CN110875407A - High-air-tightness LED support, LED and light-emitting device - Google Patents
High-air-tightness LED support, LED and light-emitting device Download PDFInfo
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- CN110875407A CN110875407A CN201811005329.1A CN201811005329A CN110875407A CN 110875407 A CN110875407 A CN 110875407A CN 201811005329 A CN201811005329 A CN 201811005329A CN 110875407 A CN110875407 A CN 110875407A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a high-air-tightness LED bracket, an LED and a light-emitting device, which comprises an anode substrate, a cathode substrate, an insulating isolation strip for insulating and isolating the anode substrate and the cathode substrate, and an insulating wall body for enclosing the anode substrate, the cathode substrate and the insulating isolation strip, wherein the front surfaces of the anode substrate and the cathode substrate are provided with a functional area and a wall contact area contacted with the wall body, at least one substrate of the anode substrate and the cathode substrate is also provided with a connecting transition area for connecting the functional area and the wall contact area, and the plane of the functional area is lower than the plane of the wall contact area, so that the path between the wall contact area and the functional area of the substrates can be prolonged, namely the path of moisture entering the functional area is prolonged, the moisture resistance of the LED bracket and an LED manufactured by utilizing the LED bracket is improved, the reliability and the durability of the LED are improved, and the LED can be better suitable for application scenes of various environments, the popularization and the application of the LED are more facilitated.
Description
Technical Field
The invention relates to the field of Light Emitting Diodes (LEDs), in particular to a high-airtightness LED bracket, an LED and a Light Emitting device.
Background
Because the LED has the advantages of rich colors, small volume, environmental protection, energy conservation, long service life and the like, the LED is widely used and popularized in various fields, such as but not limited to daily illumination, outdoor illumination, light decoration, advertisement marks, automobile illumination or indication, traffic indication and the like.
Referring to fig. 1-1 to 1-2, the conventional LED support includes a plastic enclosure 10 forming a reflective cavity, a positive electrode substrate 11 enclosed by the plastic enclosure 10, a negative electrode substrate 12, and an isolation strip 13 insulating and isolating the positive electrode substrate 11 and the negative electrode substrate 12, wherein a partial area of the front surfaces of the positive electrode substrate 11 and the negative electrode substrate 12 is in direct contact with the plastic enclosure 10, which is called an enclosure contact area; the other part of the area is positioned at the bottom of the reflecting cavity and is used as a functional area which can be used for bearing an LED chip and other possible electronic devices, wiring, die bonding, a light reflecting area and the like. In the existing LED support, the enclosure contact area and the functional area on the front surfaces of the positive substrate 11 and the negative substrate 12 are located on a same plane, so when moisture spreads to the front surface of the substrate along the joint of the side surface of the substrate and the plastic enclosure 10, the moisture can easily enter the functional area through the enclosure contact area on the front surface of the substrate, which causes a short circuit of a circuit in the functional area, damage of a device, and even directly causes a lamp failure; and most of the functional areas of the substrate are plated with metal silver layers, and the metal silver layers are also easily corroded under the action of moisture to cause functional defects. Therefore, the existing LED support and the LED prepared by the support have poor moisture resistance.
Disclosure of Invention
The invention provides a high-air-tightness LED bracket, an LED and a light-emitting device, which mainly solve the technical problems that: the problem that the existing LED support and an LED manufactured by the support are poor in moisture resistance is solved.
In order to solve the technical problems, the invention provides a high-air-tightness LED support which comprises an anode substrate, a cathode substrate and an insulating isolation strip, wherein the insulating isolation strip is positioned between the anode substrate and the cathode substrate to isolate the anode substrate from the cathode substrate;
at least one of the positive electrode substrate and the negative electrode substrate is also provided with a connecting transition region for connecting the functional region and the wall contact region, and the plane of the functional region is lower than the plane of the wall contact region.
In an embodiment of the invention, the planes of the functional regions of the positive electrode substrate and the negative electrode substrate are lower than the plane of the fence contact region.
In an embodiment of the present invention, the functional regions of the positive electrode substrate and the negative electrode substrate are located at the bottom of the reflection cavity formed by the enclosure; the height difference between the plane where the functional area is located and the plane where the enclosing wall contact area is located is larger than 0 and smaller than or equal to one fourth of the depth of the reflection cavity.
In an embodiment of the present invention, the connection transition area is a slope, an arc, or a combination of planes including at least two of a plane, a slope, and an arc.
In one embodiment of the invention, at least a partial region of the connecting transition zone is in contact with the enclosure body.
In one embodiment of the present invention, the front surface of the insulating isolation belt is higher than the front surfaces of the positive electrode substrate and the negative electrode substrate.
In an embodiment of the invention, two long sides of the insulating isolation strip opposite to each other in the cross-sectional profile are arc-shaped sides, or are curved sides with at least one bend, or are broken line sides with at least one bend, or are inclined sides with an included angle of 10 ° or more and less than 90 ° with the short sides of the negative electrode substrate.
In one embodiment of the invention, two long sides of the cross-sectional profile of the insulating isolation belt are parallel to each other.
In order to solve the above problems, the present invention further provides an LED, including the above high air-tightness LED support and at least one LED chip, where the LED chip is disposed on the anode substrate and/or the cathode substrate, and an anode pin and a cathode pin of the LED chip are electrically connected to the anode substrate and the cathode substrate, respectively.
In order to solve the above problems, the present invention further provides a light emitting device, which includes the LED as described above, and the light emitting device is a lighting device, an optical signal indicating device, a light supplementing device, or a backlight device.
The invention has the beneficial effects that:
the invention provides a high-air-tightness LED bracket, an LED and a light-emitting device, which comprises an anode substrate, a cathode substrate, an insulating isolation strip for insulating and isolating the anode substrate and the cathode substrate, and an insulating wall body for enclosing the anode substrate, the cathode substrate and the insulating isolation strip, wherein the front surfaces of the anode substrate and the cathode substrate are provided with a functional area and a wall contact area contacted with the wall body, at least one substrate in the anode substrate and the cathode substrate is also provided with a connecting transition area for connecting the functional area and the wall contact area, and the plane of the functional area is lower than the plane of the wall contact area, so that the path between the wall contact area and the functional area of the substrate can be prolonged, namely the path of moisture entering the functional area is prolonged, the moisture resistance of the LED bracket and an LED prepared by using the LED bracket is improved, the reliability and the durability of the LED are improved, and the LED can be better suitable for application scenes of various environments, the popularization and the application of the LED are more facilitated.
Drawings
FIG. 1-1 is a top view of an LED support;
1-2 are cross-sectional views of the LED support shown in FIG. 1-1;
FIG. 2-1 is a first cross-sectional view of an LED support according to a second embodiment of the present invention;
2-2 are sectional views of a second LED support provided in accordance with a second embodiment of the present invention;
2-3 are cross-sectional views of a third LED support provided in accordance with a second embodiment of the present invention;
2-4 are cross-sectional views of a second embodiment of the invention providing an LED support;
fig. 3-1 is a first cross-sectional view of an LED mount according to a third embodiment of the present invention;
3-2 are cross-sectional views of a second LED support provided in accordance with a third embodiment of the present invention;
3-3 are cross-sectional views of a third LED support provided in accordance with a third embodiment of the present invention;
3-4 are cross-sectional views of a third embodiment of the invention providing an LED support;
3-5 are cross-sectional views of a third embodiment of the invention providing an LED support;
3-6 are cross-sectional views six of LED supports provided in accordance with a third embodiment of the present invention;
3-7 are cross-sectional views seven of LED supports provided in accordance with a third embodiment of the present invention;
3-8 are cross-sectional views eight of LED supports according to a third embodiment of the present invention;
fig. 4-1 is a first top view of an LED holder according to a fifth embodiment of the present invention;
fig. 4-2 is a second top view of an LED mount according to a fifth embodiment of the present invention;
fig. 4-3 are top views three of LED holders according to a fifth embodiment of the present invention;
4-4 are top views four of LED supports according to fifth embodiment of the present invention;
4-5 provide a fifth top view of an LED support according to fifth embodiment of the present invention;
4-6 provide top views six of LED stands for example five of the present invention;
fig. 5-1 is a top view seven of an LED fixture according to a fifth embodiment of the present invention;
fig. 5-2 is a top view eight of an LED mount according to a fifth embodiment of the present invention;
5-3 provide a top view nine of an LED support according to a fifth embodiment of the present invention;
5-4 are top views ten of LED supports according to fifth embodiment of the present invention;
wherein, the reference numeral 10 in fig. 1-1 to fig. 1-2 is a plastic fence, 11 is a positive electrode substrate, 12 is a negative electrode substrate, and 13 is an isolation strip; in fig. 2-1 to 2-4, 20 is a surrounding wall, 21 is a substrate, 211 is a functional region, and 212 is a surrounding wall contact region; in fig. 3-1 to 3-8, 30 is a wall body, 31 is a substrate, 311 is a functional region, 312 is a wall contact region, and 313 is a connecting transition region; in fig. 4-1 to 4-6, 50 is a wall body, 51 is a positive substrate, 52 is a negative substrate, and 53 is an insulating isolation region; in fig. 5-1 to 5-4, 60 is a surrounding wall, 61 is a substrate, 61 is a positive electrode substrate, 62 is a negative electrode substrate, and 63 is an insulating isolation region.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The first embodiment is as follows:
in order to solve the problem of poor moisture resistance of the conventional LED support, the embodiment provides an LED support with high sealing performance, which includes a positive electrode substrate, a negative electrode substrate, and an insulating isolation strip, where the insulating isolation strip is located between the positive electrode substrate and the negative electrode substrate to isolate the positive electrode substrate from the negative electrode substrate, the LED support in this embodiment further includes an insulating enclosure enclosing the positive electrode substrate, the negative electrode substrate, and the insulating isolation strip, and the fronts of the positive electrode substrate and the negative electrode substrate have a functional region and an enclosure contact region contacting the enclosure; in one example, the functional regions on the front sides of the positive and negative substrates are located at the bottom of the reflective cavity formed around the wall.
The positive electrode substrate and the negative electrode substrate in this embodiment are both conductive substrates, and the conductive substrate in this embodiment may be substrates made of various conductive materials, for example, various metal conductive substrates, including but not limited to a copper substrate, an aluminum substrate, an iron substrate, and a silver substrate; the conductive substrate may also be a hybrid material conductive substrate containing a conductive material, such as a conductive rubber or the like.
Optionally, in this embodiment, a reflective layer may be further disposed in the functional region on at least one front surface of the positive electrode substrate and the negative electrode substrate to improve the light extraction efficiency of the bracket, and the reflective layer may be various light reflective layers capable of improving the light extraction efficiency, for example, including but not limited to a silver plating layer.
Optionally, in this embodiment, the back surface of at least one of the positive electrode substrate and the negative electrode substrate is exposed to the bottom of the enclosure body as the electrode pad. Of course, in some examples, the back surface of at least one of the positive electrode substrate and the negative electrode substrate may not be used as the welding area, and the side surface thereof may be used as the welding area, and the specific arrangement may be flexibly determined according to the specific application requirements.
Optionally, the enclosure body in this embodiment may be made of various insulating materials, for example, but not limited to, various plastics, insulating ceramics, and the like. For example, in one example, the enclosure body may be made of Epoxy resin (EP), high temperature resistant nylon (PPA plastic), Polyphthalamide (PPA), 1, 4-cyclohexanedimethanol terephthalate (PCT, Poly1, 4-cyclohexylene dimethylene terephthalate), Liquid Crystal Polymer (LCP), Liquid Crystal Polymer (Liquid Crystal Polymer), Sheet Molding Compound (SMC), Epoxy Molding Compound (EMC), Unsaturated Polyester (UP) resin, polyester resin (PET), Polycarbonate (PC, Polycarbonate), polyhexamethylene adipamide (nylon66), and glass fiber.
Optionally, the material of the insulating isolation strip in this embodiment may be the same as or different from the wall body, and it may be formed together with the wall body or formed separately.
In addition, it should be understood that the forming manner of the enclosure body in the embodiment may also be flexibly selected, for example, but not limited to, forming by injection molding.
In this embodiment, the functional region and the wall contact region of at least one of the positive substrate and the negative substrate of the LED support are not on a plane, for example, the functional region and the wall contact region on the front surface of the positive substrate are not on a plane, and/or the functional region and the wall contact region on the front surface of the negative substrate are not on a plane; the functional region and the fence contact region, which are particularly provided with one or two of the anode substrate and the cathode substrate, are not on the same plane, and can be flexibly set according to specific requirements. For example, in one example, in order to improve the sealing performance of the LED support, the functional regions and the fence contact region of the positive substrate and the negative substrate may not be on the same plane. The setting can prolong the path between the enclosing wall contact area functional areas of the substrate, namely, the path of moisture entering the functional areas is prolonged, so that the sealing performance of the LED bracket and the LED manufactured by the LED bracket can be improved, the reliability and the durability of the LED are improved, the LED can better meet the use requirements of various environments, and the popularization and the use of the LED are facilitated.
In an example of this embodiment, the fence contact region on the front surface of the substrate may be directly connected to the functional region, and the fence contact region may be a bevel, a cambered surface, or another type of surface.
In another example of this embodiment, in order to further extend the path between the enclosure contact region and the functional region of the substrate, a connection transition region may be further disposed between the enclosure contact region and the functional region of the substrate, so that moisture needs to pass through the enclosure contact region and the connection transition region before entering the functional region, and the moisture resistance of the support may be further improved. In this embodiment, the connection transition area may also be a slope, an arc, or a combination of at least two of a plane, a slope, and an arc.
The functional area and the wall contact area of this embodiment through setting up at least one base plate in the anodal base plate and the negative pole base plate of LED support are not on a plane, and optionally, can set up the plane that the functional area is located and be higher than the plane at wall contact area place, or set up the plane that the functional area is located and be less than the plane at wall contact area place, consequently can prolong the route between the wall contact area and the functional area of base plate, also prolong the route that the moisture enters into the functional area in to promote the dampproofing ability of LED support and the LED that utilizes this LED support to make.
Example two:
for convenience of understanding, the embodiment is described by taking the fence contact region on the substrate directly connected to the functional region, and the functional region is located above the fence contact region as an example.
Referring to fig. 2-1, a schematic diagram of a direct connection between a fence contact region and a functional region on a substrate is shown, in which 20 is a fence body, 21 is a substrate (which may be a positive substrate and/or a negative substrate), 211 is a functional region, and 212 is a fence contact region. In fig. 2-1, the wall contact area 212 is a slope, and the functional area 211 is a plane located on the wall contact area 212, although the functional area 211 may be configured to be non-planar according to the requirement. The route between enclosure contact zone 212 and the functional zone 211 has obviously lengthened for current enclosure contact zone and functional zone set up in the route of coplanar, consequently can lengthen the route that the moisture got into the functional zone, and then promote the humidity resistance of support, promote the reliability of the LED lamp pearl or other products that utilize this support to make.
In some examples, fence contact region 212 may also be other than a chamfer, but other types of faces. For example, referring to fig. 2-2, the enclosing wall contact area 212 is a curved surface, and the curved surface is a convex curved surface protruding to the outer side of the substrate 21, the convex curved surface shown in fig. 2-2 is arranged relative to the inclined surface shown in fig. 2-1, so that the path of moisture entering the functional area can be further extended, and the moisture-proof effect can be further improved.
In some examples, where perimeter wall contact zone 212 is a curved surface, other types of curved surfaces are possible in addition to the convex curved surface shown in fig. 2-2. For example, as shown in fig. 2-3, it is an inward curved surface concave toward the inside of the substrate 21, which can further extend the path of moisture entering the functional region relative to the slope shown in fig. 2-1, thereby further improving the moisture-proof effect.
Of course, it should be understood that, in the embodiment, the enclosing wall contact area 212 may be a slope or a curved surface, and may also be configured as another type of surface according to the requirement, and it may specifically be a regular surface, and may also be an irregular surface. For example, referring to fig. 2-4, the perimeter wall contact area 212 is a curved surface that may further extend the path of moisture into the functional area relative to the sloped surface shown in fig. 2-1, thereby further enhancing the moisture barrier effect.
In addition, it should be understood that the fence contact areas 212 on opposite sides in fig. 2-1 to 2-4 may be configured as the same surface, or may be configured as different surfaces, and may be flexibly configured according to application scenarios. And it should be understood that in another example of the present embodiment, a connection transition region may also be provided between the fence contact region and the functional region of the substrate in order to further extend the path between the fence contact region and the functional region of the substrate.
In some examples, the forming process of the fence contact region 212 may be flexibly selected, for example, including but not limited to etching, cutting, stamping, and the like, and the forming method is simple, low-cost, and efficient, and can improve the moisture resistance of the LED support while ensuring the manufacturing cost and efficiency of the support.
Example three:
for convenience of understanding, the embodiment is described by taking an example in which the fence contact region and the functional region on the substrate have a connection transition region therebetween, and the functional region is located below the fence contact region.
In an example of the present embodiment, the functional regions of the positive electrode substrate and the negative electrode substrate may be disposed on a plane lower than the plane of the fence contact region.
In an example of the embodiment, the functional regions of the positive electrode substrate and the negative electrode substrate are located at the bottom of the reflection cavity formed around the wall body; the height difference value between the plane of the functional area and the plane of the wall contact area can be flexibly set, for example, the height difference can be set to be greater than 0 and less than or equal to one fourth of the depth of the reflecting cavity; of course, other values may be set according to specific requirements, for example, the height difference may be set to be greater than 0, less than or equal to one fifth, one sixth, one third, etc. of the depth of the reflective cavity.
In this embodiment, the connecting transition area may be a slope, an arc, or a combination of at least two of a plane, a slope, and an arc.
Optionally, at least part of the connecting transition region can also be in contact with the enclosure body, so as to simultaneously increase the contact area between the substrate and the enclosure body, and further increase the strength of the support.
The enclosure contact region and the connecting transition region in this embodiment may be of the same type and/or formed by different processes. And it should be understood that the fence contact area in this embodiment may also be several types of surfaces as shown in embodiment two.
For example, in one example, see fig. 3-1, where 30 is a bounding wall, 31 is a substrate (which may be a positive substrate and/or a negative substrate), 311 is a functional region, 312 is a bounding wall contact region, and 313 is a junction transition region. In fig. 3-1, the area of the fence contact area 312 is a planar area where the front surface of the substrate directly contacts the fence body 30, and the connection transition area 313 is a bevel area connecting the fence contact area 312 and the functional area 11. The path between the fence contact area 312 and the functional area 311 can be further increased by arranging the connecting transition area 313, and the moisture resistance of the support is improved.
For another example, referring to fig. 3-2, the area of the fence contact area 312 is a planar area where the front surface of the substrate directly contacts the fence body 30, and the connection transition area 313 is an arc area connecting the fence contact area 312 and the functional area 11, in the example shown in fig. 3-2, the arc area is a concave arc area concave toward the back surface of the substrate 31, and the concave arc area transition connection area can further increase the path between the fence contact area 312 and the functional area 311 relative to the slope transition connection area, thereby further improving the moisture resistance and strength of the bracket. In this embodiment, when the connecting transition region 313 is an arc-shaped surface region connecting the fence contact region 312 and the functional region 11, it may also be a convex arc-shaped surface region protruding above the front surface of the substrate 31, as shown in fig. 3-4, and the opposite inclined surface transition connection region may also further increase the path between the fence contact region 312 and the functional region 311, and may also further improve the moisture resistance and strength of the bracket.
The connecting transition region in this embodiment may also be a combination surface, which may include, but is not limited to, a combination of at least two of a flat surface, a slant surface, and an arc surface.
For another example, referring to fig. 3-3, the area of the fence contact area 312 is a planar area where the front surface of the substrate directly contacts the fence body 30, and the connection transition area 313 is a combined surface formed by combining a planar area and a bevel area where the front surface of the substrate connects the fence contact area 312 and the function area 311, and the combined surface can further increase the path between the fence contact area 312 and the function area 311 to improve the moisture-proof performance.
For example, referring to fig. 3-5, the area of the fence contact area 312 is a planar area where the front surface of the substrate directly contacts the fence body 30, the connection transition area 313 is a combined surface where the front surface of the substrate is combined with the planar and arc-shaped surfaces of the fence contact area 312 and the functional area 311, and the arc-shaped surface is a convex arc-shaped area protruding above the front surface of the substrate 31. For another example, referring to fig. 3-6, the difference between the bracket shown in fig. 3-5 and the connecting transition region 313 is that the connecting transition region is composed of a plane and a concave arc surface region, and the combined surface can further increase the path between the fence contact region 312 and the functional region 311 to improve the moisture-proof performance.
In addition, it should be understood that the connection transition regions 313 on opposite sides of the front surface of the substrate in the present embodiment may be provided as the same type of surface, or as different types of surfaces. For example, as shown in fig. 3 to 8, the connection transition region 313 on one side of the substrate is configured as a combination surface of a plane and an inclined surface, and the connection transition region 313 on the other opposite side is configured as a combination surface of a plane and a concave arc surface, and the specific configuration mode can be flexibly determined according to a specific application scenario and an adopted process.
In addition, in the embodiment, a connection transition region is further disposed between the enclosure contact region and the functional region on the substrate, so that at least a portion of the connection transition region is directly contacted with the enclosure contact region 312, thereby increasing the contact area between the substrate and the enclosure. For example, as shown in fig. 3-7, the combination surface 313 formed by combining the inclined surface and the flat surface is completely in direct contact with the fence contact area 312, so that the contact area between the substrate and the fence body can be further increased, and the strength of the bracket can be further increased; meanwhile, the air tightness of the bracket can be further improved, so that the moisture resistance is further improved.
Example four:
referring to fig. 1-1 to 1-2, in the conventional LED support, the side surfaces of the positive substrate 11 and the negative substrate 12 are vertical surfaces, as shown in fig. 1-2, so when moisture easily spreads to the front surface of the substrate along the joint between the side surface of the substrate and the plastic enclosure 10, the moisture easily enters the functional region through the contact region between the side surfaces of the positive substrate 11 and the negative substrate 12 and the enclosure, which causes short circuit of the circuit in the functional region, damage of the device, and even directly causes lamp failure; and most of the functional areas of the substrate are plated with metal silver layers, and the metal silver layers are also easily corroded under the action of moisture to cause functional defects. Therefore, the existing LED support and the LED prepared by the support have poor moisture resistance.
In view of the above problem, the present embodiment further provides a highly reliable LED support, where at least one of the side surfaces of the positive substrate and the negative substrate has at least one target side surface, a surface path value of the target side surface along the height direction is greater than a side surface height value of the target side surface, and the target side surface is non-planar. For the setting of current base plate side for the perpendicular, can prolong the route of base plate side, also prolong the route that the moisture entered into the functional area in to promote the dampproofing property of LED support and the LED that utilizes this LED support to make, promote LED's reliability and durability, make the application scene that is applicable to various environment that LED can be better.
In order to better improve the air tightness of the LED support and to improve the moisture resistance thereof, in some examples, the side surfaces of the positive electrode substrate and the negative electrode substrate may be provided with the target side surface, for example:
example one: arranging at least one target side surface in the side surfaces of the positive electrode substrate and the negative electrode substrate, which are in contact with the wall body;
for example, when the positive electrode substrate and the negative electrode substrate have three sides which need to be in contact with the enclosure body, and two sides in the width direction are opposite sides, the three sides may be both the target sides, or only two opposite sides of the three sides may be the target sides, or only one of the three sides may be the target side; which sides are set as the target sides can be selected according to requirements.
Example two:
the side surfaces of the positive electrode substrate and the negative electrode substrate, which are in contact with the insulating isolation belt, are set as the target side surfaces.
Example three:
the side face of the positive electrode substrate and the side face of the negative electrode substrate, which are contacted with the wall body, are provided with at least one target side face, and the side face of the positive electrode substrate and the side face of the negative electrode substrate, which are contacted with the insulating isolation belt, are provided with the target side faces.
In this embodiment, the target side surface may be an arbitrary surface that has a surface path value along the height direction greater than a side height value of the target side surface and is not planar; for example, the curved surface may be a regular arc-shaped curved surface or an irregular curved surface when the curved surface is a curved surface. For another example, in some examples, the target side surface may also be a combined surface including, but not limited to, a combined surface combining at least two of a flat surface, a sloped surface, and an arcuate surface. And when the combined surface is a combined surface, the combined surface can also be a step combined surface combined by at least two of planes, inclined planes and arc-shaped surfaces so as to further prolong the path of the side surface and improve the moisture-proof performance. For example, in one example, the stepped composition surface is composed of a horizontal plane and a vertical plane, and an arc-shaped surface connecting the horizontal plane and the vertical plane; or consists of a plurality of inclined planes, or consists of a transverse plane, or a vertical plane and an inclined plane, or consists of a vertical plane, an inclined plane and an arc surface, or consists of a transverse plane, an inclined plane and an arc surface; the specific combination composition mode can be flexibly set.
In an example of the embodiment, the width of the front surface of the positive electrode substrate and the width of the back surface of the negative electrode substrate can be set to be larger than that of the back surface of the positive electrode substrate and the back surface of the negative electrode substrate, so that external moisture can be better prevented from entering the functional region through the side surface of the substrate, and the manufacturing and processing of the substrate and the LED support can be better facilitated.
In this embodiment, the target side surface may be formed by, but not limited to, stamping, etching, cutting, and the like.
This embodiment is through setting up in anodal base plate and the negative pole base plate, the surface path value of at least one side of at least one base plate is greater than the side height value of this side, and this side is the non-plane, be the setting of perpendicular for current base plate side, can prolong the route of base plate side, also prolong the route that the moisture enters into in the functional area, thereby promote the LED support and utilize the moisture resistance of the LED that this LED support made, promote LED's reliability and durability, make LED can be better be applicable to the application scene of various environment, more do benefit to LED's popularization and use. In addition, the target side of the substrate side in this embodiment can be flexibly combined with the front functional area of the substrate in the first to third embodiments to achieve double extension of the path of moisture entering the functional area in the LED support, thereby further improving the moisture resistance of the LED support.
Example five:
referring to fig. 1-1 to 1-2, in a conventional LED support, an insulating isolation strip between a positive substrate and a negative substrate is perpendicular to a long side of the support and is parallel to the positive substrate and the negative substrate; and the insulating isolation belt is a fragile insulating material, and the width of the insulating isolation belt is narrow, so that the insulating isolation belt is easy to break, and the overall strength and reliability of the LED support are reduced.
To solve the problem, the embodiment further provides an LED support with a novel structure, where two long sides of the LED support opposite to the cross-sectional profile of the insulating isolation strip are arc-shaped sides, or curved sides with at least one bend, or broken line sides with at least one bend, or inclined sides with an included angle greater than or equal to 10 ° and smaller than 90 ° with the short side of the negative electrode substrate, so that when the isolation strip is stressed, a part of the mechanical force applied to the isolation strip can be transmitted to the positive electrode substrate, the negative electrode substrate and the enclosure body, thereby increasing the strength of the insulating isolation strip.
Optionally, in this embodiment, two long sides of the insulating isolation strip, which have opposite cross-sectional profiles, may be parallel or may be set to be non-parallel, and specifically, may be flexibly set according to requirements; for ease of understanding, the present embodiment will be described below with two examples of parallel arrangement and non-parallel arrangement, respectively.
Example of parallel arrangement:
referring to fig. 4-1, 50 is a surrounding wall, 51 is a positive substrate, 52 is a negative substrate, and 53 is an insulating isolation region. In fig. 4-1, the broken line is a short side of the negative electrode substrate 52. In fig. 4-1, two long sides of the cross-sectional profile of the insulating isolation strip 53 are two parallel oblique sides having an included angle a of 10 ° or more and less than 90 ° with the short side of the negative electrode substrate 52, that is, the included angle a in fig. 4-1 is 10 ° or more and less than 90 °, and the value of the included angle can be flexibly set according to at least one of the strength requirement of a specific application scenario, the material adopted by the insulating isolation strip, the forming process, and the like. For example, in an example, the included angle a may be 75 ° to 85 °, for example, specifically 75 °, 78 °, 80 °, 83 °, 85 °, and the like, so that when the insulating isolation strip 53 is subjected to a mechanical force, a part of the mechanical force can be transmitted to the positive substrate 51, the negative substrate 52, and the enclosure body 50, thereby improving the strength of the insulating isolation strip 53, and further improving the overall strength and reliability of the LED support.
In this embodiment, the two opposite long sides of the cross-sectional profile of the insulating isolation strip 53 may be arc-shaped sides in addition to the oblique sides. For example, as shown in fig. 4-2, two long sides of the cross-sectional profile of the insulating isolation strip 53 are two arc sides parallel to each other, and the two arc sides are also arranged so that when mechanical force is applied to the insulating isolation strip 53, a part of the mechanical force applied to the insulating isolation strip 53 is transmitted to the positive substrate 51, the negative substrate 52 and the enclosure body 50, thereby improving the strength of the insulating isolation strip 53.
The two opposite long sides of the cross-sectional profile of the insulating isolation strip 53 in this embodiment may be curved sides in addition to the oblique sides and the arc-shaped sides. For example, as shown in fig. 4-3, two long sides of the cross-sectional profile of the insulating isolation strip 53 are two parallel curved sides, and the curved sides are also arranged such that when a mechanical force is applied to the insulating isolation strip 53, a part of the mechanical force applied to the insulating isolation strip 53 is transmitted to the positive substrate 51, the negative substrate 52 and the enclosure body 50, thereby improving the strength of the insulating isolation strip 53. The number of the curved sides other than the bending points in the present embodiment can be flexibly set, for example, the curved sides shown in fig. 4-5 can be used in addition to the curved sides shown in fig. 4-3, and of course, other forms of curved sides can be used.
In this embodiment, the two opposite long sides of the cross-sectional profile of the insulating isolation strip 53 may be a polygonal line side having at least one bend, in addition to the oblique side, the arc side and the curved side. For example, as shown in fig. 4-4, two long sides of the insulating isolation strip 53, which are opposite to each other in cross-sectional profile, are two fold lines parallel to each other, and the fold lines are arranged such that when mechanical force is applied to the insulating isolation strip 53, a part of the mechanical force applied to the insulating isolation strip 53 is transmitted to the positive substrate 51, the negative substrate 52 and the enclosure body 50, thereby improving the strength of the insulating isolation strip 53. The number of the folding line edges in the present embodiment other than the number of the bending points can be flexibly set, for example, the folding line edges shown in fig. 4-6 can be used in addition to the folding line edges shown in fig. 4-4, and of course, other types of folding line edges can also be used.
Non-parallel setup example:
referring to fig. 5-1, 60 is a surrounding wall, 61 is a positive substrate, 62 is a negative substrate, and 63 is an insulating isolation region. In fig. 5-1, two long sides opposite to the cross-sectional profile of the insulating isolation strip 63 are two parallel oblique sides having an included angle a of 10 ° or more and less than 90 ° with the short side of the negative substrate 62, and the two oblique sides are not parallel to each other, so that when the insulating isolation strip 63 is subjected to a mechanical force, a part of the mechanical force can be transmitted to the positive substrate 61, the negative substrate 62 and the surrounding wall body 60, thereby improving the strength of the insulating isolation strip 63 and further improving the overall strength and reliability of the LED support.
The two opposite long sides of the cross-sectional profile of the insulating isolation strip 63 in this embodiment may be arc-shaped sides in addition to the oblique sides. For example, as shown in fig. 5-2, two long sides of the cross-sectional profile of the insulating isolation strip 63 are two non-parallel arc-shaped sides, and the non-parallel arc-shaped sides are also arranged such that when the insulating isolation strip 63 is subjected to a mechanical force, a part of the mechanical force is transmitted to the positive electrode substrate 61, the negative electrode substrate 62 and the enclosing wall body 60, thereby enhancing the strength of the insulating isolation strip 63.
The two opposite long sides of the cross-sectional profile of the insulating isolation strip 63 in this embodiment may be curved sides in addition to the oblique sides and the curved sides. For example, as shown in fig. 5-3, two long sides of the cross-sectional profile of the insulating isolation strip 63 are two non-parallel curved sides, and the two non-parallel curved sides are also arranged so that when the insulating isolation strip 63 is subjected to a mechanical force, a part of the mechanical force is transmitted to the positive substrate 61, the negative substrate 62 and the enclosure body 60, thereby enhancing the strength of the insulating isolation strip 63.
In this embodiment, the two opposite long sides of the cross-sectional profile of the insulating isolation belt 63 may be a polygonal line side having at least one bend, in addition to the oblique side, the arc side and the curved side. For example, as shown in fig. 5-4, two long sides of the cross-sectional profile of the insulating isolation strip 63 are two non-parallel fold lines, and the two non-parallel fold lines can also be arranged to transmit a part of mechanical force received by the insulating isolation strip 63 to the positive substrate 61, the negative substrate 62 and the enclosure body 60 when the insulating isolation strip 63 is subjected to mechanical force, so as to improve the strength of the insulating isolation strip 63.
In another example of the embodiment, in order to further improve the strength of the insulating isolation belt, the front surface of the insulating isolation belt can be arranged to be higher than the front surfaces of the positive electrode substrate and the negative electrode substrate; and the raised part can also cross over the positive electrode substrate and the negative electrode substrate so as to further improve the strength of the insulating isolation belt.
Two relative long limits of insulating median cross section profile set up to the arc limit in this embodiment, or the curve limit, or broken line limit, or for the contained angle more than or equal to 10 between the minor face with the negative pole base plate, be less than 90 hypotenuses, when the median atress, can give positive pole base plate, negative pole base plate and enclosure on the wall body with the mechanical force transmission part that receives, consequently can increase the intensity of insulating median, promote the overall strength and the reliability of LED that LED support and utilized this support to make.
Example six:
the embodiment provides an LED, which includes the LED support shown in the above embodiments, and further includes at least one LED chip, where the LED chip is disposed on the positive substrate and/or the negative substrate, and the positive pin and the negative pin of the LED chip are electrically connected to the positive substrate and the negative substrate, respectively. It should be understood that the LED chip in this embodiment may be a flip LED chip or a front LED chip, and the manner of electrically connecting the positive pin and the negative pin of the LED chip to the positive substrate and the negative substrate respectively includes but is not limited to: by conductive wire, conductive glue or other forms of conductive material.
It should be understood that the colors of the LED lights presented to the user according to the present embodiment can be flexibly set according to the actual needs and application scenarios. What color the LED emits and appears can be flexibly controlled by, but not limited to, the following factors: the color of the light emitted by the LED chip itself, whether the LED includes a luminescence conversion layer, the type of luminescence conversion layer when the LED includes a luminescence conversion layer.
In an example of the embodiment, the LED may further include a lens adhesive layer or a diffusion adhesive layer disposed on the LED chip (when the light emitting conversion adhesive layer is disposed on the LED chip, the light emitting conversion adhesive layer is disposed on the light emitting conversion adhesive layer).
It should be understood that, in an example, the luminescence conversion glue layer may be a phosphor glue layer containing phosphor, or may be a colloid containing quantum dot photo-induced material, or other luminescence conversion glue or film capable of realizing luminescence conversion, and may also include diffusing powder or silicon powder, etc. as required; the light emitting conversion glue layer, the lens glue layer or the diffusion glue layer formed on the LED chip in this embodiment includes, but is not limited to, dispensing, molding, spraying, pasting, and the like.
For example, the luminescence conversion layer may include a phosphor paste layer, a phosphor film, or a quantum dot QD film; the phosphor glue layer and the phosphor film can be made of inorganic phosphor, and can be inorganic phosphor doped with rare earth elements, wherein the inorganic phosphor includes but is not limited to at least one of silicate, aluminate, phosphate, nitride and fluoride phosphor.
For another example, the quantum dot QD film may be fabricated using quantum dot phosphors; quantum dot phosphors include, but are not limited to, at least one of BaS, AgInS2, NaCl, Fe2O3, In2O3, InAs, InN, InP, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, GaAs, GaN, GaS, GaSe, InGaAs, MgSe, MgS, MgTe, PbS, PbSe, PbTe, Cd (SxSe1-x), BaTiO3, PbZrO3, CsPbCl3, CsPbBr3, CsPbI 3.
In this embodiment, the type of light emitted by the LED chip itself may be visible light, or ultraviolet light or infrared light invisible to the naked eye; when the type of light emitted by the LED chip itself is ultraviolet light or infrared light invisible to the naked eye, a light emitting conversion layer may be disposed on the LED chip to convert the invisible light to visible light, so that the light emitted from the LED is visible to the user. For example, when the light emitted from the LED chip itself is ultraviolet light, if the LED is supposed to display white light visible to the user, the light conversion layer may be made by mixing red, green, and blue phosphors.
The present embodiment also provides a light emitting device including the LED exemplified in the above embodiment. The light emitting device in this embodiment may be a lighting device, an optical signal indicating device, a light supplementing device, or a backlight device. When the lighting device is used, the lighting device can be specifically applied to various fields, such as a table lamp, a fluorescent lamp, a ceiling lamp, a down lamp, a street lamp, a projection lamp and the like in daily life, a high beam lamp, a dipped beam lamp, an atmosphere lamp and the like in an automobile, an operation lamp, a low electromagnetic lighting lamp and a lighting lamp of various medical instruments in medical use, and various colored lamps, landscape lighting lamps, advertisement lamps and the like in the field of decoration; when the light signal indicating device is used, the light signal indicating device can be applied to various fields, such as signal indicating lamps in the traffic field, various signal state indicating lamps on communication equipment in the communication field, various indicating lamps on vehicles and the like; when the device is a light supplement device, the device can be a light supplement lamp in the photographic field, such as a flash lamp and a light supplement lamp, and can also be a plant light supplement lamp for supplementing light to plants in the agricultural field; in the case of the backlight device, the backlight device may be applied to various backlight fields, for example, a display, a television, a mobile terminal such as a mobile phone, and an advertisement machine.
It should be understood that the above applications are only a few of the applications exemplified by the present embodiment, and that the application of LEDs is not limited to the above exemplified fields.
The foregoing is a more detailed description of embodiments of the present invention, and the present invention is not to be considered limited to such descriptions. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (10)
1. A high-air-tightness LED support is characterized by comprising an anode substrate, a cathode substrate and an insulating isolation strip, wherein the insulating isolation strip is positioned between the anode substrate and the cathode substrate to isolate the anode substrate and the cathode substrate in an insulating way;
at least one of the positive electrode substrate and the negative electrode substrate is also provided with a connecting transition region for connecting the functional region and the wall contact region, and the plane of the functional region is lower than the plane of the wall contact region.
2. The highly hermetic LED support of claim 1, wherein the functional regions of the positive electrode substrate and the negative electrode substrate are located on a plane lower than the plane of the perimeter wall contact region.
3. The high-airtightness LED support according to claim 1, wherein the functional regions of the positive electrode substrate and the negative electrode substrate are located at the bottom of a reflection cavity formed by the enclosing body; the height difference between the plane where the functional area is located and the plane where the enclosing wall contact area is located is larger than 0 and smaller than or equal to one fourth of the depth of the reflection cavity.
4. The high-airtightness LED support according to any one of claims 1 to 3, wherein the connection transition region is a slope, an arc-shaped surface, or a combination surface comprising a combination of at least two of a flat surface, a slope and an arc-shaped surface.
5. The highly hermetic LED support according to any of claims 1 to 3, wherein at least a partial region of the connecting transition region is in contact with the enclosure body.
6. The highly air-tight LED support according to any of claims 1 to 3, wherein the front surface of the insulating isolation tape is higher than the front surfaces of the positive electrode substrate and the negative electrode substrate.
7. The high-airtightness LED support according to any one of claims 1 to 3, wherein two long sides of the insulating isolation strip, which are opposite in cross-sectional profile, are arc-shaped sides, or are curved sides having at least one bend, or are broken line sides having at least one bend, or are inclined sides having an included angle of 10 ° or more and less than 90 ° with a short side of the negative electrode substrate.
8. The highly hermetic LED support according to claim 7, wherein the two long sides of the insulating isolation tape opposite to the cross-sectional profile are parallel to each other.
9. An LED, comprising the high-air-tightness LED bracket as claimed in any one of claims 1 to 8 and at least one LED chip, wherein the LED chip is arranged on the positive substrate and/or the negative substrate, and a positive pin and a negative pin of the LED chip are respectively and electrically connected with the positive substrate and the negative substrate.
10. A lighting device comprising the LED of claim 9, wherein the lighting device is a lighting device, a light signal indicating device, a light supplementing device, or a backlight device.
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| CN201811005329.1A CN110875407A (en) | 2018-08-30 | 2018-08-30 | High-air-tightness LED support, LED and light-emitting device |
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| CN201811005329.1A CN110875407A (en) | 2018-08-30 | 2018-08-30 | High-air-tightness LED support, LED and light-emitting device |
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| CN110875407A true CN110875407A (en) | 2020-03-10 |
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| CN104064656A (en) * | 2014-06-25 | 2014-09-24 | 晶科电子（广州）有限公司 | LED bracket with good moisture-proof performance, LED device and preparation method thereof |
| CN104167484A (en) * | 2014-08-29 | 2014-11-26 | 深圳市得润电子股份有限公司 | Ultra-thin LED support and manufacturing method thereof |
| WO2018151463A1 (en) * | 2017-02-20 | 2018-08-23 | 서울반도체주식회사 | Package body and light emitting diode package including package body |
| CN209087898U (en) * | 2018-08-30 | 2019-07-09 | 深圳市聚飞光电股份有限公司 | High-air-tightness LED support, LED and light emitting device |
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| CN202308035U (en) * | 2011-09-26 | 2012-07-04 | 东莞市凯昶德电子科技股份有限公司 | Improved structure of LED bracket |
| CN103400927A (en) * | 2013-07-25 | 2013-11-20 | 晶科电子（广州）有限公司 | High-reliability LED (light emitting diode) bracket and LED device thereof |
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| CN104167484A (en) * | 2014-08-29 | 2014-11-26 | 深圳市得润电子股份有限公司 | Ultra-thin LED support and manufacturing method thereof |
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