CN110883626B

CN110883626B - Wafer planarization equipment

Info

Publication number: CN110883626B
Application number: CN201911240572.6A
Authority: CN
Inventors: 王春宏
Original assignee: Nanjing Blue New Material Technology Co ltd
Current assignee: Nanjing Blue New Material Technology Co.,Ltd.
Priority date: 2019-12-06
Filing date: 2019-12-06
Publication date: 2021-11-16
Anticipated expiration: 2039-12-06
Also published as: CN110883626A

Abstract

The invention discloses a wafer planarization device, which structurally comprises: the polishing machine comprises an outer shell, turntables, polishing disks and a blind area polishing mechanism, wherein the bottom of the outer shell is connected with the turntables, the polishing disks are arranged at the bottom end surfaces of the turntables, and the blind area polishing mechanism is positioned between the turntables and at the central point position below the outer shell, and the polishing machine has the advantages that: rely on the last device that leads that shakes that is equipped with of blind area grinding machanism to drive the dish that flattens of its bottom to rotate, the special rhombus disk body that flattens can visit into the blind area of polishing between the carousel and cover the blind area, the arc lines of side can not produce the collision with the carousel and polish to the region of blind area in the at utmost simultaneously, and utilize the punching press effort can realize the frequent punching press of high strength to the brilliant stick central point of circle, thereby eliminate the rough surface of the blind area of polishing of brilliant central point of circle and make it level and smooth.

Description

Wafer planarization equipment

Technical Field

The invention relates to the field of wafer, in particular to wafer planarization equipment.

Background

Almost for all electronic digital products, the wafer is indispensable, the wafer is manufactured in the semiconductor field, the technology content is quite high, the technical process requirement is quite high, on the premise of manufacturing the high standard, the wafer is in a scarce state, the wafer can be manufactured into a complete product only through a series of processing steps, the surface of the wafer is rough and uneven due to the material problem in the processing process, the wafer can be put into use only after being polished and flattened, the central position of the conventional wafer flattening process is in a polishing blind area in the processing process, the central position of the wafer cannot be kept flat with the side position, the use efficiency of the wafer can be reduced, and on the basis of the above premises, the wafer flattening equipment is researched and developed to solve the problem.

Disclosure of Invention

Aiming at the defects of the prior art, the invention is realized by the following technical scheme: a wafer planarization apparatus, comprising: the device comprises an outer shell, a turntable, a polishing disc and a blind area polishing mechanism, wherein the bottom of the outer shell is connected with the turntable, the polishing disc is arranged at the bottom end face of the turntable, the blind area polishing mechanism is positioned between the turntables and positioned at the central point below the outer shell, the outer shell is integrally formed by a semicircular combined cylinder structure, the diameter of the bottom of the outer shell is slightly larger than that of a cylinder of a round crystal bar, the blind area polishing mechanism is mainly used as a main structure and a protective structure of the device, on one hand, a high-strength metal shell is used for protecting internal components from being damaged, on the other hand, the shell structure is used for connecting other components, the turntable is a conventional structure for polishing the round crystal bar by the device, the number of the turntable is four, the four polishing discs are respectively and equidistantly positioned at four corners below the outer shell of the device, the polishing disc is made of silicon carbide material, the hardness of the polishing disc is higher than that of the round crystal bar, the rough and uneven position of the surface of the round crystal can be polished by using the friction force contacted with the round crystal bar in the rotating process, three polishing disks are arranged in one turntable in an equilateral triangle shape, and a circular linear operation action can be formed in the rotating process.

As a further technical supplement of the invention, a driver is arranged in the outer shell and connected with the outer shell, the driver is connected by depending on the structure of the outer shell, and is connected with other components at the bottom of the outer shell, the driver is mainly used as a core driving structure of the equipment to provide a power source for the other components of the equipment, original power is converted into grinding rotary power and vibration acting force required by wafer planarization through the components, and long-time stable supply of the power can be realized through an external power supply.

As a further technical supplement of the invention, the turntable consists of a driving shaft and a linkage shaft, the driving shaft and the linkage shaft are mutually connected and synchronously run, the driving shaft is provided with four positions which are respectively and correspondingly connected to the bottom of the driver, the driving shaft is mainly used for transmitting power on the driver, conveying the power downwards and converting the power into power required by rotation, the driving shaft is divided into four power structures which independently run by a total power source, the linkage shaft is a bearing structure which enables the power to act on the turntable, and the linkage shaft mainly has the functions of reducing vibration feedback generated in the process of conveying the power by the driving shaft and realizing synchronous running between two parts.

As a further technical supplement of the invention, the blind area polishing mechanism consists of a shaft core column, an embedded tooth block, a damping reed pipe, a vibration guide device and a flattening disc, an embedded tooth block is arranged at the side edge of the middle section of the shaft core column, a damping spring tube is arranged below the embedded tooth block and is connected with the shaft core column, a vibration guide device is arranged at the middle end of the shaft core column, the bottom of the vibration guide device is connected with a flattening disc, the shaft core column is an external main body framework of the blind area polishing mechanism, the two sides of the top of the polishing mechanism are provided with raised plates for enhancing structural strength, the polishing mechanism is integrally of a bearing structure, the polishing mechanism can rotate and drive an internal-jetting component to link, the embedded tooth blocks are used for connecting the upper part and the lower part of a core column of a shaft to achieve the purpose of replacing the core column, and the damping reed pipe is used for reducing the integral redundant vibration force of the polishing mechanism of the dead zone to prevent the vibration guide device and the flattening disc at the bottom from being influenced and the phenomenon of horizontal plane inclination in the operation process.

As a further technical supplement of the invention, the vibration guide device comprises a transmission arm, a limiting column and a pressurizing crankshaft, wherein the transmission arm is connected with the limiting column, the pressurizing crankshaft is positioned at two sides of the bottom of the transmission arm and is positioned below the limiting column to correspond to the limiting column, the transmission arm is mainly used for transmitting and transmitting power and converting the power into linear vibration acting force vertically fluctuating up and down in the process, the linear vibration acting force is a core structure for realizing power output of the vibration guide device, the limiting column is used for limiting the lifting height of the transmission arm so as to control the power output strength of the transmission arm and prevent the occurrence of an event that the polishing precision is uncontrollable due to overlarge vibration, and the pressurizing crankshaft is used for enhancing the pressure strength of a flattening disc at the bottom and enabling the applied pressure strength to a polishing dead zone of the central point of the round crystal bar to be larger so as to achieve the purpose of flattening the rough surface of the central point.

As a further technical supplement of the invention, the flattening disc comprises a diamond disc body, slide rails, grinding and cutting blocks and a punching seat, wherein the slide rails are arranged on the side edge of the bottom surface of the diamond disc body in an equal proportion around the shape of the diamond disc body, the grinding and cutting blocks are movably connected with the slide rails, the punching seat is positioned at the central point of the diamond disc body and is connected with the diamond disc body, the diamond disc body is a main body structure of the flattening disc, the whole structure of the diamond disc body is in a four-pointed star shape, four corners of the diamond disc body can extend into the grinding blind area between turntables to cover the blind area, meanwhile, arc-shaped lines on the side edges cannot collide with the turntables and grind the area of the blind area to the maximum extent, the slide rails are mainly used for a track structure for moving the grinding and cutting blocks, the grinding and cutting blocks are totally provided with four blocks, the circular track for clockwise and forward movement and then backward movement can be realized according to the design structure, so that the grinding and cutting blocks are limited in the peripheral area of the central point of the round crystal bar, and the grinding and cutting blocks are made of silicon carbide material, the contact part of the round crystal rod can be ground and polished in the moving process, the middle punching seat is also made of a silicon carbide-based material, high-strength frequent punching can be realized on the central point of the round crystal rod by utilizing punching acting force, and the rough surface of the round crystal surface is ground to be flat by relying on the high-frequency punching acting force.

Advantageous effects

The invention is applied to the aspect of wafer planarization technology, and mainly aims to solve the problem that the middle position of a wafer cannot be kept flat with the side edge position due to the fact that the center position of the wafer is in a polishing blind area in the processing process of the conventional wafer planarization technology;

the blind area polishing mechanism is structurally arranged to solve the problem, power is converted into vibration acting force by virtue of the vibration guide device arranged on the blind area polishing mechanism, and regulation and control are realized, so that the pressing plate at the bottom of the blind area polishing mechanism is driven to operate, the special rhombic plate body of the pressing plate can extend into the polishing blind area between the rotating plates to cover the blind area, meanwhile, the arc-shaped lines on the side edges cannot collide with the rotating plates and polish the area of the blind area to the maximum extent, and high-strength frequent stamping can be realized on the central point of the round crystal rod by utilizing stamping acting force, so that the rough surface of the polishing blind area of the central point of the round crystal rod is eliminated and the round crystal rod is smooth.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

FIG. 1 is a schematic diagram of an external structure of a wafer planarization apparatus according to the present invention.

FIG. 2 is a cross-sectional view of a wafer planarization apparatus according to the present invention.

FIG. 3 is a front cross-sectional view of a dead zone polishing mechanism of a wafer planarization apparatus according to the present invention.

FIG. 4 is a front cross-sectional view of a vibration guide device of a blind area polishing mechanism of a wafer planarization apparatus according to the present invention.

FIG. 5 is a bottom view of a platen structure of a dead zone polishing mechanism of a wafer planarization apparatus of the present invention.

In the figure: the device comprises an outer shell-1, a rotary table-2, a polishing disc-3, a blind area polishing mechanism-4, a driver-6, a driving shaft-7, a linkage shaft-8, a shaft core column-10, an embedded tooth block-11, a damping reed pipe-12, a vibration guide device-13, a flattening disc-14, a driving arm-16, a limiting column-17, a pressurizing crankshaft-18, a diamond disc body-20, a slide rail-21, a grinding and cutting block-22 and a stamping seat-23.

Detailed Description

In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easy to understand, the following description and the accompanying drawings further illustrate the preferred embodiments of the invention.

Examples

Referring to fig. 1, the present invention provides a wafer planarization apparatus, which comprises: the device comprises an outer shell 1, a turntable 2, polishing discs 3 and a blind area polishing mechanism 4, wherein the bottom of the outer shell 1 is connected with the turntable 2, the polishing disc 3 is arranged at the bottom end face of the turntable 2, the blind area polishing mechanism 4 is positioned between the turntables 2 and at the central point position below the outer shell 1, the outer shell 1 is integrally formed by a semicircular combined cylinder structure, the diameter size of the bottom of the outer shell is slightly larger than that of a round crystal rod, the outer shell is mainly used as a main structure and a protective structure of the device, on one hand, the inner components are protected from being damaged by a high-strength metal shell, on the other hand, the shell structure is used for connecting other components, the turntable 2 is a conventional structure for polishing the round crystal rod by the device, the total number of the four grinding discs are arranged at four corners below the outer shell 1 of the device at equal intervals, the polishing discs 3 are made of silicon carbide materials, and the hardness of the grinding discs is higher than that of the round crystal rod, the grinding disc can grind and flatten the rough and uneven surface of the round crystal by using the friction force contacted with the round crystal in the rotating process, wherein three grinding discs 3 are arranged in one rotary disc 2 and arranged in an equilateral triangle position, and a circular linear operation action can be formed in the rotating process.

Referring to fig. 2, the present invention provides a wafer planarization apparatus, which comprises: the rotary table 2 is composed of a driving shaft 7 and a linkage shaft 8, the driving shaft 7 and the linkage shaft 8 are mutually connected and synchronously run, the driving shaft 7 is provided with four positions which are respectively correspondingly connected to the bottom of the driver 6, the driving shaft is mainly used for transmitting the power on the driver 6 and downwards transmitting the power and converting the power into the power required by rotation, and a total power source divides the power into four power structures which are independently run, the linkage shaft 8 is a bearing structure which enables power to act on the turntable 2, and mainly has the functions of reducing vibration feedback generated in the process of power transmission of the driving shaft 7 and realizing synchronous operation of the two components.

Referring to fig. 3, the present invention provides a wafer planarization apparatus, which comprises: the blind area polishing mechanism 4 consists of a shaft core column 10, an embedded tooth block 11, a damping reed pipe 12, a vibration guide device 13 and a flattening disc 14, an embedded tooth block 11 is arranged at the side edge of the middle section of the shaft core column 10, a shock absorption reed pipe 12 is arranged below the embedded tooth block 11 and is connected with the shaft core column 10, a vibration guide device 13 is arranged at the middle end of the shaft core column 10, the bottom of the vibration guide device is connected with a flattening disc 14, the shaft core column 10 is an external main body framework of the blind area polishing mechanism 4, the two sides of the top of the polishing mechanism are provided with raised plates for enhancing the structural strength, the whole polishing mechanism is of a bearing structure, the polishing mechanism can rotate and drive an internal-jetting component to link, the embedded tooth blocks 11 are used for connecting the upper part and the lower part of the core column 10 so as to achieve the purpose of replacing the core column, and the damping reed pipe 12 is used for reducing the whole redundant vibration force of the blind area polishing mechanism 4 so as to prevent the phenomenon that the vibration guide device 13 and the flattening disc 14 at the bottom are influenced and the horizontal plane is inclined in the running process.

Referring to fig. 4, the present invention provides a wafer planarization apparatus, which comprises: the vibration guide device 13 is composed of a transmission arm 16, a limiting column 17 and a pressurizing crankshaft 18, the transmission arm 16 is connected with the limiting column 17, the pressurizing crankshaft 18 is positioned at two sides of the bottom of the transmission arm 16 and is positioned below the limiting column 17 to correspond to the limiting column, the transmission arm 16 is mainly used for transmitting power, in the process, the power is converted into linear vibration acting force vertically fluctuating up and down, the linear vibration acting force is a core structure for realizing power output by the vibration guide device 13, the limiting column 17 is used for limiting the lifting height of the transmission arm 16, thereby controlling the power output intensity of the transmission arm 16 to prevent the occurrence of an event of uncontrollable grinding precision caused by excessive vibration, the pressurizing crankshaft 18 is used for enhancing the pressure intensity of the bottom flattening disc 14, the pressure applying device is used for enabling the pressure applying intensity of the polishing blind area of the central point of the round crystal rod to be larger so as to achieve the purpose of polishing the rough surface of the central point.

Referring to fig. 5, the present invention provides a wafer planarization apparatus, which includes: the flattening disc 14 comprises a diamond disc body 20, slide rails 21, grinding blocks 22 and a stamping seat 23, the slide rails 21 are arranged on the side edges of the bottom surface of the diamond disc body 20 in an equal proportion around the shape of the diamond disc body, the grinding blocks 22 are movably connected with the slide rails 21, the stamping seat 23 is positioned at the central point of the diamond disc body 20 and connected with the central point, the diamond disc body 20 is a main body structure of the flattening disc 14, the whole structure is in a four-corner star shape, four corners of the diamond disc body can extend into grinding blind areas between the turntables 2 to cover the blind areas, meanwhile, arc lines on the side edges cannot collide with the turntables 2 and grind the area of the blind areas to the maximum extent, the slide rails 21 are mainly of a rail structure for the movement of the grinding blocks 22, the grinding blocks 22 are totally provided with four blocks, the circular track of clockwise forward movement and then backward movement can be realized according to the design structure, so that the grinding blocks 22 are limited in the area around the central point of the round crystal bar, the grinding and cutting block 22 is made of silicon carbide materials, the contact part of the round crystal rod can be ground and polished in the moving process, the middle punching seat 23 is also made of silicon carbide-based materials, high-strength frequent punching can be achieved on the central point of the round crystal rod by utilizing punching acting force, and the rough surface of the round crystal surface can be ground flat by means of high-frequency punching acting force.

When the device is used, a round crystal bar is placed at the bottom of the device, the round crystal bar is aligned to a blind area polishing mechanism 4 of the middle point position of the device as far as possible, the device is started after the round crystal bar is placed, firstly, a turntable 2 rotates and drives a polishing disc 3 to polish the rough and uneven position of the round crystal bar surface smoothly by using friction force contacted with the round crystal in the rotating process, a flattening disc 14 on the blind area polishing mechanism 4 covers the blind area in the running process of the polishing disc 3, a grinding cutting block 22 moves clockwise and forward and then moves reversely to cover and polish the blind area of the round crystal bar, a middle punching seat 23 can realize high-strength frequent punching on the central point of the round crystal bar by using punching acting force, the rough surface of the round crystal bar surface is ground flat by using high-frequency punching acting force, and the side edge and the central point are simultaneously polished until the surface of the round crystal bar is consistent in height.

While there have been shown and described what are at present considered the fundamental principles of the invention, the essential features and advantages thereof, it will be understood by those skilled in the art that the present invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but rather, is capable of numerous changes and modifications in various forms without departing from the spirit or essential characteristics thereof, and it is intended that the invention be limited not by the foregoing descriptions, but rather by the appended claims and their equivalents.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A wafer planarization apparatus, comprising: shell body (1), carousel (2), polishing dish (3), blind area grinding machanism (4), its characterized in that:

the bottom of the outer shell (1) is connected with the turntables (2), the bottom end face of each turntable (2) is provided with a polishing disc (3), the blind area polishing mechanism (4) is positioned between the turntables (2) and is positioned at the central point position below the outer shell (1), and a driver (6) is arranged in the outer shell (1) and connected with the outer shell;

the blind area polishing mechanism is characterized in that the rotary table (2) consists of a driving shaft (7) and a linkage shaft (8), the driving shaft (7) and the linkage shaft (8) are connected with each other and run synchronously, the blind area polishing mechanism (4) consists of a shaft core column (10), an embedded tooth block (11), a damping reed pipe (12), a vibration guide device (13) and a flattening disc (14), the embedded tooth block (11) is arranged at the side edge of the middle section of the shaft core column (10), the damping reed pipe (12) is arranged below the embedded tooth block (11) and is connected with the shaft core column (10), and the vibration guide device (13) is positioned at the middle end of the shaft core column (10) and is connected with the flattening disc (14) at the bottom;

the vibration guide device (13) consists of a transmission arm (16), a limiting column (17) and a pressurizing crankshaft (18), wherein the transmission arm (16) is connected with the limiting column (17), and the pressurizing crankshaft (18) is positioned at two sides of the bottom of the transmission arm (16) and is positioned below the limiting column (17) to correspond to the position;

the flattening disc (14) is composed of a rhombic disc body (20), a sliding rail (21), a grinding cutting block (22) and a stamping seat (23), the sliding rail (21) is arranged on the side edge of the bottom surface of the rhombic disc body (20) in an equal proportion around the shape of the rhombic disc body, the grinding cutting block (22) is movably connected with the sliding rail (21), and the stamping seat (23) is located at the central point position of the rhombic disc body (20) and is connected with the central point position.