is finished, in order to ensure that the glue is wetted and flows to a specified position, the defect of no glue cavity is avoided, the water resistance is poor, and online vacuumizing is needed.
In one embodiment, curing, the product after glue pouring is placed in a room for natural curing or placed in a tunnel furnace for heating and curing; the time for indoor natural curing is 4-24 hours.
In one embodiment, curing, the product after glue pouring is placed in a room for natural curing or placed in a tunnel furnace for heating and curing; the time for heating and curing in the tunnel furnace is 5-20 minutes.
In one embodiment, curing, the product after glue pouring is placed in a room for natural curing or placed in a tunnel furnace for heating and curing; the temperature for heating and curing in the tunnel furnace is 60-80 DEG C
In conclusion, by means of the technical scheme, the base coat adopted by the invention belongs to a solvent-free base coat, so that the release of volatile organic compounds and the volatilization of a large amount of solvents are effectively reduced, the harm to the environment is reduced, further, safety measures such as ventilation and static electricity prevention are not required to be provided in the process of use, the problem of potential safety hazard is reduced, and meanwhile, the harm to the health of working personnel is avoided; in addition, the production process is simplified, and the working efficiency is improved. The primary coating process can complete the curing process at indoor temperature without heating and drying; meanwhile, the embedding glue curing process is used for heating and curing in a tunnel furnace, and the bonding and water proofing can be realized only at 60-80 ℃. The addition type pouring sealant disclosed by the invention is resistant to high and low temperatures, good in high-temperature and high-humidity performance, and free of reversion under the high-temperature sealing condition, the power device, the shell and the addition type pouring sealant are connected together by the primary coating in a bridging manner, so that the waterproof, stable and reliable effects can be realized, and the defect of reversion of the condensation pouring sealant can be avoided; meanwhile, the mixing ratio of the addition type pouring sealant is 1:1, so that the requirement on the ratio control precision is not high, the mixing construction requirement of the pouring sealant is simple, the pouring sealant can be heated and cured, and the automatic and efficient production is easy to realize. The base coating process can adopt various construction modes such as spraying, brushing, dip-coating and the like, and can carry out waterproof operation on various types of LED power supplies.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. The preparation method of the waterproof power supply based on the base coating process is characterized by comprising the following steps of:
assembling, namely assembling all the prepared functional components, the circuit board and the power supply shell;
testing, namely testing each assembled functional component, circuit board and power supply shell;
spraying, namely spraying the surfaces of the tested functional components and circuit boards and the inner side of the power supply shell;
airing, namely placing all the sprayed functional components, the circuit board and the power supply shell on a ventilated operation line for natural airing;
glue pouring, namely performing quantitative glue pouring on the dried product by using a glue pouring machine;
curing, namely placing the product subjected to glue pouring in a room for natural curing or placing the product in a tunnel furnace for heating and curing;
and (5) finishing the product, and outputting the finished product of the waterproof power supply after the manufacturing process is finished.
2. The preparation method of the waterproof power supply based on the base coating process as claimed in claim 1, wherein the spraying is performed during the spraying process of the surfaces of the tested functional components and circuit boards and the inner side of the power supply shell: the surface of each tested functional component and circuit board and the inner side of the power supply shell can be brushed or dipped.
3. The preparation method of the waterproof power supply based on the base coating process according to claim 1, characterized in that spraying is carried out in the process of spraying the surfaces of the tested functional components and circuit boards and the inner side of the power supply shell; before the surfaces of the functional components and the circuit board and the inner side of the power supply shell are sprayed, the surfaces of the functional components and the circuit board and the inner side of the power supply shell need to be kept clean and dry.
4. The preparation method of the waterproof power supply based on the base coating process according to claim 1, characterized in that spraying is carried out in the process of spraying the surfaces of the tested functional components and circuit boards and the inner side of the power supply shell; and (3) spraying the surfaces of the functional components and the circuit board and the inner side of the power supply shell for 1-2 times, wherein the spraying thickness is generally 10-100 micrometers.
5. The preparation method of the waterproof power supply based on the base coating process according to claim 1, characterized in that the waterproof power supply is dried in the air, and the sprayed functional components, the circuit board and the power supply shell are placed on a ventilated operation line and are dried in the air naturally; the natural drying time is 10-60 minutes.
6. The preparation method of the waterproof power supply based on the base coating process as claimed in claim 1, wherein glue is poured, and the dried product is subjected to quantitative glue pouring by using a glue pouring machine; need use the management and control stirring, avoid introducing the bubble and influence waterproof performance.
7. The preparation method of the waterproof power supply based on the base coating process as claimed in claim 1, wherein glue is poured, and the dried product is subjected to quantitative glue pouring by using a glue pouring machine; after the glue filling operation is finished, in order to ensure that the glue is wetted and flows to a specified position, the defect of no glue cavity is avoided, the water resistance is poor, and online vacuumizing is needed.
8. The preparation method of the waterproof power supply based on the base coating process according to claim 1, wherein the curing step comprises the steps of placing the product after glue pouring indoors for natural curing or placing the product in a tunnel furnace for heating and curing; the time for indoor natural curing is 4-24 hours.
9. The preparation method of the waterproof power supply based on the base coating process according to claim 1, wherein the curing step comprises the steps of placing the product after glue pouring indoors for natural curing or placing the product in a tunnel furnace for heating and curing; the time for heating and curing in the tunnel furnace is 5-20 minutes.
10. The preparation method of the waterproof power supply based on the base coating process according to claim 1, wherein the curing step comprises the steps of placing the product after glue pouring indoors for natural curing or placing the product in a tunnel furnace for heating and curing; the temperature for heating and curing in the tunnel furnace is 60-80 ℃.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911216523.9A CN110911286A (en) | 2019-12-02 | 2019-12-02 | Preparation method of waterproof power supply based on base coating process |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911216523.9A CN110911286A (en) | 2019-12-02 | 2019-12-02 | Preparation method of waterproof power supply based on base coating process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114364221A (en) * | 2021-12-31 | 2022-04-15 | 苏州市博电云科能源科技有限公司 | Power supply, method for manufacturing the same, and apparatus for manufacturing the same |
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| CN101262757A (en) * | 2008-04-09 | 2008-09-10 | 艾默生网络能源有限公司 | Tool for filling glue of power module and filling method |
| CN103108493A (en) * | 2013-02-25 | 2013-05-15 | 上海夏普电器有限公司 | Damp-proof processing method of electronic circuit board |
| CN103219447A (en) * | 2013-03-20 | 2013-07-24 | 深圳雷曼光电科技股份有限公司 | TOP-LED packaging device and preparation method thereof |
| CN104812193A (en) * | 2014-01-24 | 2015-07-29 | 台达电子企业管理（上海）有限公司 | Encapsulated power supply |
-
2019
- 2019-12-02 CN CN201911216523.9A patent/CN110911286A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101262757A (en) * | 2008-04-09 | 2008-09-10 | 艾默生网络能源有限公司 | Tool for filling glue of power module and filling method |
| CN103108493A (en) * | 2013-02-25 | 2013-05-15 | 上海夏普电器有限公司 | Damp-proof processing method of electronic circuit board |
| CN103219447A (en) * | 2013-03-20 | 2013-07-24 | 深圳雷曼光电科技股份有限公司 | TOP-LED packaging device and preparation method thereof |
| CN104812193A (en) * | 2014-01-24 | 2015-07-29 | 台达电子企业管理（上海）有限公司 | Encapsulated power supply |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114364221A (en) * | 2021-12-31 | 2022-04-15 | 苏州市博电云科能源科技有限公司 | Power supply, method for manufacturing the same, and apparatus for manufacturing the same |
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