CN209566368U - Sapphire ingot accurate digital control processes multi-wire saw clamping device - Google Patents
Sapphire ingot accurate digital control processes multi-wire saw clamping device Download PDFInfo
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- CN209566368U CN209566368U CN201822158432.1U CN201822158432U CN209566368U CN 209566368 U CN209566368 U CN 209566368U CN 201822158432 U CN201822158432 U CN 201822158432U CN 209566368 U CN209566368 U CN 209566368U
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- resin plate
- sapphire ingot
- groove
- clamping device
- wire saw
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Abstract
The utility model discloses a kind of sapphire ingot accurate digital controls to process multi-wire saw clamping device, including resin plate；Milling is fluted on the surface of the resin plate；The both ends of the groove connection resin plate；The groove inner wall two sides are that the slot bottom of curved surface and the groove is plane；The sapphire ingot is adhered in groove；The bond area of the sapphire ingot and groove inner wall is at least the 1/3 of sapphire ingot surface area；The technical solution that the utility model is taken solves bonding crystal bar cutting processing when chip cutting is near completion, all wafers stress focuses on fixture and the contact surface of sapphire ingot, be easy to cause bonding wafer is insecure to cause to fall piece and the exceeded the problem of causing the undesirable scrappage of Warp to rise for being bonded Warp parameter (angularity) caused by insecure chip shakes after the completion of cutting because bond area is too small.
Description
Technical field
The utility model relates to superhard material special process numerical control device technical fields, and in particular to a kind of sapphire ingot
Accurate digital control processes multi-wire saw clamping device.
Background technique
In the semicon industry of current countries in the world, sapphire crystal multi-wire cutting technology is always the one of this industry
The key processing technology of item, but with the expanded demand of semi-conductor market, the matter of sapphire wafer in processing cutting process
Amount stability cannot be guaranteed, especially the stability control of cutting processing wafer face type；Crystal bar during cutting processing
Bonding have a certain impact to the crystal bar face type after cutting, former sapphire ingot be bonded when using glass bar process arc groove into
Row bonding cutting processing；Bonding crystal bar area is too small after fluting processing on glass bar；Bonding crystal bar cutting processing is cut in chip
It cuts when being near completion, all wafers stress focuses on fixture and the contact surface of sapphire ingot, is easy because bond area is too small
Cause bonding wafer is insecure to cause to fall piece and be bonded insecure chip shake to cause Warp parameter (angularity) after the completion of cutting
Exceeded the problem of causing the undesirable scrappage of Warp to rise.
Summary of the invention
The purpose of this utility model is to provide a kind of sapphire ingot accurate digital controls to process multi-wire saw clamping device,
Bonding crystal bar cutting processing is solved when chip cutting is near completion, all wafers stress focuses on fixture and sapphire ingot
On contact surface, it be easy to cause bonding wafer is insecure to cause to fall piece and bonding loosely die bond after the completion of cutting because bond area is too small
Piece shakes the exceeded the problem of causing the undesirable scrappage of Warp to rise for causing Warp parameter (angularity).
In order to solve the above technical problems, the utility model uses a kind of following technical scheme: sapphire ingot precision number
Control processing multi-wire saw clamping device, including resin plate；Milling is fluted on the surface of the resin plate；The groove connection
The both ends of resin plate；The groove inner wall two sides are that the slot bottom of curved surface and the groove is plane；The sapphire ingot bonding
In in groove；The bond area of the sapphire ingot and groove inner wall is at least the 1/3 of sapphire ingot surface area；Passing through will
The baseboard material that sapphire ingot uses when being bonded changes into resin plate, and will simple arc groove milling originally on resin plate
Being processed into two sides is the groove that curved bottom portion is plane, improves sapphire bond area, enhances the fastness of bonding, blue precious
When stone will cut completion, contact area when stress focuses on crystal bar and fixture is effectively increased, reduces piece and shake；It will
The average value of original bonding cutting warp data is reduced to 40-45 by 49-50, improves the qualification rate of cutting, effectively reduces because of crystalline substance
Production cost caused by piece angularity is exceeded；Groove is directed to various sizes of crystal bar, current to be now processed into suitable width and depth
Degree, to meet the dimensional parameters of crystal bar；
Further, the resin plate with a thickness of 20mm-30mm；Using resin plate and open up two N-Side surf slot bottom planes
Groove, the thickness of resin plate can be increased to 30mm, be conducive to processing, while improving intensity；
Further, bar shaped shallow slot is machined on surface of the resin plate far from groove side；In vertical plate far from recessed
The bar shaped shallow slot processed on one side surface of slot, convenient for shifting resin plate with tool；
Further, feather plucking has anti-skidding bur on the inner wall of the bar shaped shallow slot；Feather plucking has on the inner wall of bar shaped shallow slot
Anti-skidding bur improves the coefficient of friction with tool contact when mobile resin plate, is conducive to stablize fixed and mobile resin plate；
Further, it is also set up on the two sidewalls of the resin plate and is machined with round micropore；The circle micropore is through tree
The two side walls of rouge plate；After cutting processing, need for resin plate and the crystal bar being bonded in vertical plate groove to be put into togerther
It is impregnated in hot water, sapphire ingot is separated with resin plate, by the round micropore processed on resin plate two sidewalls, be conducive to
Hot water enters, and quickly carries out heat exchange, sapphire ingot is separated with resin plate, improves processing efficiency；
Further technical solution is the slot bottom lower position that the round micropore is located at groove；It can be in enhancing hot water
While in into resin plate, avoid impacting the structural strength of vertical plate.
Compared with prior art, the beneficial effects of the utility model are at least one of following:
1, the baseboard material used when by the way that sapphire ingot to be bonded changes into resin plate, and will be original on resin plate
It is the groove that curved bottom portion is plane that two sides are processed into simple arc groove milling, improves sapphire bond area, and enhancing is viscous
The fastness connect effectively increases contact area when stress focuses on crystal bar and fixture when sapphire will cut completion,
Reduce piece and shake；
2, the former average value for being bonded cutting warp data is reduced to 40-45 by 49-50, improves the qualification rate of cutting, has
Effect reduce because chip warpage degree it is exceeded caused by production cost.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model.
Fig. 2 is the utility model main view.
Fig. 3 is the utility model bottom view.
Fig. 4 is the utility model left view.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
Embodiment 1: as illustrated in fig. 1 and 2, a kind of sapphire ingot accurate digital control processing multi-wire saw clamping device, packet
Include resin plate 1；Milling fluted 2 on the surface of the resin plate 1；The groove 2 connects the both ends of resin plate 1；The groove 2
Inner wall two sides are that the slot bottom of curved surface and the groove 2 is plane；The sapphire ingot is adhered in groove 2；The sapphire
The bond area of crystal bar and 2 inner wall of groove is at least the 1/3 of sapphire ingot surface area；Make when by the way that sapphire ingot being bonded
Baseboard material changes into resin plate 1, and it is curved surface that two sides are processed into original simple arc groove milling on resin plate 1
Bottom is the groove 2 of plane, improves sapphire bond area, enhances the fastness of bonding, will cut completion in sapphire
When, contact area when stress focuses on crystal bar and fixture is effectively increased, reduces piece and shake；Original is bonded and cuts warp
The average value of data is reduced to 40-45 by 49-50, improves the qualification rate of cutting, effectively reduces and makes because chip warpage degree is exceeded
At production cost.
Embodiment 2: as shown in Figures 1 to 4, the resin plate 1 with a thickness of 20mm-30mm；Using resin plate 1 and open up two
The thickness of resin plate 1 can be increased to 30mm by the groove 2 of N-Side surf slot bottom plane, be conducive to processing, while improving intensity.
Embodiment 3: as shown in Figures 3 and 4, bar shaped shallow slot 3 is machined on the surface of the resin plate 1 far from 2 side of groove；
In vertical plate far from the bar shaped shallow slot 3 processed on 2 one side surface of groove, convenient for shifting resin plate 1 with tool.
Embodiment 4: as shown in figure 3, feather plucking has anti-skidding bur 4 on the inner wall of the bar shaped shallow slot 3；In bar shaped shallow slot 3
Feather plucking has anti-skidding bur 4 on inner wall, improves the coefficient of friction with tool contact when mobile resin plate 1, is conducive to stablize fixation
With mobile resin plate 1.
Embodiment 5: it as shown in Figures 3 and 4, is also set up on the two sidewalls of the resin plate 1 and is machined with round micropore 5；It is described
Round micropore 5 runs through the two side walls of resin plate 1；After cutting processing, needs resin plate 1 and be bonded in resin plate 1
Crystal bar in groove 2, which is put into togerther in hot water, to be impregnated, and sapphire ingot is separated with resin plate 1, by 1 two sidewalls of resin plate
The round micropore 5 of upper processing is conducive to hot water entrance, quickly carries out heat exchange, sapphire ingot is separated with resin plate, is mentioned
High processing efficiency.
Embodiment 6: as shown in Figures 3 and 4, the circle micropore 5 is located at the slot bottom lower position of groove 2；The circle is micro-
Hole 5 is located at the slot bottom lower position of groove 2；It can avoid while enhancing hot water enters in resin plate to resin plate 1
Structural strength impacts.
Although reference be made herein to the utility model is described in multiple explanatory embodiments of the utility model, still,
It should be understood that those skilled in the art can be designed that a lot of other modification and implementations, these modifications and implementations
It will fall within scope and spirit disclosed in the present application.More specifically, it discloses in the application, drawings and claims
In range, can building block to theme combination layout and/or layout carry out a variety of variations and modifications.In addition to building block
And/or outside the modification and improvement of layout progress, to those skilled in the art, other purposes also be will be apparent.
Claims (6)
1. a kind of sapphire ingot accurate digital control processes multi-wire saw clamping device, it is characterised in that: including resin plate (1)；
Milling is fluted (2) on the surface of the resin plate (1)；The both ends of groove (2) connection resin plate (1)；The groove (2)
Inner wall two sides are that the slot bottom of curved surface and the groove (2) is plane；The sapphire ingot is adhered in groove (2)；The indigo plant
The bond area of jewel crystal bar and groove (2) inner wall is at least the 1/3 of sapphire ingot surface area.
2. sapphire ingot accurate digital control according to claim 1 processes multi-wire saw clamping device, it is characterised in that:
The resin plate (1) with a thickness of 20mm-30mm.
3. sapphire ingot accurate digital control according to claim 1 processes multi-wire saw clamping device, it is characterised in that:
Bar shaped shallow slot (3) are machined on the surface of separate groove (2) side of the resin plate (1).
4. sapphire ingot accurate digital control according to claim 3 processes multi-wire saw clamping device, it is characterised in that:
Feather plucking has anti-skidding bur (4) on the inner wall of the bar shaped shallow slot (3).
5. sapphire ingot accurate digital control according to claim 1 processes multi-wire saw clamping device, it is characterised in that:
It is also set up on the two sidewalls of the resin plate (1) and is machined with round micropore (5)；The circle micropore (5) is through resin plate (1)
Two side walls.
6. sapphire ingot accurate digital control according to claim 5 processes multi-wire saw clamping device, it is characterised in that:
The circle micropore (5) is located at the slot bottom lower position of groove (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822158432.1U CN209566368U (en) | 2018-12-21 | 2018-12-21 | Sapphire ingot accurate digital control processes multi-wire saw clamping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822158432.1U CN209566368U (en) | 2018-12-21 | 2018-12-21 | Sapphire ingot accurate digital control processes multi-wire saw clamping device |
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| Publication Number | Publication Date |
|---|---|
| CN209566368U true CN209566368U (en) | 2019-11-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201822158432.1U Active CN209566368U (en) | 2018-12-21 | 2018-12-21 | Sapphire ingot accurate digital control processes multi-wire saw clamping device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111015980A (en) * | 2019-12-13 | 2020-04-17 | 广东富源科技股份有限公司 | Efficient heat exchange method sapphire gluing ingot saving method and device |
| WO2023280201A1 (en) * | 2021-07-09 | 2023-01-12 | 麦斯克电子材料股份有限公司 | Manual ingot bonding method for 12-inch semiconductor wafer |
-
2018
- 2018-12-21 CN CN201822158432.1U patent/CN209566368U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111015980A (en) * | 2019-12-13 | 2020-04-17 | 广东富源科技股份有限公司 | Efficient heat exchange method sapphire gluing ingot saving method and device |
| WO2023280201A1 (en) * | 2021-07-09 | 2023-01-12 | 麦斯克电子材料股份有限公司 | Manual ingot bonding method for 12-inch semiconductor wafer |
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