CN110877380A - Thin bamboo board processing technology - Google Patents
Thin bamboo board processing technology Download PDFInfo
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- CN110877380A CN110877380A CN201911265391.9A CN201911265391A CN110877380A CN 110877380 A CN110877380 A CN 110877380A CN 201911265391 A CN201911265391 A CN 201911265391A CN 110877380 A CN110877380 A CN 110877380A
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- Prior art keywords
- thin
- bamboo
- thin bamboo
- chips
- wall
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27D—WORKING VENEER OR PLYWOOD
- B27D1/00—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
- B27D1/10—Butting blanks of veneer; Joining same along edges; Preparatory processing of edges, e.g. cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27J—MECHANICAL WORKING OF CANE, CORK, OR SIMILAR MATERIALS
- B27J1/00—Mechanical working of cane or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27M—WORKING OF WOOD NOT PROVIDED FOR IN SUBCLASSES B27B - B27L; MANUFACTURE OF SPECIFIC WOODEN ARTICLES
- B27M1/00—Working of wood not provided for in subclasses B27B - B27L, e.g. by stretching
- B27M1/06—Working of wood not provided for in subclasses B27B - B27L, e.g. by stretching by burning or charring, e.g. cutting with hot wire
Abstract
The invention discloses a thin bamboo board processing technology, which comprises the following steps: putting the thin-wall bamboo wood into a high-temperature furnace for high-temperature carbonization; cutting and flattening the thin-wall bamboo materials carbonized at high temperature into thin bamboo chips; the surface of one end of the thin bamboo sheet is larger, and the surface of the other end of the thin bamboo sheet is smaller; drying the flattened thin bamboo chips; cutting the thin bamboo chips according to the required length for later use; on the premise of not damaging the overall shape of the thin bamboo chips, the outer surfaces of the thin bamboo chips are flattened, so that the subsequent splicing is facilitated; gluing the flattened thin bamboo chips; when the thin bamboo boards are spliced, the side surfaces with the large surfaces and the small surfaces staggered with each other are laterally spliced, namely the side surface of the larger end of the surface of each thin bamboo chip is laterally spliced with the side surface of the smaller end of the surface of the adjacent thin bamboo chip to form the thin bamboo board. The thin bamboo board processing technology can utilize bamboo wood to the maximum extent, reduce the processing loss of the bamboo wood, improve the utilization rate of the bamboo wood to the maximum extent, ensure that the green surface of the bamboo wood is fully utilized, and improve the strength of the thin bamboo board.
Description
Technical Field
The invention relates to the technical field of bamboo board processing, in particular to a thin bamboo board processing technology.
Background
In the thin bamboo board processing technology, the bamboo tube is divided, four-side planing is adopted to fix the width and thickness, bamboo strips with uniform shapes and sizes are processed, then the bamboo strips are spliced into bamboo square materials through gluing, and finally the bamboo square materials are divided into the thin bamboo boards. And bamboo is in the natural growth in-process, and its root diameter is great and the wall thickness is also thicker, and afterbody diameter is less and the wall thickness is also thinner. When the existing four-side planer is adopted for width and thickness fixing processing, the bamboo wood at one end with larger diameter and thicker wall thickness is inevitably sliced too much, so that the bamboo wood is greatly wasted in the process of manufacturing the bamboo square stock. Meanwhile, the green surface of the bamboo is cut off, so that the strength of the formed bamboo square stock is reduced. In addition, a large amount of bamboo is lost in the process of cutting the bamboo square stock into thin bamboo boards.
Disclosure of Invention
In order to solve the problems, the invention provides a thin bamboo board processing technology which can utilize bamboo wood to the maximum extent, reduce the processing loss of the bamboo wood, improve the utilization rate of the bamboo wood to the maximum extent, ensure that the green surface of the bamboo wood is fully utilized and improve the strength of the thin bamboo board.
In order to achieve the above object, a first technical solution of the present invention is a thin bamboo board processing process, including the steps of:
s1: putting the thin-wall bamboo wood into a high-temperature furnace for high-temperature carbonization;
s2: cutting and flattening the thin-wall bamboo materials carbonized at high temperature into thin bamboo chips; because one end of the thin-wall bamboo wood is large in diameter and thick in side wall, and the other end of the thin-wall bamboo wood is small in natural diameter and thin in side wall, the surface of one end of the thin bamboo sheet is necessarily large, and the surface of the other end of the thin bamboo sheet is small; for convenience of subsequent description, the green bamboo surface and the yellow bamboo surface of the thin bamboo chip are taken as the front surfaces, the left side surface and the right side surface of the thin bamboo chip except the green bamboo surface and the yellow bamboo surface are taken as the left side surface and the right side surface respectively, and the large end surface and the small end surface of the thin bamboo chip are taken as the front end surface and the rear end surface respectively;
s3: drying the flattened thin bamboo chips to enable the water content of the thin bamboo chips to meet the requirement;
s4: cutting the thin bamboo chips according to the required length for later use;
s5: on the premise of not damaging the overall shape and size of the thin bamboo chips, the outer surfaces of the thin bamboo chips are flattened, burrs are removed, and subsequent splicing is facilitated;
s6: gluing the flattened thin bamboo chips;
s7: and (3) carrying out plate splicing treatment on a plurality of thin bamboo strips, wherein during plate splicing, the left side surface and the right side surface with mutually staggered large and small surfaces are adopted for lateral splicing, namely the side surface of the larger end of the surface of each thin bamboo strip is laterally spliced with the side surface of the smaller end of the surface of the adjacent thin bamboo strip to form the thin bamboo plate.
The second technical scheme provided by the invention is a thin bamboo board processing technology, which comprises the following steps:
s1: cutting the thin-wall bamboo wood according to the required length for later use;
s2: putting the thin-wall bamboo wood into a high-temperature furnace for high-temperature carbonization;
s3: cutting and flattening the thin-wall bamboo materials carbonized at high temperature into thin bamboo chips; because one end of the thin-wall bamboo wood is large in diameter and thick in side wall, and the other end of the thin-wall bamboo wood is small in natural diameter and thin in side wall, the surface of one end of the thin bamboo sheet is necessarily large, and the surface of the other end of the thin bamboo sheet is small; for convenience of subsequent description, the green bamboo surface and the yellow bamboo surface of the thin bamboo chip are taken as the front surfaces, the left side surface and the right side surface of the thin bamboo chip except the green bamboo surface and the yellow bamboo surface are taken as the left side surface and the right side surface respectively, and the large end surface and the small end surface of the thin bamboo chip are taken as the front end surface and the rear end surface respectively;
s4: drying the flattened thin bamboo chips to enable the water content of the thin bamboo chips to meet the requirement;
s5: on the premise of not damaging the overall shape and size of the thin bamboo chips, the outer surfaces of the thin bamboo chips are flattened, burrs are removed, and subsequent splicing is facilitated;
s6: gluing the flattened thin bamboo chips;
s7: and (3) carrying out plate splicing treatment on a plurality of thin bamboo strips, wherein during plate splicing, the left side surface and the right side surface with mutually staggered large and small surfaces are adopted for lateral splicing, namely the side surface of the larger end of the surface of each thin bamboo strip is laterally spliced with the side surface of the smaller end of the surface of the adjacent thin bamboo strip to form the thin bamboo plate.
Compared with the prior art, the invention has the following beneficial effects: the invention can flatten the outer surface of the thin bamboo sheet without damaging the whole shape and size of the thin bamboo sheet, remove the burrs, flatten the surface of the thin bamboo sheet, and facilitate the subsequent splicing. Meanwhile, during plate splicing, the left side and the right side with the large and small surfaces staggered with each other are spliced laterally, namely the side of the larger end of the surface of the thin bamboo strip is spliced laterally with the side of the smaller end of the surface of the adjacent thin bamboo strip to form the thin bamboo plate. Therefore, the thin bamboo board processing technology can utilize bamboo wood to the maximum extent, reduce the processing loss of the bamboo wood, improve the utilization rate of the bamboo wood to the maximum extent, ensure that the green surface of the bamboo wood is fully utilized, and improve the strength of the thin bamboo board.
Drawings
Fig. 1 is a structural diagram of a single thin bamboo sheet in the embodiment.
Fig. 2 is a schematic structural view of a thin bamboo board processed by the process of the invention.
In the figure: k0 thin bamboo sheet, K1 surf green face, K2 tabasheer face, K3 left side face, K4 right side face, K5 front end face, and K6 rear end face.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Example 1
A thin bamboo board processing technology comprises the following steps:
s1: putting the thin-wall bamboo wood into a high-temperature furnace for high-temperature carbonization;
s2: cutting and flattening the thin-wall bamboo materials carbonized at high temperature into thin bamboo chips; because one end of the thin-wall bamboo material is large in diameter and thick in side wall, and the other end of the thin-wall bamboo material is small in natural diameter and thin in side wall, as shown in fig. 1, the surface of one end of the thin bamboo sheet K0 is necessarily large, and the surface of the other end of the thin bamboo sheet K0 is small; for convenience of subsequent description, the surf green surface K1 and the surf green surface K2 of the thin bamboo chip K0 are front surfaces, the left and right side surfaces of the thin bamboo chip K0 except the surf green surface K1 and the surf green surface K2 are respectively a left side surface K3 and a right side surface K4, and the large and small end surfaces of the thin bamboo chip are respectively a front end surface K5 and a rear end surface K6;
s3: drying the flattened thin bamboo chips to enable the water content of the thin bamboo chips to meet the requirement;
s4: cutting the thin bamboo chips according to the required length for later use;
s5: on the premise of not damaging the overall shape and size of the thin bamboo chips, the outer surfaces of the thin bamboo chips are flattened, burrs are removed, and subsequent splicing is facilitated;
s6: gluing the flattened thin bamboo chips;
s7: and (3) splicing a plurality of thin bamboo chips, wherein the left side surface and the right side surface (K3 and K4) with staggered large and small surfaces are adopted for lateral splicing when the thin bamboo chips are spliced, namely the side surface of the larger end of the surface of each thin bamboo chip is laterally spliced with the side surface of the smaller end of the surface of the adjacent thin bamboo chip to form the thin bamboo board, as shown in figure 2.
Example 2
A thin bamboo board processing technology comprises the following steps:
s1: cutting the thin-wall bamboo wood according to the required length for later use;
s2: putting the thin-wall bamboo wood into a high-temperature furnace for high-temperature carbonization;
s3: cutting and flattening the thin-wall bamboo materials carbonized at high temperature into thin bamboo chips; because one end of the thin-wall bamboo material is large in diameter and thick in side wall, and the other end of the thin-wall bamboo material is small in natural diameter and thin in side wall, as shown in figure 1, the surface of one end of the thin bamboo sheet is necessarily large, and the surface of the other end of the thin bamboo sheet is small; for convenience of subsequent description, the surf green surface K1 and the surf green surface K2 of the thin bamboo chip K0 are front surfaces, the left and right side surfaces of the thin bamboo chip K0 except the surf green surface K1 and the surf green surface K2 are respectively a left side surface K3 and a right side surface K4, and the large and small end surfaces of the thin bamboo chip are respectively a front end surface K5 and a rear end surface K6;
s4: drying the flattened thin bamboo chips to enable the water content of the thin bamboo chips to meet the requirement;
s5: on the premise of not damaging the overall shape and size of the thin bamboo chips, the outer surfaces of the thin bamboo chips are flattened, burrs are removed, and subsequent splicing is facilitated;
s6: gluing the flattened thin bamboo chips;
s7: and (3) splicing a plurality of thin bamboo chips, wherein the left side surface and the right side surface (K3 and K4) with staggered large and small surfaces are adopted for lateral splicing when the thin bamboo chips are spliced, namely the side surface of the larger end of the surface of each thin bamboo chip is laterally spliced with the side surface of the smaller end of the surface of the adjacent thin bamboo chip to form the thin bamboo board, as shown in figure 2.
The invention can flatten the outer surface of the thin bamboo sheet without damaging the whole shape and size of the thin bamboo sheet, remove the burrs, flatten the surface of the thin bamboo sheet, and facilitate the subsequent splicing. Meanwhile, during plate splicing, the left side and the right side with the large and small surfaces staggered with each other are spliced laterally, namely the side of the larger end of the surface of the thin bamboo strip is spliced laterally with the side of the smaller end of the surface of the adjacent thin bamboo strip to form the thin bamboo plate. Therefore, the thin bamboo board processing technology can utilize bamboo wood to the maximum extent, reduce the processing loss of the bamboo wood, improve the utilization rate of the bamboo wood to the maximum extent, ensure that the green surface of the bamboo wood is fully utilized, and improve the strength of the thin bamboo board.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (2)
1. The thin bamboo board processing technology is characterized by comprising the following steps:
s1: putting the thin-wall bamboo wood into a high-temperature furnace for high-temperature carbonization;
s2: cutting and flattening the thin-wall bamboo materials carbonized at high temperature into thin bamboo chips; because one end of the thin-wall bamboo wood is large in diameter and thick in side wall, and the other end of the thin-wall bamboo wood is small in natural diameter and thin in side wall, the surface of one end of the thin bamboo sheet is necessarily large, and the surface of the other end of the thin bamboo sheet is small;
s3: drying the flattened thin bamboo chips;
s4: cutting the thin bamboo chips according to the required length for later use;
s5: on the premise of not damaging the overall shape and size of the thin bamboo chips, the outer surfaces of the thin bamboo chips are flattened, so that the subsequent splicing is facilitated;
s6: gluing the flattened thin bamboo chips;
s7: and (3) carrying out plate splicing treatment on a plurality of thin bamboo strips, wherein during plate splicing, the left side surface and the right side surface with mutually staggered large and small surfaces are adopted for lateral splicing, namely the side surface of the larger end of the surface of each thin bamboo strip is laterally spliced with the side surface of the smaller end of the surface of the adjacent thin bamboo strip to form the thin bamboo plate.
2. The thin bamboo board processing technology is characterized by comprising the following steps:
s1: cutting the thin-wall bamboo wood according to the required length for later use;
s2: putting the thin-wall bamboo wood into a high-temperature furnace for high-temperature carbonization;
s3: cutting and flattening the thin-wall bamboo materials carbonized at high temperature into thin bamboo chips; because one end of the thin-wall bamboo wood is large in diameter and thick in side wall, and the other end of the thin-wall bamboo wood is small in natural diameter and thin in side wall, the surface of one end of the thin bamboo sheet is necessarily large, and the surface of the other end of the thin bamboo sheet is small;
s4: drying the flattened thin bamboo chips;
s5: on the premise of not damaging the overall shape and size of the thin bamboo chips, the outer surfaces of the thin bamboo chips are flattened, so that the subsequent splicing is facilitated;
s6: gluing the flattened thin bamboo chips;
s7: and (3) carrying out plate splicing treatment on a plurality of thin bamboo strips, wherein during plate splicing, the left side surface and the right side surface with mutually staggered large and small surfaces are adopted for lateral splicing, namely the side surface of the larger end of the surface of each thin bamboo strip is laterally spliced with the side surface of the smaller end of the surface of the adjacent thin bamboo strip to form the thin bamboo plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911265391.9A CN110877380A (en) | 2019-12-11 | 2019-12-11 | Thin bamboo board processing technology |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911265391.9A CN110877380A (en) | 2019-12-11 | 2019-12-11 | Thin bamboo board processing technology |
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| CN110877380A true CN110877380A (en) | 2020-03-13 |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1970254A (en) * | 2006-11-07 | 2007-05-30 | 国家林业局北京林业机械研究所 | Curved bamboo material original state regroup method and its making method |
| CN201007073Y (en) * | 2007-01-22 | 2008-01-16 | 陈炜 | Bamboo floor |
| CN201658039U (en) * | 2010-04-15 | 2010-12-01 | 杭州金竹宝地板有限公司 | Natural staggered bamboo-wood furniture board |
| CN102172928A (en) * | 2011-02-28 | 2011-09-07 | 刘佐财 | Non-uniform thickness bamboo chip integrated plate and production technology method thereof |
| JP2013018280A (en) * | 2011-07-13 | 2013-01-31 | Design Office Line Co Ltd | Bias core wooden panel |
| CN106003301A (en) * | 2016-07-22 | 2016-10-12 | 上海云生竹业股份有限公司 | Expanded type bamboo piece seamless long bamboo section |
| CN107756556A (en) * | 2017-10-25 | 2018-03-06 | 江西兴创木业有限责任公司 | The preparation method of Eucalyptus core integrated timber |
-
2019
- 2019-12-11 CN CN201911265391.9A patent/CN110877380A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1970254A (en) * | 2006-11-07 | 2007-05-30 | 国家林业局北京林业机械研究所 | Curved bamboo material original state regroup method and its making method |
| CN201007073Y (en) * | 2007-01-22 | 2008-01-16 | 陈炜 | Bamboo floor |
| CN201658039U (en) * | 2010-04-15 | 2010-12-01 | 杭州金竹宝地板有限公司 | Natural staggered bamboo-wood furniture board |
| CN102172928A (en) * | 2011-02-28 | 2011-09-07 | 刘佐财 | Non-uniform thickness bamboo chip integrated plate and production technology method thereof |
| JP2013018280A (en) * | 2011-07-13 | 2013-01-31 | Design Office Line Co Ltd | Bias core wooden panel |
| CN106003301A (en) * | 2016-07-22 | 2016-10-12 | 上海云生竹业股份有限公司 | Expanded type bamboo piece seamless long bamboo section |
| CN107756556A (en) * | 2017-10-25 | 2018-03-06 | 江西兴创木业有限责任公司 | The preparation method of Eucalyptus core integrated timber |
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Application publication date: 20200313 |
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