CN110885974A - Chemical water bath deposition device - Google Patents
Chemical water bath deposition device Download PDFInfo
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- CN110885974A CN110885974A CN201811042868.2A CN201811042868A CN110885974A CN 110885974 A CN110885974 A CN 110885974A CN 201811042868 A CN201811042868 A CN 201811042868A CN 110885974 A CN110885974 A CN 110885974A
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- 238000010438 heat treatment Methods 0.000 claims abstract description 57
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- 239000010408 film Substances 0.000 description 21
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- 229910021641 deionized water Inorganic materials 0.000 description 13
- 239000010409 thin film Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 8
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 7
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 7
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
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- 238000009827 uniform distribution Methods 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- PFNQVRZLDWYSCW-UHFFFAOYSA-N (fluoren-9-ylideneamino) n-naphthalen-1-ylcarbamate Chemical compound C12=CC=CC=C2C2=CC=CC=C2C1=NOC(=O)NC1=CC=CC2=CC=CC=C12 PFNQVRZLDWYSCW-UHFFFAOYSA-N 0.000 description 1
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- 229910004613 CdTe Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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- 150000003863 ammonium salts Chemical class 0.000 description 1
- LHQLJMJLROMYRN-UHFFFAOYSA-L cadmium acetate Chemical compound [Cd+2].CC([O-])=O.CC([O-])=O LHQLJMJLROMYRN-UHFFFAOYSA-L 0.000 description 1
- 229940075417 cadmium iodide Drugs 0.000 description 1
- 229910000331 cadmium sulfate Inorganic materials 0.000 description 1
- 229910000369 cadmium(II) sulfate Inorganic materials 0.000 description 1
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- 229910052802 copper Inorganic materials 0.000 description 1
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- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- GKCNVZWZCYIBPR-UHFFFAOYSA-N sulfanylideneindium Chemical compound [In]=S GKCNVZWZCYIBPR-UHFFFAOYSA-N 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mixers Of The Rotary Stirring Type (AREA)
Abstract
The invention provides a chemical water bath deposition device, which comprises: a water bath kettle; the heating wire is arranged around the inner side wall of the water bath kettle or arranged around the inner side wall and the bottom of the water bath kettle. Therefore, the embodiment of the invention improves the heating mode of the heating wire from the bottom heating mode to the peripheral annular heating mode, or adds the peripheral annular heating mode on the basis of the existing heating mode of the heating wire, so that the heating area can be increased on one hand, and the temperature uniformity of different heights of the water bath can be ensured on the other hand. Due to the increase of the heating area, the water bath heating speed in the embodiment of the invention can be improved, so that the film deposition efficiency can be improved. Because the temperature uniformity at different heights is ensured, the embodiment of the invention can avoid the adverse effect on the film deposition process caused by overlarge temperature difference at different heights, and create a better external water bath environment for the deposition of the film material, thereby improving the quality of the deposited film.
Description
Technical Field
The invention relates to the technical field of thin film material preparation, in particular to a chemical water bath deposition device.
Background
At present, the use of thin film materials is becoming more common, and there are various preparation methods for thin film materials, such as magnetron sputtering method, screen printing method, thermal evaporation method, electrodeposition method, and Chemical Bath Deposition (CBD for short).
Among the above methods, the chemical water bath deposition method is widely favored by the scientific research and industrial industries because it is a non-vacuum preparation method and has the advantages of simple structure of the deposition device, low deposition temperature, low energy consumption, etc. However, the heating speed of the water bath in the current chemical water bath deposition device is very slow, the water bath usually needs to be heated for a very long time to reach the predetermined temperature, and meanwhile, the temperature distribution at different heights of the water bath is not uniform, which seriously affects the film deposition efficiency and quality.
Disclosure of Invention
The embodiment of the invention provides a chemical water bath deposition device, which can shorten the heating time of a water bath kettle in the chemical water bath deposition device, ensure the uniform temperature distribution of the water bath kettle at different heights and improve the quality of deposited films.
The embodiment of the invention provides a chemical water bath deposition device, which comprises:
a water bath kettle;
the heating wire is arranged around the inner side wall of the water bath kettle; or the heating wires are arranged around the inner side wall and the bottom of the water bath kettle.
Optionally, the chemical water bath deposition apparatus further comprises:
the first stirring piece is rotatably arranged at the bottom of the water bath kettle and rotates in a working state.
Optionally, the central region of the bottom of the water bath is provided with one first stirring piece; and/or the presence of a gas in the gas,
the non-central area of the bottom of the water bath is provided with one or more than one first stirring piece.
Optionally, in a case that the non-central region of the bottom of the water bath is provided with one or more first stirring members, the one or more first stirring members are distributed in at least one of the following shapes relative to the central region of the bottom of the water bath:
radial, centrosymmetric, circular, elliptical, triangular, polygonal, cross-shaped, concentric square, concentric rectangle, concentric circle, concentric triangle, and other concentric polygons.
Optionally, the bottom of the water bath is provided with a first groove;
the first stirring piece is arranged in the first groove.
Optionally, the first stirring member comprises:
the main body is rotatably arranged at the bottom of the water bath kettle, and a first connecting part and a second connecting part are arranged at intervals along the circumferential direction of the outer circumferential surface of the main body;
the first fan blade is fixedly connected with the first connecting part;
the second fan blade is fixedly connected with the second connecting part.
Optionally, the chemical water bath deposition apparatus further comprises:
a first speed knob for adjusting a speed of rotation of the first stirring member.
Optionally, the chemical water bath deposition apparatus further comprises:
the magnetic submodule is rotationally arranged at the bottom of the water bath, and rotates under the working state to drive a magnetic stirrer in a sample container heated by the water bath of the water bath to rotate.
Optionally, the magnet sub-module is disposed in a central region of a bottom of the water bath.
Optionally, a second groove is formed in the bottom of the water bath;
the magnetic sub-module is arranged in the second groove.
Optionally, the magnetic sub-module is arranged at the bottom of the water bath through an installation shaft, a second stirring piece is further arranged on the installation shaft, and the second stirring piece rotates in the working state.
Optionally, the chemical water bath deposition apparatus further comprises:
and the second rotating speed knob is used for adjusting the rotating speed of the magnetic sub-module and/or the second stirring piece.
Optionally, the chemical water bath deposition apparatus further comprises:
at least two temperature measuring elements, each temperature measuring element is used for measuring the temperature values of different positions in the water bath;
a display panel;
the controller is respectively electrically connected with the display panel and each temperature measuring element, and is used for acquiring the temperature value measured by each temperature measuring element and controlling the display panel to display temperature uniformity prompt information in the form of characters, numbers or patterns under the condition that the difference value of the temperature values measured by any two temperature measuring elements is smaller than a preset temperature difference threshold value.
Optionally, the chemical water bath deposition apparatus further comprises:
and the temperature control meter is used for setting heating parameters of the water bath kettle.
In the chemical water bath deposition device provided by the embodiment of the invention, the heating wire is arranged around the inner side wall of the water bath kettle; or the heating wires are arranged around the inner side wall and the bottom of the water bath kettle, and in the prior art, the heating wires are only arranged at the bottom of the water bath kettle. Due to the increase of the heating area, the water bath heating speed in the embodiment of the invention can be improved, so that the film deposition efficiency can be improved. Because the temperature uniformity at different heights is ensured, the embodiment of the invention can better avoid the adverse effect on the film deposition process caused by overlarge temperature difference at different heights, so that a better external water bath environment can be created for the deposition of film materials, and the quality of the deposited film is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a schematic structural diagram of a chemical water bath deposition apparatus provided by an embodiment of the present invention at a viewing angle;
FIG. 2 is a schematic structural diagram of a chemical water bath deposition apparatus provided in an embodiment of the present invention from another view angle;
fig. 3 is a schematic structural diagram of a first stirring member in a chemical water bath deposition apparatus according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The following is a description of the chemical water bath deposition apparatus provided by the embodiment of the present invention.
It should be noted that the chemical water bath deposition apparatus provided by the embodiment of the invention can be used for preparing important functional layer materials in thin film solar cells. In particular, the chemical water bath deposition device can be used for preparing window layer materials in CdTe (cadmium telluride) thin film solar cells; alternatively, the chemical water bath deposition device can be used for preparing buffer layer materials In a CIGS (copper indium gallium selenide) thin-film solar cell, such as CdS (cadmium sulfide), ZnS (zinc sulfide), ZnO (zinc oxide), ZnSe (zinc selenide), In2S3(indium sulfide), and the like.
The CIGS (copper indium gallium selenide) thin-film solar cell is a thin-film solar cell composed of four elements of Cu (copper), In (indium), Ga (gallium) and Se (selenium); CIGS thin-film solar cells may employ glass substrates, for example SLG (soda lime glass) substrates. In addition, CdS is a direct band gap II-VI compound semiconductor material, and the forbidden band width is about 2.42 eV.
Referring to fig. 1 and fig. 2, schematic structural diagrams of a chemical water bath deposition apparatus provided by an embodiment of the present invention are shown. As shown in fig. 1 and 2, the chemical water bath deposition apparatus includes: a water bath 1 and a heating wire 2; wherein, the heating wire 2 is arranged around the inner side wall of the water bath 1; or the heating wires 2 are arranged around the inner side wall and the bottom of the water bath kettle 1.
Specifically, the heating wire 2 may be fixedly connected to the inner sidewall of the water bath 1 and/or the bottom of the water bath 1 by welding or the like, so as to ensure reliable arrangement of the heating wire 2.
Optionally, the chemical water bath deposition apparatus may further include a heating switch 31 and a power switch 32. For example, in order to prepare a buffer layer CdS material film buffer layer in a CIGS (copper indium gallium selenide) thin film solar cell by using the chemical water bath deposition device, a proper amount of deionized water may be added into the water bath 1, and then the power switch 32 and the heating switch 31 are sequentially operated to energize the heating wire 2 and heat the deionized water in the water bath 1.
It should be noted that the amount of the deionized water added into the water bath 1 is not too much, so that the ratio of the height of the area of the inner side wall of the water bath 1 where the heating wire 2 is arranged to the height of the water bath 1 is 1/2 to 2/3.
After the deionized water in the water bath 1 is heated to meet the requirement, the sample container 4 (e.g., beaker, reaction kettle or reactor, etc.) can be placed in the water bath 1 in a centered manner, the sample 100 can be placed in the sample container 4 through the sample support 5, and the sample container 4 can also contain the prepared solution. And then, a chemical reaction is generated in the sample container 4, when the solution in the sample container 4 becomes dark or turbid, the sample container 4 can be taken out from the water bath 1, and the sample in the sample container 4 is taken out and washed and dried to obtain the final film material. Thereafter, the heating switch 31 and the power switch 32 may be operated in sequence to turn off the power of the apparatus and clean the waste liquid in the sample container 4.
It should be noted that, when the thin film material to be prepared is CdS, the solution prepared in the sample container 4 mainly consists of cadmium salt and CSN2H4(thiourea) and ammonia (which dissolves natural oxides generated during subsequent chemical reactions); wherein the cadmium salt can include Cd (CH)3CO2)2(cadmium acetate), CdSO4(cadmium sulfate), CdCl2(cadmium chloride), CdI2(cadmium iodide), and the like. In some cases, an ammonium salt may also be present as a PH buffer in the solution provided in the sample container 4, in which case the solution provided in the sample container 4 is alkaline as a whole. The total reaction equation for the configured solution in the sample container 4 to produce the chemical reaction is:
it should be noted that the deposition process of CdS is closely related to temperature, and when the temperature is increased, the deposition rate of the film is significantly increased, the film becomes dense from loose, the crystallization degree is increased, but the surface of the film is rough due to too high temperature. Therefore, the temperature difference of different regions in the water bath 1 is not suitable to be too large in the process of preparing CdS.
In the chemical water bath deposition device provided by the embodiment of the invention, a heating wire 2 is arranged around the inner side wall of a water bath kettle 1; or the heating wires 2 are arranged around the inner side wall and the bottom of the water bath kettle 1, and in the prior art, the heating wires 2 are only arranged at the bottom of the water bath kettle 1, so that the embodiment of the invention improves the heating mode of the heating wires 2 from the bottom heating mode to the peripheral annular heating mode, or increases the peripheral annular heating mode on the basis of the existing heating mode of the heating wires 2, thereby increasing the heating area on one hand, and ensuring the temperature uniformity of the water bath kettle 1 at different heights on the other hand. Due to the increase of the heating area, the water bath heating speed in the embodiment of the invention can be improved, so that the film deposition efficiency can be improved. Because the temperature uniformity at different heights is ensured, the embodiment of the invention can better avoid the adverse effect on the film deposition process caused by overlarge temperature difference at different heights, so that a better external water bath environment can be created for the deposition of film materials, and the quality of the deposited film is improved.
Optionally, the chemical water bath deposition apparatus further comprises: the first stirring piece 6 is rotationally arranged at the bottom of the water bath kettle 1, and the first stirring piece 6 rotates in a working state.
In order to realize the rotation of the first stirring member 6, a first driving mechanism (e.g., a driving motor) may be provided corresponding to the first stirring member 6 in the chemical water bath deposition apparatus, and the first driving mechanism is used for driving the first stirring member 6 to rotate in the working state. In particular, the first driving mechanism may drive the first stirring member 6 to rotate at a constant speed, which may be between 50 revolutions per minute and 200 revolutions per minute.
In this embodiment, the first stirring member 6 rotates in the operating state, and at this time, the first stirring member 6 plays a role of stirring to drive the surrounding water to rotate, which is beneficial to accelerating the heat exchange between different areas in the water bath 1, so as to ensure the temperature uniformity of different areas in the water bath 1, thereby further improving the quality of the deposited film.
Alternatively, as shown in fig. 3, the first stirring member 6 includes: a main body 61 (which may be a cylindrical structure), a first blade 62 and a second blade 63; the main body 61 is rotatably arranged at the bottom of the water bath 1, and the main body 61 is provided with a first connecting part 611 and a second connecting part 612 at intervals along the circumferential direction of the outer circumferential surface; the first blade 62 is fixedly connected to the first connection portion 611; the second fan 63 is fixedly connected to the second connecting portion 612.
Specifically, the first connecting portion 611 may be a first slot disposed on the outer circumferential surface of the main body 61, and the first blade 62 may be inserted into the first slot to fix the first blade 61. Similarly, the second connecting portion 612 may be a second slot disposed on the outer circumferential surface of the main body 61, and the second blade 63 may be inserted into the second slot to fix the second blade 62.
Of course, the first connection portion 611 and the second connection portion 612 may have other structures, the first blade 62 and the first connection portion 611 may be fixedly connected by screwing, clipping or other methods known to those skilled in the art, and the second blade 63 and the second connection portion 612 may be fixedly connected by screwing, clipping or other methods known to those skilled in the art, which are not listed here.
In this embodiment, under the condition that the first stirring member 6 is in the working state, the first driving mechanism can drive the main body 61 to rotate, and at this time, the first blade 62 and the second blade 63 can rotate along with the main body 61, so that the first stirring member 6 can realize the integral rotation.
In this embodiment, in the overall structure of the first stirring member 6, the first fan blade 62 and the second fan blade 63 can provide a larger contact area, which is beneficial to ensuring the stirring effect of the first stirring member 6.
Optionally, as shown in fig. 1 and 2, a first groove 7 is formed at the bottom of the water bath 1; the first stirring member 6 is disposed in the first groove 7.
Here, the first stirring member 6 may be disposed in the first groove 7 by a mounting shaft (for distinction from a mounting shaft appearing in a subsequent embodiment, the mounting shaft in the present embodiment is hereinafter referred to as a first mounting shaft 8). Specifically, the lower end (with respect to fig. 1 and 2) of the first mounting shaft 8 may be fixed to the bottom of the first groove 7 by welding or the like, and the main body 61 of the first stirring member 6 may be rotatably connected to the upper end (with respect to fig. 1 and 2) of the first mounting shaft 8.
In this embodiment, the first stirring member 6 is disposed in the first groove 7, so that the first stirring member 6 does not occupy too much space at the bottom of the water bath 1, and more usable space can exist at the bottom of the water bath 1.
Optionally, a central region of the bottom of the water bath 1 is provided with a first stirring member 6; and/or the presence of a gas in the gas,
the non-central area of the bottom of the water bath 1 is provided with one or more first stirring members 6.
The number of the first stirring members 6 disposed in the non-central region of the bottom of the water bath 1 may be one, two, three or more, and is not listed here.
In this embodiment, the central region and the non-central region of the bottom of the water bath 1 may be provided with the first stirring member 6, which is beneficial to ensuring the heat exchange effect between different regions in the water bath 1.
Optionally, in case that more than one first stirring members 6 are provided in the non-central region of the bottom of the water bath 1, the more than one first stirring members 6 are distributed in at least one of the following shapes with respect to the central region of the bottom of the water bath 1:
radial, centrosymmetric, circular, elliptical, triangular, polygonal, cross-shaped, concentric square, concentric rectangle, concentric circle, concentric triangle, and other concentric polygons.
In this embodiment, in the case that more than one first stirring members 6 are disposed in the non-central area of the bottom of the water bath 1, as shown in fig. 2, the more than one first stirring members 6 may constitute a plurality of (e.g., two, three, five, six, seven, or eight) rotating arms disposed along the radial direction of the water bath 1, each rotating arm includes a plurality of first stirring members 6 disposed at regular intervals, and all the first stirring members 6 may rotate simultaneously to further accelerate the heat exchange between different areas in the water bath 1.
It can be seen that the present embodiment can further improve the heat exchange effect between different regions in the water bath 1 by distributing one or more first stirring members 6 disposed in the non-central region of the bottom of the water bath 1 in the regular shape.
It is of course also possible that more than one first stirring element 6 arranged in a non-central area of the bottom of the water bath 1 is distributed in an irregular shape.
It should be noted that, in the chemical water bath deposition apparatus, when the total number of the first stirring members 6 is more than one, the total number of the first grooves 7 formed in the bottom of the water bath 1 may be more than one, and the more than one first stirring members 6 and the more than one first grooves 7 may be arranged in a one-to-one correspondence manner.
Optionally, as shown in fig. 1, the chemical water bath deposition apparatus further includes: a first rotation speed knob 33, the first rotation speed knob 33 being used to adjust the rotation speed of the first stirring member 6.
Specifically, the chemical water bath deposition apparatus may further include a housing 3, and the first rotation speed knob 33 may be disposed on the housing 3. In addition, the heating switch 31 and the power switch 32 may also be provided to the case 3, and the heating switch 31, the power switch 32, and the first rotation speed knob 33 may be arranged side by side on the case 3.
In this embodiment, the first rotating speed knob 33 can be rotated according to actual requirements to adjust the rotating speed of the first stirring member 6, so as to adjust the stirring effect of the first stirring member 6.
Optionally, the chemical water bath deposition apparatus further comprises: a magnetic submodule 9; wherein, magnetism submodule 9 rotates and sets up in the bottom of water bath 1, and magnetism submodule 9 rotates under operating condition to drive the interior magnetism stirring of sample container 4 of water bath heating of water bath 1 rotates 10.
The magnetic sub-module 9 may be a magnet.
In order to realize the rotation of the magnetic submodule 9, a second driving mechanism (for example, a driving motor) may be further provided in the chemical water bath deposition apparatus corresponding to the magnetic submodule 9, and the second driving mechanism is configured to drive the magnetic submodule 9 to rotate in an operating state. Specifically, the second driving mechanism may drive the magnetic sub-module 9 to rotate at a constant speed, and the second speed may be between 200 revolutions per minute and 300 revolutions per minute.
In this embodiment, the magneton module 9 rotates in an operating state, at this time, the magnetic stirrer 10 rotates under the driving of the magneton module 9, and the magnetic stirrer 10 plays a role in stirring to drive the surrounding solution to rotate, which is beneficial to ensuring the uniform distribution of the solute in the sample container 4.
Optionally, the magnet sub-module 9 is arranged in a central region of the bottom of the water bath 1.
It should be noted that the magnetic stirrer 10 is generally disposed in the central region of the bottom of the sample container 4, and in addition, when the sample container 4 is indirectly heated by the deionized water in the water bath 1, the sample container 4 and the water bath 1 are generally placed in a center, so that in this embodiment, the magnetic stirrer module 9 may be disposed in the central region of the bottom of the water bath 1 to achieve the centering of the magnetic stirrer module 9 and the magnetic stirrer 10, thereby reliably ensuring that the magnetic stirrer 10 rotates along with the magnetic stirrer module 9.
Optionally, a second groove 11 is formed at the bottom of the water bath 1, and the magnetic sub-module 9 is disposed in the second groove 11.
It should be noted that if the magnetic sub-module 9 needs to be disposed in the central region of the bottom of the water bath 1, the second groove 11 needs to be opened in the central region of the bottom of the water bath 1.
In this embodiment, the magnetic submodule 9 is disposed in the second groove 11, so that the magnetic submodule 9 does not occupy too much space at the bottom of the water bath 1, and more usable space can exist at the bottom of the water bath 1.
Alternatively, as shown in fig. 1, the magnetic sub-module 9 is disposed at the bottom of the water bath 1 through a mounting shaft (for the sake of distinguishing from the mounting shaft appearing in the above embodiment, the mounting shaft in this embodiment is hereinafter referred to as a second mounting shaft 13), and a second stirring member 14 is further disposed on the second mounting shaft 13, and the second stirring member 14 rotates in an operating state.
The lower end (with respect to fig. 1) of the second mounting shaft 13 may be fixed to the bottom of the second groove 11 by welding, etc., the magnetic sub-module 9 may be rotatably connected to the upper end (with respect to fig. 1) of the second mounting shaft 13, and the second stirring member 14 may be disposed in the middle of the second mounting shaft 13. In specific implementation, the second stirring member 14 and the magnetic sub-module 9 may be relatively fixed, and the second driving mechanism may simultaneously drive the magnetic sub-module 9 and the second stirring member 14 to rotate; alternatively, the second stirring member 14 and the magnetic sub-module 9 may be relatively independent, and the rotation of the second stirring member 14 may be driven by a driving mechanism different from the second driving mechanism.
It should be noted that, in the case that the magnetic submodule 9 is arranged in the central region of the bottom of the water bath 1, and the central region of the bottom of the water bath 1 is provided with one first stirring member 6, the second stirring member 14 and the first stirring member 6 may be the same stirring member.
In this embodiment, the magnetic sub-module 9 and the second stirring member 14 can be simultaneously disposed at the bottom of the water bath 1 through the second mounting shaft 13, which is favorable for saving the disposing space at the bottom of the water bath 1. In addition, the second stirring member 14 can perform a stirring effect to drive the surrounding water to rotate, which is beneficial to accelerate the heat exchange between different areas in the water bath 1, so as to ensure the temperature uniformity of different areas in the water bath 1, thereby further improving the quality of the deposited film.
Optionally, the chemical water bath deposition apparatus further comprises: a second rotation speed knob for adjusting the rotation speed of the magnet sub-module 9 and/or the second stirring element 14.
In particular, the second rotation speed knob may also be provided on the housing 3.
In this embodiment, the second rotation speed knob and the first rotation speed knob 33 may be two rotation speed knobs independent from each other, so that by rotating the second rotation speed knob, the present embodiment may implement rotation speed adjustment of at least one of the magnetic sub-module 9 and the second stirring member 14, thereby implementing adjustment of the stirring effect of the magnetic sub-module 9 and/or the second stirring member 14. Of course, the second rotation speed knob and the first rotation speed knob 33 may be the same rotation speed knob, so that by rotating the second rotation speed knob, the embodiment can simultaneously realize the rotation speed adjustment of at least one of the magnetic sub-module 9 and the second stirring member 14 and the first stirring member 6.
Optionally, the chemical water bath deposition apparatus further comprises: a temperature measuring element 15, a display panel (not shown), and a controller (not shown).
Wherein, the quantity of temperature measurement component 15 is two at least, and each temperature measurement component 15 is used for measuring the temperature value of different positions in the water bath 1.
The controller is respectively electrically connected with the display panel and each temperature measuring element 15, and is used for obtaining the temperature value measured by each temperature measuring element 15, and controlling the display panel to display temperature uniformity prompt information in the form of characters, numbers or patterns under the condition that the difference value of the temperature values measured by any two temperature measuring elements 15 is smaller than a preset temperature difference threshold value.
The temperature measuring elements 15 can be temperature sensors, the number of the temperature measuring elements 15 can be three, four, five or more than five, the temperature difference threshold can be 1 degree centigrade, 2 degrees centigrade or other temperature values, and the specific number of the temperature measuring elements 15 and the specific value of the temperature difference threshold are not limited in this embodiment.
It should be noted that, under the condition that the difference between the temperature values measured by any two temperature measuring elements 15 is smaller than the preset temperature difference threshold, the temperatures of different areas in the water bath 1 can be considered to be uniform, and at this time, the controller can control the display panel to display the temperature uniformity prompting information in the form of characters, numbers or patterns so as to notify the situation. In this way, the sample container 4 can be put into the water bath 1 to be heated and a timer can be started only in the case where the temperatures of different areas in the water bath 1 are uniform, so that the thin film material can be prepared. Under the condition that the difference value of the temperature values measured by any two temperature measuring elements 15 is greater than or equal to the preset temperature difference threshold value, the temperature of different areas in the water bath 1 can be considered to be uneven, and at the moment, the controller can control the display panel to display prompting information of uneven temperature in the form of characters, numbers or patterns so as to inform the situation; meanwhile, the controller controls the first stirring part 6 or the second stirring part 14 to rotate to continue to finish heat exchange in water areas with different heights in the water bath pot 1, and when the difference value of the temperature values measured by any two temperature measuring elements 15 is smaller than the preset temperature difference threshold value, the sample container 4 is placed into the water bath pot 1 to be heated and starts timing to prepare a film material, so that the quality of the deposited film is effectively guaranteed.
Optionally, the chemical water bath deposition apparatus further comprises: and the temperature control meter 34, wherein the temperature control meter 34 is used for setting the heating parameters of the water bath 1.
Specifically, the temperature control meter 34 may also be provided on the case 3.
In this embodiment, the heating parameters of the water bath 1 include, but are not limited to: the target temperature of the deionized water in the water bath 1, the time required for heating the deionized water to the target temperature, the time for keeping the deionized water at the target temperature, the heating rate of the deionized water and the like. In specific implementation, the target temperature of the deionized water can be between 80 degrees centigrade and 90 degrees centigrade, the time for keeping the target temperature of the deionized water can be between 20 minutes and 30 minutes, and the temperature rise speed of the deionized water can be between 3 degrees centigrade and 5 degrees centigrade per minute.
It can be seen that, in this embodiment, the heating parameters of the water bath 1 can be set on the temperature control table 34 according to actual requirements, so that the heating effect of the deionized water in the water bath 1 can be better matched with the actual requirements.
In conclusion, the present embodiment can increase the heating area, shorten the time for the temperatures at different heights to reach uniform distribution, and continuously maintain the temperature uniformity at different heights of the water bath, thereby improving the film deposition efficiency and the film deposition quality.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (14)
1. A chemical water bath deposition apparatus, comprising:
a water bath kettle;
the heating wire is arranged around the inner side wall of the water bath kettle; or the heating wires are arranged around the inner side wall and the bottom of the water bath kettle.
2. The chemical water bath deposition apparatus according to claim 1, further comprising:
the first stirring piece is rotatably arranged at the bottom of the water bath kettle and rotates in a working state.
3. The chemical bath deposition apparatus as claimed in claim 2,
the central area of the bottom of the water bath is provided with the first stirring piece; and/or the presence of a gas in the gas,
the non-central area of the bottom of the water bath is provided with one or more than one first stirring piece.
4. The deposition apparatus in chemical water bath according to claim 3, wherein, in the case that the non-central region of the bottom of the water bath is provided with one or more first stirring members, the one or more first stirring members are distributed in at least one of the following shapes relative to the central region of the bottom of the water bath:
radial, centrosymmetric, circular, elliptical, triangular, polygonal, cross-shaped, concentric square, concentric rectangle, concentric circle, concentric triangle, and other concentric polygons.
5. The chemical bath deposition apparatus as claimed in claim 2,
the bottom of the water bath kettle is provided with a first groove;
the first stirring piece is arranged in the first groove.
6. The chemical water bath deposition apparatus as claimed in claim 2, wherein the first stirring member comprises:
the main body is rotatably arranged at the bottom of the water bath kettle, and a first connecting part and a second connecting part are arranged at intervals along the circumferential direction of the outer circumferential surface of the main body;
the first fan blade is fixedly connected with the first connecting part;
the second fan blade is fixedly connected with the second connecting part.
7. The chemical water bath deposition apparatus according to claim 2, further comprising:
a first speed knob for adjusting a speed of rotation of the first stirring member.
8. The chemical water bath deposition apparatus according to claim 1, further comprising:
the magnetic submodule is rotationally arranged at the bottom of the water bath, and rotates under the working state to drive a magnetic stirrer in a sample container heated by the water bath of the water bath to rotate.
9. The chemical bath deposition apparatus as claimed in claim 8, wherein the magnetic sub-module is disposed at a central region of the bottom of the water bath.
10. The chemical bath deposition apparatus as claimed in claim 8,
the bottom of the water bath kettle is provided with a second groove;
the magnetic sub-module is arranged in the second groove.
11. The deposition apparatus in chemical water bath according to claim 8, wherein the magnetic sub-module is disposed at the bottom of the water bath kettle through a mounting shaft, and a second stirring member is further disposed on the mounting shaft, and the second stirring member rotates in an operating state.
12. The chemical water bath deposition apparatus according to claim 11, further comprising:
and the second rotating speed knob is used for adjusting the rotating speed of the magnetic sub-module and/or the second stirring piece.
13. The chemical water bath deposition apparatus according to claim 1, further comprising:
at least two temperature measuring elements, each temperature measuring element is used for measuring the temperature values of different positions in the water bath;
a display panel;
the controller is respectively electrically connected with the display panel and each temperature measuring element, and is used for acquiring the temperature value measured by each temperature measuring element and controlling the display panel to display temperature uniformity prompt information in the form of characters, numbers or patterns under the condition that the difference value of the temperature values measured by any two temperature measuring elements is smaller than a preset temperature difference threshold value.
14. The chemical water bath deposition apparatus according to claim 1, further comprising:
and the temperature control meter is used for setting heating parameters of the water bath kettle.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811042868.2A CN110885974A (en) | 2018-09-07 | 2018-09-07 | Chemical water bath deposition device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811042868.2A CN110885974A (en) | 2018-09-07 | 2018-09-07 | Chemical water bath deposition device |
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| CN110885974A true CN110885974A (en) | 2020-03-17 |
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| CN201811042868.2A Pending CN110885974A (en) | 2018-09-07 | 2018-09-07 | Chemical water bath deposition device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113186521A (en) * | 2021-05-06 | 2021-07-30 | 深圳大学 | Chemical water bath deposition device and using method thereof |
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