CN114364221A - Power supply, method for manufacturing the same, and apparatus for manufacturing the same - Google Patents

Power supply, method for manufacturing the same, and apparatus for manufacturing the same Download PDF

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Publication number
CN114364221A
CN114364221A CN202111657749.XA CN202111657749A CN114364221A CN 114364221 A CN114364221 A CN 114364221A CN 202111657749 A CN202111657749 A CN 202111657749A CN 114364221 A CN114364221 A CN 114364221A
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CN
China
Prior art keywords
power supply
shell
manufacturing
filling
pcb assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111657749.XA
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Chinese (zh)
Inventor
王越天
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Yundian Electronic Manufacturing Co ltd
Original Assignee
Suzhou Bodian Yunke Energy Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Bodian Yunke Energy Technology Co ltd filed Critical Suzhou Bodian Yunke Energy Technology Co ltd
Priority to CN202111657749.XA priority Critical patent/CN114364221A/en
Publication of CN114364221A publication Critical patent/CN114364221A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
    • B05D3/065—After-treatment
    • B05D3/067—Curing or cross-linking the coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/06—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
    • B05D5/061—Special surface effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)

Abstract

The application provides a power supply, a manufacturing method thereof and a manufacturing device of the power supply, comprising the following steps: assembling, namely assembling the parts and the PCB into a whole; and (5) spraying paint, namely spraying three-proofing paint on the surface of the assembled part and the PCB. The invention solves the problem of protecting electronic parts and electronic circuits of power supply products in a liquid cooling environment, greatly reduces the heat dissipation space while quickly dissipating heat, greatly reduces the volume of the power supply products, reduces energy consumption, improves functional efficiency, enables the obtained power supply to efficiently dissipate heat in high-load work and prevents a circuit board from being corroded by cooling liquid.

Description

Power supply, method for manufacturing the same, and apparatus for manufacturing the same
Technical Field
The application relates to the technical field related to circuit protection, in particular to a power supply, a manufacturing method thereof and a manufacturing device of the power supply.
Background
At present, the cooling mode widely adopted in the electronic industry is air cooling, and the defects of the cooling mode are that huge heat dissipation space needs to be occupied, the energy consumption is high, and the efficiency is low, so that the liquid cooling mode with higher heat dissipation efficiency, smaller space occupation and lower energy consumption is one of research hotspots in the industry.
Disclosure of Invention
The purpose of the present application is to provide a power supply using liquid cooling as a heat dissipation method, a method for manufacturing the same, and an apparatus for manufacturing the same.
In order to achieve the purpose, the application provides the following technical scheme:
a method of manufacturing a power supply, comprising the steps of:
assembling: assembling the electronic part and the PCB into a whole to form a PCB assembly;
painting: and spraying three-proofing paint on the whole surface of the PCB assembly.
In some embodiments of the present application, in the painting step, the automatic painting operation is performed using the following process parameters: the spraying pressure is 0.4-0.8 MPa, the spraying speed is 80-200 m/s, the atomization range is 10-15 mm, and the dry film thickness is 70-120 mu m.
In some embodiments of the present application, the painting step is followed by a curing step, and the painted PCB assembly is placed into an automatic UV oven for curing.
In some embodiments of the present application, in the curing step, the following process parameters are used for the curing operation: the curing speed is 0.8-1.2 m/min, the curing energy is 1200-2500 mJ, the curing time is 3-10 s, and the ultraviolet lamp with the wavelength of 360-370 nm is adopted for irradiation.
In some embodiments of the present application, a housing sealing step is further included after the curing step, and the cured PCB assembly is sealed in the housing by using an inclined assembly mechanism, so as to obtain a semi-finished product.
In some embodiments of the present application, after the step of sealing the housing, a filling step is further included, in which a filling diversion mechanism is adopted to be abutted with the semi-finished product and a cooling liquid is filled into the semi-finished product, so as to obtain the power supply.
In some embodiments of the present application, the tri-proof paint is a urethane acrylate; the cooling fluid is available under the trademark FC-40 from 3M company in the United states.
In some embodiments of the present application, 0.1-0.5% by mass of a phosphor is doped into the three-proofing paint.
In some embodiments of the application, the tri-proof paint is brand of letter friend, and model number is UV3342 LV-80H; or the three-proofing paint is BT in the brand and BT51-00UV in the model.
In order to achieve the above purpose, the present application further provides a technical solution:
a power supply comprises a shell, a PCB assembly, cooling liquid and three-proofing paint;
the three-proofing paint is sprayed on the surface of the PCB assembly;
the cooling liquid is in contact with the shell and the PCB assembly;
the power supply is obtained by the method for manufacturing the power supply.
In order to achieve the above purpose, the present application further provides a technical solution:
a manufacturing device of a power supply is used for executing the manufacturing method of the power supply, and comprises an inclined assembling mechanism;
the inclined assembling mechanism comprises a chassis, a supporting frame and a supporting plate;
the base plate is rectangular and is provided with a positioning protrusion;
one end of the supporting frame is clamped on the positioning protrusion, the other end of the supporting frame supports the supporting plate, and an inclined included angle is formed between the supporting plate and the chassis;
the shell comprises a first shell and a second shell, the first shell is fixed on the supporting plate, the cured PCB assembly is installed in the first shell, the second shell is butted with the first shell, and the first shell and the second shell form a sealed shell to seal the PCB assembly in the sealed shell.
In some embodiments of the present application, the chassis is provided with a plurality of the positioning protrusions, and the supporting frame is supported by different positioning protrusions to form different angles.
In some embodiments of the present application, a rotating plate is further disposed on the supporting plate; the rotating plate is fixed on the supporting plate through a rotating shaft, and the rotating plate rotates relative to the supporting plate.
In some embodiments of the present application, a fixing block is disposed on the rotating plate, and the fixing block defines a position of the first housing.
In some embodiments of the present application, the manufacturing apparatus of the power supply further comprises a filling diversion mechanism;
the shell is provided with a screw hole and a blocking piece;
the filling flow guide mechanism is connected with the shell through the screw hole;
the filling guide mechanism is internally provided with a guide hole, the guide hole is connected with a liquid filling gun, cooling liquid passes through the liquid filling gun, the guide hole and the screw hole enter the power supply, and the filling guide mechanism is removed after filling is finished and the plugging piece is used for plugging the screw hole.
In some embodiments of the present application, an outer peripheral surface of the filling guide mechanism in the flow direction of the coolant is partially a cylindrical surface and partially a hexagonal prism surface;
and the corresponding first end surface of the hexagonal prism surface part is lower than the corresponding second end surface of the cylindrical surface part; the first end face is matched with the liquid filling gun.
The invention has the beneficial effects that:
1. the protection problem of power supply product to electronic part and electronic circuit under the liquid cooling environment has been solved, has reduced the heat dissipation space greatly when quick heat dissipation, and the volume that the department made power supply product reduces greatly, reduces the energy consumption, and it is high to improve functional efficiency, makes gained power can high-efficient heat dissipation and make the circuit board can not corroded by the coolant liquid in high load work.
2. The problem of power supply product application and compatibility under UV three proofings lacquer and 3M FC-40 coolant liquid environment is solved, can carry out permanent normal protection in the passenger supplies the radiating fluid of 3M FC-40, the compatibility is strong and make power supply product in the use more high-efficient, more rationality, have more protectiveness, lower cost.
3. The hardness and thickness of the solidified three-proofing paint can meet the requirements of use protection, low-cost and high-efficiency production can be realized, the process is mature, and the flow is simple.
4. The fluorescent powder is doped into the three-proofing paint, so that a spraying area can be displayed, and the spraying work is convenient to carry out.
5. The inclined assembly mechanism can adjust the inclined angle at a plurality of points within the range of 30-90 degrees, is provided with a rotating plate which can rotate by 360 degrees, can provide a plurality of support angles so as to facilitate assembly work, and is favorable for the PCB to be fixedly, hermetically and coated by the metal shell.
6. The filling diversion mechanism is matched with the liquid filling gun to prevent the liquid filling gun from generating foolproof effects such as rotation, deflection and the like, thereby preventing the cooling liquid from overflowing.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view of a power supply;
FIG. 2 is a schematic structural view of a tilt assembly mechanism;
FIG. 3 is a schematic structural diagram of a filling diversion mechanism;
fig. 4 is a schematic structural view of the blocking member.
The main reference numbers in the drawings accompanying the present specification are as follows:
1-a shell; 2-a PCB assembly; 3-a chassis; 4-a support frame; 5-a support plate; 6-positioning the protrusion; 7-rotating plate; 8, fixing blocks; 9-filling and guiding mechanism; 10-diversion holes; 11-obstruction piece.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely below, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The present application provides a power supply, a method of manufacturing the same, and an apparatus for manufacturing the same, which will be described in detail below. The order of description in the following examples is not intended to limit the preferred order of the examples of the present application. In the following embodiments, descriptions of the various embodiments are focused, and reference may be made to related descriptions of other embodiments for parts that are not described in detail in a certain embodiment.
A method of manufacturing a power supply, comprising the steps of:
assembling: assembling the electronic part and the PCB into a whole to form a PCB assembly;
painting: and spraying three-proofing paint on the whole surface of the PCB assembly.
In some embodiments of the present application, in the painting step, the automatic painting operation is performed using the following process parameters: the spraying pressure is 0.4-0.8 MPa, the spraying speed is 80-200 m/s, the atomization range is 10-15 mm, and the dry film thickness is 70-120 mu m.
In some embodiments of the present application, in the paint spraying step, the spraying pressure may be 0.5 to 0.7Mpa, or 0.55 to 0.60Mpa or 0.58 to 0.64 Mpa.
In some embodiments of the present application, in the spraying step, the spraying speed may be 95-180 m/s, or 120-150 m/s or 140-164 m/s.
In some embodiments of the present application, in the spraying step, the atomization range adopted may be 11-14 mm, and may also be 12-13 mm or 12.5-13.7 mm.
In some embodiments of the present application, in the spraying step, the dry film thickness may be 85 to 110 μm, or 90 to 106 μm, or 95 to 102 μm.
In some embodiments of the present application, the painting step is followed by a curing step, and the painted PCB assembly is placed into an automatic UV oven for curing.
In some embodiments of the present application, in the curing step, the following process parameters are used for the curing operation: the curing speed is 0.8-1.2 m/min, the curing energy is 1200-2500 mJ, the curing time is 3-10 s, and the ultraviolet lamp with the wavelength of 360-370 nm is adopted for irradiation.
In some embodiments of the present application, in the curing step, the curing speed may be 0.9-1.1 m/min, or 0.92-1 m/min or 0.98-1.05 m/min.
In some embodiments of the present application, in the curing step, the curing energy may be 1500-2200 mJ, 1700-2100 mJ, or 1800-2000 mJ.
In some embodiments of the present application, in the curing step, the curing time period used may be 4 to 9 seconds, or 5 to 8 seconds or 6 to 7 seconds.
In some embodiments of the present application, in the curing step, the wavelength of the ultraviolet lamp used may be 362-368 nm, 364-367 nm, or 365-366 nm.
In some embodiments of the present application, a housing sealing step is further included after the curing step, and the cured PCB assembly is sealed in the housing by using an inclined assembly mechanism, so as to obtain a semi-finished product.
In some embodiments of the present application, after the step of sealing the housing, a filling step is further included, in which a filling diversion mechanism is adopted to be abutted with the semi-finished product and a cooling liquid is filled into the semi-finished product, so as to obtain the power supply.
In some embodiments of the present application, the tri-proof paint is a urethane acrylate; the cooling fluid is available under the trademark FC-40 from 3M company in the United states. In some embodiments of the application, the tri-proof paint is brand of letter friend, and model number is UV3342 LV-80H; in some embodiments of the application, the tri-proof paint is BT in brand name and BT51-00UV in model number; and the three-proofing paint of other brands can be replaced according to actual conditions.
In some embodiments of the application, the fluorescent powder is doped into the three-proofing paint by the mass ratio of 0.1-0.5%, and the fluorescent powder can display a spraying area so as to facilitate spraying.
The brand of the fluorescent powder is Basff, and the type of the fluorescent powder is OB type; and the fluorescent powder can be replaced by fluorescent powder of other brands according to actual conditions.
As shown in fig. 1, in some embodiments of the present application, a power supply includes a housing 1, a PCB assembly 2, a coolant (not shown), and a conformal coating (not shown);
the three-proofing paint is sprayed on the surface of the PCB component 2;
the PCB component 2 is sealed in the shell 1;
the cooling liquid is in contact with the shell 1 and the PCB assembly 2;
the power supply is obtained by the method for manufacturing the power supply.
In some embodiments of the present application, as shown in fig. 2, a manufacturing apparatus for a power supply for performing the above-described manufacturing method for a power supply includes a tilt assembly mechanism;
the inclined assembling mechanism comprises a chassis 3, a support frame 4 and a support plate 5;
the chassis 3 is rectangular and is provided with a positioning protrusion 6;
one end of the support frame 4 is clamped on the positioning protrusion 6, the other end of the support frame supports the support plate 5, and an inclined included angle is formed between the support plate 5 and the chassis 3;
a first housing (not shown) is fixed on the supporting plate 5, the cured PCB assembly is mounted in the first housing, and a second housing (not shown) is abutted with the first housing, wherein the first housing and the second housing form a sealed shell to seal the PCB assembly therein.
In some embodiments of the present application, a plurality of the positioning protrusions 6 are disposed on the chassis 3, and the supporting frame 4 is supported by different positioning protrusions 6 to form different angles.
In some embodiments of the present application, a rotating plate 7 is further disposed on the supporting plate 5; the rotation plate 7 is fixed to the support plate 5 by a rotation shaft (not shown), and the rotation plate 7 rotates relative to the support plate 5.
In some embodiments of the present application, a fixing block 8 is disposed on the rotating plate 7, and the fixing block 8 defines a position of the first housing.
In some embodiments of the present application, the manufacturing apparatus of the power supply further includes a filling diversion mechanism 9;
the housing is provided with a screw hole (not shown) and a blocking member 11;
the filling guide mechanism 9 is connected with the shell 1 through the screw hole;
as shown in fig. 3 and 4, a flow guide hole 10 is formed in the filling flow guide mechanism 9, the flow guide hole 10 is connected with a liquid filling gun, cooling liquid enters the power supply from the liquid filling gun through the flow guide hole 10 and a screw hole, after filling, the filling flow guide mechanism 9 is removed, and the screw hole is blocked by the blocking piece 11.
In some embodiments of the present application, the outer peripheral surface of the filling and guiding mechanism 9 in the flow direction of the cooling liquid is a cylindrical surface, and a hexagonal prism surface;
and the corresponding first end surface of the hexagonal prism surface part is lower than the corresponding second end surface of the cylindrical surface part; the first end face is matched with the liquid filling gun, and the problems of deflection, rotation and the like of the liquid filling gun during liquid filling are prevented through the matching of the first end face and the liquid filling gun, so that the possible leakage of cooling liquid during filling is avoided.
Testing the three-proofing paint with the brand of Xinyou and the model of UV3342LV-80H at high temperature and high humidity by adopting a high temperature and high humidity test box under the conditions that the temperature is 85 ℃ and the humidity is 85% RH, wherein the initial ultraviolet curing dosage is 1200mJ/cm2Then curing for 72 hours under the condition that the humidity is 70% RH; the phenomena of bubble, shedding and cracking of an adhesive layer of the three-proofing paint are observed, which shows that the high-temperature and high-humidity resistance of the three-proofing paint is good.
The acid value test is carried out on the conformal-coating with the brand name of Xinyou and the model number of UV3342LV-80H according to ASTM D1980, the test environment temperature is 25 ℃, the test environment humidity is 40% RH, and the test result shows that the acid value of the conformal-coating is 0.29mgKOH/g, which indicates that the conformal-coating has good acid value.
The three-proofing paint with the brand of Xinyou and the model number of UV3342LV-80H is subjected to an instantaneous hardness test according to GB/T2411-2008, an LX-D type Shore hardness tester is adopted to test under the conditions that the temperature is 25 ℃ and the humidity is 40% RH, the initial ultraviolet curing dose is 1200mJ/cm2, then 70% RH moisture curing is carried out for 72H, and the test result shows that the instantaneous hardness of the three-proofing paint is 45D, which indicates that the paint has good hardness.
The three-proofing paint with the brand name of Xinyou and the model number of UV3342LV-80H is subjected to a vulcanization Test according to ASTM B809-95(2003) Standard Test Method for Porosity in Metallic Coatings by Humid sulfurr Vapor at a Test environment temperature of 25 ℃, a Test environment humidity of 55% RH, and is cured (UV light) by a mercury lamp with a curing energy of 3000mJ/cm2And then the three-proofing paint is placed at room temperature for 24 hours, the coating thickness of a wet film is 125 mu m, and the vulcanization corrosion phenomenon is not found after the test is finished, which shows that the three-proofing paint has good vulcanization corrosion resistance.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims. In addition, the principle and implementation of the present application are explained in the specification by applying specific examples, the above description of the embodiments is only used to help understand the method and the core idea of the present application, and the content of the present application should not be construed as limiting the present application.

Claims (11)

1. A method of manufacturing a power supply, comprising the steps of:
assembling: assembling the electronic part and the PCB into a whole to form a PCB assembly;
painting: and spraying three-proofing paint on the whole surface of the PCB assembly.
2. The method for manufacturing a power supply according to claim 1, wherein in the painting step, an automatic painting operation is performed using the following process parameters: the spraying pressure is 0.4-0.8 MPa, the spraying speed is 80-200 m/s, the atomization range is 10-15 mm, and the dry film thickness is 70-120 mu m.
3. The method of manufacturing a power supply according to claim 1, wherein: and a curing step is further included after the paint spraying step, and the sprayed PCB assembly is placed into an automatic UV furnace for curing.
4. The method for manufacturing a power supply according to claim 3, wherein in the curing step, a curing operation is performed using the following process parameters: the curing speed is 0.8-1.2 m/min, the curing energy is 1200-2500 mJ, the curing time is 3-10 s, and the ultraviolet lamp with the wavelength of 360-370 nm is adopted for irradiation.
5. The method of manufacturing a power supply according to claim 3, wherein: a shell sealing step is further included after the curing step, and the cured PCB assembly is sealed in the shell by adopting an inclined assembly mechanism to obtain a semi-finished product;
the filling step is also included after the shell sealing step, a filling guide mechanism is adopted to be in butt joint with the semi-finished product, and cooling liquid is filled into the semi-finished product to obtain the power supply;
the three-proofing paint is polyurethane acrylate;
and doping the fluorescent powder into the three-proofing paint according to the mass ratio of 0.1-0.5%.
6. A power supply, characterized by: the PCB cooling device comprises a shell, a PCB assembly, cooling liquid and three-proofing paint;
the three-proofing paint is sprayed on the surface of the PCB assembly;
the PCB assembly is sealed in the shell;
the cooling liquid is in contact with the shell and the PCB assembly;
the method for manufacturing a power supply according to any one of claims 1 to 5.
7. A manufacturing apparatus of a power supply for performing the manufacturing method of the power supply according to any one of claims 1 to 5, characterized in that: the manufacturing device of the power supply comprises a tilt assembly mechanism;
the inclined assembling mechanism comprises a chassis, a supporting frame and a supporting plate;
the base plate is rectangular and is provided with a positioning protrusion;
one end of the supporting frame is clamped on the positioning protrusion, the other end of the supporting frame supports the supporting plate, and an inclined included angle is formed between the supporting plate and the chassis;
the shell comprises a first shell and a second shell, the first shell is fixed on the supporting plate, the cured PCB assembly is installed in the first shell, the second shell is butted with the first shell, and the first shell and the second shell form a sealed shell to seal the PCB assembly in the sealed shell.
8. The manufacturing apparatus of the power supply according to claim 7, wherein: the chassis is provided with a plurality of positioning bulges, and the support frame is supported on different positioning bulges to form different angles.
9. The manufacturing apparatus of the power supply according to claim 7, wherein: the supporting plate is also provided with a rotating plate; the rotating plate is fixed on the supporting plate through a rotating shaft and rotates relative to the supporting plate;
the rotating plate is provided with a fixing block, and the fixing block limits the position of the first shell.
10. The manufacturing apparatus of the power supply according to claim 7, wherein: the manufacturing device of the power supply also comprises a filling flow guide mechanism;
the shell is provided with a screw hole and a blocking piece;
the filling flow guide mechanism is connected with the shell through the screw hole;
the filling guide mechanism is internally provided with a guide hole, the guide hole is connected with a liquid filling gun, cooling liquid passes through the liquid filling gun, the guide hole and the screw hole enter the power supply, and the filling guide mechanism is removed after filling is finished and the plugging piece is used for plugging the screw hole.
11. The manufacturing apparatus of the power supply according to claim 10, wherein: the outer peripheral surface of the filling flow guide mechanism along the flow direction of the cooling liquid is a cylindrical surface, and the part of the outer peripheral surface is a hexagonal prism surface;
and the corresponding first end surface of the hexagonal prism surface part is lower than the corresponding second end surface of the cylindrical surface part; the first end face is matched with the liquid filling gun.
CN202111657749.XA 2021-12-31 2021-12-31 Power supply, method for manufacturing the same, and apparatus for manufacturing the same Pending CN114364221A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111657749.XA CN114364221A (en) 2021-12-31 2021-12-31 Power supply, method for manufacturing the same, and apparatus for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111657749.XA CN114364221A (en) 2021-12-31 2021-12-31 Power supply, method for manufacturing the same, and apparatus for manufacturing the same

Publications (1)

Publication Number Publication Date
CN114364221A true CN114364221A (en) 2022-04-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111657749.XA Pending CN114364221A (en) 2021-12-31 2021-12-31 Power supply, method for manufacturing the same, and apparatus for manufacturing the same

Country Status (1)

Country Link
CN (1) CN114364221A (en)

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Effective date of registration: 20230904

Address after: No. 16, Shebang Road, Jiangling Street, Wujiang District, Suzhou City, Jiangsu Province, 215000

Applicant after: Suzhou Yundian Electronic Manufacturing Co.,Ltd.

Address before: 215000 - 3107, building 5, yunzhidong business center, No. 1088, Yundong Avenue, Jiangling street, Wujiang District, Suzhou City, Jiangsu Province

Applicant before: Suzhou Bodian Yunke Energy Technology Co.,Ltd.